JP2001274299A - Heat sink and electronic device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink device which has high cooling performance or low noise and an electronic device using it. SOLUTION: The device has a heat sink substrate 10 having air discharge openings 11 and 12, a fan 13 which supplies an air flow to the heat sink substrate 10, and an air discharge opening 19 provided at the end part of the heat sink substrate 10 and the air flow produced by the rotation of the fan 13 is discharged from the discharge openings 11 and 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an IC, an LSI, an M
The present invention relates to a heat sink device for cooling a semiconductor device such as a PU, an electronic component, and the like, and an electronic device using the same.

[0002]

2. Description of the Related Art FIG. 9 is a plan view showing a conventional heat sink device, and FIG. 10 is a sectional view showing a conventional heat sink device. In FIGS. Motor provided in 1,
3 is a fan rotated by the motor 2, 4 is a cover,
The cover 4 is provided with an intake port 5. Reference numeral 6 denotes an exhaust port for discharging a gas flow in one direction.

As described above, the heat sink device thus configured is mounted on an MPU or the like mounted on a computer or the like, and the heat generated by the MPU is radiated by the heat sink device to prevent runaway of the MPU.

[0004]

However, as the performance of an MPU or the like increases, the amount of heat generated by a semiconductor device such as an MPU further increases. Therefore, if the rotation speed of the motor 2 is increased to improve the cooling performance, the fan 3
Is configured to draw in the gas flow from the cover 4 side and exhaust the gas from the exhaust port 6 which is substantially perpendicular to the motor. Therefore, the noise between the fan 3 and the air increases, and the gas flow rate does not increase so much. There is a problem that the cooling performance is poor even at a high rotation.

Further, in an electronic device equipped with the above-described heat sink device, warm air inside the electronic device is sucked by the heat sink device to cool the MPU, and a gas flow exhausted from the heat sink device is discharged outside the housing. As described above, when the motor 2 is rotated at a high speed, noise increases and exhaust efficiency is poor.
U could not be cooled well, the gas circulation in the housing was poor, and it was difficult to lower the temperature in the housing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a heat sink device having high cooling performance or low noise and electronic equipment using the same.

[0007]

SUMMARY OF THE INVENTION The present invention provides a heat sink substrate having a first exhaust port, a fan for supplying a gas flow to the heat sink substrate, driving means for rotating the fan, and a heat sink provided at an end of the heat sink substrate. A second exhaust port is provided, and a gas flow generated by rotation of the fan is exhausted from the first exhaust port and the second exhaust port.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a heat sink substrate having a first exhaust port, a fan for supplying a gas flow to the heat sink substrate, driving means for rotating the fan, and an end of the heat sink substrate. A second exhaust port provided in the section, and a gas flow generated by rotation of the fan is provided to the first exhaust port.
By exhausting from the exhaust port and the second exhaust port, the gas flow rate can be increased, and the cooling performance can be improved.

According to a second aspect of the present invention, in the first aspect, a side wall is provided on the heat sink substrate, a cover is provided on the side wall, a space is provided between the heat sink substrate and the cover, and at least a part of the fan is provided in the space. By arranging and providing the second exhaust port in at least a part of the side wall, a cylindrical flow path can be configured, so that the exhaust efficiency can be improved.

According to a third aspect of the present invention, in the second aspect, the cover is provided with an intake port for a gas flow by a fan, so that the intake efficiency can be increased and the cooling efficiency can be improved.

According to a fourth aspect of the present invention, in the first to third aspects, the fan is disposed so as to face the first exhaust port provided on the heat sink substrate, so that interference between air and the fan can be suppressed. The cooling performance can be improved and noise can be reduced.

According to a fifth aspect of the present invention, in the first to third aspects, the fan and the first exhaust port provided in the heat sink substrate are arranged so as not to be opposed to each other, so that the substrate and the electronic component can be placed in the first exhaust port. It can be cooled by the gas flow discharged from the exhaust port.

According to a sixth aspect of the present invention, in the first to fifth aspects, the flow rate flowing out of the first exhaust port is smaller than the flow rate flowing out of the second exhaust port, thereby improving the exhaust efficiency. Can be.

According to a seventh aspect of the present invention, in the first to sixth aspects, the fins are erected on the heat sink substrate, so that the heat radiation efficiency can be further improved.

