TWI546652B - Heat dissipation unit of handheld electronic device - Google Patents
Heat dissipation unit of handheld electronic device Download PDFInfo
- Publication number
- TWI546652B TWI546652B TW102142547A TW102142547A TWI546652B TW I546652 B TWI546652 B TW I546652B TW 102142547 A TW102142547 A TW 102142547A TW 102142547 A TW102142547 A TW 102142547A TW I546652 B TWI546652 B TW I546652B
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- TW
- Taiwan
- Prior art keywords
- heat
- electronic device
- handheld electronic
- heat dissipating
- receiving portion
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Description
一種手持式電子裝置散熱單元,尤指一散熱本體一側形成一受熱部及另一側形成一散熱部,該受熱部及散熱部係分別為陶瓷材質及散熱導體所製成,可快速將手持式電子裝置所產生內部的熱量導出至該手持式電子裝置外部的手持式電子裝置散熱單元。 A heat sink unit of a handheld electronic device, in particular, a heat receiving portion is formed on one side of the heat dissipating body and a heat dissipating portion is formed on the other side. The heat receiving portion and the heat dissipating portion are respectively made of ceramic material and heat dissipating conductor, and can be quickly held by hand. The internal heat generated by the electronic device is led to a heat sink unit of the handheld electronic device outside the handheld electronic device.
手持式電子裝置是指可讓使用者隨身攜帶及操作使用之一種電子裝置。隨著元件積集度之日益增加,電子裝置的體積隨之縮小且重量較輕薄,相對地,電子裝置之尺寸縮小伴隨而來產生的散熱問題亦逐漸困擾著產品設計者,而於手持式電子裝置之領域中更是明顯。 A handheld electronic device is an electronic device that can be carried and operated by a user. As the degree of component accumulation increases, the size of the electronic device shrinks and the weight is lighter. In contrast, the heat dissipation problem associated with the downsizing of the electronic device gradually plagues the product designer, and the handheld electronic device It is even more obvious in the field of devices.
一般市面上的手持式電子裝置,其多數使用塑膠作為殼體材質,由於手持式電子裝置因體積較小的關係,其裝置內的電子元件尺寸也隨之縮小,而電子元件所產生的熱量變得較不易排出,造成手持式電子裝置解熱困難,導致其內部的電子元件因過熱造成衰竭而壽命縮短或效能降低。 Most of the hand-held electronic devices on the market use plastic as the material of the casing. Due to the small volume of the handheld electronic device, the size of the electronic components in the device is also reduced, and the heat generated by the electronic components is changed. It is difficult to discharge, which makes the handheld electronic device difficult to deheat, resulting in the failure of its internal electronic components due to overheating and shortened life or reduced performance.
另外,也有從事相關行業之業者將手持式電子裝置大量使用金屬作為殼體之主要材質,尤其是鋁鎂合金,因其質輕且強度較高,並具有出色的外觀,幾乎已經成為新一代手持式電子 裝置之主要外殼材質,但由於以鋁鎂合金作為殼體僅較一般塑膠製成的殼體具有較出色的外觀,內部的熱量同樣也無法排出,並無解熱效果,而內部的電子元件會因熱量無法排出使得其壽命減短。 In addition, there are also people in related industries who use a large amount of metal in hand-held electronic devices as the main material of the casing, especially aluminum-magnesium alloy, which has become a new generation of handheld because of its light weight, high strength and excellent appearance. Electronics The main outer casing material of the device, but the aluminum-magnesium alloy as the casing only has a better appearance than the casing made of ordinary plastic, the internal heat can not be discharged, and there is no antipyretic effect, and the internal electronic components are caused by The heat cannot be discharged so that its life is shortened.
以上所述,習知具有下列之缺點:1.無法有效解熱;2.減少手持式電子裝置之壽命。 As described above, the conventional disadvantages are as follows: 1. The heat cannot be effectively decomposed; 2. The life of the handheld electronic device is reduced.
是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此,為有效解決上述之問題,本發明之主要目的在於提供一散熱本體一側形成一受熱部及另一側形成一散熱部,該受熱部及散熱部係分別為陶瓷材質及散熱導體所製成,並與一手持式電子裝置搭配組設令手持式電子裝置得以快速解熱的手持式電子裝置散熱單元。 Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a heat receiving portion on one side of the heat dissipating body and a heat dissipating portion on the other side. The heat receiving portion and the heat dissipating portion are respectively made of ceramic material and heat dissipating conductor. The handheld electronic device heat dissipating unit is configured to be equipped with a handheld electronic device to quickly dissipate the handheld electronic device.
為達上述目的,本發明係一種手持式電子裝置散熱單元,其中包括:一散熱本體,係一側形成一受熱部及另一側形成一散熱部,所述受熱部係為陶瓷材質,所述散熱部係可為散熱導體,該散熱本體與手持式電子裝置組設時,該受熱部及該散熱部係分別對應設置於前述手持式電子裝置之內部及外部。 In order to achieve the above object, the present invention is a heat dissipating unit for a handheld electronic device, comprising: a heat dissipating body, a heat receiving portion is formed on one side and a heat dissipating portion is formed on the other side, and the heat receiving portion is made of ceramic material. The heat dissipation portion may be a heat dissipation conductor. When the heat dissipation body and the handheld electronic device are assembled, the heat receiving portion and the heat dissipation portion are respectively disposed inside and outside the handheld electronic device.
