CN2840165Y

CN2840165Y - Noise suppressing structure of radiating module

Info

Publication number: CN2840165Y
Application number: CN 200520044767
Authority: CN
Inventors: 张淳华
Original assignee: Shanghai Huanda Computer Technology Co Ltd; Mitac International Corp
Current assignee: Huanda Computer Shanghai Co Ltd; Shanghai Huanda Computer Technology Co Ltd; Mitac International Corp
Priority date: 2005-09-02
Filing date: 2005-09-02
Publication date: 2006-11-22
Anticipated expiration: 2015-09-02

Abstract

The utility model relates to a noise suppression structure of a heat radiating module, which is matched with a heating electronic component of an electronic device. Part of the heat radiating module is pasted on the surface of the electronic component, and a heat radiating fan is arranged at the side where the surface of the electronic component is pasted on the heat radiating module. A plurality of mutually superimposed heat radiating fins are arranged at the air outlet of the heat radiating fan. A casing of the electronic device is provided with a fence at the air outlet of the heat radiating fan, and the fence corresponds to the heat radiating fin. A guide frame is sheathed at one end where the heat radiating fin corresponds to the fence, and the side of the guide frame is pasted on the inner side of the casing. The part of the heat radiating module, which pastes the electronic component, absorbs the heat produced by the electronic component, and the heat is transmitted to the heat radiating fin. The airflow absorbs the heat of the heat radiating fin under the blowing of the heat radiating fan, and the heat is vented out of the electronic device from the fence of the casing. A guide frame is arranged between the casing and the heat radiating fin, which can prevent the reflux air from creating noise.

Description

The noise suppression arrangement of radiating module

[technical field]

The noise suppression arrangement of the relevant a kind of radiating module of the utility model, and particularly be used relevant for a kind of electronic component that can generate heat with electronic installation, in order to removing the heat energy of this electronic component, and reduce the noise suppression arrangement of the noise of this radiating module generation in service.

[background technology]

Along with the advancing by leaps and bounds of computer technology, make the running speed of computer constantly improve in recent years, and the heating power of the electronic component of host computer inside is also constantly soaring.Overheated for the electronic component that prevents host computer inside, and cause electronic component to take place temporary or permanently lost efficacy, so provide enough heat dissipation to the electronic component of computer inside will become extremely important.With CPU (central processing unit) (CPU) is example, and CPU (central processing unit) is under running, when the temperature of CPU (central processing unit), in case when exceeding its normal operating temperature range, operation mistake very likely can take place in CPU (central processing unit), or temporarily loses efficacy, and so will cause host computer to work as machine.In addition, when the temperature of CPU (central processing unit) during considerably beyond its normal operating temperature range, even very likely damage the transistor of the inside of CPU (central processing unit) chip, thereby cause CPU (central processing unit) permanently to lose efficacy, just must change CPU (central processing unit) thus, the beginning can be recovered the normal operation of host computer.

In order to reduce the heat energy that electronic component is produced effectively when operating, with regard to prior art, remove and to install radiator fan additional in the casing inside of host computer, beyond the thermolysis that the thermal convection form is provided, more can be directly in the power supply unit and the CPU (central processing unit) (CPU) of host computer, or even install radiating module additional on the easy electronic component that raises of chipset equitemperature, in order to remove the heat energy that these electronic components are produced rapidly when operating.

Existing radiating module can be consulted shown in Figure 1, the part of this radiating module 5 is fitted with the surface of this electronic component (not icon), and this radiating module 5 is provided with a fan 51 in the side with the electronical elements surface fitting part, and be provided with several radiating fins that is superimposed with each other 52 at these fan 51 air outlet places, again, the housing 6 of this electronic installation is provided with several slits 60 in fan 51 air outlet positions, relative with this radiating fin 52, so this this radiating module 5 is absorbing the heat that electronic component produces with the electronical elements surface fitting part, and conduct to radiating fin 52, under the blowing of fan 51, the heat of absorbed radiating fin 52 also drains into the periphery of this electronic installation from the slit 60 of housing 6, only there is following weak point in this kind mode: because of there is certain slit in the inwall of radiating fin 52 and case of electronic device 6 because of directional error etc. mostly, so when passing through the air flow slit 60 of radiating fin 52, the part air-flow is stopped by the part that housing 6 is positioned at slit 60 sides, from flowing to the slit 7 of meeting between radiating fin 52 and housing 6, so can produce noise, thereby increase the noise content that electronic installation produces when operation, thereby the operator is produced unnecessary interference, also reduced the usability of this electronic installation.

In view of this, be necessary to develop a kind of noise suppression arrangement of radiating module in fact, utilize this structure, flow out from the slit between this radiating module and the case of electronic device from the radiating module airflow flowing avoiding, thereby avoid producing noise, reducing the noise of electronic installation generation in service, thereby increase the usability of this electronic installation.

