JP6726897B2 - Electronics - Google Patents

Description

The present disclosure relates to an electronic device including a housing that houses electronic components.

Patent Document 1 discloses a structure for dissipating heat generated by an electronic component housed inside a housing to an external space in an electronic device. In this structure, a fan having a cooling fin and a heat pipe for transmitting the heat generated by the heat-generating component to the cooling fin are provided in the housing.

JP, 2013-41334, A

In the structure disclosed in Patent Document 1, it is necessary to dispose a fan, a heat pipe, or the like inside the housing, which complicates the structure of the housing of the electronic device.

An object of the present disclosure is to make it possible to dissipate heat generated by an electronic component housed inside a housing to an external space with a simple structure in an electronic device.

The electronic device of the present disclosure is
Electronic components,
And a metal housing that houses electronic components.
The electronic component is in contact with the inner surface of the housing in a heat conductive manner.
A fin for heat dissipation is formed on the outer surface of the housing.

According to the electronic device of the present disclosure, heat generated by an electronic component can be radiated to a space outside the casing via a fin for heat dissipation formed on an outer surface of a metal casing that houses the electronic component. You can Therefore, the heat generated by the electronic components housed inside the housing can be radiated to the external space with a simple structure.

It is a perspective view of the upper surface side of the electronic device according to the present embodiment. It is a perspective view of the lower surface side of the electronic device according to the present embodiment. It is a perspective view of the upper surface side in the state where the upper surface cover of the electronic device according to the present embodiment is removed. It is a perspective view of the lower surface side in the state where the lower surface cover of the electronic device according to the present embodiment is removed. FIG. 1B is a partially omitted sectional perspective view taken along the line AA of FIG. 1A. FIG. 2B is a partially omitted sectional perspective view taken along the line BB of FIG. 2A. FIG. 3 is a perspective view of a single upper housing of the electronic device according to the present embodiment. It is sectional drawing (A figure) and end view ((b) figure) by the AA line of Drawing 1A.

Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed description of well-known matters and duplicate description of substantially the same configuration may be omitted. This is for avoiding unnecessary redundancy in the following description and for facilitating understanding by those skilled in the art.

The inventor provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims by these. Absent.

(Embodiment 1)
Embodiment 1 will be described below with reference to the drawings.

[1. Constitution]
[1-1. Overview of electronic devices]
FIG. 1A is a perspective view of the upper surface side of the electronic device according to the present embodiment. FIG. 1B is a perspective view of the lower surface side of the electronic device according to the present embodiment.

The electronic device 10 has a tablet shape. Here, the top surface of the electronic device 10 is one of the two main surfaces of the electronic device 10 that face each other, and the bottom surface of the electronic device 10 is the other main surface. In addition, in order to make the contents easier to understand, the notation regarding the directions such as “upper” and “lower” in the “upper face” and “lower face” and “upper” and “lower” used in correspondence with this in other explanations is made. However, the arrangement conditions and the like when manufacturing and using the electronic device of the present disclosure are not limited.

The electronic device 10 is a portable computer, and internally stores an arithmetic processing unit such as a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and an SSD (Solid State Disk). Contains various electronic components of the device. The ROM and the SSD store an OS (Operating System), various application programs, various data, and the like. The CPU realizes various functions by reading the OS, application programs, and various data and executing arithmetic processing according to the operation content of the user.

As shown in FIG. 1A, a removable top cover 130 is provided on the top surface of the electronic device 10.

As shown in FIG. 1B, a removable battery 300 and a lower surface cover 150 are provided on the lower surface of the electronic device 10.

As shown in FIGS. 1A and 1B, a side cover 140 is provided on each of four side surfaces of the electronic device 10, and various switches and interfaces are provided.

[1-2. Structure of electronic device]
The structure of the electronic device 10 will be described with reference to FIG. 2A, FIG. 2B, FIG. 3A, FIG. 3B, FIG. 4, and FIG. 5 in addition to the above-described FIG. 1A and FIG. 1B. FIG. 2A is a perspective view of the top surface side of the electronic device 10 according to the present embodiment with the top cover 130 removed. FIG. 2B is a perspective view of the lower surface side of the electronic device 10 according to the present embodiment with the lower surface cover 150 removed. 3A is a partially omitted sectional perspective view taken along the line AA of FIG. 1A. 3B is a partially omitted sectional perspective view taken along the line BB of FIG. 2A. 3A and 3B, some components such as electronic components and electronic boards housed inside the electronic device 10 are omitted. Further, the lower surface cover 150 is also omitted in FIG. 3A. Further, in FIGS. 3A and 3B, hatching of the cross-sectional portion is omitted for easy visual recognition.