由於陶瓷具有耐高溫、低熱膨脹係數等特性,透過前述之手持式電子裝置散熱單元,利用以陶瓷材質製成之受熱部,可令手 持式電子裝置內部所產生的熱量,藉由所述散熱本體之受熱部快速傳導至該散熱部,之後再由該散熱部將熱量導出所述手持式電子裝置之外部,進而提高該手持式電子裝置之壽命。 Since the ceramic has characteristics such as high temperature resistance and low thermal expansion coefficient, the heat-receiving unit made of ceramic material can be used for the heat-dissipating unit of the hand-held electronic device. The heat generated inside the holding electronic device is quickly transmitted to the heat dissipating portion by the heat receiving portion of the heat dissipating body, and then the heat dissipating portion is used to conduct heat to the outside of the handheld electronic device, thereby improving the handheld electronic device. The life of the device.
1‧‧‧手持式電子裝置 1‧‧‧Handheld electronic device
10‧‧‧散熱本體 10‧‧‧Solution body
101‧‧‧受熱部 101‧‧‧Heating Department
102‧‧‧散熱部 102‧‧‧ Department of heat dissipation
11‧‧‧殼體 11‧‧‧Shell
111‧‧‧容置空間 111‧‧‧ accommodating space
12‧‧‧發熱源 12‧‧‧heat source
第1A圖係本發明之手持式電子裝置散熱單元之第一實施例之立體分解圖;第1B圖係本發明之手持式電子裝置散熱單元之第一實施例之立體組合圖;第1C圖係本發明之手持式電子裝置散熱單元之第一實施例之立體圖;第2圖係本發明之手持式電子裝置散熱單元之第二實施例之立體圖。 1A is a perspective exploded view of a first embodiment of a heat sink unit of a handheld electronic device of the present invention; FIG. 1B is a perspective assembled view of a first embodiment of a heat sink unit for a handheld electronic device of the present invention; A perspective view of a first embodiment of a heat sink unit for a handheld electronic device of the present invention; and a second perspective view of a second embodiment of a heat sink unit for a hand held electronic device of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1A、1B、1C圖,係為本發明之手持式電子裝置散熱單元之第一實施例之立體分解圖及立體組合圖,如圖所示,一種手持式電子裝置散熱單元,係用以與一手持式電子裝置1搭配組設,係包括:一散熱本體10一側形成一受熱部101及另一側形成一散熱部102,係分設於該散熱本體10之兩側,所述受熱部101係為陶瓷材質,所述散熱部102係可為散熱導體(可係為金屬或高導熱係數的材質),所述散熱本體10與該 手持式電子裝置1搭配組設時,該受熱部101及該散熱部102分別對應設置於前述手持式電子裝置1之內部及外部。 1A, 1B, and 1C are perspective exploded views and a perspective assembled view of a first embodiment of a heat sink unit for a handheld electronic device of the present invention. As shown in the drawing, a heat sink unit for a handheld electronic device is used. The heat-dissipating portion 101 is formed on one side of the heat-dissipating body 10 and the heat-dissipating portion 102 is formed on the other side of the heat-dissipating body 10, and is disposed on two sides of the heat-dissipating body 10, The heat receiving portion 101 is made of a ceramic material, and the heat dissipating portion 102 can be a heat dissipating conductor (which can be made of metal or a material having high thermal conductivity), and the heat dissipating body 10 and the heat dissipating portion 10 When the handheld electronic device 1 is assembled, the heat receiving portion 101 and the heat dissipation portion 102 are respectively disposed inside and outside the handheld electronic device 1 .
所述手持式電子裝置1係可為行動電話及平板式電腦(如第1C圖所示)其中任一。 The handheld electronic device 1 can be any of a mobile phone and a tablet computer (as shown in FIG. 1C).
藉由前述手持式電子裝置1散熱單元,由於陶瓷具有耐高溫、低熱膨脹係數等特性,透過由陶瓷材質製成之受熱部101及由散熱導體製成之散熱部102,該手持式電子裝置1內部所產生的熱量會經由所述散熱本體10之受熱部101傳導至該散熱部102,之後再由該散熱部102將熱量導出所述手持式電子裝置1之外部,如此可令手持式電子裝置1內部所產生之熱量快速導出至手持式電子裝置1外部達到散熱效果,進而提高該手持式電子裝置1之壽命及使用效能。 The heat-receiving unit of the hand-held electronic device 1 has a heat-resistant portion 101 made of a ceramic material and a heat-dissipating portion 102 made of a heat-dissipating conductor, because the ceramic has characteristics such as high temperature resistance and low thermal expansion coefficient. The heat generated by the heat is transmitted to the heat dissipating portion 102 through the heat receiving portion 101 of the heat dissipating body 10, and then the heat is discharged from the heat dissipating portion 102 to the outside of the handheld electronic device 1, so that the handheld electronic device can be made. 1 The heat generated inside is quickly exported to the outside of the handheld electronic device 1 to achieve a heat dissipation effect, thereby improving the life and performance of the handheld electronic device 1.
