CN203327471U - Heat radiation structure and hand-held electronic device with heat radiation structure - Google Patents

Heat radiation structure and hand-held electronic device with heat radiation structure Download PDF

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Publication number
CN203327471U
CN203327471U CN2013204416500U CN201320441650U CN203327471U CN 203327471 U CN203327471 U CN 203327471U CN 2013204416500 U CN2013204416500 U CN 2013204416500U CN 201320441650 U CN201320441650 U CN 201320441650U CN 203327471 U CN203327471 U CN 203327471U
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China
Prior art keywords
heat conduction
radiator structure
heat
support body
hand
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Expired - Fee Related
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CN2013204416500U
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Chinese (zh)
Inventor
谢国俊
黄传秦
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Priority to CN2013204416500U priority Critical patent/CN203327471U/en
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Abstract

Provided is a heat radiation structure which comprises a heat conduction frame arranged inside a hand-held electronic device. The heat conduction frame is provided with a first side and a second side which are opposite to each other. A cavity chamber is arranged between the first side and the second side. The cavity chamber is provided with more than one capillary structures and one working fluid. Multiple electronic components of the hand-held electronic device are contacted by any one or two of the first side and the second side, and any one of the first side and the second side is contacted with a shell of the hand-held electronic device so that heat generated by the electronic components can be rapidly conducted and radiated, and thus a heat relieving effect is further achieved.

Description

Radiator structure and there is the portable electric device of this radiator structure
Technical field
The utility model relates to a kind of radiator structure and has the portable electric device of this radiator structure, relates in particular to a kind of radiator structure that is applied to heat radiation usefulness in hand-hold electronic device.
Background technology
Along with the develop rapidly of electronic industry, in hand held device, the electronic component speed of service constantly promotes, and produces amount of heat during operation, and itself and system temperature are raise, and then affects the stability of its system.For guaranteeing that electronic component can normally move, heat abstractor is installed usually thereon, discharge the heat that it produces.
Temperature-uniforming plate, samming sheet are recently to be applied to the analgesic active material of electronic product, as if intelligent mobile phone, flat computer, illumination and LED lamp for vehicles, all bring into use this passive heat radiation technology and material.Mobile phone, flat computer and LED light fixture, can select the reason of temperature-uniforming plate (Vapof Chambef), samming sheet (Heat Spreadef), mainly considers a little and have: both passive heat radiation, not energy source consumption; Secondly their heat exchange pattern is two-dimentional, is not affected by gravity the conduction that belongs to face.The 3rd is, while being limited to light, thin, the closed design of electronic product, to have the performance space of mechanism design to have again good radiating effect concurrently.
The operation principle of temperature-uniforming plate and heat pipe person are roughly the same, comprised conduction, evaporation, convection current, solidified four key steps, and temperature-uniforming plate is to inject by pure water the two phase fluid device that the container be covered with micro-structural forms.Heat is entered in plate via the heat conduction by outside high-temperature region, and the water arround points of proximity thermal source can promptly absorb heat and be gasificated into steam, takes away a large amount of heat energy.The latent heat of recycling steam, in plate, higher-pressure region, steam mountain is diffused into low-pressure area (being also low-temperature space), and when steam touches the lower inwall of temperature, steam can promptly condense into liquid and emit heat energy.The water condensed flows back to hot source point by the capillarity of micro-structural, completes a heat and passes circulation, the two-phase cycle system that forms a water and steam and deposit.The gasification of water continues to carry out in temperature-uniforming plate, along with the pressure in the variation cavity of temperature can with maintain balance.When water operates at low temperature, its coefficient of heat conduction value is lower, but because the vicidity of water can change with temperature is different, therefore temperature-uniforming plate also can operate when 5 ℃ or 10 ℃.Because liquid backflow is by the capillary force effect, so temperature-uniforming plate is subject to the impact of gravity less, just can be any angle in the utilization of application system design space.Temperature-uniforming plate also without any moving meter, is a complete hermetic passive type device without power supply.
