JP2017228594A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable heat generated by electronic components housed in a housing to be radiated to an external space with a simple structure in an electronic device.SOLUTION: An electronic device 10 includes a CUP 410 and a metallic housing 100 which houses the CPU 410. The CPU 410 contacts with an inner surface of the housing 100 so as to conduct heat. Fins for heat radiation 110a are formed on an outer surface of the housing 100.SELECTED DRAWING: Figure 5

Description

  The present disclosure relates to an electronic device including a housing that houses an electronic component.

  Patent Document 1 discloses a structure for radiating heat generated by an electronic component housed in a housing to an external space in an electronic device. In this structure, a fan having a cooling fin and a heat pipe that transmits heat generated by the heat generating component to the cooling fin are provided in the housing.

JP 2013-41334 A

  In the structure disclosed in Patent Document 1, it is necessary to arrange a fan, a heat pipe, or the like inside the casing, and the structure of the casing or the like of the electronic device becomes complicated.

  An object of the present disclosure is to allow heat generated by an electronic component housed in a housing to be radiated to an external space with a simple structure in an electronic device.

The electronic device of the present disclosure is
Electronic components,
A metal housing that houses the electronic component.
The electronic component is in contact with the inner surface of the housing so as to be able to conduct heat.
A fin for heat dissipation is formed on the outer surface of the housing.

  According to the electronic device of the present disclosure, heat generated by the electronic component is radiated to a space outside the housing through the heat radiation fin formed on the outer surface of the metal housing that houses the electronic component. Can do. Therefore, the heat generated by the electronic component housed in the housing can be radiated to the external space with a simple structure.

It is a perspective view of the upper surface side of the electronic device which concerns on this embodiment. It is a perspective view of the lower surface side of the electronic device which concerns on this embodiment. It is a perspective view of the upper surface side in the state which removed the upper surface cover of the electronic device which concerns on this embodiment. It is a perspective view of the lower surface side in the state where the lower surface cover of the electronic device concerning this embodiment was removed. FIG. 1B is a partially omitted cross-sectional perspective view taken along line AA in FIG. 1A. 2B is a partially omitted cross-sectional perspective view taken along line BB in FIG. 2A. FIG. It is a perspective view of the upper case simple substance of the electronic device concerning this embodiment. It is sectional drawing ((a) figure) and end elevation ((b) figure) by the AA line of FIG. 1A.

  Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

  The inventor provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims. Absent.

(Embodiment 1)
The first embodiment will be described below with reference to the drawings.

[1. Constitution]
[1-1. Overview of electronic equipment]
FIG. 1A is a perspective view of the upper surface side of the electronic apparatus according to the present embodiment. FIG. 1B is a perspective view of the lower surface side of the electronic apparatus according to the present embodiment.

  The electronic device 10 has a tablet shape. Here, the upper surface of the electronic device 10 is one main surface of two opposing main surfaces of the electronic device 10, and the lower surface of the electronic device 10 is the other main surface. In addition, “upper” and “lower” on the “upper surface” and “lower surface” and “upper” and “lower” used in other explanations corresponding to this are used for easy understanding of the contents. It is for the sake of convenience, and does not limit the arrangement conditions and the like when manufacturing and using the electronic device of the present disclosure.

  The electronic device 10 is a portable computer, and stores therein an arithmetic processing unit such as a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read only Memory), an SSD (Solid State Disk), and the like. It contains various electronic components of the device. The ROM and SSD store an OS (Operating System), various application programs, various data, and the like. The CPU implements various functions by reading the OS, application programs, and various data, and executing arithmetic processing in accordance with user operation contents and the like.

  As shown in FIG. 1A, a detachable upper surface cover 130 is provided on the upper surface of the electronic device 10.

  As shown in FIG. 1B, a detachable battery 300 and a lower surface cover 150 are provided on the lower surface of the electronic device 10.

  As shown in FIGS. 1A and 1B, a side cover 140 is provided on each of the four side surfaces of the electronic device 10, and various switches and interfaces are provided.