請參閱第2圖,係為本發明之手持式電子裝置散熱單元之第二實施例之立體圖,本實施例係與前述第一實施例部分結構及連結關係相同,故在此不再贅述,惟本實施例與前述第一實施例不同處係為,所述手持式電子裝置1更具有一殼體11,所述殼體11具有一容置空間111,該容置空間111至少一側呈開放側,並於所述容置空間111內容設至少一發熱源12,所述散熱本體10對應蓋合封閉前述容置空間111,所述以陶瓷材質製成之散熱本體10之受熱部101對應設於該容置空間111內,並與該發熱源12貼設,所述散熱本體10之散熱部102對應設於前述殼體11外部。 2 is a perspective view of a second embodiment of the heat sink unit of the handheld electronic device of the present invention. This embodiment is identical to the structure and connection relationship of the first embodiment, and therefore will not be further described herein. The difference between the embodiment and the foregoing first embodiment is that the handheld electronic device 1 further has a housing 11 , and the housing 11 has an accommodating space 111 , and the accommodating space 111 is open at least on one side. At least one heat source 12 is disposed on the side of the accommodating space 111. The heat dissipating body 10 is correspondingly closed to close the accommodating space 111. The heat receiving portion 101 of the heat dissipating body 10 made of ceramic material is correspondingly disposed. The heat dissipation portion 102 of the heat dissipation body 10 is disposed outside the casing 11 in the accommodating space 111.
藉由所述以陶瓷材質製成之受熱部101與該發熱源12貼設,並容設於該容置空間111內,該發熱源12所產生之熱量係以傳導方式經由該受熱部101傳遞至由散熱導體製成之散熱部102後,再由該散熱部102將熱量導出所述手持式電子裝置1之外部,達成散熱效果,並提高該手持式電子裝置1之壽命。 The heat receiving portion 101 made of a ceramic material is attached to the heat generating source 12 and accommodated in the accommodating space 111. The heat generated by the heat generating source 12 is transmitted through the heat receiving portion 101 in a conductive manner. After the heat dissipating portion 102 is formed by the heat dissipating conductor, the heat dissipating portion 102 conducts heat to the outside of the hand-held electronic device 1 to achieve a heat dissipating effect and improve the life of the hand-held electronic device 1.
所述發熱源12所產生之熱量的傳遞係以接觸傳導方式將熱量導出至外部藉以達到散熱效果,但並不引以為限。 The heat generated by the heat source 12 is transferred to the outside by contact conduction to achieve heat dissipation, but is not limited.
以上所述,本發明相較於習知具有下列優點:1.熱量快速導出至外部;2.提高手持式電子裝置的壽命。 As described above, the present invention has the following advantages as compared with the prior art: 1. The heat is quickly exported to the outside; 2. The life of the handheld electronic device is improved.
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
1‧‧‧手持式電子裝置 1‧‧‧Handheld electronic device
10‧‧‧散熱本體 10‧‧‧Solution body
101‧‧‧受熱部 101‧‧‧Heating Department
102‧‧‧散熱部 102‧‧‧ Department of heat dissipation
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102142547A TWI546652B (en) | 2013-11-22 | 2013-11-22 | Heat dissipation unit of handheld electronic device |
DE202014000066.2U DE202014000066U1 (en) | 2013-11-22 | 2014-01-02 | Cooling device for a mobile electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102142547A TWI546652B (en) | 2013-11-22 | 2013-11-22 | Heat dissipation unit of handheld electronic device |
DE202014000066.2U DE202014000066U1 (en) | 2013-11-22 | 2014-01-02 | Cooling device for a mobile electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201520746A TW201520746A (en) | 2015-06-01 |
TWI546652B true TWI546652B (en) | 2016-08-21 |
Family
ID=54365897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102142547A TWI546652B (en) | 2013-11-22 | 2013-11-22 | Heat dissipation unit of handheld electronic device |
Country Status (2)
Country | Link |
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DE (1) | DE202014000066U1 (en) |
TW (1) | TWI546652B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI691254B (en) * | 2015-07-28 | 2020-04-11 | 大陸商東莞錢鋒特殊膠黏製品有限公司 | Heat-dissipation buffer shielding composite structure of mobile electronic device |
-
2013
- 2013-11-22 TW TW102142547A patent/TWI546652B/en active
-
2014
- 2014-01-02 DE DE202014000066.2U patent/DE202014000066U1/en not_active Expired - Lifetime
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Publication number | Publication date |
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DE202014000066U1 (en) | 2014-02-17 |
TW201520746A (en) | 2015-06-01 |
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