Because the shell of temperature-uniforming plate need be done the anode processing, cause oxidation to avoid ingress of air, but the anode processing has increased one deck thermal impedance, can affect radiating efficiency.Therefore using soft ceramic heat-dissipating paint instead coats the temperature-uniforming plate skin, if especially use white soft ceramic heat-dissipating paint, its thermal impedance is hanged down near-zero, can avoid oxidation by protecting sheathing again, and cooling-down effect is showing very much.
More have at present in addition and utilize the graphite radiating film or claim the member of graphite samming sheet (Gfaphite Heat Spreader) as temperature uniforming heat radiation, the graphite radiating film is a kind of nanocomposite, adapt to any surface uniform heat conduction, there is the EMI effectiveness, it has unique grain orientation, along the both direction uniform heat conduction, laminar structuredly can adapt to well any surface.
The chemical composition of graphite radiating film is mainly single carbon (C) element, is a kind of native element metal mineral.Can be by obtaining the graphitization film under the chemical method HTHP, because carbon is nonmetalloid, but the conduction that metal material is but arranged, heat conductivility, also there is the same plasticity of similar organic plastic cement, and also have special hot property, chemical stability, lubricated and can be coated in the surface of solids etc. some good processing performances, in the graphite radiating membrane plane (horizontal heat conduction) there is the super-high heat-conductive performance in the 150-1500W/m-K scope.Moreover the vertical thermal conductivity of graphite is only 5~20W/mK, almost played heat insulation effect.Also because of the graphite radiating film, have the coefficient of heat conduction that horizontal direction allows other metals be difficult to reach, and the feature on the low side of the coefficient of heat conduction in vertical direction.
The key property of graphite radiating film in addition: super-high heat-conductive performance, easily operation, low thermal resistance and lightweight.Utilize the plasticity of graphite, graphite material can be made to the thin slice of a picture paster, allow it be attached to the circuit board top of interior of mobile phone.Contact between both can barrier element, also play certain antihunt action.Because the graphite radiating film has higher horizontal conductive coefficient, therefore, it can carry out heat the conduction of horizontal direction fast, makes the whole surperficial uniform heat distribution of horizontal direction, eliminates hot localised points.So accurate, the graphite radiating film is to have played heat conduction in fact, and the effect of heat uniformly dispersing, indirectly namely play thermolysis.
But no matter how light the weight of graphite radiating film is, how thin of thickness, be used in running gear inside, or can occupy a space, therefore in order to realize the frivolous concept of running gear inner space, how, in existing space, utilize different thinkings to change the component properties in existing mobile phone framework, effectively solving heat dissipation problem, is original intention of the present invention.
The utility model content
Therefore, for solving the shortcoming of above-mentioned prior art, main purpose of the present utility model, provide the electronic component in a kind of heat conduction support body contact contact hand-hold electronic device, do not need extra heat dissipation element, and electronic component is dispelled the heat.
For achieving the above object, it is a kind of in view of the problems referred to above that the utility model provides, and the utility model main purpose is to provide a kind of thickness that does not increase portable electric device, and the heat-conduction value radiator structure high compared to known techniques.
Another purpose of the utility model is to provide the electronic component in a kind of heat conduction support body contact contact hand-hold electronic device, does not need extra heat dissipation element, and electronic component is dispelled the heat.
Another purpose of the utility model is to provide its surface of a kind of heat conduction support body and is provided with groove, in hand-hold electronic device corresponding electronic component correspondence be installed on this surface and be positioned at this groove so that thermolysis to be provided.
Another purpose of the utility model is to provide the back side that a kind of heat conduction frame system can contact a display screen, with analgesic to this display screen.
For achieving the above object, the utility model provides a kind of radiator structure, be applied in a hand-held electronic installation, this hand-hold electronic device has a housing, there are a plurality of electronic components in this housing, this radiator structure comprises: a heat conduction support body, there is one first contrary side and one second side, have in a chamber between this first side and this second side and there is a capillary structure and a working fluid, wherein this first side and this second side a plurality of electronic components of either side or this hand-hold electronic device of contact both sides wherein.
