CN2610390Y - Ventilation cover of heat sink of computer mainframe plate - Google Patents

Ventilation cover of heat sink of computer mainframe plate Download PDF

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Publication number
CN2610390Y
CN2610390Y CN 03243586 CN03243586U CN2610390Y CN 2610390 Y CN2610390 Y CN 2610390Y CN 03243586 CN03243586 CN 03243586 CN 03243586 U CN03243586 U CN 03243586U CN 2610390 Y CN2610390 Y CN 2610390Y
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CN
China
Prior art keywords
top board
kuppe
heating radiator
cpu
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03243586
Other languages
Chinese (zh)
Inventor
陈涵敦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAZHONG COMPUTER Co Ltd
Original Assignee
DAZHONG COMPUTER Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAZHONG COMPUTER Co Ltd filed Critical DAZHONG COMPUTER Co Ltd
Priority to CN 03243586 priority Critical patent/CN2610390Y/en
Application granted granted Critical
Publication of CN2610390Y publication Critical patent/CN2610390Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A dome of the computer mainboard radiator comprises a cover body which includes an upper plate, a right side plate and a left side plate, wherein the inner side margin of the right side plate under the upper plate is provided with a first vent hole which can cover the periphery of a CPU radiator; the inner side margin of the left side plate under the upper plate is equipped with a second vent hole which can cover the periphery of the electronic parts that support the CPU and also can effectively dissipate the heat of the electronic parts that support the central processing unit; the upper end of the upper plate is provided with a fastener which is offered to a fixing component to fix the dome from the top of the computer casing; and the utility model can avoid opening the hole on the mainboard and affecting the circuit disposition of the mainboard when assembling the fixing structure of the dome.