[1-2. Structure of electronic equipment]
The structure of the electronic device 10 will be described with reference to FIGS. 2A, 2B, 3A, 3B, 4, and 5 in addition to the above-described FIGS. 1A and 1B. FIG. 2A is a perspective view of the upper surface side of the electronic apparatus 10 according to the present embodiment with the upper surface cover 130 removed. FIG. 2B is a perspective view of the lower surface side of the electronic device 10 according to the present embodiment with the lower surface cover 150 removed. 3A is a partially omitted cross-sectional perspective view taken along line AA in FIG. 1A. 3B is a partially omitted cross-sectional perspective view taken along line BB in FIG. 2A. 3A and 3B, some components such as an electronic component and an electronic substrate housed in the electronic device 10 are omitted. In FIG. 3A, the bottom cover 150 is also omitted. Moreover, in FIG. 3A and FIG. 3B, the hatching about the cross-sectional part is abbreviate | omitted so that it may be visually recognized easily.

  As shown in FIGS. 1A and 1B, the upper surface cover 130 is formed with ventilation openings 130a and 130b. A ventilation opening 150 a is formed in the lower surface cover 150.

  When the upper surface cover 130 and the lower surface cover 150 are removed, as shown in FIGS. 2A and 2B, the housing 100 (consisting of the upper housing 110 and the lower housing 120) and the fan 200 appear. The casing 100 is provided with a duct-like wall portion 100h that penetrates between the upper surface and the lower surface in a tunnel shape on one end side in the longitudinal direction. Hereinafter, the duct-shaped wall portion 100h is referred to as a “duct-shaped wall portion 100h”. The duct-like wall portion 100h includes an upper duct-like wall portion 110h and a lower duct-like wall portion 120h. And the fan 200 is arrange | positioned in the tunnel-shaped space Sf of the inner peripheral side of this duct-shaped wall part 100h. Hereinafter, the tunnel-shaped space Sf is referred to as “fan accommodating space Sf”. In the vicinity of the fan 200, a plurality of cooling fins 110a are arranged. As shown in FIG. 2B, the lower housing 120 is provided with a substantially circular opening 120a formed by the lower end portion of the duct-like wall portion 120h and constituting the lower end of the fan accommodating space Sf. The lower end side of the duct-like wall portion 100h has a substantially cylindrical shape corresponding to the shape of the opening 120a, and the lower end portion of the duct-like wall portion 110h of the upper housing 110 and the duct shape of the lower housing 120. The connection part with the upper end part of the wall part 120h is substantially circular.

  The fan 200 includes a plurality of blades 201 and a motor 202 that rotationally drives the blades 201. The fan 200 is a waterproof type fan having a predetermined waterproof performance.

  FIG. 4 is a perspective view of the upper housing 110 alone of the electronic device 10 according to the present embodiment.

  As shown in FIG. 4, the fins 110 a are formed integrally with the upper housing 110.

  A portion in the vicinity of the fin 110a in the duct-like wall portion 110h on the upper housing 110 side is inclined so that wind generated by the fan 200 is smoothly guided to the fin 110a, and is configured as a guide surface 110c.

  Further, on the guide surface 110c of the upper housing 110, a plurality of rectifying plates 110d for standing and distributing the wind generated by the fan 200 to the plurality of fins 110a in a balanced manner are provided.

  5A is a cross-sectional view taken along line AA in FIG. 1A, and FIG. 5B is an end view taken along line AA in FIG. 1A.

  The lower housing 120 is provided with a recess 120 b that can accommodate the battery 300. Between the bottom wall portion 120c of the recess 120b and the upper wall portion 110u of the upper housing 110 (including the guide surface 110c portion of the duct-like wall portion 110h), a plurality of circuit boards 401 and 402 and a plurality of electronic components An electronic component housing space Sd in which is housed is defined.

  The duct-like wall portion 100h is formed with a through-hole for wiring (not shown) for passing the power line of the motor 202 of the fan 200 into the electronic component housing space Sd. The through-hole for through-line is waterproofed with a sealing material or the like after the power line is connected. The duct-like wall portion 100h (including the guide surface 110c) is provided with an opening and a through-hole for communicating the fan housing space Sf and the electronic component housing space Sd for waterproofing in addition to the above-described through-hole for wiring. It is not done.