Preferably, wherein either side or both sides are provided with at least one groove and contact corresponding electronic component for this first side and this second side.
Preferably, this electronic component is arranged on this first side and this second side wherein on either side or both sides.
Preferably, this first side and this second side wherein arbitrary side-line contact the housing of this portable electric device.
Preferably, this heat conduction support body is temperature-uniforming plate or thin type heat pipe.The present invention provides a kind of portable electric device of tool radiator structure in addition, and it comprises: a housing, by a upper cover and a lower cover, formed, a space be positioned at this upper cover and lower cover between; One heat conduction support body, be arranged in this space, has one first contrary side and one second side, has in a chamber between this first side and this second side and have a capillary structure and a working fluid; A plurality of electronic components, be positioned at this space, and arrange and contact in this first side and this second side wherein on either side or both sides.
Preferably, wherein either side or both sides are provided with at least one groove and contact corresponding electronic component for this first side and this second side.
Preferably, this first side and this second side wherein either side contact the housing of this portable electric device.
Preferably, this heat conduction support body is temperature-uniforming plate or thin type heat pipe.
Preferably, more comprise that a display screen is contained in this space, this display screen has a display surface and a back side, and wherein this back side contacts this heat conduction support body.
The accompanying drawing explanation
The decomposing schematic representation that Figure 1A is radiator structure of the present utility model;
After the combination that Figure 1B is radiator structure of the present utility model the heat conduction support body wherein the one side schematic diagram;
The heat conduction support body schematic diagram of opposite side wherein after the combination that Fig. 1 C is radiator structure of the present utility model;
Fig. 1 D is heat conduction support body cross-sectional schematic of the present utility model;
Fig. 2 A is the decomposing schematic representation at the visual angle, front of the hand-hold electronic device from having the heat conduction support body;
Fig. 2 B is the decomposing schematic representation at the visual angle, the back side of the hand-hold electronic device from having the heat conduction support body;
Fig. 2 C is heat conduction support body and electronic component assembling schematic diagram together;
The schematic diagram that Fig. 3 is the visual angle, front after the hand-hold electronic device assembling;
The schematic diagram of the A-A section that Fig. 4 is presentation graphs 3.
Symbol description
10 heat conduction support bodys
11 upper plate bodies
111 first sides
12 lower bodies
121 second sides
13 chambers
14 capillary structures
15 working fluids
16a, 16b groove
17 battery cases
20 hand-hold electronic devices
21 housings
211 upper covers
2111 open-works
212 lower covers
213 spaces
22,23 electronic components
221 electronic components
24 display screens
241 display surfaces
242 back sides
25 batteries
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Characteristic on above-mentioned purpose of the present utility model and structure thereof and function, will be explained according to appended graphic preferred embodiment.
The decomposing schematic representation that Figure 1A is the utility model radiator structure; The heat conduction support body heat conduction support body schematic diagram of opposite side wherein after schematic diagram Fig. 1 C of one side combination that is radiator structure of the present invention wherein after the combination that Figure 1B is radiator structure of the present invention; Fig. 1 D is heat conduction support body cross-sectional schematic of the present invention.As shown in Figure 1A to Fig. 1 D, heat conduction support body 10 is temperature-uniforming plate or thin type heat pipe, in this better enforcement, be to using temperature-uniforming plate as explanation, it is constituted by a upper plate body 11 and lower body 12 docking, and there is one first side 111 and contrary this first side 111 of one second side 112, there is an airtight chamber 13 between this first side 111 and the second side 112, there is capillary structure 14 and a working fluid 15 more than one in this chamber 13, wherein this upper plate body 11 and this lower body 12 are that for example copper or aluminium form for the metal good by thermal conductivity, this capillary structure 14 is formed on the inner surface of this chamber 13, the kenel of capillary structure 14 comprises groove or metal dictyosome or sinter from metal powder, this working fluid 15 is for example pure water.Though do not mean in this better enforcement in addition, but chamber 13 is interior, can be provided with a plurality of supporters.
