TWI624219B - Graphic card heat dissipating module - Google Patents

Abstract

A display card heat dissipation module includes a display card, a fin set and a fan. The display card has a main heat source area and a pair of heat source areas. The fin group is disposed on the display card and covers the main heat source area and the sub heat source area of the display card. The fin set includes a perforation at a portion corresponding to the sub heat source region. The fan is disposed obliquely on the perforations of the fin set. The projection of the fan to the display card covers the secondary heat source area, does not cover the main heat source area, and the fan is inclined toward the fin group at a portion corresponding to the main heat source area.

Description

Display card thermal module

The present invention relates to a heat dissipation module, and more particularly to a display card heat dissipation module.

With the rapid advancement of electronic technology, the demand for the function and operation speed of electronic devices is increasing, and the relative number of electronic components required will also increase. The increase in the number of electronic components and the increase in the operating speed of components will lead to electronic devices. The inside generates high heat. Among them, as for the display card, as the operation speed of the graphics processor, the memory chip, etc. is continuously increased, the generated thermal energy will also be significantly improved.

In order to effectively remove the thermal energy generated by the graphics processor and the memory chip of the display card during operation, most commonly used display cards use heat sinks to reduce the temperature of the graphics processor and the memory chip. However, the heat source of the display card is not limited to the graphics processor and the memory chip, and other electronic components of the display card (such as inductive components, etc.) generate thermal energy during operation. Therefore, the heat sink used in the conventional display card can only reduce the heat energy generated by the graphics processor and the memory chip during operation, and cannot balance other electronic components that generate heat.

The invention provides a display card heat dissipation module, which can effectively remove the thermal energy generated by the inductance component of the display card during operation.

The display card heat dissipation module of the present invention comprises a display card, a fin set and a fan. The display card has a main heat source area and a pair of heat source areas. The fin group is disposed on the display card and covers the main heat source area and the sub heat source area of the display card. The fin set includes a perforation at a portion corresponding to the sub heat source region. The fan is disposed obliquely on the perforations of the fin set. The projection of the fan to the display card covers the secondary heat source area, does not cover the main heat source area, and the fan is inclined toward the fin group at a portion corresponding to the main heat source area.

In an embodiment of the invention, a part of the wind blown by the fan passes through the perforation and is blown toward the sub heat source area, and a part of the wind blown by the fan faces the fin group at a portion corresponding to the main heat source area.

In an embodiment of the invention, the fin assembly includes a base and a plurality of fins, the base having a first region corresponding to the main heat source region and a second region corresponding to the secondary heat source region, the fins Only in the first zone, and the perforations are located in the second zone.

In an embodiment of the invention, an air hood is further disposed between the air outlet of the fan and the fin set, and the air hood includes a support frame, wherein the support frame is disposed in the second area, and the fan is fixed obliquely On the support frame.

In an embodiment of the invention, the air hood further includes an extension extending from the support frame to the fins to guide the wind blown by the fan to the fins.

In an embodiment of the invention, the extension frame includes a cover plate and Two inserts on both sides of the cover plate cover the portions of the fins, and the two inserts respectively extend between the fins.

In an embodiment of the invention, the fan and the base have an angle between the fan and the base, and the angle is 20 to 40 degrees.

In an embodiment of the invention, the display card comprises a graphics processor and an inductive component. The graphics processor is located in the main heat source region, the inductive component is located in the secondary heat source region, and the position of the through hole corresponds to the position of the inductive component.

In an embodiment of the invention, the display card further includes a plurality of memory chips located in the main heat source region and the sub heat source region, and the fin group corresponds to the graphics processor and the memory chips on the surface facing the display card. A plurality of thermal pads are disposed to transfer heat generated by the graphics processor and the memory chips to the fin set.

In an embodiment of the invention, the height of the fin group at a portion corresponding to the main heat source region is different from the height of the portion corresponding to the sub heat source region.

Based on the above, the fin group of the display card heat dissipation module of the present invention includes a perforation at a portion corresponding to the sub heat source region, and the fan is obliquely disposed on the perforation of the fin group and covers the sub heat source region by the projection of the display card. The fan can blow the wind through the perforations to the secondary heat source zone. In this way, the wind flow in the auxiliary heat source area is relatively smooth, and the heat energy generated by the auxiliary heat source area during operation can be effectively removed by the wind flow. In addition, in addition to being able to dissipate heat from the fin group, the main heat source area of the display card of the present invention can also blow the wind toward the fins to quickly move the fins to the heat to make the heat hot. The main heat source region coupled to the fins can have good heat dissipation efficiency. That is to say, the display card heat dissipation module of the present invention can not only be used when the display card is operated The main heat source area of the display card is effectively dissipated, and the heat dissipation of the sub-heat source area can be taken into consideration.

