CN101207997A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101207997A CN101207997A CNA2006101578870A CN200610157887A CN101207997A CN 101207997 A CN101207997 A CN 101207997A CN A2006101578870 A CNA2006101578870 A CN A2006101578870A CN 200610157887 A CN200610157887 A CN 200610157887A CN 101207997 A CN101207997 A CN 101207997A
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- fins
- heat
- heat abstractor
- substrate
- transfer segment
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Abstract
The invention relates to a heat dissipation device, which is used for the heat dissipation of a plurality of electronic elements arranged on a circuit board. The heat dissipation device comprises a baseplate which absorbs heat from one of the electronic elements and a plurality of fins which are arranged in an interval way; wherein, the fins are bent alonga certain direction; an air current channel which is used for the circulating and redirection of the air current is formed between the fins, so as to lead the air current which passes through the air current channel to blow the other electronic elements, therefore, the heat dissipation device can dissipate the heat for a plurality of electronic elements.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic element radiating.
Background technology
The electronic component that central processing unit etc. are located on the circuit board produces a large amount of heat in running, for guaranteeing the normal operation of electronic component, the heat of its generation need distribute in time.Usually, install a heat abstractor on this electronic component additional and think its heat radiation.
Heat abstractor commonly used comprises that a contact electronic component is with the metal base plate of heat absorption and be located at some plate radiating fins that be arranged in parallel with heat radiation on this base plate.Along with the increase of electronic component function and the lifting of running frequency, the heat that electronic component produces is more and more, and increasing electronic component needs heat radiation.And at present, some electronic components can not directly install heat abstractor additional owing to the influence of factors such as its size, ability to bear, and needing the heat abstractor by other electron component be its heat radiation.Yet above-mentioned heat abstractor needs directly to contact electronic component and could dispel the heat for it, thus can not satisfy demand for a plurality of electronic element radiatings, so this heat abstractor needs further to improve.
Summary of the invention
In view of this, being necessary to provide a kind of can be the heat abstractor of a plurality of electronic element radiatings in fact.
A kind of heat abstractor, be used for being located at the some electronic element radiatings on the circuit board, it comprises one to absorb the substrate of heat from an electronic component wherein and to be positioned at some fins of arranging at certain intervals on this substrate, these some fins are crooked in a certain direction, form the gas channel of circulation of air feed stream and change airflow direction between these some fins, and make air-flow blow to other electron component by this gas channel.
Compared with prior art, the base plate of above-mentioned heat abstractor is directly from above-mentioned wherein electronic component heat absorption, and by above-mentioned fin heat radiation, and these some fins are along certain direction bending, make air-flow change the direction after-blow, thereby make this heat abstractor can be a plurality of electronic element radiatings to other electron component by gas channel between this fin.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention and related elements.
Fig. 2 is the stereogram of Fig. 1.
Fig. 3 is the vertical view of Fig. 2.
Embodiment
See also Fig. 1 and Fig. 2, this heat abstractor is used for being arranged at the electronic component 20 on the circuit board 10 and being positioned at other peripheral element 30 heat radiations such as electric capacity of this electronic component 20 1 sides.This heat abstractor comprises a base plate 40, be positioned at radiator 50 on this base plate 40, be positioned at the fins group 60 of these radiator 50 1 sides and connect two heat pipes 70 of this base plate 40, radiator 50 and fins group 60.One is positioned at the fan (figure does not show) of these fins group 60 1 sides to provide the forced convertion air-flow to this fins group 60 and radiator 50.
Above-mentioned base plate 40 is the square plate body of a high-termal conductivity, and it comprises that one is used to contact the bottom surface of electronic component 20 and the end face that contacts with above-mentioned radiator 50, and this end face is provided with two parallel grooves 401, with in conjunction with above-mentioned two heat pipes 70.
