CN104780735B - Electronic device and its assemble method with heat sinking function - Google Patents
Electronic device and its assemble method with heat sinking function Download PDFInfo
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- CN104780735B CN104780735B CN201410012148.7A CN201410012148A CN104780735B CN 104780735 B CN104780735 B CN 104780735B CN 201410012148 A CN201410012148 A CN 201410012148A CN 104780735 B CN104780735 B CN 104780735B
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- housing
- electronic device
- conducting pipe
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- heat conducting
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Abstract
The present invention provides a kind of electronic device and its assemble method with heat sinking function, electronic device includes one first housing, one second housing, one radiator and a heat conducting pipe, first housing is relatively arranged on the second housing, a circuit board and radiator with an at least heating electronic package are equipped between first housing and the second housing, heat conducting pipe is arranged at an outer surface of the second housing, at least a heating electronic package and radiator of its both ends respectively between the first housing and the second housing are connected, such heat conducting pipe can will at least caused by a heating electronic package thermal energy conduction to radiator, radiator drains into thermal energy outside electronic device.From the above, an at least heating electronic package and radiator connection of the heat conducting pipe of the present invention between the outside of the second housing and the first housing and the second housing, such heat conducting pipe need not pass through other electronic building bricks between the first housing and the second housing, in order to the setting of heat conducting pipe, and then the effect of easy assembling.
Description
【Technical field】
The present invention is related to a kind of electronic device and its assemble method, its espespecially a kind of electronic device with heat sinking function
And its assemble method.
【Background technology】
The electronic devices such as traditional desktop PC, notebook computer or industrial computer are pacified in housing
Fill all electronic building bricks, each electronic building brick can produce thermal energy, especially central processing unit, hard disk or memory etc. when running
Electronic building brick, therefore at least a radiator or radiator structure are usually set by those electronic building bricks for producing a large amount of heat sources,
Such as：Radiating fin, radiator fan or heat emission hole, housing is directed to by radiator or radiator structure by the heat source in housing
Outside, to reduce the temperature of electronic device, make electronic device energy normal operation.
Since most electronic device all sets radiator fan (or radiating fin) and heat emission hole to radiate, make electronics
Space in the housing of device is communicated with the space outside housing, electronic device is had preferable heat dissipation effect.But dissipate
The electronic building brick that Hot-air fan (or radiating fin) can directly not generate heat in contact electronic device, so radiator fan (or heat radiating fin
Piece) thermal energy caused by electronic building brick can not be led directly to the outside of electronic device completely, it will usually increase by a heat conducting pipe.
Heat conducting pipe connects electronic building brick and radiator fan (or radiating fin), by thermal energy caused by heat conducting pipe guiding electronic building brick extremely
Heat source is directed to the outside of electronic device by radiator fan (or radiating fin), radiator fan (or radiating fin) again.Usually lead
Heat pipe is arranged in the housing of electronic device, in order to connect radiator fan (or radiating fin), it is necessary to through those electronic building bricks,
Even change the setting position of electronic building brick, cause heat conducting pipe in the inconvenience in setting, and then produce the problem of not being easily assembled.
In view of the above problem, the present invention provides a kind of electronic device and its assemble method with heat sinking function, it is led
Heat pipe is arranged at the outside of the housing of electronic device, then is connected with the heating electronic package in electronic device with radiator, such as
This need not be placed through other electronic building bricks in housing, need not also change the setting position of electronic building brick, so that heat conducting pipe
It is more convenient to set, and then easily assembling.
【The content of the invention】
The purpose of the present invention, there is provided a kind of electronic device and its assemble method with heat sinking function, it, which has, is connected to
Few a heating electronic package and a heat conducting pipe, and heat conducting pipe is arranged at the outside of a housing of the electronic device, is not passed through position
Between other electronic building bricks in the housing, so increase the convenience of the setting of heat conducting pipe, and then hold easy-to-assemble
Effect.