As shown in FIGS. 1A and 1B, ventilation holes 130a and 130b are formed in the top cover 130. A ventilation opening 150a is formed in the lower surface cover 150.

When the top cover 130 and the bottom cover 150 are removed, the housing 100 (composed of the upper housing 110 and the lower housing 120) and the fan 200 appear as shown in FIGS. 2A and 2B. The housing 100 is provided with a duct-shaped wall portion 100h that penetrates between the upper surface and the lower surface in a tunnel shape at one end side in the longitudinal direction thereof. Hereinafter, the duct-shaped wall portion 100h is referred to as a "duct-shaped wall portion 100h". The duct-shaped wall portion 100h includes an upper duct-shaped wall portion 110h and a lower duct-shaped wall portion 120h. The fan 200 is arranged in the tunnel-shaped space Sf on the inner peripheral side of the duct-shaped wall portion 100h. Hereinafter, the tunnel-shaped space Sf is referred to as a "fan accommodation space Sf". A plurality of fins 110a for cooling are arranged near the fan 200. As shown in FIG. 2B, the lower housing 120 is provided with a substantially circular opening 120a which is formed by the lower end of the duct-shaped wall 120h and constitutes the lower end of the fan housing space Sf. The lower end side of the duct-shaped wall portion 100h has a substantially cylindrical shape corresponding to the shape of the opening 120a, and the lower end portion of the duct-shaped wall portion 110h of the upper housing 110 and the duct shape of the lower housing 120. The connection portion of the wall portion 120h with the upper end portion is substantially circular.

The fan 200 has a plurality of blades 201 and a motor 202 that rotationally drives the blades 201. The fan 200 is a waterproof type fan having a predetermined waterproof performance.

FIG. 4 is a perspective view of the upper housing 110 alone of the electronic device 10 according to the present embodiment.

As shown in FIG. 4, the fin 110 a is formed integrally with the upper housing 110.

A portion of the duct-shaped wall portion 110h near the upper housing 110 near the fin 110a is inclined so that the wind generated by the fan 200 is smoothly guided to the fin 110a, and is configured as a guide surface 110c.

Further, on the guide surface 110c of the upper housing 110, a plurality of straightening vanes 110d for vertically distributing and guiding the wind generated by the fan 200 to the plurality of fins 110a in a balanced manner are provided.

5A is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 5B is an end view taken along the line AA in FIG. 1A.

The lower housing 120 is provided with a recess 120b capable of accommodating the battery 300. A plurality of circuit boards 401, 402 and a plurality of electronic components are provided between the bottom wall portion 120c of the recess 120b and the top wall portion 110u of the upper housing 110 (including the guide surface 110c portion of the duct-shaped wall portion 110h). An electronic component housing space Sd for housing is defined.

The duct-shaped wall portion 100h is provided with a through hole (not shown) for passing a power line of the motor 202 of the fan 200 into the electronic component housing space Sd. After the power supply line is passed through, the through-hole for passing wire is waterproofed with a sealing material or the like. The duct-shaped wall portion 100h (including the guide surface 110c) is provided with an opening or a through hole for communicating the fan accommodation space Sf and the electronic component accommodation space Sd for waterproofing, in addition to the above-mentioned through hole for wire passage. Has not been done.

A lower end portion of the duct-shaped wall portion 110h on the upper housing 110 side and an upper end portion of the duct-shaped wall portion 120h on the lower housing 120 side are in contact with each other via a sealing material (not shown). Further, as described above, the duct-shaped wall portion 100h (including the guide surface 110c) communicates with the fan accommodation space Sf and the electronic component accommodation space Sd for waterproofing, in addition to the above-mentioned through hole for wire passage. No opening or through hole is provided. Therefore, it is difficult for liquid such as water to enter the electronic component housing space Sd from the fan housing space Sf communicating with the external space. That is, since the fan 200 is provided so as to be waterproofly isolated from the electronic component housing space Sd and the fins 110a are formed on the outer surface of the upper housing 110, the waterproof performance of the electronic device 10 when the cooling fan 200 is provided. Can be properly secured. Further, since the connecting portion between the lower end of the duct-shaped wall portion 110h of the upper housing 110 and the upper end of the duct-shaped wall portion 120h of the lower housing 120 is substantially circular, the lower end portion of the duct-shaped wall portion 110h is The sealing material for waterproofing the connection portion with the upper end of the duct-shaped wall portion 120h on the lower housing 120 side can be easily configured by a general O-ring or the like.

