1314259 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置，尤指一種具較高散熱效 率之散熱器。 【先前技術】 ^隨著積體電路製造技術日新月異之發展，電子元件朝 者更快之運算速度邁進。由於電子元件之運算速度愈來愈 快，其高速運作過程中伴隨産生之熱量亦愈來愈多。若電 子元件産生之熱量不被及時導出，將會導致電子元件之溫 度持續升高:進而影響其運行之穩定性，嚴重時會使電子 疋件燒毀。爲此’業界通常在產生熱量較多之電子元件項 面裝設-散熱器，再透過系統風扇之協助排出埶量。、 請-併參閱圖i及圖2’習知技術之散熱器ι〇包括— ，底座12及複數自該底座12頂部延伸之散熱讀片μ， 每了分厚度均相同。當該散熱㈣裝設於 月旬主板之某1子元件上時，該電子元件 該發熱源位於該底座12底部之中央位置。’，'、X…源， 於該散熱器10 —定距離處設置一風扇（ 散熱時，該風扇産生之風流進入該散熱器10之—：二 端13 ;該風流流出該散熱器 ’、、、風 流包括-流向該散熱…散熱；該風 ⑽、-流向該散熱器10之底部與該熱源之間笛一風机 及一流向該底座12之側端面12〇之 一風流 於該底座具一定之厚度且每一部分厚度均::二4該： 6 1314259 三風流114流至該底座12之側端面12〇時會產生如圖所示 之渴流，故使得氣流之流動不順暢，進而增加氣流進入該 散熱器10之風阻’降低了散熱效率。 因是，實有必要對習知之散熱器進行改良，以消除上 述缺失。 【發明内容】 繁於上述内容，有必要提供一種可提高散熱 埶哭。 口口 本發明提供一種散熱器，包括一底座及複數自該底座 向上L伸之政熱鰭片，該散熱器有一進風端及一出風， :亥底座具有一上表面及一下表面，其下表面中部爲一平坦 部，該下表面自其平坦部兩端分別向該進風端及出風端方 向之上表面延伸。 山相較習知技術，該底座由十部向對應於進風端及出風 端之兩相對側邊逐漸縮減變薄，可避免氣流流向該底座時 産生渦机，增大了氣流之流入，進而提高了系統整體之散 熱效率。 【實施方式】 凊參閱圖3及圖4,本發明散熱器20之較佳實施方式 =括底座22、複數自該底座22之上表面向上延伸之散 熱鰭片24。於該散熱器2〇 一定距離處設置一風扇（圖未 =^協助散熱時’該風扇産生之風流進入該散熱器20之一 端爲進風端23;風流流出該散熱器20之一端爲出風端25; °亥底座22由中部分別向進風端23及出風端25之兩相對侧 1314259 邊逐漸縮減變薄直至該底座22 底座22之整個上表面可呈一中間上：面及下表面相交。該 面亦可t部爲一平坦部，該底_之千=面;該上表 蠕分別向進風端23及出風端25方向部兩 座22之下表面中部爲—平坦部 ： = 坦部兩端分別向進風端23及出風端 上表面及下表面之平坦部兩 端25分別形成平滑弧面或傾斜面。進風及出風 2明散熱H 2G之較佳實施方式於使 4主板之某一電子元件（圖未示）U 二 :散熱。該電子元件即發熱源位於該底座22底部:中央： 之第St風流包括—流經該散熱器2〇之散熱鰭片24 門之笛 及一流經該散熱器20之底部與該發教源之 風流212。由於該底座22由中部分別向兩相、對側 ==變薄’且在靠近該進風端23及該出風端㈣ Γ2=:上表面及下表面相交，故該風流流向該底座 之進⑽23之側端面22〇時不産生渦流，該進風端μ 降低。當該第-風流21〇自該出風端25流出時， 2對應於該出風端25之側端面222之平滑弧面亦 及下表面之氣流可儘快擴散’進而更好的滿 ,、、、、之政熱需求，提高了系統之整體散熱效率。 本發明散熱器之較佳實施方式之該底座22由中部分 別向該進風端23及出風端25之兩相對側邊逐漸縮減變； 8 1314259 直至該底座22之上表面及下表面相交’可降低風阻 了整體散熱系統之散熱效率。 间 綜上所述’本發明符合發明專利要件，羡依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，舉 凡熟悉本案技藝之人士，在爰依本發明精神所作之等效^ 飾或變化，皆應涵蓋於以τ之申請專利範圍内。 乂 【圖式簡單說明】 圖1係習知散熱器之立體圖。 圖2係圖1之主視圖。 圖3係本發明散熱器之較 平乂1土貫施方式之立體圖 圖4係圖3之主視圖。 【主要元件符號說明】 [習知] 散熱器 10 進風端 13 出風端 15 第二風流 112 側端面 120 [本發明] 散熱器 20 進風端 23 出風端 25 第二風流 212 底座 12 散熱鰭片 14 第一風流 110 第三風流 114 底座 22 散熱鳍片 24 第—風流 210 側端面 220、2221314259 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a high heat dissipation efficiency. [Prior Art] With the rapid development of integrated circuit manufacturing technology, electronic components are moving toward faster computing speeds. As electronic components operate faster and faster, the amount of heat that comes with them during high-speed operation is increasing. If the heat generated by the electronic component is not exported in time, the temperature of the electronic component will continue to rise: this will affect the stability of its operation, and in severe cases, the electronic component will burn out. To this end, the industry usually installs a heat sink on the surface of an electronic component that generates a lot of heat, and then uses the system fan to assist in the discharge. - Please also refer to Figures 1 and 2'. The heat sink of the prior art includes - the base 12 and a plurality of heat-dissipating readings μ extending from the top of the base 12, each having the same thickness. When the heat dissipation (4) is installed on a certain sub-element of the main board in the month, the heat source of the electronic component is located at a central position of the bottom of the base 12. ', ', X... source, a fan is disposed at a certain distance from the heat sink 10 (when the heat is dissipated, the wind generated by the fan enters the heat sink 10 - the two ends 13; the wind flows out of the heat sink', The wind flow includes: a heat flow to the heat sink; the wind (10), a flow to the bottom of the heat sink 10 and the heat source, and a wind turbine flowing to the side end surface 12 of the base 12 The thickness and thickness of each part are: 2:4: 6 1314259 When the three airflow 114 flows to the side end face 12 of the base 12, the thirsty flow as shown in the figure will occur, so that the flow of the airflow is not smooth, thereby increasing the airflow. The wind resistance into the heat sink 10 reduces the heat dissipation efficiency. Therefore, it is necessary to improve the conventional heat sink to eliminate the above-mentioned defects. [Disclosed] In the above, it is necessary to provide a heat dissipation crying The present invention provides a heat sink comprising a base and a plurality of political fins extending upward