In order to reach above-mentioned censured each purpose and effect, the present invention discloses a kind of electronics dress with heat sinking function
Put, it includes：One first housing；One second housing, is relatively arranged on first housing, and has an electricity between first housing
Road plate, the circuit board have an at least heating electronic package；One radiator, is arranged at first housing；And a heat conducting pipe,
Second housing is arranged at, and there is a first end and a second end, which connects an at least heating electronic package, should
Second end connects the radiator；Wherein at least thermal energy caused by a heating electronic package is directed to this and dissipated by the heat conducting pipe
Thermal energy, is then discharged the outside of the electronic device by thermal.
The present invention also provides a kind of assemble method of the electronic device with heat sinking function, it includes：One first shell is provided
Body and one second housing, first housing are relatively arranged on second housing；One heat conducting pipe is installed in second housing, the heat conduction
Pipe has a first end and a second end；One circuit board is set between first housing and second housing, circuit board tool
There is an at least heating electronic package, the first end of the heat conducting pipe connects an at least heating electronic package；And one is set to dissipate
Hot charging is placed in first housing, and the second end of the heat conducting pipe connects the radiator.
【Brief description of the drawings】
Fig. 1 is the stereogram of the electronic device of the first embodiment of the present invention.
Fig. 2 is the assembling figure of the electronic device of the first embodiment of the present invention.
Fig. 3 is the schematic diagram of the second housing of the first embodiment of the present invention.
Fig. 4 is the schematic diagram of the electronic device of the second embodiment of the present invention.
Fig. 5 is the assembling figure of the electronic device of the second embodiment of the present invention.
【Embodiment】
Have a better understanding and awareness by the feature to the present invention and the effect of being reached, sincerely help with embodiment and match somebody with somebody
Detailed description is closed, is illustrated as after：
Heat conducting pipe and radiator are set in known electronic device, by least heating electronic package in electronic device
Caused thermal energy drains into the outside of electronic device, but when heat conducting pipe is arranged in electronic device, heat conducting pipe is intended to and radiator
Connection, must cause around other electronic building bricks in electronic device, or even the setting position of palpus change electronic building brick is arranged at
Heat pipe is in the inconvenience in setting.
Please refer to Fig.1 and Fig. 2, its for the electronic device of the first embodiment of the present invention stereogram and assembling figure；Such as figure
Shown, the present embodiment provides a kind of electronic device 1 with heat sinking function, the electronic device 1 of the present embodiment is a notes type meter
One keyboard base of calculation machine.Electronic device 1 includes one first housing 10, one second housing 11, a radiator 12 and a heat conduction
Pipe 13, wherein the first housing is the D parts being commonly called as in the assembling field of notebook computer, and the second housing is C parts.The
Two housings 11 are relatively arranged on the first housing 10, when wherein electronic device 1 is placed in a body surface, the one of the first housing 10
Outer surface 101 is contacts with body surface, and an outer surface 111 of the second housing 11 usually sets a keyboard and a Trackpad.
There is an accommodating space 14 between one inner surface 112 of the second housing 11 and an inner surface 102 of the first housing 10, hold
Have between emptying in 14 a circuit board 2 and other electronic building bricks (do not show in figure, such as：Hard disk, CD-ROM drive etc.), the of the present embodiment
The outer surface 111 of two housings 11 has one first through hole 113 and one second through hole 114.Heat conducting pipe 13 has a first end
131 and a second end 132, heat conducting pipe 13 be arranged at the outer surface 111 of the second housing 11, second housing 11 of right the present embodiment
Outer surface 111 is equipped with a groove 1111, and groove 1111 connects the first through hole 113 and the second through hole 114, right heat conducting pipe 13 are set
It is placed in groove 1111, heat conducting pipe 13 is not protruded the outer surface 111 of the second housing 11.The heat conducting pipe 13 of the present embodiment
It is fixed on using an at least fixing piece 15 on the outer surface 111 of the second housing 11, to prevent heat conducting pipe 13 from departing from groove 1111.Lead
The first end 131 of heat pipe 13 penetrates the first through hole 113, its second end 132 penetrates the second through hole 114.
So, circuit board 2 is arranged at the inner surface 112 of the second housing 11, and has 21 (example of an at least heating electronic package
Such as:Central processing unit or memory), an at least heating electronic package 21 corresponds to the first through hole 113, and with the first of heat conducting pipe 13
The connection of end 131.In addition, radiator 12 is arranged between the first housing 10 and the second housing 11, i.e., in accommodating space 14,
And the side wall 115 of neighbouring second housing 11, and corresponding second through hole 114, wherein side wall 115 have plural heat emission hole 1151,
Those heat emission holes 1151 correspond to radiator 12.So, radiator 12 is connected with the second end 132 of heat conducting pipe 13, so i.e. complete
Into the assembling of electronic device 1.