As shown in FIGS. 3A and 5, the electronic component housing space Sd houses a CPU 410 that is a main arithmetic processing unit of the electronic device 10. CPU410 is an example of an electronic component. The CPU 410 is mounted on the upper surface of the circuit board 401. The CPU 410 generates more heat than other electronic components during operation. The CPU 410 is in contact with the guide surface 110c of the upper housing 110 via the heat conductive material 420. The heat conductive material 420 can be made of, for example, a high heat conductive elastic body. The fin 110a and the ventilation opening 130b of the top cover 130 are located above the CPU 410 with the guide surface 110c interposed therebetween.

[1-3. Action]
When the electronic device 10 operates, the electronic components such as the CPU 410 generate heat in the electronic component housing space Sd. In particular, the CPU 410 generates more heat than other electronic components, but the generated heat is transferred to the guide surface 110c and the fins 110a of the upper housing 110 via the heat conducting material 420. The heat transmitted to the fins 110a is radiated to the external space through the ventilation openings 130b of the top cover 130.

Further, when the fan 200 operates when the electronic device 10 operates, the air W1 and W2 flow into the fan housing space Sf through the ventilation openings 150a of the upper cover 130 and the lower cover 150. The inflowing air W1 and W2 is guided to the fin 110a by the guide surface 110c of the upper housing 110, passes between the plurality of fins 110a, and flows out to the external space through the ventilation opening 130a of the top cover 130. When the air passes between the plurality of fins 110a, the fins 110a radiate heat to the air to cool the fins 110a. Thereby, the heat generated in the CPU 410 and transferred to the fins 110a can be appropriately radiated. Therefore, the CPU 410 can be appropriately cooled.

Further, when water enters the tunnel-shaped space Sf from either the upper surface side or the lower surface side, the water is discharged from the other surface side. Therefore, it is possible to prevent the entered water from staying.

[2. Effects, etc.]
The electronic device 10 of the present embodiment is
CPU410 (electronic component),
A metal housing 100 that houses a CPU 410 (electronic component).
The CPU 410 (electronic component) is in contact with the inner surface of the housing 100 in a heat conductive manner.
The fins 110a for heat dissipation are formed on the outer surface of the housing 100.

As a result, the heat generated by the CPU 410 (electronic component) passes through the fins 110a for heat radiation formed on the outer surface of the metal casing 100 that houses the CPU 410 (electronic component), and the space outside the casing 100. Can dissipate heat. Therefore, the heat generated by the CPU 410 (electronic component) housed inside the housing 100 can be radiated to the external space with a simple structure.

In this embodiment,
The electronic component is the CPU 410 (large-scale integrated circuit).

As a result, the heat generated by the CPU 410 (large-scale integrated circuit), which generates a relatively large amount of heat, can be radiated to the external space with a simple structure.

In this embodiment,
An upper surface cover 130 (cover) that forms an external surface of the electronic device 10 is arranged outside the housing 100,
A ventilation opening 130b (opening) for heat dissipation is provided in the top cover 130 (cover) at a position close to the fin 110a.

Thereby, the heat emitted from the fins 110a for heat radiation can be radiated to the external space through the ventilation opening 130b (opening) of the top cover 130 (cover). Therefore, even when the upper surface cover 130 (cover) is provided to make the appearance of the electronic device 10 appropriate, the electronic device 10 can be appropriately cooled.

[3. Note]
In the present embodiment, [2. In addition to the electronic device 10 having the configuration described in [Effects and the like], the following electronic devices are disclosed.
CPU410 (electronic component),
A housing 100 made of metal for accommodating a CPU 410 (electronic component),
The housing 100 is provided with a duct-shaped wall portion 100h that penetrates between the opposing upper surface and lower surface (two main surfaces) in a tunnel shape,
The fan 200 is arranged in the tunnel-shaped space Sf on the inner peripheral side of the duct-shaped wall portion 100h,
A fin 110a for heat dissipation and a guide surface 110c for guiding the wind generated by the fan 200 to the fin 110a are formed on the outer surface of the housing 100.
Electronics.

