CN2594507Y

CN2594507Y - Radiating structure

Info

Publication number: CN2594507Y
Application number: CN 02290145
Authority: CN
Inventors: 张瑞祺
Original assignee: Mitac Technology Corp
Current assignee: Getac Technology Corp
Priority date: 2002-12-13
Filing date: 2002-12-13
Publication date: 2003-12-24
Anticipated expiration: 2012-12-13

Abstract

The utility model relates to a heat radiating structure, which can be applied to a flat electronic device. The heat radiating structure comprises a radiator and a heat radiating fan, wherein, the heat radiating fan is connected with a heat conducting block through a heat conducting pipe; when connecting, the heat source of a heat generation subassembly which is to radiate is led to fin sheets of the heat radiating structure through the heat conducting block, wherein, the radiator is composed of a plurality of heat radiating fins which are provided with high step parts and low step parts, wherein, a plane which is formed from potential difference between the high step parts and the low step parts just can be provided with a spiral type heat radiating fan to cause the heat source to be conducted to the low step heat radiating fins to obtain heat radiation, and the heat source can also be conducted to the high step heat radiating fins to enlarge heat radiating area and enhance heat radiating efficiency.

Description

Radiating structure

Technical field

The utility model relates to a kind of radiating structure, is applied to the heat radiation of electronic equipment, and particularly one has the radiating structure that the ladder-type radiating fin is formed, and is suitable in the comparatively flat electronic equipment in device space.

Background technique

The radiating structure that is applied in the electronic equipment generally is made up of the radiator of radiation fan and fin type, main with being the heat conducting principle of utilization, the radiator of fin type is attached on the heating element in the electronic equipment with thermal grease, make the heating element can be by heat conducting mode, the thermal source that produces is conducted on the fin of radiator, and by being located at above the radiator or the radiation fan of sidepiece, introduce a large amount of cool airs (wind), fast with the thermal source band on the fin from fin, can quicken heat radiation to reach, general common radiating structure as shown in Figure 1, be that radiation fan 11 with an axial flow is installed on the radiator 12 of a fin type, bottom with this radiator is attached on the heating element 50 again, the application of this kind radiating structure 10 is applicable in the bigger device in space, as in the PC, the heat radiation of CPU or the heat radiation of display card, radiating fin 121 areas of this kind radiating structure 10 are bigger, radiating efficiency is comparatively good, yet, install suitable big in shared space, radiation fan 11 back additional, if desire is applied to this kind radiating structure 10 then can't be suitable in the less or flat electronic equipment in space.

Please consult Fig. 2, another kind of radiating structure 20 commonly used as shown in Figure 2, be by a heat-conducting block 24, heat

conductive tube

25 and 26, one radiator 22 and a radiation fan 21 are formed, it is applicable in the more flat electronic equipment in space, as mobile computer, mainly be to utilize highly lower finned radiator 22 collocation one to be installed on the radiation fan 21 of an enclosing cover 23 to cooperate flat space, and then utilize heat-conducting block 24 to be attached on the heating element 50, and utilize the connection of heat

conductive tube

25 and 26, the thermal source that heating element 50 is produced can conduct on the radiating fin 221 of sink 22, the air-flow that utilizes radiation fan 21 to be blown into again, rapidly with the thermal source band from this radiator, the radiating fin 221 of this kind radiating structure 20 is highly lower, so can be applicable in the comparatively flat electronic equipment in space, yet the also relative area with its radiating fin 221 of the efficient of its heat radiation reduces; Hence one can see that, and the area size of the radiating efficiency of radiating structure and its heat radiation is closely bound up, yet under the demand of the restriction in space and heat radiation, radiating structure often is difficult to take into account both equilibriums.

Summary of the invention

The purpose of this utility model is to provide a kind of thermal diffusivity good, and can build the radiating structure in the electronic equipment that places flat space.

The purpose of this utility model can realize by following measure:

A kind of radiating structure, this radiating structure links to each other with a heating element in the electronic equipment; It comprises:

One vortex type radiation fan can ventilate;

One radiator comprises a plurality of radiating fins;

This radiating fin is formed with a high-order portion and a low order portion of a height fall, the drop that this high-order portion and low order portion form is a containing space, this radiator fan device is in this containing space, and this high-order portion of this radiating fin is positioned at the exhaust outlet of this vortex type radiation fan.

