CN105636400A - Display module heat dissipation structure and electronic device - Google Patents
Display module heat dissipation structure and electronic device Download PDFInfo
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- CN105636400A CN105636400A CN201410582466.7A CN201410582466A CN105636400A CN 105636400 A CN105636400 A CN 105636400A CN 201410582466 A CN201410582466 A CN 201410582466A CN 105636400 A CN105636400 A CN 105636400A
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- backboard
- display module
- transmission element
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- back side
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Abstract
The invention discloses a display module heat dissipation structure which is arranged in an electronic device. The display module heat dissipation structure comprises a touch control display panel, wherein the touch control display panel is provided with a touch control display side and a backboard opposite to the touch control display side. The backboard is provided with a heat transfer element and a revere side which is opposite to the touch control display side. The heat transfer element attached to or partially or completely embedded in the reverse side of the backboard, and the heat transfer element is horizontally flush with the reverse side when being embedded in the reverse side. A heat source inside the electronic device is transmitted to a position away from the heat source and dissipated by means of the heat transfer element.
Description
Technical field
The present invention relates to a kind of display module, particularly relate to a kind of display module having radiator structure and electronic installation thereof.
Background technology
Existing hand-held device (such as tablet PC, smart mobile phone etc.) is along with constantly promoting in function and speed, owing to hand-held device is towards compact and functional promotion trend development, make the disconnected increase of heat generation density not section of hand-held device, also make heat dissipation problem come into one's own. Except heat dissipation problem, owing to needing skin-proximal when hand-held device uses, human body being caused discomfort, therefore the heat dissipation design of hand-held device has become important challenge.
Explain with smart mobile phone, the smart mobile phone of prior art comprises a display module, a circuit board, a battery part and a framework, this display module is sequentially installed in this framework with circuit board and battery part, and this circuit board is provided with multiple electronic component (such as CPU (CPU), graphic process unit (GPU), memorizer and other IC chips), and this display module is made up of a touch control display module and a backboard, and this backboard is only be installed with the function in this touch control display module all merely, there is no other purposes.
So when described electronic component is (such as CPU, GPU, or display module) when producing thermal source, the thermal source that electronic component (or display module) produces is made uniformly to spread out in real time, and cause that described electronic component produces thermal source and can continue to build up (or hoarding) at electronic component itself and periphery place thereof, easily causing the electronic component within hand-held device cannot outside normal operation, also extend another problem, it is exactly that user grips this hand-held device when using, the hand skin of user can paste and contact outside this framework, now cannot spread by Quick uniform in localized positions (i.e. electronic component itself and periphery place thereof) because thermal source can continue to build up (or hoarding), usually easily cause user and use the problem having discomfort.
Therefore, how will solving the above-mentioned problem commonly used and disappearance, the inventor being this case and the relevant manufactures being engaged in the industry are desired most ardently the place, direction that research improves.
Summary of the invention
Therefore, for effectively solving the problems referred to above, the main purpose of the present invention, for providing a kind of and will the heat conduction that thermal source produces dispel the heat to away from the position of thermal source providing a kind of, reduces the display module radiator structure of heat concentration.
Another object of the present invention, providing a kind of by can the heat conduction that thermal source produces be dispelled the heat to the position away from thermal source, reduces the electronic installation that heat is concentrated.
For reaching above-mentioned purpose, the present invention provides a kind of display module radiator structure, including: a touch-control display panel, there is a touch-control display side and the backboard of this touch-control contrary display side, this backboard has a thermal transmission element and a back side this touch-control contrary and shows side.
This thermal transmission element system is sticked on this back side.
Thermal transmission element has side to should backboard, and it is sticked at the back side of this backboard, and this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, the back side of this first surface and this second surface this backboard contrary.
This thermal transmission element is embedded on this backboard.
This backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I and Part II are embedded in this and are embedded into position, and this first surface and this second surface level trim this back side.
This thermal transmission element system local is embedded on this backboard, and part is sticked on this back side.
This backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I is embedded in this and is embedded into position, and this first surface level trims this back side.
The Part II of this thermal transmission element is sticked at the back side of this backboard, and the back side of this second surface this backboard contrary.
Having a sloping portion between Part I and the Part II of thermal transmission element, what this sloping portion was tilted into this backboard from the back side of this backboard is embedded into position.
The sloping portion of this thermal transmission element has one first bending side and connects this Part I, and one second bending side connect this Part II, this the first bending side is positioned at this and is embedded into position, and this second bending side is positioned at the back side of this backboard and inclination extends to this first bending side.
A high low head is defined between Part I and the Part II of this thermal transmission element.