The above described features and advantages of the invention will be apparent from the following description.

5‧‧‧ screws

6‧‧‧ screw holes

10a, 10b, 10c, 10d, 10e‧‧‧ Thermal pad

100‧‧‧display card cooling module

110‧‧‧ display card

110a‧‧‧Main heat source area

110b‧‧‧Sub heat source area

112‧‧‧graphic processor

114‧‧‧Inductance components

116a, 116b, 116c, 116d‧‧‧ memory chips

120‧‧‧Fin set

122‧‧‧Perforation

124‧‧‧Base

124a‧‧‧First District

124b‧‧‧Second District

126‧‧‧Fins

130‧‧‧fan

140‧‧‧wind hood

142‧‧‧Support frame

144‧‧‧Extension

144a‧‧ Covering board

144b‧‧‧ insert

H1, h2‧‧‧ height

A‧‧‧ angle

1 is a schematic diagram of a display card heat dissipation module according to an embodiment of the present invention.

2 is a top view of the display card of the display card heat dissipation module of FIG. 1.

3 is a bottom view of the fin set of the display card heat dissipation module of FIG. 1.

4 is a top view of a fin set of the display card heat dissipation module of FIG. 1.

FIG. 5 is a schematic diagram of a fan of the display card heat dissipation module of FIG. 1. FIG.

1 is a schematic diagram of a display card heat dissipation module according to an embodiment of the present invention. 2 is a top view of the display card of the display card heat dissipation module of FIG. 1. 3 is a bottom view of the fin set of the display card heat dissipation module of FIG. 1. 4 is a top view of a fin set of the display card heat dissipation module of FIG. 1. FIG. 5 is a schematic diagram of a fan of the display card heat dissipation module of FIG. 1. FIG. Referring to FIG. 1 to FIG. 5 , the display card heat dissipation module of the embodiment is used for dissipating heat of the display card, and is configured, for example, in an electronic device such as a desktop computer, a notebook computer, or a tablet computer. Do not limit this.

The display card heat dissipation module 100 of this embodiment includes a display card 110, a fin set 120, and a fan 130. The display card 110 has a main heat source area 110a and a sub heat source area. 110b. The fin set 120 is disposed on the display card 110 and covers the main heat source area 110a and the sub heat source area 110b of the display card 110. The fin set 120 includes a through hole 122 at a portion corresponding to the sub heat source region 110b. The fan 130 is disposed obliquely on the perforations 122 of the fin set 120. The projection of the fan 130 on the display card 110 covers the sub heat source region 110b, does not cover the main heat source region 110a, and the fan 130 is inclined toward the fin group 120 at a portion corresponding to the main heat source region 110a.

Specifically, referring to FIG. 2, the display card 110 of this embodiment is, for example, an MXM (mobile PCI-E module) display card. The display card 110 includes other electronic components such as a graphics processing unit (GPU) and an inductive component 114 (choke). The graphics processor 112 is located in the main heat source area of the display card 110 and is the main heat source for the operation of the display card 110 for performing the drawing operation on the electronic device. In the present embodiment, the graphics processor 112 is, for example, a 50 watt mid-level graphics processor. Other electronic components, such as inductive component 114, are located in the secondary heat source region of display card 110, which also generates thermal energy when display card 110 operates, but which produces less thermal energy than graphics processor 112 generates. Inductive component 114 is used to convert the input voltage to the voltage required by each electronic component and graphics processor 112. In addition, display card 110 also includes a plurality of memory chips 116a-116d, such as DDR memory chips. In the present embodiment, the number of memory chips 116a-116d is four, but the invention is not limited thereto. When the display card 110 is in operation, the memory chips 116a-116d also generate thermal energy, which may be located in the primary heat source region 110a and the secondary heat source region 110b.

Referring to FIG. 1 to FIG. 4, in this embodiment, for example, a screw can be used. The fin set 120 is fixed to the display card 110 through the corresponding screw holes 6 and the like, which is not limited in the present invention. The fin set 120 of the present embodiment has a plurality of thermal pads 10a-10e disposed on a surface facing the display card 110 corresponding to the graphics processor 112 and the memory chips 116a-116d. For example, referring to FIG. 2 and FIG. 3, the memory chip 116a corresponds to the thermal pad 10a, the memory chip 116b corresponds to the thermal pad 10b, the memory chip 116c corresponds to the thermal pad 10c, and the memory chip 116d is Corresponding to the thermal pad 10d, the graphics processor 112 corresponds to the thermal pad 10e. The thermal pads 10a-10e are used to transfer heat generated by the graphics processor 112 and the memory chips 116a-116d to the fin set 120. With the thermal pads 10a-10e, the thermal energy generated by the operation of the display card 110 can be more efficiently transferred to the fin set 120 for further dissipation of thermal energy. In addition, the thermal pad 10a-10e can also be, for example, a thermal adhesive for bonding the display card 110 to the fin set 120. Due to the arrangement of the thermal pads 10a-10e, there is a gap between the fin set 120 and the display card 110.