The high-order portion of this radiating fin then can provide large-area heat radiation; By heat-conductive assembly and this radiator that links to each other with sink, the advantage that can make radiating structure of the present utility model have big heat diffusion area simultaneously concurrently and can in flat space, install.

This radiator is provided with at least one heat conductive tube and is connected to a heat-conducting block.

The sidepiece of this radiating fin has the through hole that can supply this heat conductive tube to pass.

This high-order portion of this radiating fin and the intersection of low order portion are plugged with a barrier flaps.

The sidepiece of this radiating fin has the through hole that can supply a barrier flaps to pass.

Plane cover is equipped with a loam cake in the low order portion of this radiating fin, and this loam cake has a circular hole.

This radiation fan is a kind of vortex type radiation fan.

This heating element is a central processing unit.

This heating element is a chip.

This electronic equipment is a kind of notebook.

The utility model has following advantage compared to existing technology:

In the disclosed radiating structure of the utility model, the device that has utilized heat-conducting block and heat conductive tube is to reduce the device height of radiating structure, and, has the radiator that high-order portion and a low order portion radiating fin are constituted with one, to increase heat diffusion area, it not only can make radiating structure remain in certain height, has also had the heat radiation excellent function simultaneously concurrently.

From the above mentioned as can be known, the enforcement of the utility model radiating structure, it is more good really can to reach the thermal diffusivity that makes radiating structure, and can build the purpose that places in the flat electronic equipment in space.

Description of drawings

Fig. 1 is conventional radiating structure;

Fig. 2 is another conventional radiating structure;

Fig. 3 is a three-dimensional exploded view of the present utility model;

Fig. 4 is embodiment's schematic representation of the present utility model;

Fig. 5 is embodiment's generalized section of the present utility model.

Embodiment

Please consult Fig. 3, radiating structure 30 of the present utility model mainly comprises a vortex type radiation fan 32 that can ventilate, and this fan is embedded at an enclosing cover 31, and the appropriate location of these enclosing cover 31 sidepieces is provided with two through

holes

311 and 312; One radiator 33, constituted by multi-disc radiating fin 331, this radiating fin 331 includes a high-order portion 3311 and a low order portion 3312, and this high-order portion 3311 and low order portion 3312 form a height fall, these radiating fin 331 sidepiece appropriate positions are provided with through

hole

3313 and 3314, and another through hole 3315 is arranged at the intersection of this high-order portion 3311 and low order portion 3312; One loam cake 332 is installed or is formed at by on the formed low order of a plurality of radiating fin 331 portion 3312 planes; One heat-conducting block 35 is the good block of a heat conduction efficiency; One heat conductive tube 36 and another heat conductive tube 37 are the mediator of a heat conduction efficiency; One barrier flaps 34 is in the through hole 3315 of its radiating fin 331 sidepieces of just can planting.

During assembling, in the through hole 3315 of radiating fin 331 sidepieces of earlier this barrier flaps 34 being planted, and fixing in penetrating the diffusing fin of each sheet 331 backs; The enclosing cover 31 that is equiped with radiation fan 32 is placed on outside this radiator 33, and makes its side through-hole 311 and another through hole 312 corresponding with radiator sidepiece through hole 3313 and another through hole 3314; Plant with these heat conductive tube 36, one ends and plant into heat-conducting block 35 into through hole 311, one ends of enclosing cover 31 sidepieces, an end of another heat conductive tube 37 is planted and is planted into heat-conducting block 35 into through hole 312, one ends of enclosing cover 31 sidepieces, and both sides are fixed, to finish connection; So promptly constitute radiating structure 30 of the present utility model.

After assembling is finished, promptly as shown in Figure 4, this radiating structure can be installed in the heating element of an electronic equipment, as shown in FIG., the mode that this heat-conducting block 35 can attach or stick together is overlying on the heating element 50, and this heating element 50 can be common CPU or chip, this radiation fan 32 is a kind of radiation fan of vortex type, the cool air (wind) of top and sidepiece can be sucked (also can be the hot gas of radiator 33 inside is discharged); When heating element 50 produces thermal source because of action, this thermal source can be because of contact, and conduct to this heat-conducting block 35, again via the heat conductive tube 36 and another heat conductive tube 37 that are connected with this heat-conducting block 35, thermal source is conducted to radiator 33, the air-flow that is driven by this radiation fan 32 again, and with the thermal source band outside this radiator 33.

