TW201446123A - Electronic device - Google Patents

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Publication number
TW201446123A
TW201446123A TW102119496A TW102119496A TW201446123A TW 201446123 A TW201446123 A TW 201446123A TW 102119496 A TW102119496 A TW 102119496A TW 102119496 A TW102119496 A TW 102119496A TW 201446123 A TW201446123 A TW 201446123A
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Taiwan
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electronic device
heat
fan
heat source
plate
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TW102119496A
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Chinese (zh)
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TWI555464B (en
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Lao-Da Teng
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Inventec Corp
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Abstract

An electronic device comprising a base, a first shell, and a heat insulating plate is provided. A fan and a heat source are disposed at the base. The first shell is disposed at the base and covers the fan and the heat source. The heat insulating plate is disposed at one side of the first shell facing the heat source. An air insulating space is between the heat insulating plate and the first shell so that a heat insulating layer is formed. Also, an air layer is formed between the heat insulating layer and the base. The heat insulating layer prevents the transfer of the heat generated by the heat source. An air flow induced by the fan passes through air layer so as to dissipate the heat generated from the heat source.

Description

電子裝置 Electronic device

本發明是關於一電子裝置,特別是關於一種具有氣密空間及氣流空間之電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device having an airtight space and a gas flow space.

隨著資訊科技的發展,電腦已成為現代生活中不可或缺的工具。從早期的桌上型電腦,到現在筆記型電腦,都非常受到使用者的注目。 With the development of information technology, computers have become an indispensable tool in modern life. From the early desktop computers to the current notebook computers, they are very popular with users.

以筆記型電腦而言,其方便攜帶的特性非常受到歡迎。因此使用者對於筆記型電腦的外觀、功能以及使用時的舒適度等,也有更高的需求。 In terms of a notebook computer, its portability features are very popular. Therefore, the user has a higher demand for the appearance, function, and comfort of the notebook.

由於筆記型電腦中各種發熱元件集中設置於筆記型電腦的殼體之中,這使得發熱元件產生的熱較容易傳遞至筆記型電腦的殼體表面,而造成使用者之不適。 Since various heating elements in the notebook computer are collectively disposed in the casing of the notebook computer, the heat generated by the heating element is easily transmitted to the surface of the casing of the notebook computer, causing discomfort to the user.

因此,如何設計一種電子裝置,以解決筆記型電腦之熱源產生的熱量造成使用者之不適之問題,就成為設計人員需要解決的問題。 Therefore, how to design an electronic device to solve the problem of discomfort caused by the heat generated by the heat source of the notebook computer becomes a problem that the designer needs to solve.

鑒於以上的問題,本發明是關於一種電子裝置,藉以解決先前技術中筆記型電腦中熱源產生的熱量造成使用者之不適的問題。 In view of the above problems, the present invention relates to an electronic device for solving the problem of the user's discomfort caused by the heat generated by the heat source in the notebook computer in the prior art.

本發明一實施例所揭露的電子裝置,包含一底座、一第一殼件以及一隔熱板。底座上設有一風扇及一熱源。第一殼件設置於底座且覆蓋風扇及熱源。隔熱板設置於第一殼件面向熱源之一側。隔熱板與第一殼件之間具有一氣密空間以形成一絕熱層,且隔熱板與底座之間形成一氣流空間。絕熱層阻絕熱源所產生之熱能的傳遞。氣流空間供風扇所產生之一氣流流通以移除熱源所產生之熱能。 An electronic device according to an embodiment of the invention includes a base, a first cover member and a heat shield. A fan and a heat source are arranged on the base. The first shell member is disposed on the base and covers the fan and the heat source. The heat shield is disposed on a side of the first shell facing the heat source. An airtight space is formed between the heat shield and the first shell member to form a heat insulating layer, and an air flow space is formed between the heat shield panel and the base. The insulating layer blocks the transfer of thermal energy generated by the heat source. The airflow space is used by one of the fans to circulate the airflow to remove the heat generated by the heat source.