[0015] The invention according to claim 8 is a heat sink substrate having a heat receiving surface to which a heating element can be attached, a heat receiving surface, a side wall directed opposite to the heat receiving surface, and a first exhaust port provided.
A cover having an air inlet provided on the heat sink substrate, a fan at least a part of which is arranged between the heat sink substrate and the cover so as to face the air inlet, a driving unit for rotating the fan, and a part of the side wall. A second exhaust port provided, wherein a gas flow is suctioned from an intake port by rotation of a fan, and a gas flow is increased by exhausting the gas flow from both the first exhaust port and the second exhaust port. And cooling performance can be improved.

According to a ninth aspect of the present invention, in the ninth aspect, the first exhaust port and the fan are opposed to each other.
The interference between the air and the fan can be suppressed, and the cooling performance can be improved and the noise can be reduced.

According to a tenth aspect of the present invention, according to the eighth aspect, by disposing the first exhaust port and the fan so as not to face each other, the gas discharged from the first exhaust port through the substrate or the electronic component can be obtained. It can be cooled with a stream.

An eleventh aspect of the present invention provides a housing having an exhaust port, a circuit board housed in the housing, a semiconductor device provided on the circuit board, and a semiconductor device mounted on the semiconductor device. A heat sink substrate having an exhaust port, a fan for supplying a gas flow to the heat sink substrate, a driving means for rotating the fan to directly or indirectly provide the heat sink substrate, and a driving means provided at an end of the heat sink substrate. A second exhaust port provided, the exhaust port of the housing is opposed to the second exhaust port, and by rotating the fan, the gas flow in the housing is sucked by the fan. And a gas flow discharged from the first exhaust port is discharged into the housing while a gas flow discharged from the second exhaust port is discharged from the exhaust port of the housing to the outside. By letting Thus, the gas flow released from the first exhaust port can promote the circulation of gas in the housing, can suppress a rise in temperature inside the housing, and can reduce the temperature rise inside the housing by the first and second exhaust ports. Since the gas is exhausted, the gas flow rate can be increased, and the semiconductor device can be efficiently cooled.

According to a twelfth aspect of the present invention, in the eleventh aspect, a side wall is provided on the heat sink substrate, a cover is provided on the side wall, and a space is provided between the heat sink substrate and the cover.
While placing at least a part of the fan in the space,
By providing the second exhaust port on at least a part of the side wall, a cylindrical flow path can be formed, so that the exhaust efficiency can be improved.

According to a thirteenth aspect of the present invention, in the twelfth aspect, the cover is provided with a gas flow intake port by a fan, so that the intake efficiency can be increased and the cooling efficiency can be improved.

The invention according to claim 14 is the invention according to claims 11 to 1
3, the circuit board is mounted in the housing so that a gap is provided between the circuit board and the housing, and the gas flow discharged from the first exhaust port is discharged into the gap, so that the high-temperature gas Since the exhausted gas flow is supplied to a portion where convection is likely to occur, gas circulation inside the housing can be efficiently performed, and the inside of the housing can be prevented from being partially heated.

The invention according to claim 15 is the invention according to claims 11 to 1
3, the first exhaust port and the circuit board are opposed to each other, and the gas flow discharged from the first exhaust port is blown to at least one of the circuit board and the electronic components provided on the circuit board, thereby forming a heat sink. In addition to the heat radiation from the substrate, the circuit board and the like can be cooled by the gas flow from the first exhaust port, so that the cooling performance can be further improved and the thermal runaway of the semiconductor device or the like can be prevented.

FIGS. 1 and 2 are a plan view and a side view, respectively, showing a heat sink device according to an embodiment of the present invention.

In FIGS. 1 and 2, reference numeral 10 denotes a heat sink substrate, and the heat sink substrate 10 is provided with exhaust ports 11 and 12 by providing through holes at the bottom.
Reference numeral 13 denotes a fan attached to the heat sink substrate 10, and the fan 13 generally includes driving means such as a motor,
It is composed of an impeller and the like rotated by the driving means. In the case of the present embodiment, although not shown, it is constituted by, for example, a rotary motor unit 14 provided with coils and magnets and an impeller 15 attached to the motor unit 14.