Please consult Fig. 5, it shown in the figure cross-sectional schematic of the utility model radiating structure, as shown in FIG., radiating fin 331 sidepieces are connected with a heat conductive tube 36 and another heat conductive tube 37, after thermal source is conducted to each radiating fin 331 of radiator 33 thus, promptly be distributed on each radiating fin 331, again, this radiating fin 331 includes a high-order portion 3311 and a low order portion 3312, and intersection in this high-order portion 3311 and low order portion 3312, be plugged with a barrier flaps 314, and each sheet radiating fin 331 of break-through, this deaden piece 314 is for preventing that radiator 33 air outside from refluxing; When enclosing cover 31 is placed on radiator 33 outsides, low order portion 3312 promptly forms a containing space with enclosing cover 31, this space can be for installing one radiation fan 32, and this radiation fan 32 has a loam cake 332 with the interplanar device of low order portion 3312, these loam cake 332 centres also are formed with a circular hole 3331, can make outside cool air (wind) when entering, form an air channel.

When radiation fan 32 during in the running of normality, outside cool air (wind) is promptly constantly sucked, and at this moment, conducts to the thermal source on each radiating fin 331, promptly is with discrete heat device 33 rapidly by the cool air that is sucked (wind), to reach the purpose of heat radiation; As shown in FIG., after cool air (wind) was inhaled into, a part of cool air (wind) promptly can be by the circular hole 3331 formed air channels by loam cake 332, and the thermal source that will be attached to low order portion 3312 surfaces rapidly band from; Another partly cool air (wind) promptly by enclosing cover 31 guiding high-order portions 3311, and the thermal source that will adhere to high-order portion 3311 surfaces rapidly band from.

Radiating structure of the present utility model is to utilize a heat-conducting block and heat conductive tube, with the accompanying thermal source that heating element produced, guide to a radiator, this radiator and device have a radiation fan, air outside can be sucked, with the thermal source of rapid band from the radiating fin that is attached to this radiator, wherein, this radiating fin includes a high-order portion and a low order portion, but the drop of this high-order portion and low order portion forms the containing space of a supplying apparatus radiation fan, and the utility model has the advantage that reduces the radiating structure occupation space and increase heat diffusion area simultaneously.

In sum as can be known, radiating structure of the present utility model not only utilizes heat-conductive assembly to reduce the device height, also can make simultaneously the bigger area of radiating fin maintenance in order to heat radiation, can make the radiating structure radiating efficiency more good, and taken into account structural volume and radiating efficiency simultaneously, its application will be more extensive.

Claims

1, a kind of radiating structure, this radiating structure links to each other with a heating element in the electronic equipment; It comprises:

One vortex type radiation fan;

One radiator comprises a plurality of radiating fins;

It is characterized in that this radiating fin is formed with a high-order portion and a low order portion of a height fall, the drop that this high-order portion and low order portion form is a containing space, this radiator fan device is in this containing space, and this high-order portion of this radiating fin is positioned at the exhaust outlet of this vortex type radiation fan.

2, radiating structure as claimed in claim 1 is characterized in that this radiator is provided with at least one heat conductive tube and is connected to a heat-conducting block.

3, radiating structure as claimed in claim 2 is characterized in that the sidepiece of this radiating fin has the through hole that can supply this heat conductive tube to pass.

4, radiating structure as claimed in claim 1 is characterized in that this high-order portion of this radiating fin and the intersection of low order portion are plugged with a barrier flaps.

5, radiating structure as claimed in claim 4 is characterized in that the sidepiece of this radiating fin has the through hole that can supply a barrier flaps to pass.

6, radiating structure as claimed in claim 1 it is characterized in that plane cover is equipped with a loam cake in the low order portion of this radiating fin, and this loam cake has a circular hole.

7, radiating structure as claimed in claim 1 is characterized in that this radiation fan is a kind of vortex type radiation fan.

8, radiating structure as claimed in claim 1 is characterized in that this heating element is a central processing unit.

9, radiating structure as claimed in claim 1 is characterized in that this heating element is a chip.

10, radiating structure as claimed in claim 1 is characterized in that this electronic equipment is a kind of notebook.