根據上述本發明實施例所揭露的電子裝置,由於第一殼件與隔熱板之間具有一氣密空間,而氣密空間內的空氣與電子裝置外的空氣不相流通。因此,氣密空間內的空氣可作為絕熱層,而可隔絕熱源產生的熱能由隔熱板傳遞至第一殼件。此外,由於氣密空間可減少熱源經由隔熱板而傳遞至第一殼件的熱量,因而可將熱源產生的熱量侷限於氣流空間內。如此一來,藉由使氣流於氣流空間流通,可移除熱源所產生的熱量。藉此,解決了先前技術中筆記型電腦中熱源產生的熱量造成使用者之不適的問題。 According to the electronic device disclosed in the above embodiments of the present invention, since the first case member and the heat insulating plate have an airtight space, the air in the airtight space does not circulate with the air outside the electronic device. Therefore, the air in the airtight space can serve as a heat insulating layer, and the heat energy generated by the heat source can be insulated from the heat insulating plate to the first case member. In addition, since the airtight space can reduce the heat transferred from the heat source to the first case member via the heat shield, the heat generated by the heat source can be limited to the air flow space. In this way, the heat generated by the heat source can be removed by circulating the airflow in the airflow space. Thereby, the problem that the heat generated by the heat source in the notebook computer in the prior art causes discomfort to the user is solved.

以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

5‧‧‧電子裝置 5‧‧‧Electronic devices

10‧‧‧底座 10‧‧‧Base

100‧‧‧風扇 100‧‧‧fan

110‧‧‧主機板 110‧‧‧ motherboard

112‧‧‧熱源 112‧‧‧heat source

20‧‧‧第一殼件 20‧‧‧ first shell

200‧‧‧板體 200‧‧‧ board

202‧‧‧承載面 202‧‧‧ bearing surface

204‧‧‧風扇口 204‧‧‧Fankou

210‧‧‧側牆 210‧‧‧Side wall

212‧‧‧插槽 212‧‧‧ slots

30‧‧‧隔熱板 30‧‧‧ Thermal insulation board

300‧‧‧底板 300‧‧‧floor

310‧‧‧側板 310‧‧‧ side panels

320‧‧‧擋牆 320‧‧‧Retaining wall

322‧‧‧缺口 322‧‧‧ gap

40‧‧‧第二殼件 40‧‧‧Second shell

50‧‧‧氣密空間 50‧‧‧ airtight space

60‧‧‧氣流空間 60‧‧‧ airflow space

70‧‧‧偽卡 70‧‧‧Pseudo-card

72‧‧‧開口 72‧‧‧ openings

74‧‧‧導流壁面 74‧‧‧ Diversion wall

第1A圖為根據本發明一實施例所揭露的電子裝置之立體示意圖。 FIG. 1A is a perspective view of an electronic device according to an embodiment of the invention.

第1B圖為第1A圖之電子裝置之分解圖。 Fig. 1B is an exploded view of the electronic device of Fig. 1A.

第2圖為第1A圖之電子裝置之部分結構剖視圖。 Fig. 2 is a cross-sectional view showing a part of the structure of the electronic device of Fig. 1A.

第3A圖為第1A圖之電子裝置之部分結構分解圖。 Fig. 3A is a partial exploded view of the electronic device of Fig. 1A.

第3B圖為第1A圖之電子裝置之部分結構示意圖。 FIG. 3B is a partial structural diagram of the electronic device of FIG. 1A.

第3C圖為第1A圖之電子裝置之部分結構側視圖。 Fig. 3C is a side view showing a part of the structure of the electronic device of Fig. 1A.

第3D圖為第1A圖之電子裝置之部分結構上視圖。 Fig. 3D is a partial structural top view of the electronic device of Fig. 1A.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

首先請參閱第1A圖、第1B圖及第2圖,第1A圖為根據本發明一實施例所揭露的電子裝置之立體示意圖,第1B圖為第1A圖之電子裝置之分解圖,第2圖為第1A圖之電子裝置之部分結構剖視圖。電子裝置5包含一底座10、一第一殼件20以及一隔熱板30。在本實施例及其他實施例中,電子裝置5還包含一第二殼件40。在以下敘述中,將以筆記型電腦作為電子裝置5的舉例說明。 First, please refer to FIG. 1A, FIG. 1B and FIG. 2, FIG. 1A is a perspective view of an electronic device according to an embodiment of the invention, and FIG. 1B is an exploded view of the electronic device of FIG. Figure 1 is a cross-sectional view showing a portion of the electronic device of Figure 1A. The electronic device 5 includes a base 10, a first cover member 20, and a heat shield 30. In this embodiment and other embodiments, the electronic device 5 further includes a second shell member 40. In the following description, a notebook computer will be exemplified as the electronic device 5.