Description

The kuppe of computer motherboard heating radiator
Technical field
The utility model is the heat abstractor of relevant computer (PC) main frame, especially about connecting the kuppe of computer heat radiation fan and CPU (central processing unit) (CPU) heat radiator.
Background technology
No. the 511872nd, the Taiwan patent announcement that the applicant gets permission discloses a kind of wind-lead-cover structure of computer heat radiation.This wind scooper be an end of a hollow cover body in conjunction with a fan, the other end is in conjunction with another cover body.The L template body opening of this another cover body, just the fin section of CPU (central processing unit) module one side can be enveloped, so that make the air of this wind scooper inside upper and lower air channel of can flowing through, with carry out this CPU (central processing unit) module and arround the thermolysis of electronic component.
The side of general CPU (central processing unit) module is equiped with the electronic component of supporting CPU (central processing unit).These support the electronic component of CPU (central processing unit), and the heat that is produced accounts for 1/4th of heat that CPU (central processing unit) produces, also is an important pyrotoxin.
The wind scooper of above-mentioned patent case adopts the design in upper and lower air channel, though the electronic component arround reaching CPU (central processing unit) dispels the heat.But its upper air duct is located at the top of CPU (central processing unit), can not directly be opposite to the CPU (central processing unit) side, and the electronic component of supporting CPU (central processing unit) dispels the heat.
And existing wind scooper all is fixed on the motherboard by the below, needs to hole on motherboard, with screw locking wind scooper lower end, can occupy the configuration circuit space of motherboard, influences the layout of circuit.
The utility model content
Fundamental purpose of the present utility model at the kuppe that a kind of computer motherboard heating radiator is provided, can effectively be dispelled the heat to the electronic component of supporting CPU (central processing unit).
Another purpose of the present utility model at the kuppe that a kind of computer motherboard heating radiator is provided, can make motherboard have bigger circuit arrangement space by the fixing kuppe in upper end.
The kuppe of a kind of computer motherboard heating radiator of the utility model is characterized in that, comprises that a cover body has a upper plate, right plate and left plate; The inner side edge of this upper plate below and this right plate has first air hole that can cover in the cpu heat periphery; The inner side edge of this upper plate below and this left plate has second air hole that can cover in the electronic component periphery of supporting CPU.
Wherein this upper plate comprises that a side of a flat board extends an expansion board; Another side of this expansion board extends first top board and second top board; The other end of this first top board and second top board extends this right plate and this left plate respectively downwards.
Wherein the end of this second top board tilts downwards, forms a difference in height with the end of this first top board; One epipleural connects the adjacent edge of this first top board and this second top board tool difference in height.
Wherein this first air hole is between this right plate and this epipleural.
Wherein this second air hole is between below this left plate and this epipleural.
Wherein this first top board top has fastener.
Wherein this fastener upper end is socketed in the corresponding hole of a fixed component.
Wherein this fastener tool fin is pressed the lower end in fixed component.
Description of drawings
For further specifying other purposes of the present utility model, effect, see also drawings and Examples, be described in detail as follows, wherein:
Fig. 1 is the schematic perspective view of the utility model kuppe.
Fig. 2 is the schematic perspective view of the utility model kuppe and host computer.
Fig. 3 is the schematic perspective view of the utility model kuppe in conjunction with host computer.
Embodiment
See also shown in Figure 1ly, the kuppe of the utility model computer motherboard heating radiator is that a cover body 10 has a upper plate 11, right plate 12 and left plate 13 and forms.Upper plate comprises that a side of a flat board 111 extends an expansion board 112.Another side of expansion board 112 extends first top board 113 and second top board 114.The end 115 of second top board 114 tilts downwards, forms a difference in height with the end of first top board 113.One epipleural 116 connects the adjacent edge of first top board 113 and second top board, 114 tool differences in height.The other end of first top board 113 and second top board 114 extends right plate 12 and left plate 13 respectively downwards.First top board, 113 tops have two fasteners 117, supply in conjunction with other fixed components with fixed enclosure 10.Form first air hole 14 between first top board, 113 belows, right plate 12 inner side edges and the epipleural 116.Second top board, 114 belows, left plate 13 inner side edges and epipleural 116 belows form second air hole 15.
See also shown in Figure 2ly, the CPU of general host computer 20 is in conjunction with heating radiator 21, to distribute the heat that CPU produces.The side of CPU is provided with the electronic component 22 of supporting CPU, so that CPU to be provided required electric power.Show the electronic component 22 of this support CPU after tested, the heat that sends during work is about 1/4th of the own thermal value of CPU.The wind scooper of general existing kuppe and above-mentioned patent only covers in the periphery of cpu heat 21, can not directly dispel the heat to the electronic component 22 of supporting CPU, so still can't effectively dispel the heat to host computer 20 inside.
Characteristics of the present utility model are to make first air hole 14 of cover body 10 cover in the periphery of cpu heat 21; And second air hole 15 covers in the periphery of the electronic component 22 of supporting CPU.The flat board 111 of cover body 10 other ends is incorporated into the rear side of radiator fan 30.Fan 30 is incorporated into the rear side of power supply unit 40, as shown in Figure 3.
When fan 30 rotates, can get rid of the heating radiator 21 of power supply unit 40, CPU simultaneously and support the heat that the electronic component 22 of CPU is produced.Make the fan 30 can be to host computer 20 inside, main heater element carries out the heat radiation of full blast.
The utility model second top board 114 is downward-sloping design, makes the opening of second air hole 15 have air intake opening than small size, has stronger suction, and holding concurrently to absorb host computer 20 inside, the hot gas that electronic component produced that other are regional.
See also shown in Figure 3ly, two fasteners of the utility model cover body 10 upper end 118 is socketed on respectively in the corresponding hole of plate of a fixed component 50.And the fin 119 that fastener extends back is pressed in the lower end of fixed component 50.The two ends of fixed component 50 are locked in host computer 20 casings respectively with screw 60, make the cover body 10 can be by more firm being fixed in the host computer 20.Do not need to offer hole at motherboard, and the emerald green fixture construction of assembling water conservancy diversion, make motherboard have bigger circuit arrangement space.
The above record only for utilizing the embodiment of the utility model technology contents, anyly is familiar with modification, the variation that this skill person uses the utility model to do, and all belongs to the claim of the utility model opinion, and is not limited to that embodiment discloses.
In sum, the kuppe of the utility model computer motherboard heating radiator is innovated to some extent, and has the effect enhancement than existing kuppe, closes in patent condition, so apply for a patent in accordance with the law.