Thereby above-mentioned radiator 50 comprises the substrate 510 and the upwardly extending some fins 530 arranged at certain intervals of these substrate 510 end faces of above-mentioned base plate 40 end faces of a contact.This substrate 510 roughly is a square plate body, and its four angle respectively extends a fixing feet 515 outward.The bottom surface of this substrate 510 is provided with two parallel grooves 511 to groove 401 that should base plate 40, with in conjunction with above-mentioned two heat pipes 70.This fixing feet 515 is provided with a fixing hole 516, places and this heat abstractor is fixed on the foregoing circuit plate 10 for a fixture 517.Each fin 530 has a first end (indicate), a second end (sign) vertical with this first end and the curved pars intermedia of this first end of a smooth connection and the second end, this first end is positioned at a sidepiece of this substrate 510, and the second end is positioned at this substrate 510 the other side perpendicular to this sidepiece.The height of these some fins 530 is identical, and its length reduces one by one from a side direction opposite side of this substrate 510.The first end of these some fins 530 other fin 530 except that the first end of outermost two fins 530 stretches out first end terminal of other fin 530 terminal concordant.The second end of these some fins 530 terminal concordant.530 of adjacent fin form the gas channel (not indicating) of air feed stream circulation.The shape of each gas channel is similar to the shape of the fin of its both sides 530.Each gas channel has one at the air flow inlet between these adjacent fin 530 first ends (indicate) and be positioned at air stream outlet (indicating) between these adjacent fin 530 the second ends.
Above-mentioned fins group 60 is roughly L-shaped, and it comprises the some fins (not indicating) that are assembled into one, and each fin has a body 610.This body 610 is roughly L-shaped.610 of the bodies of adjacent two fins form the gas channel (not indicating) of air feed stream circulation.This body 610 is provided with and is positioned at the perforation of two on these body 610 differing heights (not indicating), the corresponding engagement groove 611 that forms in conjunction with above-mentioned heat pipe 70 of the perforation of these some fins.Corresponding bottom is stretched out to overlap with above-mentioned radiator 50 to a pleurapophysis in the upper end of this fins group 60.
Above-mentioned each heat pipe 70 roughly is " U " shape, and it comprises one first heat transfer segment 710, second heat transfer segment 720 and the vertical linkage section 730 that connect first heat transfer segment 710 and second heat transfer segment 720 parallel with this first heat transfer segment 710.
During assembling, the bottom surface of the substrate 510 of above-mentioned radiator 50 contacts the end face of above-mentioned base plate 40, the part that above-mentioned fins group 60 is positioned at a side of this radiator 50 and its upper end is overlapped in the top of these radiator 50 fins 530, and the gas channel between these fins group 60 fins is to the gas channel between should radiator 50 fins and be communicated with.First heat transfer segment 710 of above-mentioned two heat pipes 70 is bonded in the groove 401 and groove 511 of this base plate 40, substrate 510 correspondences.Second heat transfer segment 720 of this two heat pipe 70 is bonded to respectively in the engagement groove 611 of this fins group 60.The linkage section of this two heat pipe 70 is positioned at a side of this radiator 50 and fins group 60.
During use, above-mentioned heat abstractor is placed through fixing hole 101 interior being fixed on this circuit board 10 of the fixing hole 516 and the foregoing circuit plate 10 of above-mentioned radiator 50 by fixture 517.The above-mentioned electronic component 20 of above-mentioned base plate 40 contacts.The first end end of the corresponding above-mentioned fins group 60 of said fans and this radiator 50, the terminal corresponding above-mentioned peripheral element 30 of the second end of this radiator 50.This base plate 40 absorbs the heat that this electronic component 20 produces.Part heat on this base plate 40 directly is passed to the substrate 510 and the fin 530 of this radiator 50, and the part heat arrives fins group 60 by first heat transfer segment, 710 absorptions of above-mentioned heat pipe 70 and by the linkage section 730 and second heat transfer segment 720.Fan provides the forced convertion air-flow to this radiator 50 and fins group 60, this air-flow passes through the gas channel of this fins group 60 and radiator 50 and then blows to this peripheral element 30, thereby take away the heat on this fins group 60, radiator 50 and the peripheral element 30, it is shown in arrow among Fig. 2, Fig. 3.