In the present embodiment, the fin set 120 includes a base 124 and a plurality of fins 126. The base 124 has a first zone 124a corresponding to the primary heat source zone 110a and a second zone 124b corresponding to the secondary heat source zone 110b. The plurality of fins 126 are located only in the first region 124a for dissipating heat energy located in the main heat source region 110a and transferring the thermal processing pad 10e to the graphics processor 112 of the fin group 120. The present invention does not limit the number or size of the plurality of fins 126, however, more fins 126 may increase the efficiency of heat dissipation. Since the first region 124a of the base 124 has a plurality of fins 126 erected thereon, the height h1 of the fin group 120 at a portion corresponding to the main heat source region 110a is different from the height h2 of the portion corresponding to the sub heat source region 110b. . Further, the height h1 is greater than the height Degree h2. However, in other embodiments, the second region 124b of the base 124 may also have a plurality of fins 126 disposed in the secondary heat source region 110b and dissipating heat from the inductive component 114. The perforations 122 of the fin set 120 of the present embodiment are located in the second region 124b of the base 124. The location of the perforations 122 corresponds to the location of the inductive element 114. The perforations 122 may be a single hole or a plurality of holes, which may correspond to all of the inductive elements 114 or only a portion of the inductive elements 114.

In this embodiment, similar to the manner in which the fin set 120 and the display card 110 are fixed, the fan 130 may be fixed to the fin set 120 by the cooperation of the screw and the screw hole. The fan 130 is used to increase the airflow around the display card 110, and blows the heat generated by the operation of the display card 110 away from the display card 110 to achieve the effect of dissipating heat. A portion of the wind blown by the fan 130 of the present embodiment is used to dissipate heat from the inductive element 114 of the secondary heat source region 110b, particularly through the through holes 122. In the conventional display card heat dissipation module, the inductance element and the fin group are close to the closed type, and there is no air flow at all, so when the display card is in operation, the thermal energy of the inductance element is easily left, and eventually the temperature is too high. And damage to components and display cards. Compared with the conventional display card heat dissipation module, the display card heat dissipation module 100 of the present invention has a through hole 122 between the inductance element 114 and the fin set 120, so that the wind flow can be smoothed and the fan 130 blows out. The wind can be transferred to the secondary heat source region 110b, and the thermal energy of the inductance element 114 is relatively easy to escape, and the display card 110 can be prevented from being operated due to overheating.

Referring to FIG. 1 to FIG. 5 , the display card heat dissipation module 100 of the present embodiment further includes an air guiding cover 140 disposed between the air outlet of the fan 130 and the fin set 120 . The material of the air guiding cover 140 is, for example, but not limited to, paper, plastic, rubber, or the like. Air hood 140 A support frame 142 and an extension 144 extending from the support frame 142 to the plurality of fins 126 are included. The support frame 142 is located at the second region 124b of the base 124, and the fan 130 is obliquely fixed to the support frame 142. That is, the support frame 142 allows the fan 130 to be disposed obliquely on the fin set 120. The extension frame 144 is located in the first region 124a of the base 124 and includes a cover plate 144a and two insertion pieces 144b on both sides of the cover plate 144a. The cover plate 144a covers a portion of the plurality of fins 126, and the two insertion pieces 144b are respectively inserted between the two adjacent fins 126. The support frame 142 and the extension frame 144 enable the fan 130 to be tilted toward the fin set 120 at a portion corresponding to the main heat source region 110a. Since the fan 130 of the present invention is disposed obliquely, a part of the wind blown by the fan 130 can be blown not only through the through hole 122 but also toward the auxiliary heat source region 110b, and the other portion of the wind can be blown toward the side to the plurality of fins. Sheet 126 to further dissipate heat from main heat source region 110a. That is, the heat energy of the main heat source region 110a can be dissipated by the wind blown by the fan 130 in addition to the heat dissipation by the plurality of fins 126. In addition, the air hood 140 can also blow a part of the wind blown by the fan 130 to the sub heat source area 110b, and guide another part of the wind to the plurality of fins 126.