Claims (8)

1. the kuppe of a computer motherboard heating radiator is characterized in that, comprises that a cover body has a upper plate, right plate and left plate; The inner side edge of this upper plate below and this right plate has first air hole that can cover in the cpu heat periphery; The inner side edge of this upper plate below and this left plate has second air hole that can cover in the electronic component periphery of supporting CPU.
2. the kuppe of computer motherboard heating radiator as claimed in claim 1 is characterized in that, wherein this upper plate comprises that a side of a flat board extends an expansion board; Another side of this expansion board extends first top board and second top board; The other end of this first top board and second top board extends this right plate and this left plate respectively downwards.
3, the kuppe of computer motherboard heating radiator as claimed in claim 2 is characterized in that, wherein the end of this second top board tilts downwards, forms a difference in height with the end of this first top board; One epipleural connects the adjacent edge of this first top board and this second top board tool difference in height.
4. the kuppe of computer motherboard heating radiator as claimed in claim 3 is characterized in that, wherein this first air hole is between this right plate and this epipleural.
5. the kuppe of computer motherboard heating radiator as claimed in claim 3 is characterized in that, wherein this second air hole is between below this left plate and this epipleural.
6. the kuppe of computer motherboard heating radiator as claimed in claim 3 is characterized in that, wherein this first top board top has fastener.
7. the kuppe of computer motherboard heating radiator as claimed in claim 6 is characterized in that, wherein this fastener upper end is socketed in the corresponding hole of a fixed component.
8. the kuppe of computer motherboard heating radiator as claimed in claim 7 is characterized in that, wherein this fastener tool fin is pressed the lower end in fixed component.
CN 03243586 2003-04-02 2003-04-02 Ventilation cover of heat sink of computer mainframe plate Expired - Fee Related CN2610390Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03243586 CN2610390Y (en) 2003-04-02 2003-04-02 Ventilation cover of heat sink of computer mainframe plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03243586 CN2610390Y (en) 2003-04-02 2003-04-02 Ventilation cover of heat sink of computer mainframe plate

Publications (1)

Publication Number Publication Date
CN2610390Y true CN2610390Y (en) 2004-04-07

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Family Applications (1)

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CN 03243586 Expired - Fee Related CN2610390Y (en) 2003-04-02 2003-04-02 Ventilation cover of heat sink of computer mainframe plate

Country Status (1)

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CN (1) CN2610390Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100543639C (en) * 2005-11-01 2009-09-23 鸿富锦精密工业(深圳)有限公司 Cooling system
CN101644946B (en) * 2008-08-08 2012-10-31 英业达股份有限公司 Wind scooper
CN103901988A (en) * 2014-04-23 2014-07-02 合肥恒研智能科技有限公司 1U vehicle-mounted ruggedized computer
CN105792599A (en) * 2014-12-25 2016-07-20 鸿富锦精密工业(武汉)有限公司 Radiating apparatus
CN108089678A (en) * 2017-12-25 2018-05-29 曙光信息产业(北京)有限公司 A kind of server air guiding cover heat radiation module
CN111240449A (en) * 2020-02-25 2020-06-05 浙江广厦建设职业技术学院 Portable computer heat dissipation module and computer heat dissipation device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100543639C (en) * 2005-11-01 2009-09-23 鸿富锦精密工业(深圳)有限公司 Cooling system
CN101644946B (en) * 2008-08-08 2012-10-31 英业达股份有限公司 Wind scooper
CN103901988A (en) * 2014-04-23 2014-07-02 合肥恒研智能科技有限公司 1U vehicle-mounted ruggedized computer
CN105792599A (en) * 2014-12-25 2016-07-20 鸿富锦精密工业(武汉)有限公司 Radiating apparatus
CN108089678A (en) * 2017-12-25 2018-05-29 曙光信息产业(北京)有限公司 A kind of server air guiding cover heat radiation module
CN111240449A (en) * 2020-02-25 2020-06-05 浙江广厦建设职业技术学院 Portable computer heat dissipation module and computer heat dissipation device

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040407