As a result, in the housing 100, the space Sf in which the fan 200 is arranged becomes the space on the outer surface side of the housing 100, and is separated from the space Sd on the inner surface side in which the CPU 410 (electronic component) is arranged. Therefore, the heat generated by the CPU 410 (electronic component) can be appropriately radiated by the fan 200 and the fins 110a while appropriately ensuring the waterproof performance of the electronic device 10.

Further, the fan 200 can take in air from both the upper surface side and the lower surface side of the housing 100.

Further, when water enters the tunnel-shaped space Sf from either the upper surface side or the lower surface side, the water is discharged from the other surface side.

It should be noted that the electronic device may be configured as follows instead of being provided with a tunnel-shaped space. That is,
Electronic devices
CPU (electronic component),
A metal housing for accommodating a CPU (electronic component),
One of the two main surfaces of the housing facing each other is depressed toward the other surface,
A fan is placed in the space on the outside of the depressed surface,
A fin for heat radiation and a guide surface for guiding the wind generated by the fan to the fin are formed on the outer surface of the housing.

As a result, in the housing, the space in which the fan is arranged becomes the space on the outer surface side of the housing and is separated from the space on the inner surface side in which the CPU (electronic component) is arranged. Therefore, the heat generated by the CPU (electronic component) can be appropriately radiated by the fan and the fin while appropriately ensuring the waterproof performance of the electronic device.

(Other embodiments)
As described above, the first embodiment has been described as an example of the technique according to the present disclosure. However, the technique in the present disclosure is not limited to this, and is also applicable to the embodiment in which changes, replacements, additions, omissions, etc. are appropriately made.
Therefore, other embodiments will be described below.

In the above embodiment, the electronic device is a portable computer that houses a CPU as an electronic component. However, in the present disclosure, the electronic device is not limited to this. The electronic component is not limited to the CPU, and may be a heat-generating electronic component such as a transistor or an image processing LSI. In addition, the electronic device may be a music reproducing device, an information terminal device, an imaging device, or the like that includes a housing that houses such an electronic component.

In the above embodiment, the electronic device does not have a display unit. However, in the present disclosure, the electronic device may have the display unit on at least one main surface. For example, the electronic device may be a smartphone or a tablet information terminal. The electronic device may be a notebook computer.

As described above, the embodiments have been described as examples of the technology according to the present disclosure. To that end, the accompanying drawings and detailed description are provided.

Therefore, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem but also the components not essential for solving the problem in order to exemplify the above technology Can also be included. Therefore, it should not be immediately recognized that these non-essential components are essential, even if those non-essential components are described in the accompanying drawings or the detailed description.

Further, since the above-described embodiment is for exemplifying the technique in the present disclosure, various changes, replacements, additions, omissions, etc. can be made within the scope of the claims or the scope of equivalents thereof.

INDUSTRIAL APPLICABILITY The present disclosure can be widely used in electronic devices that house electronic components inside a housing.

DESCRIPTION OF SYMBOLS 10 Electronic device 100 Housing 100h Duct-shaped wall 110 Upper housing 110a Fin 110c Guide surface 110d Rectifying plate 110h Duct-shaped wall 110u Upper wall 120 Lower housing 120a Opening 120b Recess 120c Bottom wall 120h Duct-shaped wall 130 Top Covers 130a, 130b Ventilation Opening 140 Side Cover 150 Bottom Cover 150a Ventilation Opening 200 Fan 201 Blade 202 Motor 300 Battery 401, 402 Circuit Board 410 CPU
420 Thermal conductive material Sd Electronic component housing space Sf Fan housing space

Claims (2)

Electronic components,
A metal housing that houses the electronic component,
The electronic component is in contact with the inner surface of the housing in a heat conductive manner,
A fin for heat dissipation is formed on the outer surface of the housing ,
A cover that forms the external surface of the electronic device is disposed outside the housing,
An opening for heat dissipation is provided in the cover at a position close to the fin,
Electronics. The electronic component is a large-scale integrated circuit,
The electronic device according to claim 1.

Images