[summary of the invention]

The utility model purpose is to provide a kind of noise suppression arrangement of radiating module, utilize this structure, flow out from the slit between this radiating module and the case of electronic device from the radiating module airflow flowing avoiding, thereby avoid producing noise, reducing the noise of electronic installation generation in service, thereby increase the usability of this electronic installation.

For reaching above-mentioned purpose, the noise suppression arrangement of radiating module of the present utility model, cooperate with the heat-generating electronic elements of electronic installation, the part of this radiating module is fitted with the surface of this electronic component, and this radiating module is being provided with a radiator fan with electronical elements surface fitting part one side, and be provided with the radiating fin that several are superimposed with each other at this radiator fan air outlet place, again, the housing of this electronic installation is provided with fence in radiator fan air outlet position, relative with this radiating fin, and the end cover unification guide housing that this radiating fin is relative with this fence, and the medial surface of the side of this guide housing and housing is fitted.

Compared to prior art, the heat that partially absorbs the electronic component generation that this radiating module and electronic component are fitted, and conduct to radiating fin, under the blowing of radiator fan, the heat of absorbed radiating fin also flow to the periphery of this electronic installation from the housing fence, by between housing and radiating fin guide housing being set, the air that can avoid refluxing produces noise, thereby makes electronic installation have better usability.

For making the purpose of this utility model, structural attitude and function thereof there are further understanding, cooperate diagram to be described in detail as follows now:

[description of drawings]

Fig. 1 is the use synoptic diagram of existing radiating module;

Fig. 2 is for implementing the use synoptic diagram of radiating module of the present utility model;

Fig. 3 is for implementing the three-dimensional exploded view of radiating module of the present utility model;

Fig. 4 is for implementing radiating module of the present utility model and the measure of merit comparison diagram of not implementing radiating module of the present utility model.

[embodiment]

As Fig. 2 and shown in Figure 3, below be that example illustrates design of the present utility model with the radiator structure of notebook computer central processing unit, be familiar with this operator as can be known this design also can be applied on other electronic installation with heat-generating electronic elements.

For for simplicity, the part of notebook computer only is shown among the figure, wherein this notebook computer 2 comprises a housing 20, this housing 20 comprises a base plate 200, the vertical extension of ora terminalis is provided with side plate 201 around this base plate 200, this base plate 200 encloses a receiving space 202 jointly with side plate 201, and these notebook computer 2 motherboards (not icon) are mounted in this receiving space 202.Again, the base plate 200 of this housing 20 offers slit 203 in the corresponding position of the radiator fan 111 (being detailed later) of radiating module 10, and so cold air enters the inside of this notebook computer 2 from this slit 203.In addition, also be provided with fence 204 on the side plate 201 of this housing 20, so under the running of radiator fan 111, enter the cold air absorption heat of notebook computer 2 inside from slit 203 after, just fence 204 is circulated to the outside thus, in time taking away the heat that central processing unit (not icon) produces, thereby guarantee the stability of these notebook computer 2 operations.

In the present embodiment, comprise a bracing frame 100 with the radiating module 10 of the supporting setting of these notebook computer 2 central processing units, these bracing frame 100 1 ends are provided with a holding seat 112, these holding seat 112 contents are provided with radiator fan 111, this radiator fan 111 is generally upper and lower air intake, the fan of side air-out, and this bracing frame 100 is provided with radiating fin 115 at air outlet 114 places of radiator fan 111, and a side of this bracing frame 100 is provided with heat pipe 130, relative with radiating fin 115, and this radiating fin 115 attaches mutually with an end of heat pipe 130.In addition, this radiating fin 115 and radiator fan 111 tops are covered with a lid 116, so that radiating fin 115 and radiator fan 111 firmly are mounted on the bracing frame 100.Again, bracing frame 100 is provided with a heat radiation copper billet 142 in a side of radiating fin 115, and bracing frame 100 contains heat pipe 130 at the back side that this heat radiation copper billet 142 is set, and this heat radiation copper billet 142 closely attaches with an end of this heat pipe 130.In addition, in order to increase heat conducts to heat radiation copper billet 142 from central processing unit efficient, can on heat radiation copper billet 142, attach heat conductive pad 144 (for example heat conducting interface material or heat-conducting cream), thereby make heat conduct to heat radiation copper billet 142 fast by heat conductive pad 144, and heat reaches heat pipe 130 by heat radiation rapidly behind the copper billet 142, because it is little that heat pipe 130 has thermal resistance, the fast advantage of conducting heat, so heat transfers on the radiating fin 115 that reclines with heat pipe 130 other ends with the end that heat radiation copper billet 142 attaches mutually from heat pipe 130 soon, by the running of radiator fan 111 to increase air flow, thereby the cold air that order enters notebook computer 2 from the slit 203 of housing 20 absorbs the heat on the radiating fin 115, and is distributed to the outside of this notebook computer 2 from the fence 204 of housing 20 side plates 201.Backflow for avoiding this airflow to produce simultaneously because of the part of running into the side plate 201 between the fence 204, slit between the side plate 201 of radiating fin 115 and housing 20 is back to housing 20 inside, one guide housing 117 is set between this radiating fin 115 and side plate 201, in the present embodiment, this guide housing 117 is cubic framework, and be linked in an end of radiating fin 115, and the medial surface of the side plate 201 of the free end of guide housing 117 and housing 20 reclines, so make between radiating fin 115 and the side plate and sealing, the noise that produces when avoiding the slit of this backflow between the side plate 201 of radiating fin 115 and housing 20 to be back to housing 20 inside whereby.