在本實施例及部分其他實施例中,底座10上設有一風扇100以及設置於一主機板110上的一熱源112。底座10例如但不限於筆記型電腦之主機的底殼。熱源112例如為筆記型電腦中的中央處理器,或者是其他會產生熱量的電子元件。其中,風扇100是用以自外界吸入冷空氣或者將熱空氣自電子裝置5內抽出,藉以維持電子裝置5內的溫度,以避免電子裝置5因為溫度過高而造成故障或毀損。 In this embodiment and some other embodiments, the base 10 is provided with a fan 100 and a heat source 112 disposed on a motherboard 110. The base 10 is, for example but not limited to, a bottom case of a main body of a notebook computer. The heat source 112 is, for example, a central processing unit in a notebook computer or other electronic component that generates heat. The fan 100 is used for drawing cold air from the outside or extracting hot air from the electronic device 5, thereby maintaining the temperature in the electronic device 5, so as to prevent the electronic device 5 from malfunctioning or being damaged due to excessive temperature.

第一殼件20設置於底座10,並且第一殼件20覆蓋風扇100以及熱源112。詳細而言,第一殼件20包含一板體200以及環繞板體200的一側牆210。板體200具有一承載面202,承載面202是用以設置一輸入裝置,例如鍵盤,藉此以提供使用者輸入訊息之功能。此外,板體200還具有一風扇口204,位於風扇100上,而側牆210具有一插槽212,並且插槽212對應於風扇口204。風扇口204係用以提供空氣進出電子裝置5之開孔,而插槽212可以是一安全數碼卡(Secure Digital Card,SD Card)之插孔,而使用者可將一安全數碼卡插設於插槽212,藉以提供電子裝置5額外的功能。 The first case member 20 is disposed on the base 10, and the first case member 20 covers the fan 100 and the heat source 112. In detail, the first case member 20 includes a plate body 200 and a side wall 210 surrounding the board body 200. The board body 200 has a carrying surface 202 for providing an input device, such as a keyboard, for providing a function for the user to input a message. In addition, the board 200 also has a fan port 204 on the fan 100, and the side wall 210 has a slot 212, and the slot 212 corresponds to the fan port 204. The fan port 204 is for providing air into and out of the opening of the electronic device 5, and the slot 212 can be a socket of a Secure Digital Card (SD Card), and the user can insert a secure digital card into the slot. The slot 212 provides additional functionality to the electronic device 5.

隔熱板30設置於第一殼件20面向熱源112之一側,並且隔熱板30是介於底座10以及第一殼件20之間。更詳細來說,隔熱板30是位於熱源112以及第一殼件20之間。隔熱板30包含一底板300、一側板310以及一擋牆320。 The heat shield 30 is disposed on one side of the first case 20 facing the heat source 112, and the heat shield 30 is interposed between the base 10 and the first case 20. In more detail, the heat shield 30 is located between the heat source 112 and the first shell member 20. The heat shield 30 includes a bottom plate 300, a side plate 310, and a retaining wall 320.

側板310豎立於底板300,並且側板310係自底板300的端緣延伸。其中,側板310遠離底板300的一端貼合於第一殼件20。如此一來,底板300、側板310以及第一殼件20之間共同形成了一氣密空間50(如第2圖所示),而氣密空間50內的空氣與電子裝置5外的空氣不相流通。由於空氣具有較低的熱傳導係數,因此氣密空間50內的空氣可作為一絕熱層。藉此,可減少由隔熱板30傳遞至第一殼件20的熱量,藉以避免第一殼件20表面之溫度因為被熱源112加熱而升溫。 The side panel 310 is erected on the bottom panel 300, and the side panel 310 extends from the end edge of the bottom panel 300. The one end of the side plate 310 away from the bottom plate 300 is attached to the first case member 20 . As a result, an airtight space 50 (shown in FIG. 2) is formed between the bottom plate 300, the side plate 310, and the first case member 20, and the air in the airtight space 50 is not in phase with the air outside the electronic device 5. Circulation. Since the air has a lower heat transfer coefficient, the air in the airtight space 50 can serve as a heat insulating layer. Thereby, the heat transferred from the heat insulating panel 30 to the first shell member 20 can be reduced, so as to prevent the temperature of the surface of the first shell member 20 from being heated by the heat source 112.