In the present embodiment, since the height h2 of the fin group 120 at the portion corresponding to the sub heat source region 110b is smaller than the height h1 of the portion corresponding to the main heat source region 110a, the fan 130 is disposed obliquely to the fin corresponding to the sub heat source region 110. When the chip set 120 is on, the overall thickness of the display card heat dissipation module 100 is not greatly increased, which is advantageous for the thin design of the electronic device. In addition, the fan 130 and the base 124 have an angle A, and the angle A is 20 to 40 degrees. Preferably, the angle A is 30 degrees, but the invention does not limit this. However, if the angle of the angle A is too large, the display card cooling module will be added. The overall thickness of 100 is not conducive to the thin design of the electronic device. If the angle of the angle A is too small, most of the wind will be blown to the secondary heat source region 110b, and part of the wind cannot be blown to the plurality corresponding to the main heat source region 110a. The fins 126 assist the heat dissipation of the main heat source region 110a.

In summary, the fin group of the display card heat dissipation module of the present invention includes a perforation at a portion corresponding to the sub heat source region, and the fan is obliquely disposed on the perforation of the fin group and covers the sub heat source region with the projection of the display card. Allows the fan to blow wind through the perforations to the secondary heat source zone. In this way, the wind flow in the auxiliary heat source area is relatively smooth, and the heat energy generated by the auxiliary heat source area during operation can be effectively removed by the wind flow. Furthermore, in addition to being able to dissipate heat from a plurality of fins, the main heat source area of the display card of the present invention can also blow the wind toward the fins to quickly move the fins to the tropical zone, in addition to being able to dissipate the fins toward the fins. The main heat source region that is thermally coupled to the fins can have good heat dissipation efficiency. That is to say, the display card heat dissipation module of the present invention can not only effectively dissipate heat from the main heat source area of the display card but also balance heat dissipation of the sub heat source area when the display card is operated. Further, the air hood of the present invention can also blow a part of the wind blown by the fan to the sub heat source area and guide the other part of the wind to the plurality of fins. In addition, since the height of the fin group of the present invention at a portion corresponding to the sub heat source region is smaller than the height of the portion corresponding to the main heat source region, when the fan is disposed obliquely on the fin group corresponding to the sub heat source region, The overall thickness of the heat dissipation module of the display card is greatly increased, which is advantageous for the thin design of the electronic device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art without departing from the invention. In the spirit and scope, the scope of protection of the present invention is subject to the definition of the appended patent application.

Claims (9)

A display card heat dissipation module includes: a display card having a main heat source area and a pair of heat source areas; a fin set disposed on the display card and covering the main heat source area and the sub heat source area of the display card The fin group includes a through hole at a portion corresponding to the sub heat source region, and a fan disposed obliquely on the through hole of the fin group, the fan covering the display card covers the sub heat source region without covering a main heat source region, and the fan is inclined toward the fin group at a portion corresponding to the main heat source region, wherein a part of the wind blown by the fan passes through the through hole and is blown toward the sub heat source region, and the fan blows out A portion of the wind faces the fin set at a location corresponding to the main heat source zone. The display card heat dissipation module of claim 1, wherein the fin assembly comprises a base and a plurality of fins, the base having a first region corresponding to the main heat source region and corresponding to the secondary heat source In a second zone of the zone, the fins are located only in the first zone, and the perforations are located in the second zone. The display card heat dissipation module of claim 2, further comprising: an air hood disposed between the air outlet of the fan and the fin set, wherein the air hood includes a support frame, wherein the air hood includes a support frame The support frame is disposed in the second zone, and the fan is obliquely fixed to the support frame. The display card heat dissipation module of claim 3, wherein the air guiding cover further comprises an extension frame extending from the support frame to the fins to guide the wind blown by the fan to the Some fins. The display card heat dissipation module of claim 4, wherein the extension frame comprises a cover plate and two insertion pieces on both sides of the cover plate, the cover plate covers a part of the fins, and the two The inserts extend between the fins, respectively. The display card heat dissipation module according to claim 2, wherein the fan has an angle with the base, and the angle is 20 to 40 degrees. The display card heat dissipation module of claim 1, wherein the display card comprises a graphics processor and an inductive component, the graphics processor is located in the main heat source region, and the inductive component is located in the sub heat source region, and The position of the perforation corresponds to the position of the inductive element. The display card heat dissipation module of claim 7, wherein the display card further comprises a plurality of memory chips located in the main heat source region and the sub heat source region, the fin group facing the surface of the display card A plurality of thermal pads are disposed on the portion corresponding to the graphics processor and the memory chips to transfer heat generated by the graphics processor and the memory chips to the fin set. The display card heat dissipation module of claim 1, wherein a height of the fin group at a portion corresponding to the main heat source region is different from a height corresponding to a portion of the sub heat source region.