  The lower end portion of the duct-like wall portion 110h on the upper housing 110 side and the upper end portion of the duct-like wall portion 120h on the lower housing 120 side are in contact with each other via a sealing material (not shown). Further, as described above, the duct-like wall portion 100h (including the guide surface 110c) communicates the fan housing space Sf and the electronic component housing space Sd for waterproofing in addition to the above-described through-holes for wiring. No opening or through hole is provided. Therefore, it is difficult for liquid such as water to enter the electronic component housing space Sd from the fan housing space Sf communicating with the external space. That is, the waterproof performance of the electronic device 10 in the case where the cooling fan 200 is provided by providing the fan 200 in a waterproof manner isolated from the electronic component housing space Sd and forming the fin 110a on the outer surface of the upper housing 110. Can be secured appropriately. Further, since the connection portion between the lower end portion of the duct-like wall portion 110h of the upper housing 110 and the upper end portion of the duct-like wall portion 120h of the lower housing 120 is substantially circular, the lower end portion of the duct-like wall portion 110h The sealing material for waterproofing the connecting portion with the upper end portion of the duct-like wall portion 120h on the lower housing 120 side can be easily configured with a general O-ring or the like.

  As shown in FIGS. 3A and 5, the electronic component housing space Sd houses a CPU 410 that is a main processing unit of the electronic device 10. The CPU 410 is an example of an electronic component. The CPU 410 is mounted on the upper surface of the circuit board 401. The CPU 410 generates more heat during operation than other electronic components. The CPU 410 is in contact with the guide surface 110 c of the upper housing 110 through the heat conductive material 420. The heat conducting material 420 can be constituted by a high heat conducting elastic body, for example. The fins 110a and the ventilation openings 130b of the top cover 130 are located above the CPU 410 with the guide surface 110c interposed therebetween.

[1-3. Action]
When the electronic device 10 is operated, the electronic components such as the CPU 410 generate heat in the electronic component housing space Sd. In particular, the CPU 410 generates a large amount of heat compared to other electronic components, but the generated heat is transmitted to the guide surface 110c and the fins 110a of the upper housing 110 via the heat conductive material 420. The heat transmitted to the fins 110a is radiated to the external space through the ventilation openings 130b of the top cover 130.

  Further, when the electronic device 10 is operated, when the fan 200 is operated, the air W1 and W2 flows into the fan housing space Sf through the ventilation openings 150a of the upper cover 130 and the lower cover 150. The inflowing air W1 and W2 is guided to the fins 110a by the guide surfaces 110c of the upper housing 110, passes between the plurality of fins 110a, and flows out to the external space through the ventilation openings 130a of the upper surface cover 130. When air passes between the plurality of fins 110a, heat is radiated from the fins 110a to the air, and the fins 110a are cooled. Thereby, the heat generated by the CPU 410 and transmitted to the fins 110a can be appropriately radiated. Therefore, the CPU 410 can be appropriately cooled.

  Further, when water enters the tunnel-shaped space Sf from either the upper surface side or the lower surface side, it is discharged from the other surface side. Therefore, it is suppressed that the water which entered enters.

[2. Effect]
The electronic device 10 of this embodiment is
CPU410 (electronic component),
And a metal casing 100 that houses a CPU 410 (electronic component).
The CPU 410 (electronic component) is in contact with the inner surface of the housing 100 so as to conduct heat.
A heat radiating fin 110 a is formed on the outer surface of the housing 100.

  Thereby, the heat generated by the CPU 410 (electronic component) is transferred to the space outside the housing 100 via the heat dissipation fins 110a formed on the outer surface of the metal housing 100 that houses the CPU 410 (electronic component). Can dissipate heat. Therefore, the heat generated by the CPU 410 (electronic component) housed in the housing 100 can be radiated to the external space with a simple structure.

In this embodiment,
The electronic component is a CPU 410 (large scale integrated circuit).

  Thereby, the heat generated by the CPU 410 (large scale integrated circuit) having a relatively large calorific value can be radiated to the external space with a simple structure.

In this embodiment,
An upper surface cover 130 (cover) that forms the external surface of the electronic device 10 is disposed outside the housing 100, and
The upper surface cover 130 (cover) is provided with a ventilation opening 130b (opening) for heat dissipation at a position close to the fin 110a.

  Thereby, the heat released from the heat radiating fin 110a can be radiated to the external space through the ventilation opening 130b (opening) of the upper surface cover 130 (cover). Therefore, even when the upper surface cover 130 (cover) is provided to make the appearance of the electronic device 10 appropriate, the electronic device 10 can be appropriately cooled.