During assembling, earlier fan 111 is mounted in the holding seat 112 of bracing frame 100, and radiating fin 115 is mounted in the air outlet 114, and lid 116 is overlying on this radiator fan 111 and the radiating fin 115, so make this radiator fan 111 be mounted on the bracing frame 100 with radiating fin 115.To dispel the heat simultaneously copper billet 142 and heat pipe 130 is mounted on the bracing frame 100, so make an end of this heat pipe 130 attach mutually with this heat radiation copper billet 142, the other end then attaches mutually with radiating fin 115, then guide housing 117 is placed on radiating fin 115 1 ends, thereafter 10 groups will be on the motherboard of this notebook computer 2 with this radiating module, make radiating fin 115 relative with the fence 204 of the side plate 201 of housing 20, and the free end of guide housing 117 then fits with the inside surface of side plate 210, seals thereby make between radiating fin 115 and the side plate 201.So, when central processing unit is worked, the heat that this radiating module 10 produces when heat radiation copper billet 142 absorbs the central processing unit running, and transfer on the radiating fin 115 that reclines with heat pipe 130 other ends with heat pipe 130, running by radiator fan 111, the cold air that enters notebook computer 2 from the slit 203 of housing 20 absorbs the heat on the radiating fin 115, and is distributed to the outside of this notebook computer 2 from the fence 204 of housing 20 side plates 201.Because the restriction of the guide housing 117 between this radiating fin 115 and housing 20 side plates 201, the backflow that this airflow produces because of the part of running into the side plate 201 between the fence 204, can't be back to housing 20 inside from the slit between the side plate 201 of radiating fin 115 and housing 20, avoid producing noise whereby, thereby improve this notebook computer 2 whole usabilities.

See also shown in Figure 4, for implementing the test pattern of radiating module of the present utility model, it is not test under different running frequencies with the radiating module that guide housing is set at guide housing is set, wherein A represents not to be provided with the test data of the radiating module of guide housing among the figure, and B represents to be provided with the test data of the radiating module of guide housing, by finding out among the figure, in normal frequency range, the sound pressure level that the radiating module of guide housing is set all is lower than about the about 0.5dB of sound pressure level of the radiating module that guide housing is not set.

Claims

1, a kind of noise suppression arrangement of radiating module, cooperate with the heat-generating electronic elements of electronic installation, and this case of electronic device side plate is provided with fence, the part of this radiating module is fitted with the surface of this electronic component, this radiating module also comprises: a radiator fan, be located at a side of this radiating module and electronical elements surface fitting part; One radiating fin is located at the air outlet place of this radiator fan, and relative with the fence of case of electronic device; It is characterized in that: this radiating module also comprises a guide housing, be located between radiating fin and the housing side plate, and the inside surface of the free end of this guide housing and housing side plate is fitted; This radiating module and electronic component are fitted partially absorbs the heat that electronic component produces, and conducts to radiating fin, and under the blowing of fan, the heat of absorbed radiating fin also drains into the periphery of this electronic installation from the housing fence.

2, the noise suppression arrangement of radiating module as claimed in claim 1 is characterized in that: this guide housing is cubic framework, and is linked in an end of radiating fin.

3, the noise suppression arrangement of radiating module as claimed in claim 1 is characterized in that: this radiating module comprises a bracing frame, and this bracing frame one end is provided with a holding seat, and this radiator fan is contained in this holding seat.

4, the noise suppression arrangement of radiating module as claimed in claim 3 is characterized in that: this bracing frame is provided with a heat radiation copper billet in a side of radiating fin, and this heat radiation copper billet is located at the heat-generating electronic elements surface of electronic installation.

5, the noise suppression arrangement of radiating module as claimed in claim 4, it is characterized in that: this bracing frame contains heat pipe at the back side that this heat radiation copper billet is set, the surface of one end of this heat pipe and this heat radiation copper billet closely attaches, and the other end of this heat pipe attaches mutually with radiating fin.