Also referring to Fig. 3, it is the schematic diagram of the second housing of the first embodiment of the present invention；As shown in the figure, this reality
The radiator 12 for applying example includes a radiating fin 121 and a fan 122.Radiating fin 121 sets the second end of heat conducting pipe 13
132, and those heat emission holes 1151 of the side wall 115 of corresponding second housing 11, fan 122 are located at the side of radiating fin 121, its
Air outlet 1221 corresponds to radiating fin 121, and thermal energy is by the of heat conducting pipe 13 so at least caused by a heating electronic package 21
One end 131 is conducted to the second end 132 of heat conducting pipe 13, and conducts to the radiating fin 121 of radiator 12, fan 122
Air port 1221 provides wind-force to radiating fin 121, to accelerate radiating fin 122 by the outside of thermal energy discharge electronic device 1.Wherein
Radiator 12 can also omit the setting of fan 122, single outside that thermal energy can also be discharged to electronic device 1 by radiating fin 121.
It can be seen from the above, the heat conducting pipe 13 of the present embodiment is arranged at the outer surface 111 of the second housing 11, and its be not provided with
Between first housing 10 and the second housing 11, that is, it is not located in accommodating space 14, such heat conducting pipe 13 does not have to be around electronics dress
Between putting other electronic building bricks in 1, also portion uses the setting position for changing other electronic building bricks in electronic device 1, in order to
The setting of heat conducting pipe 13.Although heat conducting pipe 13 is located on the outer surface 111 of the second housing 11, thereafter the outer surface of the second housing 11
Keyboard can be set on 111, and keyboard is covered on heat conducting pipe 13, therefore sets a cover board in the appearance of the second housing 11 without extra
Heat conducting pipe 13 is covered on face 111, so reduces component count, and then reduce cost.
Refering to Fig. 2 and Fig. 3, when the function of 1 waterproof to be had of electronic device, the second housing 11 of electronic device 1 it is interior
Surface 112 has a partition wall 116, and when the first housing 10 is assembled with 11 phase of the second housing, partition wall 116 is connected to first shell
The inner surface 102 of body 10, the accommodating space 14 between the first housing 10 and the second housing 11 is separated into one by such partition wall 116 to be prevented
141 and one non-watertight area 142 of aqua region.Circuit board 2 is arranged in watertight area 141, and radiator 12 is arranged at non-waterproof
In region 142, heat conducting pipe 13 is sent out from the outer surface 111 of the second housing 11 with least one of the circuit board 2 in watertight area 141
Radiator 12 in thermoelectricity sub-component 21 and non-watertight area 142 connects, and such heat conducting pipe 13 does not run through partition wall 116, institute
Any gap is not produced with partition wall 116, and exterior aqueous vapor and dust can enter non-watertight area 142, but can not pass through and divide
Next door 116 and enter watertight area 141 in.
Fig. 4 and Fig. 5 is referred to, it is the schematic diagram and assembling figure of the electronic device of the second embodiment of the present invention；Such as figure
Shown, in order to enable watertight area 141 to reach the effect of completely waterproof, the present embodiment is gone back in the outer surface 111 of the second housing 11
One cover board 117 is set, and cover board 117 is arranged at the first through hole 113, and is covered in the first end 131 of heat conducting pipe 13, outer to prevent
The aqueous vapor and dust in portion enter watertight area 141 from the first through hole 113.In addition, can also be in an at least heating electronic package 21
Being additionally provided with a waterproof layer 16 between cover board 117, i.e. waterproof layer 16 covers the first through hole 113, and positioned at the of heat conducting pipe 13
Between one end 131 and heating electronic package 21, the aqueous vapor and dust that can more prevent outside enter anti-pool from the first through hole 113
In domain 141.Wherein, waterproof layer 16 is usually first set in the second housing 11, and is covered in the first through hole 113, it is then near again
A few heating electronic package 21 is arranged at waterproof layer 16.