The first side 111 and/or the second side 112 at this heat conduction support body 10 are respectively equipped with at least one groove 16a, 16b, its concrete practice be utilize metal stamping or the system of milling or the mode of grinding on the surface of upper plate body 11 and the predeterminated position on the surface of lower body 12 form the groove 16a of required shape and size, 16b, mean this groove 16a in this better enforcement, 16b be positioned at this first side 111 in order to contact electronic component that a hand-held electronic installation is corresponding with thermal source that electronic component is produced the working fluid 15 generation phase change via heat conduction support body 10, transfer heat to the second side 112 heat radiations.The first side 111 of this heat conduction support body 10 and the second side 112 wherein one be correspondence and a housing that contacts a hand-held electronic installation, mean this second side 112 these housings of contact in this better enforcement, the heat that therefore is delivered to the second side 112 will be asked extraneous heat radiation through housing.Moreover because heat conduction support body 10 is to be useful in a hand-held electronic installation, so can offer a battery case 17 to be installed with the battery in hand-hold electronic device in the second side 112.
Below will describe the hand-hold electronic device that heat conduction support body 10 is applied in the concrete enforcement indication of the present invention in a hand-held electronic installation in detail and comprise mobile phone (comprising intelligent mobile phone), flat computer, PDA, display and smart watch, will using intelligent mobile phone as illustration the graphic of this explanation.
Fig. 2 A is the decomposing schematic representation at the visual angle, front of the hand-hold electronic device from having the heat conduction support body; Fig. 2 B is the decomposing schematic representation at the visual angle, the back side of the hand-hold electronic device from having the heat conduction support body; Fig. 2 C means heat conduction support body and electronic component assembling schematic diagram together; Fig. 3 means the schematic diagram at the visual angle, front after the hand-hold electronic device assembling; The schematic diagram of the A-A section of Fig. 4 presentation graphs 3.
As shown in 2A to 2C, 3 and 4 figure, this hand-hold electronic device 20 comprises that a housing 21 is comprised of a upper cover 211 and a lower cover 212, defines a space 213 between this upper cover 211 and lower cover 212, and upper cover 211 offers an open-work 2111 and is communicated with this space 213.A plurality of electronic components 22, 23 and one display screen 24, battery 25 and aforesaid heat conduction support body 10 are installed with in this space 213, wherein this display screen 24 has a display surface 241 and a back side 242, this display screen 24 is to be installed near upper cover 211 places, and 241 pairs of display surfaces should upper cover 211 open-work 2111, these heat conduction support body 10 devices are at the back side 242 of this display screen 24, the first side 111 of heat conduction support body 10 is the back side 242 of this display screen of contact, electronic component 22, 23 is the groove 16a that is arranged on this first side 111, on 16b, wherein electronic component 22 is expressed as a circuit main board and which is provided with a plurality of electronic components 221 and (comprise chip in this diagram, resistance and electric capacity etc.), the one side of these electronic components 221 is pasted and is touched this heat conduction support body 10.
112 pairs of the second sides of this heat conduction support body 10 should lower cover 212, and, after lower cover 212 these upper covers 211 of combination, lower cover 212 is the second side 112 of this heat conduction support body 10 of contact.25, battery is installed with in the battery case 17 of this heat conduction support body 10.Therefore, if open the second side 112 and battery 25 that 212 of this lower covers can first be seen heat conduction support body 10, the electronic component 22,23 that is arranged on the first side 111 of heat conduction support body 10 can be not in sight, so heat conduction support body 10 can be taken as, is the protecting cover of electronic component 22,23.