Compared with prior art, fin 530 crooked settings of above-mentioned radiator 50, vertical its second end of its first end, thereby the inlet of gas channel that makes 530 of fins is perpendicular to the outlet of gas channel, make air-flow change direction blow to above-mentioned peripheral element 30 by this radiator 50, take away the heat that this peripheral element 30 produces, thereby make this heat abstractor can be for being located at a plurality of electronic element radiatings on the circuit board 10.
Claims (11)
1. heat abstractor, be used for being located at the some electronic element radiatings on the circuit board, it comprises one to absorb the substrate of heat from an electronic component wherein and to be positioned at some fins of arranging at certain intervals on this substrate, it is characterized in that: described some fins are crooked in a certain direction, form the gas channel of circulation of air feed stream and change airflow direction between these some fins, and make air-flow blow to other electron component by this gas channel.
2. heat abstractor as claimed in claim 1, it is characterized in that: comprise that also one is positioned at the fins group of described some fin gas channel air flow inlet one sides, this fins group is connected by a heat pipe with substrate, and this heat pipe comprises that first heat transfer segment and that is bonded to this substrate is placed through second heat transfer segment of this fins group.
3. heat abstractor as claimed in claim 2 is characterized in that: described heat pipe second heat transfer segment is parallel to described first heat transfer segment, and this first heat transfer segment is connected by a linkage section that is positioned at a side of described fins group and some fins with second heat transfer segment.
4. heat abstractor as claimed in claim 2 is characterized in that: the part of described fins group stretches out other parts and is overlapped in the top of described some fins.
5. heat abstractor as claimed in claim 4 is characterized in that: described fins group is L-shaped.
6. as each described heat abstractor in the claim 1 to 5, it is characterized in that: each fin of described some fins has a first end, with the vertical the second end of this first end and be connected the pars intermedia of this first end and the second end.
7. heat abstractor as claimed in claim 6 is characterized in that: described gas channel forms air flow inlet between described first end, forms air stream outlet between described the second end, and this enters the mouth perpendicular to this outlet.
8. heat abstractor as claimed in claim 6 is characterized in that: the first end of outermost two fins of described some fins stretches out the end of other fin first end.
9. heat abstractor as claimed in claim 6 is characterized in that: the length of described some fins reduces one by one from a side direction opposite side of described substrate.
10. as each described heat abstractor in the claim 1 to 5, it is characterized in that: also comprise a base plate between described substrate and electronic component.
11. as each described heat abstractor in the claim 1 to 5, it is characterized in that: described substrate stretches out some this heat abstractor is fixed to the fixing feet on the foregoing circuit plate in the outside of described some fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610157887A CN100592862C (en) | 2006-12-22 | 2006-12-22 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610157887A CN100592862C (en) | 2006-12-22 | 2006-12-22 | Heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101207997A true CN101207997A (en) | 2008-06-25 |
| CN100592862C CN100592862C (en) | 2010-02-24 |
Family
ID=39567756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610157887A Expired - Fee Related CN100592862C (en) | 2006-12-22 | 2006-12-22 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100592862C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623540A (en) * | 2012-03-13 | 2012-08-01 | 友达光电股份有限公司 | Heat radiation structure |
| CN107077177A (en) * | 2014-09-12 | 2017-08-18 | 微软技术许可有限责任公司 | Unanimously flow heat sink |
| CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6671177B1 (en) * | 2002-10-25 | 2003-12-30 | Evga.Com Corporation | Graphics card apparatus with improved heat dissipation |
| CN2694492Y (en) * | 2003-10-17 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe type heat radiator |
| CN2762348Y (en) * | 2004-12-31 | 2006-03-01 | 协禧电机股份有限公司 | Heat sink |
-
2006
- 2006-12-22 CN CN200610157887A patent/CN100592862C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623540A (en) * | 2012-03-13 | 2012-08-01 | 友达光电股份有限公司 | Heat radiation structure |
| US9171983B2 (en) | 2012-03-13 | 2015-10-27 | Au Optronics Corporation | Heat dissipation structure |
| CN107077177A (en) * | 2014-09-12 | 2017-08-18 | 微软技术许可有限责任公司 | Unanimously flow heat sink |
| CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100592862C (en) | 2010-02-24 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20131222 |