In conclusion the present invention provides a kind of electronic device and its assemble method with heat sinking function, it utilizes heat conduction
Pipe connection at least a heating electronic package and radiator, electronic device is directed to by thermal energy caused by heating electronic package
Outside.So, heat conducting pipe of the invention is arranged at the outside of electronic device, then an at least heating electronic package internal with it and
Radiator connects, i.e., heat conducting pipe is not provided with, in the inside of electronic device, need not also bypassing other electricity in electronic device
Between sub-component, it need not more change the setting position of other electronic building bricks in electronic device, so increase the setting of heat conducting pipe
Convenience, the effect of reaching easy assembling.
In addition, when having watertight area and non-watertight area in electronic device, heat conducting pipe is not provided with electronic device
Portion, so heat conducting pipe does not pass through the partition wall between watertight area and non-watertight area, partition wall will not produce any gap,
To allow exterior aqueous vapor and dust to enter from non-watertight area through partition wall in watertight area.In addition cover board and waterproof are also set up
Layer is in the first through hole on watertight area, to prevent the aqueous vapor of outside and dust from entering watertight area from the first through hole, such as
This makes electronic device reach the effect of completely waterproof.
Only as described above, is only the embodiment of the present invention, is not used for limiting the scope that the present invention is implemented, such as
According to the equivalent changes and modifications carried out by the shape described in scope of the present invention patent, construction, feature and spirit, should all be included in
In the claim of the present invention.
Claims (17)
1. a kind of electronic device with heat sinking function, it is characterised in that the electronic device includes：
One first housing；
One second housing, is relatively arranged on first housing, and has a circuit board between first housing, which has
An at least heating electronic package；
One radiator, is arranged at first housing；
One heat conducting pipe, is arranged at second housing, and has a first end and a second end, which connects at least one hair
Thermoelectricity sub-component, the second end connect the radiator；
Wherein there is in the second shell body partition wall, the partition wall will have between first housing and second housing one
Accommodating space is separated into a watertight area and a non-watertight area, the circuit board are arranged in the watertight area, the radiator
It is arranged in the non-watertight area, it is accommodating that the part which is situated between the first end and the second end is positioned essentially at this
Outside space, by this, at least thermal energy caused by a heating electronic package is directed to the radiator to the heat conducting pipe, then by heat
The outside of the electronic device can be discharged.
2. the electronic device according to claim 1 with heat sinking function, it is characterised in that second housing includes one the
Pass through aperture and one second through hole, an at least heating electronic package correspond to first through hole, the heat conducting pipe this first
End and connects an at least heating electronic package through first through hole, and the second end of the heat conducting pipe second is passed through through this
Perforation, and connect the radiator.
3. the electronic device according to claim 1 with heat sinking function, it is characterised in that the partition wall be connected to this
One housing, the heat conducting pipe do not run through the partition wall.
4. the electronic device according to claim 2 with heat sinking function, it is characterised in that the electronic device also wraps
Contain：
One waterproof layer, covers first through hole, and positioned at the first end of an at least heating electronic package and the heat conducting pipe
Between.
5. the electronic device according to claim 2 with heat sinking function, it is characterised in that the electronic device also wraps
Contain：
One cover board, it sets second housing, and is covered in first through hole and the first end of the heat conducting pipe.
6. the electronic device according to claim 1 with heat sinking function, it is characterised in that the side wall tool of first housing
There is plural heat emission hole, which corresponds to those heat emission holes.
7. the electronic device according to claim 6 with heat sinking function, it is characterised in that the radiator includes one and dissipates
Hot fin, the radiating fin correspond to those heat emission holes.
8. the electronic device according to claim 7 with heat sinking function, it is characterised in that the radiator also includes one
Fan, the fan are arranged at the side of the radiating fin.
9. the electronic device according to claim 1 with heat sinking function, it is characterised in that the electronic device also includes：
An at least fixing piece, is arranged at second housing, and fixes the heat conducting pipe in second housing.
10. the electronic device according to claim 1 with heat sinking function, it is characterised in that at least one fever electronics
Component is central processing unit.