The heat that electronic component 22,23 and display screen 24 produce, through the phase change of the hydraulic fluid 15 in the chamber 13 of heat conduction support body 10, is delivered to the second side 112 by the first side 111 heat, then covers 212 toward extraneous transmission heat radiation by the second side 112 via the back of the body.
In sum, the utility model heat conduction support body 10 can be used in various portable electric devices, as mobile phone, flat computer, PDA, and the electronic installation such as Digital display, do not need extra heat dissipation element, and do not increase the thickness of portable electric device, fast the heat of portable electric device inside is conducted everywhere to other fast, make portable electric device inside not accumulated heat can fast heat be guided to outside fast.
The thickness that utilizes temperature-uniforming plate or samming sheet to paste on heater element compared to prior art is in addition adding the thickness of plastic rubber bracket, the present invention will originally change by the support of plastic cement system the heat conduction support body consisted of temperature-uniforming plate or thin type heat pipe in hand-hold electronic device, so do not increase the thickness of hand-hold electronic device, so than prior art thin thickness, and heat conduction efficiency is high.

Claims (10)

1. a radiator structure, be applied in a hand-held electronic installation, and this hand-hold electronic device has a housing, has a plurality of electronic components in this housing, it is characterized in that, this radiator structure comprises:
One heat conduction support body, there is one first contrary side and one second side, have in a chamber and there is a capillary structure and a working fluid between this first side and this second side, wherein this first side and this second side a plurality of electronic components of either side or this hand-hold electronic device of contact both sides wherein.
2. radiator structure as claimed in claim 1, is characterized in that, wherein wherein either side or both sides are provided with at least one groove and contact corresponding electronic component for this first side and this second side.
3. radiator structure as claimed in claim 2, is characterized in that, wherein this electronic component is arranged on this first side and this second side wherein on either side or both sides.
4. radiator structure as claimed in claim 1, is characterized in that, wherein this first side and this second side housing that wherein either side is this portable electric device of contact.
5. radiator structure as claimed in claim 1, is characterized in that, wherein this heat conduction support body is temperature-uniforming plate or thin type heat pipe.
6. the portable electric device of a tool radiator structure, is characterized in that, it comprises:
One housing, be comprised of a upper cover and a lower cover, and a space is between this upper cover and lower cover;
One heat conduction support body, be arranged in this space, has one first contrary side and one second side, between this first side and this second side, has in a chamber and have a capillary structure and a working fluid;
A plurality of electronic components, be positioned at this space, and arrange and contact in this first side and this second side wherein on either side or both sides.
7. the portable electric device of tool radiator structure as claimed in claim 6, is characterized in that, wherein wherein either side or both sides are provided with at least one groove and contact corresponding electronic component for this first side and this second side.
8. the portable electric device of tool radiator structure as claimed in claim 6, is characterized in that, wherein this first side and this second side wherein arbitrary side-line contact the housing of this portable electric device.
9. the portable electric device of tool radiator structure as claimed in claim 6, is characterized in that, wherein this heat conduction support body is temperature-uniforming plate or thin type heat pipe.
10. the portable electric device of tool radiator structure as claimed in claim 6, is characterized in that, more comprises that a display screen is contained in this space, and this display screen has a display surface and a back side, and wherein this back side contacts this heat conduction support body.