Reference numeral 16 denotes a cover directly or indirectly attached to the heat sink substrate 10. The cover 16 has an opening 16a at a portion facing the fan 13, and the opening 16a is mainly used as an intake port. Can be

Reference numeral 17 denotes one or a plurality of fins provided on the heat sink substrate 10. By providing the fins 17, the heat radiation effect can be further improved. Note that the fins 17 are not always necessary.
It is preferable to provide the fins 17 or to adjust the number of the fins 17. Note that, instead of the fins 17, the grooves may be formed in a portion of the heat sink substrate 10 facing the fan 13 to form the unevenness.

Reference numeral 18 denotes a lead wire for supplying at least electric power for rotating the fan 13.

Except for one edge, sidewalls 10a, 10b, and 10c formed integrally with the heat sink substrate 1 are provided at the edges of the heat sink substrate 10, and the sidewalls 10a, 10b, and 10c are provided with covers. 16 are in contact. An opening surrounded by the cover 16 and the portion where the side wall of the heat sink substrate 1 does not exist is an exhaust port 19.

Further, the heat sink substrate 10 is provided with holes 10d and 10e used for attaching to a circuit board or the like, and further, four crimping portions 10f for attaching the cover 16 to the heat sink substrate 10 are provided. I have.

A part of the gas flowing from the vertical direction A with the rotation of the fan 13 is discharged from the exhaust ports 11 and 12, and a part of the gas is discharged from the exhaust port 19 in the B direction.

As described above, by providing the exhaust ports 11 and 12 at the bottom of the heat sink substrate 10, compared with the conventional configuration in which all gas flows are discharged from the end of the heat sink substrate, When the number of rotations of the motor unit 14 is the same, the amount of exhausted gas can be increased, and the cooling performance can be improved. In particular, by providing the exhaust port 12 at the bottom of the heat sink substrate 10 opposite to the exhaust port 19, interference between the air and the impeller 15 can be suppressed, and noise can be reduced. Further, by providing the exhaust port 11 at a portion adjacent to the exhaust port 19 and at the bottom of the heat sink substrate 10 where the impeller 15 enters from the exhaust port 19 side, noise can be similarly reduced.

The components of the heat sink device configured as described above will be described in detail.

First, the heat sink substrate 10 will be described.

The outer shape of the heat sink substrate 10 is preferably circular or polygonal. When the external shape is a circular shape, there is little directionality or the like when the heat sink device is attached to the heating element, and stable characteristics are obtained. In addition, by making the outer shape a polygonal shape, the heat sink device can be easily attached to a semiconductor device or the like with a target of the outer shape such as a corner. In particular, since the semiconductor device such as the MPU generally has a rectangular external shape, the heat sink substrate 10 has a rectangular external shape, so that the contact area with the semiconductor device can be widened and the space can be mounted in a narrow space, so that heat dissipation can be achieved. Can be improved.

The constituent material of the heat sink substrate 10 is a single material selected from zinc, aluminum, brass, gold, silver, tungsten, copper, beryllium, magnesium, molybdenum (hereinafter abbreviated as a material group), or a material selected from the above material group. Alloys of several selected materials,
Further, an alloy of at least one material selected from the material group and at least one material other than the material group can be used. In the present embodiment, in consideration of workability and cost, aluminum alone, an alloy of aluminum and at least one selected from the other material groups, an aluminum and at least one alloy selected from the material group, or the like It consisted of.

In this embodiment, the heat sink substrate 10 is made of a kind of metal material or the like. However, the heat sink substrate 10 may be formed by laminating a plurality of heat transfer members. For example, a plate, foil, thin film, or the like made of a material having good heat conductivity such as copper may be formed on at least the lower surface of the heat sink substrate 10.

Side wall 1 provided on heat sink substrate 10
Although the components 0a, 10b, and 10c are formed integrally with the heat sink substrate 10, another member may be attached to the heat sink substrate 10 by press-fitting, bonding, or screwing.
With this configuration, the heat sink substrate 10
Can substantially be a flat plate, so that the productivity of the heat sink substrate 10 can be improved and components can be shared. Since the heat sink device shown in FIGS. 1 and 2 has a one-way blowing configuration, the side wall is 10a,
10b and 10c are provided, but in the case of blowing in two directions, it can be realized by omitting one of the side walls 10a, 10b, 10c. In the case of blowing in three directions, the side walls 10a, 10c are provided. This can be realized by omitting any two of 10b and 10c. It should be noted that the case of blowing in four directions can be realized without providing a side wall. In this case, the cover 16 is fixed to a support (not shown) erected on the heat sink substrate 10.