擋牆320豎立於底板300遠離第一殼件20的一側,也就是底板300相反於側板310的一側,並且擋牆320係自底板300的端緣延伸。 擋牆320與底座10之間形成一氣流空間60,氣流空間60內的空氣可與電子裝置5外的空氣相流通,亦即電子裝置5外的空氣可進出電子裝置5內的氣流空間60。此外,由於氣密空間50可減少熱源112經由隔熱板30而傳遞至第一殼件20的熱量,因而氣密空間50可將熱源112產生的熱量侷限於氣流空間60內。 The retaining wall 320 is erected on a side of the bottom plate 300 away from the first case member 20, that is, the side of the bottom plate 300 opposite to the side plate 310, and the retaining wall 320 extends from the end edge of the bottom plate 300. An air flow space 60 is formed between the retaining wall 320 and the base 10. The air in the air flow space 60 can circulate with the air outside the electronic device 5, that is, the air outside the electronic device 5 can enter and exit the airflow space 60 in the electronic device 5. In addition, since the airtight space 50 can reduce the heat transferred from the heat source 112 to the first case member 20 via the heat shield plate 30, the airtight space 50 can confine the heat generated by the heat source 112 to the air flow space 60.

在本實施例中,擋牆320上具有至少一缺口322,而缺口322係介於插槽212與風扇口204之間。 In this embodiment, the retaining wall 320 has at least one notch 322 therein, and the notch 322 is interposed between the slot 212 and the fan port 204.

第二殼件40疊設於第一殼件20,並且第一殼件20是介於第二殼件40以及隔熱板30之間。其中,第二殼件40例如是一作為第一殼件20外觀件之鋁皮,藉此以美化第一殼件20之外觀。由於氣密空間50內的空氣所形成之絕熱層與隔熱板30可減少熱源112產生的熱量傳遞至第一殼件20,因此得以進一步減少熱源112產生的熱量傳遞置至第二殼件40之表面。如此一來,當使用者之手腕置於第二殼件40上對鍵盤進行輸入操作時,可減少因為第二殼件40之表面的溫度過高而造成使用者之不適的問題。 The second case member 40 is stacked on the first case member 20, and the first case member 20 is interposed between the second case member 40 and the heat insulation plate 30. Wherein, the second shell member 40 is, for example, an aluminum sheath which is an appearance member of the first shell member 20, thereby beautifying the appearance of the first shell member 20. Since the heat insulating layer formed by the air in the airtight space 50 and the heat insulating panel 30 can reduce the heat generated by the heat source 112 to the first shell member 20, the heat transfer generated by the heat source 112 can be further reduced to the second shell member 40. The surface. In this way, when the user's wrist is placed on the second case member 40 to perform an input operation on the keyboard, the problem that the user's discomfort is caused by the excessive temperature of the surface of the second case member 40 can be reduced.

接著請參閱第2圖、第3A圖至第3D圖,第3A圖為第1A圖之電子裝置之部分結構分解圖,第3B圖為第1A圖之電子裝置之部分結構示意圖,第3C圖為第1A圖之電子裝置之部分結構側視圖,第3D圖為第1A圖之電子裝置之部分結構上視圖。在本實施例及部分其他實施例中,電子裝置5還包含一偽卡70,偽卡70插設於插槽212。藉此,偽卡70可遮蔽插槽212,以減少灰塵等雜質進入電子裝置5而造成電子裝置5的故障甚至毀損。此外,偽卡70具有一開口72,插槽212顯露出偽卡70的開口72,而開口72對應於風扇口204,並且開口72、插槽212、氣流空間60以及風 扇口204彼此相連通。此外,在本實施例及部分其他實施例中,偽卡70還具有一導流壁面74,導流壁面74面向開口72,導流壁面74例如為一弧形壁面。因此,偽卡70可提供一風流之流道而讓外界冷空氣得以進出電子裝置5。 Next, please refer to FIG. 2, FIG. 3A to FIG. 3D, FIG. 3A is a partial structural exploded view of the electronic device of FIG. 1A, and FIG. 3B is a partial structural view of the electronic device of FIG. 1A, and FIG. 3C is a schematic view of the electronic device. A side view of a partial structure of the electronic device of FIG. 1A, and FIG. 3D is a partial structural top view of the electronic device of FIG. 1A. In this embodiment and some other embodiments, the electronic device 5 further includes a pseudo card 70, and the pseudo card 70 is inserted into the slot 212. Thereby, the dummy card 70 can shield the slot 212 to reduce impurities such as dust from entering the electronic device 5, thereby causing malfunction or even damage of the electronic device 5. In addition, the dummy card 70 has an opening 72, the slot 212 revealing the opening 72 of the dummy card 70, and the opening 72 corresponds to the fan port 204, and the opening 72, the slot 212, the air flow space 60, and the wind The fan ports 204 are in communication with each other. In addition, in this embodiment and some other embodiments, the dummy card 70 further has a flow guiding wall surface 74 facing the opening 72, and the guiding wall surface 74 is, for example, an arcuate wall surface. Therefore, the dummy card 70 can provide a flow path for the airflow to allow outside cold air to enter and exit the electronic device 5.