[3. Addendum]
In the present embodiment, [2. In addition to the electronic device 10 having the configuration described in “Effects”, the following electronic devices are disclosed.
CPU410 (electronic component),
A metal case 100 that houses a CPU 410 (electronic component),
The casing 100 is provided with a duct-like wall portion 100h that penetrates between the opposed upper and lower surfaces (two main surfaces) in a tunnel shape,
The fan 200 is disposed in the tunnel-like space Sf on the inner peripheral side of the duct-like wall portion 100h,
On the outer surface of the housing 100, a heat radiating fin 110a and a guide surface 110c for guiding the wind generated by the fan 200 to the fin 110a are formed.
Electronics.

  As a result, in the housing 100, the space Sf in which the fan 200 is arranged becomes a space on the outer surface side of the housing 100, and is separated from the inner space Sd in which the CPU 410 (electronic component) is arranged. Therefore, the heat generated by the CPU 410 (electronic component) can be appropriately radiated by the fan 200 and the fin 110a while ensuring the waterproof performance of the electronic device 10 appropriately.

  Moreover, the fan 200 can take in air from both the upper surface side and the lower surface side of the housing 100.

  Further, when water enters the tunnel-shaped space Sf from either the upper surface side or the lower surface side, it is discharged from the other surface side.

The electronic device is not provided with a tunnel-like space, but may be configured as follows. That is,
Electronic equipment
CPU (electronic component),
A metal housing that houses a CPU (electronic component),
One of the two main surfaces facing each other is recessed into the other surface,
A fan is placed in the space outside the depressed surface,
A heat radiating fin and a guide surface for guiding the wind generated by the fan to the fin are formed on the outer surface of the housing.

  Thereby, in the housing, the space in which the fan is arranged becomes the space on the outer surface side of the housing, and is separated from the space on the inner surface side in which the CPU (electronic component) is arranged. Therefore, the heat generated by the CPU (electronic component) can be appropriately radiated by the fan and the fin while appropriately securing the waterproof performance of the electronic device.

(Other embodiments)
As described above, the first embodiment has been described as an example of the technique in the present disclosure. However, the technology in the present disclosure is not limited to this, and can also be applied to an embodiment in which changes, replacements, additions, omissions, and the like are appropriately performed.
Therefore, other embodiments will be described below.

  In the embodiment, the electronic device is a portable computer that houses a CPU as an electronic component. However, in the present disclosure, the electronic device is not limited to this. The electronic component is not limited to the CPU, and may be an electronic component that generates heat, such as a transistor or an image processing LSI. In addition, the electronic device may be a music playback device, an information terminal device, an imaging device, or the like provided with a casing that houses such an electronic component.

  In the embodiment, the electronic device does not have a display unit. However, in the present disclosure, the electronic device may have a display unit on at least one main surface. For example, the electronic device may be a smartphone or a tablet information terminal. The electronic device may be a notebook computer.

  As described above, the embodiments have been described as examples of the technology in the present disclosure. For this purpose, the accompanying drawings and detailed description are provided.

  Accordingly, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem, but also the components not essential for solving the problem in order to illustrate the above technique. May also be included. Therefore, it should not be immediately recognized that these non-essential components are essential as those non-essential components are described in the accompanying drawings and detailed description.

  Moreover, since the above-mentioned embodiment is for demonstrating the technique in this indication, a various change, replacement, addition, abbreviation, etc. can be performed in a claim or its equivalent range.

  The present disclosure can be widely used in electronic devices that house electronic components inside a casing.

DESCRIPTION OF SYMBOLS 10 Electronic device 100 Case 100h Duct-like wall part 110 Upper case 110a Fin 110c Guide surface 110d Current plate 110h Duct-like wall part 110u Upper wall part 120 Lower case 120a Opening 120b Recess 120c Bottom wall part 120h Duct-like wall part 130 Upper surface cover 130a, 130b Ventilation opening 140 Side cover 150 Lower surface cover 150a Ventilation opening 200 Fan 201 Blade 202 Motor 300 Battery 401, 402 Circuit board 410 CPU
420 Thermal Conductive Material Sd Electronic Component Housing Space Sf Fan Housing Space

Claims (3)

Electronic components,
A metal housing that houses the electronic component,
The electronic component is in contact with the inner surface of the housing so as to allow heat conduction,
Fins for heat dissipation are formed on the outer surface of the housing,
Electronics. The electronic component is a large scale integrated circuit.
The electronic device according to claim 1. A cover that forms the external surface of the electronic device is disposed outside the housing,
The cover is provided with an opening for heat dissipation at a position close to the fin.
The electronic device according to claim 1 or 2.

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