In this embodiment, two exhaust ports 11 and 12 are provided at the bottom of the heat sink substrate 10. However, one or three or more exhaust ports may be provided at the bottom of the heat sink substrate 10. good. However, when noise suppression is performed as described above, it is preferable to provide the exhaust ports 11 and 12 at positions as shown in FIG. The outer diameter of the exhaust port may be square, circular, elliptical, or the like.
It may be formed in a letter shape or an L shape.

The exhaust port 1 of the heat sink substrate 10
Although not shown, the peripheral portions of the exhaust ports 11 and 12 are formed into a tapered shape or a stepped shape.
12 can be prevented from falling off from the peripheral portion of the heat sink substrate 10.

Next, the fan 13 will be described.

As shown in FIG. 1 and the like, the fan 2 is provided with, for example, a protrusion (not shown) at the bottom of the heat sink substrate 1, and the motor 14 is fitted into the protrusion by press-fitting or bonding. Provided, the motor unit 14
An impeller 15 (preferably, a propeller type) is attached to the motor, and the impeller 15 is rotated by rotation of the motor unit 14. In addition, as the motor unit 14, an electric motor using a coil and a magnet, an ultrasonic motor, or the like can be used. The impeller 15 is preferably made of a material such as resin so as to reduce the weight. Since the heat from the heat sink substrate 10 is transmitted to the impeller 15 via the motor unit 14, the heat radiation effect can be further improved by configuring the impeller 15 with a heat conductive material such as a metal.

The fan 13 draws in gas in the surrounding environment such as air and blows it to the heat sink substrate 10, or draws in gas from the exhaust port 19 and reverses the flow of gas shown in FIGS. , Etc. to the outside. The gas referred to here is not only air but also gas present around the fan 13. For example, nitrogen or an inert gas is present in the environment where the fan 13 is located. In this case, the gas refers to the nitrogen gas or the inert gas.

Further, in particular, by mounting a fluid bearing as a bearing of the motor unit 14, vibration during rotation of the motor unit 14 is suppressed, so that noise due to the vibration and destruction of a joint portion of the semiconductor device are suppressed. can do.

In the embodiment shown in FIGS. 1 and 2, a thin heat sink device can be provided by directly attaching the motor unit 14 to the heat sink substrate 10. By providing a fan, a fan having a ceiling suspension structure may be provided. With such a configuration, although the thickness tends to be somewhat thicker, thermal damage to the bearing of the motor unit 14 can be reduced, and the life of the motor unit 14 can be improved. In the case of a ceiling suspension structure, it is needless to say that the projection is not required.

In this embodiment, the impeller 1
Although the upper surface of the cover 5 is made substantially the same as the upper surface of the cover 16, the upper surface of the impeller 15 protrudes from the upper surface of the cover 16 so that the opening 16a of the cover 16 is closed when attached to an electronic device or the like. Can be prevented. In addition,
When the fan 13 has a ceiling suspension structure, the motor unit 14
Project from the upper surface of the cover 16.

Next, the cover 16 will be described.

As described above, the cover 16 is attached to the heat sink substrate 10 by caulking or the like. In another embodiment, the side walls 10a, 10b, and 10c of the heat sink substrate 10 are bonded by a method such as bonding.
You may join.

As the constituent material of the cover 16, a resin, a metal or the like is preferably used, but it is preferable that the cover 16 is formed of a heat conductive material such as a metal so as to improve a heat radiation effect. That is, naturally, the heat from the heating element is transmitted to the side walls 1a, 1b, and 1c, but the heat may be transmitted to the cover 16 and radiated from the cover 16.

In the present embodiment, the provision of the cover 16 determines the opening 16a serving as the gas inlet, controls the gas flow, and enables efficient heat dissipation. Although the effect can be obtained, the cover 16 may not be particularly provided depending on the use environment and the like.

Next, the lead wire 18 will be described.

Although the lead wire 18 is not shown, a connector is provided at a tip end thereof, and at least current is supplied to the motor unit 14 by connecting the connector to a power source or the like. Although not shown, the lead wire 18 is connected to the motor unit 14 so as to supply at least power to the motor unit 14. Further, the lead wire 18 may have a signal line for detecting the rotation speed of the motor unit 14 with a detector (not shown) and transmitting the detection signal.
Furthermore, the lead wire 18 may be a thin wiring such as a flexible printed heat sink substrate for thinning and the like, in which case a connector is not required.