from the base. The heat sink has an air inlet end and an air outlet. The base has an upper surface and a lower surface. under The middle portion of the surface is a flat portion, and the lower surface extends from the two ends of the flat portion to the upper surface of the air inlet end and the air outlet end respectively. The mountain phase corresponds to the air inlet end by ten parts. The two opposite sides of the air outlet are gradually reduced and thinned to avoid the occurrence of a vortex machine when the airflow flows to the base, thereby increasing the inflow of the airflow, thereby improving the overall heat dissipation efficiency of the system. [Embodiment] 凊 Refer to FIG. 3 and 4, a preferred embodiment of the heat sink 20 of the present invention includes a base 22 and a plurality of heat radiating fins 24 extending upward from the upper surface of the base 22. A fan is disposed at a distance from the heat sink 2 =^ When assisting in heat dissipation, 'the wind generated by the fan enters one end of the radiator 20 as the air inlet end 23; one end of the airflow flowing out of the radiator 20 is the air outlet end 25; °H base 22 is respectively directed from the middle portion to the air inlet end 23 And the opposite sides 1314259 of the outlet end 25 are gradually reduced and thinned until the entire upper surface of the base 22 of the base 22 can be in a middle: the surface and the lower surface intersect. The surface can also be a flat portion, the bottom portion _千千=面; the upper table creeps to the wind end 23 and the wind direction 25 direction part of the lower part of the lower surface 22 is a flat part: = two ends of the flat portion respectively form a smooth arc to the air inlet end 23 and the upper end surface of the wind outlet end and the flat end portions 25 of the lower surface respectively The surface or the inclined surface. The preferred embodiment of the air inlet and the outlet 2 heat dissipation H 2G is to make an electronic component of the 4 motherboard (not shown) U 2: heat dissipation. The electronic component is the heat source located at the bottom of the base 22 : Central: The St. wind flow includes a flute that passes through the heat sink fins 24 of the heat sink 2 and a first-class wind flow 212 passing through the bottom of the heat sink 20 and the teaching source. Since the base 22 is respectively directed from the middle to the middle Two phases, opposite sides == thinning 'and close to the air inlet end 23 and the air outlet end (four) Γ 2 =: the upper surface and the lower surface intersect, so the wind flow does not flow to the side end surface 22 of the inlet (10) 23 of the base An eddy current is generated, and the air inlet end μ is lowered. When the first air flow 21 flows out from the air outlet end 25, the smooth arc surface corresponding to the side end surface 222 of the air outlet end 25 and the air flow on the lower surface can be diffused as soon as possible, thereby further better filling, The political heat demand of the company has improved the overall heat dissipation efficiency of the system. In the preferred embodiment of the heat sink of the present invention, the base 22 is gradually reduced from the central portion to the opposite sides of the air inlet end 23 and the air outlet end 25; 8 1314259 until the upper surface and the lower surface of the base 22 intersect ' It can reduce the wind resistance and the heat dissipation efficiency of the overall heat dissipation system. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalents of the invention in the scope of the invention.乂 [Simplified description of the drawings] Figure 1 is a perspective view of a conventional heat sink. Figure 2 is a front view of Figure 1. Fig. 3 is a perspective view showing a relatively shallow concrete 1 embodiment of the heat sink of the present invention. Fig. 4 is a front view of Fig. 3. [Main component symbol description] [General knowledge] Heat sink 10 Air inlet end 13 Air outlet end 15 Second air flow 112 Side end surface 120 [Invention] Heat sink 20 Air inlet end 23 Air outlet end 25 Second air flow 212 Base 12 Heat dissipation Fin 14 first wind flow 110 third air flow 114 base 22 heat sink fin 24 first air flow 210 side end face 220, 222