CN103984398A - Notebook computer structure with upper cover used for conducting and dissipating heat - Google Patents
Notebook computer structure with upper cover used for conducting and dissipating heat Download PDFInfo
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- CN103984398A CN103984398A CN201410236792.2A CN201410236792A CN103984398A CN 103984398 A CN103984398 A CN 103984398A CN 201410236792 A CN201410236792 A CN 201410236792A CN 103984398 A CN103984398 A CN 103984398A
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- heat
- upper cover
- circuit board
- heat pipe
- lid
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a notebook computer structure with an upper cover used for conducting and dissipating heat. The notebook computer structure comprises the upper cover and a seat, wherein the upper cover is formed by a cover A, a display screen, a heat conduction pipe and a circuit board. A rotary shaft, heat dissipation fins and a heat pipe attaching surface are arranged on the cover A, the heat conduction pipe is formed by a heat dissipation end and a plurality of heat absorption ends, the circuit board is attached to the back surface of the display screen and arranged in the cover A, and the heat conduction pipe is arranged between the cover A and the circuit board. By arranging the heat conduction pipe in the upper cover, heat in a notebook computer can be directly conducted to the outside of the upper cover in a heat conduction mode to perform heat dissipation. Due to the fact that a heat dissipation air fan and a special heat dissipation member are omitted, the notebook computer is lighter and thinner, no noise is generated, and the real silenced notebook computer is achieved.
Description
Technical field
The present invention relates to the notebook computer of field of computer technology, especially a kind of laptop structure with upper cover heat loss through conduction.
Background technology
What the heat dissipation problem of notebook computer had become computer design must obligato key element, the notebook computer of prior art is by internal memory, CPU and video card chip etc. easily heating element are all placed in main machine base, main machine base connects display screen by rotating shaft, in use, no matter computer is placed on desktop or leg, all can cause the not smooth heating causing of heat radiation due to computer bottom surface, and even hot, the heat dissipation problem of this structure computer is comparatively outstanding, for solving the heat dissipation problem of notebook computer, also have the easy heating element in computer is moved in the upper cover of computer, to improve the external cooling environment of computer, the problem existing is, the interior easily heat energy of heating element of upper cover cannot be directly transferred to A and cover, heat energy can not distribute in time, especially along with the Application and Development of high performance CPU and chip, the function of computer is more and more stronger, size is more and more thinner, be subject to the restriction in space, the heat dissipation problem thereupon bringing is also more and more serious.
Summary of the invention
A kind of laptop structure with upper cover heat loss through conduction providing for the deficiencies in the prior art is provided, the present invention moves to upper cover by easy heating element in computer, and heat pipe is set in upper cover, the heat of computer is derived from upper cover, realize the heat radiation of notebook computer, owing to having saved radiator fan and special-purpose radiating component, thereby make the weight of notebook computer lighter, size is thinner, and noise producing not, become real quiet notebook computer.
The concrete technical scheme that realizes the object of the invention is:
A kind of laptop structure with upper cover heat loss through conduction, its feature comprises upper cover, base, described upper cover is covered by A, display screen, heat pipe and circuit board form, A covers and is provided with rotating shaft, the outside surface of A lid is provided with radiating fin, inside surface is provided with heat pipe binding face, internal memory is installed on circuit board, CPU and video card chip, heat pipe consists of radiating end and many heat absorbing end, the back side that described circuit board is fitted in display screen is arranged in A lid, heat pipe is located between A lid and circuit board, its radiating end is fitted on the heat pipe binding face of A lid, heat absorbing end is fitted in respectively the internal memory of circuit board, on CPU and video card chip, base is comprised of lower house and keyboard, Trackpad, battery and the interface be located in lower house, described upper cover is hinged through rotating shaft and base, and the circuit board in upper cover is connected with keyboard, Trackpad, battery and the interface of base by the winding displacement in rotating shaft,
Described heat pipe is vacuum-tight strip pipe fitting, in the vacuum chamber of heat pipe, is provided with heat-conducting medium, and heat pipe is inverse-T-shaped or " mountain " font by strip pipe fitting is folding, and its horizontal edge is that radiating end, one or more vertical edge are heat absorbing end.
The present invention moves to upper cover by easy heating element in computer, and heat pipe is set in upper cover, the heat of computer is derived from upper cover, realize the heat radiation of notebook computer, owing to having saved radiator fan and special-purpose radiating component, thereby the weight that makes notebook computer is lighter, size is thinner, and noise producing not, real quiet notebook computer become.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of upper cover.