CN2013204416500U 2013-07-23 2013-07-23 Heat radiation structure and hand-held electronic device with heat radiation structure Expired - Fee Related CN203327471U (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103826426A (en) * 2014-03-10 2014-05-28 上海鼎为电子科技(集团)有限公司 Mobile terminal and mobile terminal heat dissipating method
CN104349637A (en) * 2013-07-23 2015-02-11 奇鋐科技股份有限公司 Heat dissipation structure, and hand-held electronic device provided with same
CN105307453A (en) * 2014-07-25 2016-02-03 三星电子株式会社 Electronic device including heating element
CN105578840A (en) * 2015-07-31 2016-05-11 宇龙计算机通信科技(深圳)有限公司 Mobile terminal
CN105592666A (en) * 2014-10-24 2016-05-18 奇鋐科技股份有限公司 Display module group having heat radiation structure and hand-held device
CN105592676A (en) * 2014-10-23 2016-05-18 奇鋐科技股份有限公司 EMI-prevention shielding structure for electronic element
CN105636406A (en) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 Radiating module of mobile device
CN105636400A (en) * 2014-10-27 2016-06-01 奇鋐科技股份有限公司 Display module heat dissipation structure and electronic device
CN105658020A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Wearable host device with heat radiation structure
CN105658021A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Heat dissipation structure of wearable electronic device
CN106455422A (en) * 2016-09-21 2017-02-22 奇鋐科技股份有限公司 Heat dissipation structure of handheld device
CN107148192A (en) * 2016-03-01 2017-09-08 讯凯国际股份有限公司 Heat pipe module and apply its heat abstractor
CN104582366B (en) * 2014-12-31 2018-01-23 广东欧珀移动通信有限公司 Terminal shell and its terminal of application, and terminal shell preparation method
US10481654B2 (en) 2014-03-21 2019-11-19 Huawei Device Co., Ltd. Holder and mobile terminal
CN111986708A (en) * 2019-05-22 2020-11-24 三星电子株式会社 Electronic device and portable solid state drive

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349637A (en) * 2013-07-23 2015-02-11 奇鋐科技股份有限公司 Heat dissipation structure, and hand-held electronic device provided with same
CN103826426A (en) * 2014-03-10 2014-05-28 上海鼎为电子科技(集团)有限公司 Mobile terminal and mobile terminal heat dissipating method
CN103826426B (en) * 2014-03-10 2016-08-17 上海鼎为电子科技(集团)有限公司 Mobile terminal and mobile terminal heat dissipating method
US10481654B2 (en) 2014-03-21 2019-11-19 Huawei Device Co., Ltd. Holder and mobile terminal
CN105307453A (en) * 2014-07-25 2016-02-03 三星电子株式会社 Electronic device including heating element
CN105592676A (en) * 2014-10-23 2016-05-18 奇鋐科技股份有限公司 EMI-prevention shielding structure for electronic element
CN105592666A (en) * 2014-10-24 2016-05-18 奇鋐科技股份有限公司 Display module group having heat radiation structure and hand-held device
CN105636400A (en) * 2014-10-27 2016-06-01 奇鋐科技股份有限公司 Display module heat dissipation structure and electronic device
CN105636406A (en) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 Radiating module of mobile device
CN105658020A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Wearable host device with heat radiation structure
CN105658021A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Heat dissipation structure of wearable electronic device
CN105658021B (en) * 2014-11-10 2018-08-10 奇鋐科技股份有限公司 Wearable electronic apparatus heat radiation construction
CN104582366B (en) * 2014-12-31 2018-01-23 广东欧珀移动通信有限公司 Terminal shell and its terminal of application, and terminal shell preparation method
CN105578840B (en) * 2015-07-31 2018-06-15 宇龙计算机通信科技(深圳)有限公司 A kind of mobile terminal
WO2017020419A1 (en) * 2015-07-31 2017-02-09 宇龙计算机通信科技(深圳)有限公司 Mobile terminal
CN105578840A (en) * 2015-07-31 2016-05-11 宇龙计算机通信科技(深圳)有限公司 Mobile terminal
CN107148192A (en) * 2016-03-01 2017-09-08 讯凯国际股份有限公司 Heat pipe module and apply its heat abstractor
CN106455422A (en) * 2016-09-21 2017-02-22 奇鋐科技股份有限公司 Heat dissipation structure of handheld device
CN111986708A (en) * 2019-05-22 2020-11-24 三星电子株式会社 Electronic device and portable solid state drive
US11670570B2 (en) 2019-05-22 2023-06-06 Samsung Electronics Co., Ltd. Electronic device and method of manufacturing an electronic device

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Granted publication date: 20131204

Termination date: 20210723