Next, the relationship between the impeller 15 and the exhaust ports 11 and 12 will be described.

As shown in FIG. 1, a part of the exhaust ports 11 and 12 and the impeller 15 directly face each other.
The other part is configured not to face the impeller 15 or, although not shown, configured so that all of the exhaust ports 11 and 12 face the impeller 15, and further, The exhaust ports 11 and 12 may be configured not to face the impeller 15 at all, or the exhaust ports 11 may be configured to face the impeller 15 and the exhaust port 12 may not be configured to face the impeller 15.

Next, the rotation center P of the impeller 15 and the side wall 10
The arrangement relationship of a, 10b, and 10c will be described.

As shown in FIG. 1, when the distance between the rotation center P of the impeller 15 and each of the side walls 10a, 10b, 10c is L1, L2, L3, the impeller 15 is arranged such that L1>L2> L3. Be placed. By providing the exhaust port 11 at the bottom near the side wall 10a having the shortest distance, noise can be reduced. Furthermore, by providing the exhaust port 12 at the bottom near the side wall 10b having the second shortest distance,
Noise can be reduced. In addition, the exhaust ports 11, 1
By providing at least one of the two, noise reduction can be realized as compared with the related art.

As described above, by varying the rotation center of the impeller 13 from each of the side walls 10a, 10b and 10c, the exhaust efficiency of the fan 13 itself can be improved.

Next, an electronic apparatus according to an embodiment of the present invention will be described with reference to FIG.

Note that examples of the electronic apparatus include those equipped with a high-performance semiconductor device (MPU or the like) such as a personal computer, a car navigation device, and a digital television.

FIG. 3 is a sectional view showing an electronic apparatus using the heat sink device according to one embodiment of the present invention.
In the figure, reference numeral 20 denotes a casing which is an exterior of the electronic device,
0 is provided with an exhaust port 20a. Reference numeral 21 denotes a circuit board on which electronic components (heating elements) such as a semiconductor device 22 are mounted. The circuit board 21 is fixed to a rib or the like protruding inside the housing 20 with a screw or an adhesive. Reference numeral 23 denotes a heat sink device shown in FIG. 1 and the like. The heat sink device 23 is mounted on the semiconductor device 22. Further, the exhaust port 19 of the heat sink device 23 is connected to an exhaust port 20 a provided in the housing 20.

The electronic device configured as described above includes the fan 1
3, the gas in the housing 20 is sucked through the opening 16a. The heat generated by the semiconductor device 22 is transferred to the heat sink substrate 1
0 and is cooled by the gas discharged from the exhaust ports 19 and 20a. Further, a part of the gas sucked by the fan is exhausted through the exhaust port 12 and the exhaust port 11 (not shown) and returned to the inside of the housing 20.

As described above, by returning a part of the gas sucked in by the exhaust port 12 and the like to the inside of the housing 20, the air in the housing 20 can be efficiently circulated. The gap 24 between the bottom portion 20b and the circuit board 21 is apt to store heat, and the bottom portion 20b may become hot. Therefore, the gas discharged from the exhaust port 12 or the like is supplied to the gap 24 as shown in FIG. By setting
4 can be circulated favorably, so that the bottom 2
0b can be prevented from becoming high temperature.

Next, another embodiment will be described.

FIG. 4 is a cross-sectional view showing an electronic apparatus according to another embodiment of the present invention. In FIG. 4, a heat sink device 23 has a slightly different structure from those shown in FIGS. That is, the distance between the fan 13 and the exhaust port 19 is longer than that of the heat sink device shown in FIGS. 1 to 3, and a plurality of fins 17 are formed on the elongated heat sink substrate 10. Further, the raised portion 10g is formed integrally with the heat sink substrate 10 or by providing another member so that the contact portion of the heat sink substrate 10 with the semiconductor device 22 is thicker than other portions. By providing the raised portion 10g, the heat transfer efficiency can be increased, and the cooling efficiency can be further improved. Preferably, as shown in FIG. 4, it is preferable to arrange the fins 17 so that the fins 17 are present on the surface opposite to the raised portion 10g. In addition, the raised portion 10a
By providing a portion protruding outward at the bottom of the heat sink substrate 10 or the like, a gap is provided between the heat sink substrate 10 and the circuit board 21 when the housing 20 is attached. It can be configured to perform good gas discharge.