當風扇100運轉時,風扇100可將一外界的氣流A自外界吸入電子裝置5,氣流A經由開口72進入插槽212內而流入氣流空間60。藉由導流壁面74的導引,氣流A進入風扇口204,藉此使氣流A流經電子裝置5內的熱源112以及隔熱板30,以將熱源112產生的熱量以及隔熱板30所吸收的熱量帶出電子裝置5,如此可更加地減少傳遞至第一殼件20以及第二殼件40的熱量,而可避免第一殼件20以及第二殼件40的表面溫度過高之問題。其中,導流壁面74的弧面設計可進一步提昇氣流A移除熱量的效率。藉此,當使用者操作電子裝置5時,可避免因第一殼件20以及第二殼件40的溫度過高而造成使用者之不適的問題。 When the fan 100 is in operation, the fan 100 can draw an external airflow A from the outside into the electronic device 5, and the airflow A enters the slot 212 through the opening 72 to flow into the airflow space 60. By the guiding of the guiding wall surface 74, the airflow A enters the fan port 204, thereby causing the airflow A to flow through the heat source 112 and the heat insulating plate 30 in the electronic device 5, so as to heat the heat generated by the heat source 112 and the heat insulating plate 30. The absorbed heat is taken out of the electronic device 5, so that the heat transferred to the first case member 20 and the second case member 40 can be further reduced, and the surface temperature of the first case member 20 and the second case member 40 can be prevented from being excessively high. problem. Wherein, the curved surface design of the flow guiding wall surface 74 can further improve the efficiency of the heat removal of the airflow A. Thereby, when the user operates the electronic device 5, the problem that the user's discomfort is caused by the excessive temperature of the first case member 20 and the second case member 40 can be avoided.

根據上述本發明實施例所揭露的電子裝置,由於第一殼件與隔熱板之間具有一氣密空間,而氣密空間內的空氣與電子裝置外的空氣不相流通。因此,氣密空間內的空氣可作為絕熱層,而可隔絕熱源產生的熱能由隔熱板傳遞至第一殼件。此外,由於氣密空間可減少熱源經由隔熱板而傳遞至第一殼件的熱量,因而可將熱源產生的熱量侷限於氣流空間內。如此一來,藉由使氣流於氣流空間流通,可移除熱源所產生的熱量。藉此,解決了先前技術中筆記型電腦中熱源產生的熱量造成使用者之不適的問題。 According to the electronic device disclosed in the above embodiments of the present invention, since the first case member and the heat insulating plate have an airtight space, the air in the airtight space does not circulate with the air outside the electronic device. Therefore, the air in the airtight space can serve as a heat insulating layer, and the heat energy generated by the heat source can be insulated from the heat insulating plate to the first case member. In addition, since the airtight space can reduce the heat transferred from the heat source to the first case member via the heat shield, the heat generated by the heat source can be limited to the air flow space. In this way, the heat generated by the heat source can be removed by circulating the airflow in the airflow space. Thereby, the problem that the heat generated by the heat source in the notebook computer in the prior art causes discomfort to the user is solved.

此外,藉由位於插槽內的偽卡其所具有的開口以及導流壁面 之設計,使外界的冷空氣可自開口流入電子裝置,可進一步降低第一殼件以及第二殼件的溫度。 In addition, the opening of the dummy card located in the slot and the wall of the diversion wall The design allows the cold air from the outside to flow into the electronic device from the opening, which can further reduce the temperature of the first shell member and the second shell member.

雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

5‧‧‧電子裝置 5‧‧‧Electronic devices

10‧‧‧底座 10‧‧‧Base

100‧‧‧風扇 100‧‧‧fan

110‧‧‧主機板 110‧‧‧ motherboard

112‧‧‧熱源 112‧‧‧heat source

20‧‧‧第一殼件 20‧‧‧ first shell

200‧‧‧板體 200‧‧‧ board

202‧‧‧承載面 202‧‧‧ bearing surface

204‧‧‧風扇口 204‧‧‧Fankou

210‧‧‧側牆 210‧‧‧Side wall

212‧‧‧插槽 212‧‧‧ slots

30‧‧‧隔熱板 30‧‧‧ Thermal insulation board

322‧‧‧缺口 322‧‧‧ gap

40‧‧‧第二殼件 40‧‧‧Second shell

Claims (7)