Embodiment
Consult Fig. 1, Fig. 2, the present invention includes upper cover 1, base 2, described upper cover 1 is by A lid 11, display screen 12, heat pipe 13 and circuit board 14 form, A lid 11 is provided with rotating shaft 113, the outside surface of A lid 11 is provided with radiating fin 111, inside surface is provided with heat pipe binding face 112, on circuit board 14, internal memory is installed, CPU and video card chip, heat pipe 13 consists of radiating end 131 and many heat absorbing end 132, the back side that described circuit board 14 is fitted in display screen 12 is arranged in A lid 11, heat pipe 13 is located between A lid 11 and circuit board 14, its radiating end 131 is fitted on the heat pipe binding face 112 of A lid 11, heat absorbing end 132 is fitted in respectively the internal memory of circuit board 14, video memory, CPU, on video card chip and South Bridge chip, base 2 is comprised of lower house and keyboard, Trackpad, battery and the interface be located in lower house,
Described upper cover 1 is hinged through rotating shaft 113 and base 2, and the circuit board 14 in upper cover 1 is connected with keyboard, Trackpad, battery and the interface of base 2 by the winding displacement in rotating shaft 113;
Described heat pipe 13 is vacuum-tight strip pipe fitting, in the vacuum chamber of heat pipe 13, be provided with heat-conducting medium 133, heat pipe 13 is inverse-T-shaped or " mountain " font by strip pipe fitting is folding, and its horizontal edge is that radiating end 131, one or more vertical edge are heat absorbing end 132.
The embodiment of the present invention:
Configuration of the present invention, consult Fig. 1, Fig. 2, the present invention is provided with rotating shaft 113 at A lid 11, radiating fin 111 and heat pipe binding face 112, by the internal memory in computer 41, video memory 42, CPU43, video card chip 44 and South Bridge chip 45 are integrated on circuit board 14, finally circuit board 14 is placed near A and covers a side of 11 rotating shafts 113 and the laminating of the back side of display screen 12, the radiating end 131 in heat pipe 13 fronts is fitted on the heat pipe binding face 112 of A lid 11, the heat absorbing end 132 of reverse side respectively with CPU 43, the surface laminating of video card chip 44 and South Bridge chip 45, again circuit board 14 is fixed in A lid 11 together with display screen 12, the circuit board 14 of upper cover is by the keyboard of the winding displacement in rotating shaft 113 and base 2, Trackpad, battery and interface connect, form notebook computer, configuration of the present invention is complete.
The course of work of the present invention, consults Fig. 1, Fig. 2, during work, the present invention for be integrated in internal memory 41, CPU 43 and video card chip 44 etc. on circuit board 14 easily heating element the approach of a heat conducting and radiating is provided;
Its process is by heat pipe 13, the heat pipe binding face 112 of A lid 11, radiating fin 111 and easily heating element form, the radiating end 131 of heat pipe 13 is fitted on the heat pipe binding face 112 of A lid 11, with be located at the radiating fin 111 that A covers on 11 outside surfaces and be combined into a powerful heat radiator, many heat absorbing end 132 are fitted in respectively the internal memory of circuit board 14, CPU and video card chip, heat pipe 13 of the present invention is a kind of all particulate metal material of temperature characteristics making fast that have, in its vacuum-tight cavity, be provided with heat-conducting medium 133, during work, heat-conducting medium 133 forms gas-liquid between heat absorbing end 132 and radiating end 131, the microcirculation of liquid gas shift, heat-conducting medium 133 is when heat absorbing end 132 evaporation, heat-conducting medium 133 produces partial high pressure in cavity, order about heat-conducting medium 133 evaporation of being heated high velocity stream to radiating end 131, heat-conducting medium 133 is back to heat absorbing end 132 after radiating end 131 condenses, iterative cycles, continuously the heat energy of easy heating element is transported on A lid 11, and distribute by radiating fin 111, complete the heat radiation of notebook computer.
Because the present invention has saved radiator fan and special-purpose radiating component, thereby make the weight of notebook computer lighter, size is thinner, and noise producing not, real quiet notebook computer become.
Claims (2)
1. the laptop structure with upper cover heat loss through conduction, it is characterized in that it comprises upper cover (1), base (2), described upper cover (1) is by A lid (11), display screen (12), heat pipe (13) and circuit board (14) form, A lid (11) is provided with rotating shaft (113), the outside surface of A lid (11) is provided with radiating fin (111), inside surface is provided with heat pipe binding face (112), circuit board is provided with internal memory on (14), CPU and video card chip, heat pipe (13) consists of radiating end (131) and many heat absorbing end (132), described circuit board (14) is fitted in the back side of display screen (12) and is arranged in A lid (11), heat pipe (13) is located between A lid (11) and circuit board (14), its radiating end (131) is fitted on the heat pipe binding face (112) of A lid (11), heat absorbing end (132) is fitted in respectively the internal memory of circuit board (14), video memory, CPU, on video card chip and South Bridge chip, base (2) is comprised of lower house and keyboard, Trackpad, battery and the interface be located in lower house,
Described upper cover (1) is hinged through rotating shaft (113) and base (2), and the circuit board (14) in upper cover (1) is connected with keyboard, Trackpad, battery and the interface of base (2) by the winding displacement in rotating shaft (113).