With such a configuration, a part of the gas sucked in by the exhaust port 12 and the like is returned to the housing 20 again, so that the air in the housing 20 can be efficiently circulated. Further, the exhaust port 12 and the exhaust port 11 (not shown)
Air blown out of the circuit board 21 is directly blown onto the circuit board 21, and furthermore, the electronic components 22 a mounted on the circuit board 21.
And the like, so that the circuit board 21 itself can be cooled, and the electronic components 22a other than the semiconductor device 22 and the electronic components around it can be cooled.

As described above, the semiconductor device 22 is mainly cooled by the gas exhausted from the exhaust ports 20 and 20a, and the air released from the exhaust port 12 and the exhaust port 11 is directly blown onto the circuit board 21. The circuit board 21
By cooling itself, heat generated from the electronic component 22b or another semiconductor device 22c provided on the back surface of the circuit board 21 and transmitted to the circuit board 21 can be dissipated, and the air flow to the electronic component 22a itself can be reduced. Since the electronic component 22a is sprayed, the electronic component 22a itself can be cooled, and heat radiation in the housing 20 can be efficiently performed as a whole.

Next, another embodiment will be described.

FIG. 5 is a cross-sectional view showing an electronic apparatus according to another embodiment of the present invention. In FIG. 5, a part different from FIG. That is, in FIG. 5, the exhaust port 12 is provided near the semiconductor device 22.

In the configuration shown in FIG. 5, the gas discharged from the exhaust port 12 is blown to the semiconductor device 22, the semiconductor device 22 is cooled by contact with the heat sink substrate 10, and Since the semiconductor device 22 is cooled, the gas discharged from the exhaust port 12 is also blown onto the circuit board 21, so that the circuit board 21 is cooled.
The cooling of itself and the cooling of electronic components around the semiconductor device 22 can be performed.

Next, the performance of the heat sink device according to the present embodiment will be described.

FIG. 6 is a graph showing the relationship between the flow rate and the pressure of the heat sink device. M1 is a curve of the conventional heat sink device shown in FIGS. 9 and 10, and M2 and M3 are curves of FIG.
3 is a curve of the heat sink device according to the embodiment of the present invention shown in FIG. M2 indicates the relationship between the flow rate of gas discharged from the exhaust port 19 and the pressure, and M3 indicates the relationship between the exhaust ports 19 and 1.
The relationship between the total gas flow rate and the pressure of 1, 12 is shown. The power to be supplied was the same for both.

As can be seen from FIG. 6, the flow rate of the gas discharged from the exhaust port 19 depends on the exhaust port 6 of the conventional heat sink device.
Is smaller than the gas flow discharged from
In No. 3, a gas flow rate much higher than M1 is obtained on the low pressure side. That is, even with the same power, the heat sink device of the present embodiment can move more gas. That is, in the present embodiment,
For example, it is possible to efficiently circulate gas in a housing of an electronic device or the like, which has been insufficient in the past, so that the cooling performance can be improved. Further, the load curve in the case of the actual notebook personal computer was changed to M4.
Shown in That is, comparing the intersections of M4 and M1 and M3, the pressure of M3 is higher and the gas flow rate is much larger than that of M1.

FIGS. 7 and 8 are graphs respectively showing the noise generation state at different frequencies of the conventional heat sink device and the heat sink device of the present embodiment. As can be seen from FIGS. 7 and 8, the noise at each frequency is smaller in FIG. 8, and it can be seen that the heat sink device of the present embodiment has a lower noise.

[0073]

The present invention provides a heat sink heat sink substrate having a first exhaust port, a fan for supplying a gas flow to the heat sink heat sink substrate, driving means for rotating the fan, and an end provided on the heat sink heat sink substrate. A second exhaust port provided for exhausting a gas flow generated by the rotation of the fan from the first exhaust port and the second exhaust port. Performance can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a heat sink device according to an embodiment of the present invention.

FIG. 2 is a side view showing the heat sink device according to the embodiment of the present invention;

FIG. 3 is a sectional view showing an electronic apparatus using the heat sink device according to the embodiment of the present invention.

FIG. 4 is a sectional view showing an electronic apparatus according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating an electronic device according to another embodiment of the present invention.