一種電子裝置,包含:一底座,該底座上設有一風扇及一熱源;一第一殼件,設置於該底座且覆蓋該風扇及該熱源;以及一隔熱板,設置於該第一殼件面向該熱源之一側,該隔熱板與該第一殼件之間具有一氣密空間以形成一絕熱層,且該隔熱板與該底座之間形成一氣流空間,該絕熱層阻絕該熱源所產生之熱能的傳遞,該氣流空間供該風扇所產生之一氣流流通以移除該熱源所產生之熱能。 An electronic device comprising: a base having a fan and a heat source; a first cover member disposed on the base and covering the fan and the heat source; and a heat shield disposed on the first cover member Facing one side of the heat source, an airtight space is formed between the heat insulating plate and the first shell member to form a heat insulating layer, and an air flow space is formed between the heat insulating plate and the base, and the heat insulating layer blocks the heat source The transfer of generated thermal energy for the airflow generated by the fan to circulate to remove thermal energy generated by the heat source. 如請求項1所述之電子裝置,其中該第一殼件包含一板體以及環繞於該板體周緣的一側牆,該板體具有一風扇口,位於該風扇上,該側牆具有一插槽對應該風扇口,該氣流經由該插槽流進該電子裝置內,並經由該風扇口排出該電子裝置外。 The electronic device of claim 1, wherein the first casing comprises a plate body and a side wall surrounding the periphery of the plate body, the plate body having a fan port on the fan, the side wall having a wall The slot corresponds to the fan port, and the airflow flows into the electronic device through the slot, and is discharged outside the electronic device via the fan port. 如請求項2所述之電子裝置,更包含一偽卡,插設於該插槽,該偽卡具有一開口,該插槽顯露出該開口,該開口對應於該風扇口,該氣流經由該開口流進該電子裝置內。 The electronic device of claim 2, further comprising a pseudo card inserted in the slot, the pseudo card having an opening, the slot revealing the opening, the opening corresponding to the fan port, the airflow passing through the The opening flows into the electronic device. 如請求項3所述之電子裝置,其中該偽卡更具有至少一導流壁面,面向該開口。 The electronic device of claim 3, wherein the dummy card further has at least one flow guiding wall facing the opening. 如請求項2所述之電子裝置,其中該隔熱板包含一底板及一擋牆,該擋牆豎立於該底板遠離該第一殼件的一側,該擋牆上具有至少一缺口,介於該自該插槽與該風扇口之間。 The electronic device of claim 2, wherein the heat shield comprises a bottom plate and a retaining wall, the retaining wall is erected on a side of the bottom plate away from the first shell member, the retaining wall having at least one gap, Between the slot and the fan port. 如請求項1所述之電子裝置,更包含一第二殼件,疊設於該第一殼件,且該第一殼件介於該第二殼件與該隔熱板之間。 The electronic device of claim 1, further comprising a second case member stacked on the first case member, and the first case member is interposed between the second case member and the heat shield plate. 如請求項1所述之電子裝置,其中該隔熱板包含一底板以及豎立於該底板的一側板,該側板遠離該底板的一端貼合於該第一殼件,該底板、該側板及該第一殼件共同形成該氣密空間。 The electronic device of claim 1, wherein the heat shield comprises a bottom plate and a side plate standing on the bottom plate, and an end of the side plate away from the bottom plate is attached to the first shell member, the bottom plate, the side plate and the bottom plate The first shell member together forms the airtight space.
TW102119496A 2013-05-31 2013-05-31 Electronic device TWI555464B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549599B (en) * 2014-12-08 2016-09-11 英業達股份有限公司 Electronic device
CN106455409A (en) * 2015-08-11 2017-02-22 奇鋐科技股份有限公司 Handheld device heat insulation structure and handheld device having heat insulation structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW519865B (en) * 2001-07-31 2003-02-01 Leu-Wen Tsay High efficiency heat sink
JP4426943B2 (en) * 2004-10-27 2010-03-03 インターナショナル・ビジネス・マシーンズ・コーポレーション Electronic device provided with cooling device inside casing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549599B (en) * 2014-12-08 2016-09-11 英業達股份有限公司 Electronic device
CN106455409A (en) * 2015-08-11 2017-02-22 奇鋐科技股份有限公司 Handheld device heat insulation structure and handheld device having heat insulation structure
CN106455409B (en) * 2015-08-11 2019-11-26 奇鋐科技股份有限公司 Hand-held device heat insulation structural and hand-held device with heat insulation structural

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