11. a kind of assemble method of the electronic device with heat sinking function, it is characterised in that the assemble method includes：
One first housing and one second housing are provided, which is relatively arranged on second housing, wherein second housing
Inside there is a partition wall, which is separated into one by the accommodating space having between first housing and second housing prevents
Aqua region and a non-watertight area；
One heat conducting pipe is installed in second housing, which has a first end and a second end, the heat conducting pipe be situated between this
Part between one end and the second end is positioned essentially at outside the accommodating space；
One circuit board is set in the watertight area, which has an at least heating electronic package, the heat conducting pipe this
One end connects an at least heating electronic package；
Setting a radiator, the second end of the heat conducting pipe connects the radiator in the non-watertight area.
12. the assemble method of the electronic device according to claim 11 with heat sinking function, it is characterised in that this second
Housing includes one first through hole and one second through hole, which covers first through hole, this is led
The first end of heat pipe passes through first through hole, and connects an at least heating electronic package, the second end of the heat conducting pipe
Through second through hole, and connect the radiator.
13. the assemble method of the electronic device according to claim 11 with heat sinking function, it is characterised in that setting should
Also included before the step of circuit board：
One waterproof layer is set in second housing, and is covered in one first through hole of second housing.
14. the assemble method of the electronic device according to claim 13 with heat sinking function, it is characterised in that setting should
The step of circuit board, also includes：
An at least heating electronic package is set in the waterproof layer, and connects the first end of the heat conducting pipe.
15. the assemble method of the electronic device according to claim 11 with heat sinking function, it is characterised in that the assembling
Method also includes：
One cover board is set in second housing, the cover board cover second housing one first through hole and the heat conducting pipe this
One end.
16. the assemble method of the electronic device according to claim 11 with heat sinking function, it is characterised in that the assembling
Method also includes：
An at least fixing piece is set to fix the heat conducting pipe in second housing in second housing, an at least fixing piece.
17. the assemble method of the electronic device according to claim 11 with heat sinking function, it is characterised in that this is at least
One heating electronic package is central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012148.7A CN104780735B (en) | 2014-01-10 | 2014-01-10 | Electronic device and its assemble method with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012148.7A CN104780735B (en) | 2014-01-10 | 2014-01-10 | Electronic device and its assemble method with heat sinking function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104780735A CN104780735A (en) | 2015-07-15 |
| CN104780735B true CN104780735B (en) | 2018-04-20 |
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ID=53621871
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410012148.7A Active CN104780735B (en) | 2014-01-10 | 2014-01-10 | Electronic device and its assemble method with heat sinking function |
Country Status (1)
| Country | Link |
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| CN (1) | CN104780735B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623637A (en) * | 2017-10-26 | 2018-01-23 | 昆山六二丰塑胶电子有限公司 | Router and its assemble method |
| TWI761926B (en) * | 2020-08-26 | 2022-04-21 | 英業達股份有限公司 | Server device |
| CN114126329A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Heat dissipation assembly and automobile |
| CN114167945A (en) * | 2020-09-11 | 2022-03-11 | 神讯电脑(昆山)有限公司 | Extended electronic device and electronic system |
| TWI820918B (en) * | 2022-09-19 | 2023-11-01 | 神基科技股份有限公司 | Electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2840165Y (en) * | 2005-09-02 | 2006-11-22 | 上海环达计算机科技有限公司 | Noise suppressing structure of radiating module |
| CN2898908Y (en) * | 2005-12-14 | 2007-05-09 | 上海环达计算机科技有限公司 | Structure improvement of military-industry rule notebook computer |
| CN101742872A (en) * | 2008-11-14 | 2010-06-16 | 和硕联合科技股份有限公司 | Radiation module and electronic device using same |
-
2014
- 2014-01-10 CN CN201410012148.7A patent/CN104780735B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2840165Y (en) * | 2005-09-02 | 2006-11-22 | 上海环达计算机科技有限公司 | Noise suppressing structure of radiating module |
| CN2898908Y (en) * | 2005-12-14 | 2007-05-09 | 上海环达计算机科技有限公司 | Structure improvement of military-industry rule notebook computer |
| CN101742872A (en) * | 2008-11-14 | 2010-06-16 | 和硕联合科技股份有限公司 | Radiation module and electronic device using same |
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| CN104780735A (en) | 2015-07-15 |
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