FIG. 6 is a graph showing the relationship between the gas flow rate and the pressure of the heat sink device according to the related art and the embodiment of the present invention.

FIG. 7 is a graph showing noise according to frequency of the conventional heat sink device.

FIG. 8 is a graph showing noise for each frequency of the heat sink device according to one embodiment of the present invention.

FIG. 9 is a plan view showing a conventional heat sink device.

FIG. 10 is a sectional view showing a conventional heat sink device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Heat sink board 10a, 10b, 10c Side wall 11, 12 Exhaust port 13 Fan 14 Motor part 15 Impeller 16 Cover 16a Opening 17 Fin 20 Housing 20a Exhaust port 20b Bottom 21 Circuit board 22 Semiconductor device

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hidefumi Furuya 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd.

Claims (15)

[Claims] 1. A heat sink substrate having a first exhaust port, a fan for supplying a gas flow to the heat sink substrate, driving means for rotating the fan, and a second means provided at an end of the heat sink substrate. And a gas outlet generated by rotation of the fan is exhausted from the first exhaust port and the second exhaust port. 2. A side wall is provided on the heat sink substrate, a cover is provided on the side wall, a space is provided between the heat sink substrate and the cover, at least a part of a fan is arranged in the space, and 2. The heat sink device according to claim 1, wherein a second exhaust port is provided at least in part. 3. The heat sink device according to claim 2, wherein the cover is provided with a gas flow inlet through a fan. 4. The heat sink device according to claim 1, wherein a fan is disposed so as to face the first exhaust port provided on the heat sink substrate. 5. The heat sink device according to claim 1, wherein a fan is arranged so as not to face the first exhaust port provided on the heat sink substrate. 6. The heat sink device according to claim 1, wherein a flow rate flowing out of said first exhaust port is smaller than a flow rate flowing out of said second exhaust port. 7. The heat sink device according to claim 1, wherein fins are erected on the heat sink substrate. 8. A heat sink substrate having a heat receiving surface to which a heating element can be attached, a heat sink surface provided with a first exhaust port having a side wall directed opposite to the heat receiving surface, and a first exhaust port provided on the heat sink substrate. A cover provided with an air inlet, a fan at least a part of which is arranged between the heat sink substrate and the cover so as to face the air inlet, a driving unit for rotating the fan, and a part of the side wall And a second exhaust port provided in the air inlet, wherein the rotation of the fan sucks a gas flow from the intake port and exhausts the gas flow from both the first exhaust port and the second exhaust port. Characterized heat sink device. 9. The heat sink device according to claim 8, wherein the first exhaust port and the fan are opposed to each other. 10. The heat sink device according to claim 8, wherein the first exhaust port and the fan are arranged so as not to face each other. 11. A housing having an exhaust port, a circuit board housed in the housing, a semiconductor device provided on the circuit board, and a first exhaust mounted on the semiconductor device. A heatsink substrate having an opening, a fan for supplying a gas flow to the heatsink substrate, a driving means for rotating the fan and provided directly or indirectly to the heatsink substrate, and an end portion of the heatsink substrate. A second exhaust port provided, the exhaust port of the housing is opposed to the second exhaust port, and by rotating the fan, the gas flow in the housing is sucked by the fan, The sucked gas flow is released from the first and second exhaust ports, and the gas flow discharged from the first exhaust port is released into the housing, and the gas flow released from the second exhaust port. Electronic device stream is characterized in that to release to the outside from the exhaust port of the housing. 12. A heat sink substrate, wherein a side wall is provided, a cover is provided on the side wall, a space is provided between the heat sink substrate and the cover, and at least a part of a fan is disposed in the space. The electronic device according to claim 11, wherein a second exhaust port is provided at least in part. 13. The electronic apparatus according to claim 12, wherein the cover is provided with a gas flow inlet through a fan. 14. The circuit board is mounted in the housing so that a gap is provided between the circuit board and the housing.
14. The electronic device according to claim 11, wherein the gas flow discharged from the first exhaust port is discharged to the gap. 15. A first exhaust port and a circuit board are opposed to each other, and a gas flow released from the first exhaust port is directed to at least one of the circuit board and an electronic component provided on the circuit board. The method according to claim 11, wherein spraying is performed.
14. The electronic device according to any one of items 13 to 13.