2. the laptop structure with upper cover heat loss through conduction according to claim 1, it is characterized in that heat pipe (13) is vacuum-tight strip pipe fitting, in the vacuum chamber of heat pipe 13, be provided with heat-conducting medium (133), heat pipe (13) is inverse-T-shaped or " mountain " font by strip pipe fitting is folding, and its horizontal edge is that radiating end (131), one or more vertical edge are heat absorbing end (132).
Priority Applications (1)
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CN201410236792.2A CN103984398A (en) | 2014-05-30 | 2014-05-30 | Notebook computer structure with upper cover used for conducting and dissipating heat |
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CN201410236792.2A CN103984398A (en) | 2014-05-30 | 2014-05-30 | Notebook computer structure with upper cover used for conducting and dissipating heat |
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CN201410236792.2A Pending CN103984398A (en) | 2014-05-30 | 2014-05-30 | Notebook computer structure with upper cover used for conducting and dissipating heat |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105974999A (en) * | 2016-04-22 | 2016-09-28 | 张小林 | Solar computer capable of automatically dissipating heat |
WO2018094877A1 (en) * | 2016-11-25 | 2018-05-31 | 华为技术有限公司 | Heat dissipation panel, heat dissipation device and electronic apparatus |
CN110099550A (en) * | 2019-05-17 | 2019-08-06 | 海纳巨彩(深圳)实业科技有限公司 | A kind of outdoor LED display screen waterproof cooling method |
CN113949751A (en) * | 2020-07-15 | 2022-01-18 | 华为技术有限公司 | Foldable electronic equipment |
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CN2594507Y (en) * | 2002-12-13 | 2003-12-24 | 神基科技股份有限公司 | Radiating structure |
CN201017271Y (en) * | 2007-03-28 | 2008-02-06 | 庆扬资讯股份有限公司 | Waterproof type display apparatus having computer without fan |
WO2011044735A1 (en) * | 2009-10-17 | 2011-04-21 | Qin Biao | Portable computer with two screens |
CN102238842A (en) * | 2010-04-21 | 2011-11-09 | 王训忠 | Heat dissipation structure of electric device |
CN103226378A (en) * | 2013-05-03 | 2013-07-31 | 合肥华恒电子科技有限责任公司 | Split type flat plate computer |
CN203894691U (en) * | 2014-05-30 | 2014-10-22 | 夏维 | Notebook computer structure with thermal conduction achieved through upper cover |
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2014
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2585307Y (en) * | 2002-11-22 | 2003-11-05 | 许宗成 | Hand-carried computer having heat sink |
CN2594507Y (en) * | 2002-12-13 | 2003-12-24 | 神基科技股份有限公司 | Radiating structure |
CN201017271Y (en) * | 2007-03-28 | 2008-02-06 | 庆扬资讯股份有限公司 | Waterproof type display apparatus having computer without fan |
WO2011044735A1 (en) * | 2009-10-17 | 2011-04-21 | Qin Biao | Portable computer with two screens |
CN102238842A (en) * | 2010-04-21 | 2011-11-09 | 王训忠 | Heat dissipation structure of electric device |
CN103226378A (en) * | 2013-05-03 | 2013-07-31 | 合肥华恒电子科技有限责任公司 | Split type flat plate computer |
CN203894691U (en) * | 2014-05-30 | 2014-10-22 | 夏维 | Notebook computer structure with thermal conduction achieved through upper cover |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105974999A (en) * | 2016-04-22 | 2016-09-28 | 张小林 | Solar computer capable of automatically dissipating heat |
WO2018094877A1 (en) * | 2016-11-25 | 2018-05-31 | 华为技术有限公司 | Heat dissipation panel, heat dissipation device and electronic apparatus |
US11272639B2 (en) | 2016-11-25 | 2022-03-08 | Huawei Technologies Co., Ltd. | Heat dissipation panel, heat dissipation apparatus, and electronic device |
CN110099550A (en) * | 2019-05-17 | 2019-08-06 | 海纳巨彩(深圳)实业科技有限公司 | A kind of outdoor LED display screen waterproof cooling method |
CN113949751A (en) * | 2020-07-15 | 2022-01-18 | 华为技术有限公司 | Foldable electronic equipment |
CN113949751B (en) * | 2020-07-15 | 2023-08-22 | 华为技术有限公司 | Foldable electronic equipment |
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Application publication date: 20140813 |