Being embedded into position is a through hole.
Thermal transmission element is that a thin type heat pipe has a chamber, is equipped with a capillary structure and a working fluid in this chamber.
Be sticked on this touch-control display side a printing opacity plate body.
The present invention additionally provides a kind of electronic installation, including: a display module includes: a touch-control display panel, has a touch-control display side and the backboard of this touch-control contrary display side, and this backboard has a thermal transmission element and a back side this touch-control contrary and shows side; One electronic component group, to should the back side of backboard of touch-control display panel, and it is to the side-line at the back side contacting this thermal transmission element; And a housing, there is an accommodating sky and ask to be installed with this display module and electronic component group.
This thermal transmission element is sticked on this back side.
This thermal transmission element has side to should backboard, and it is sticked at the back side of this backboard, and this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, the back side of this first surface and this second surface this backboard contrary.
This thermal transmission element is embedded on this backboard.
This backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I and Part II are embedded in this and are embedded into position, and this first surface and this second surface level trim this back side.
This thermal transmission element local is embedded on this backboard, and part is sticked on this back side, part this back side non-bulging.
This backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I system is embedded in this and is embedded into position, and this first surface level trims this back side.
The Part II system of this thermal transmission element is sticked at the back side of this backboard, and the back side of this second surface this backboard contrary.
Having a sloping portion between Part I and the Part II of this thermal transmission element, what this sloping portion was tilted into this backboard from the back side of this backboard is embedded into position.
The sloping portion of this thermal transmission element has one first bending side and connects this Part I, and one second bending side connect this Part II, this the first bending side is positioned at this and is embedded into position, and this second bending side is positioned at the back side of this backboard and inclination extends to this first bending side.
A high low head is defined between Part I and the Part II of this thermal transmission element.
This is embedded into position is a through hole.
This thermal transmission element is that a thin type heat pipe has a chamber, is equipped with a capillary structure and a working fluid in this chamber.
Be sticked on this touch-control display side a printing opacity plate body.
Implement this thermal transmission element one to be sticked on this back side.
Implement this thermal transmission element one to be embedded on this backboard.
Have one at this backboard of enforcement and be embedded into position, this thermal transmission element has a Part I and a Part II connects this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I and Part II are embedded in this and are embedded into position, and this first surface and this second surface level trim this back side.
Implement this thermal transmission element system local one to be embedded on this backboard, and part is sticked on this back side.
Have one at this backboard of enforcement and be embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I is embedded in this and is embedded into position, and this first surface level trims this back side.
It is sticked at the back side of this backboard at another Part II implementing this thermal transmission element, and the back side of this second surface this backboard contrary.
Having a sloping portion between Part I and the Part II of another this thermal transmission element of enforcement, what this sloping portion was tilted into this backboard from the back side of this backboard is embedded into position.
At a sloping portion implementing this thermal transmission element, there is one first bending side and connect this Part I, and one second bending side connect this Part II, this the first bending side is positioned at this and is embedded into position, and this second bending side is positioned at the back side of this backboard and inclination extends to this first bending side.
A high low head is defined between Part I and the Part II implementing this thermal transmission element.
In an enforcement, this is embedded into position is a through hole.
Implementing this thermal transmission element one is that a thin type heat pipe has a chamber, is equipped with a capillary structure and a working fluid in this chamber.
Implement this touch-control one and show the printing opacity plate body that is sticked on side.
Accompanying drawing explanation
Figure 1A is the perspective exploded view that display module first of the present invention is implemented;
Figure 1B is the solid combination schematic diagram that display module first of the present invention is implemented:
Fig. 1 C is the schematic diagram that the solid that display module first of the present invention is implemented combines another visual angle:
Fig. 1 D is the partial schematic sectional view of the 1d-1d hatching line of Fig. 1 C:
Fig. 1 E is the partial schematic sectional view of the 1e-1e hatching line of Fig. 1 C:
Fig. 2 A is the perspective exploded view that display module second of the present invention is implemented;
Fig. 2 B is the solid combination schematic diagram that display module second of the present invention is implemented:
Fig. 2 C is the schematic diagram that the solid that display module second of the present invention is implemented combines another visual angle:
Fig. 2 D is the partial schematic sectional view of the 2d-2d hatching line of Fig. 2 C:
Fig. 2 E is the partial schematic sectional view of the 2e-2e hatching line of Fig. 2 C:
Fig. 3 A is the perspective exploded view that display module the 3rd of the present invention is implemented;
Fig. 3 B is the solid combination schematic diagram that display module the 3rd of the present invention is implemented:
Fig. 3 C is the schematic diagram that the solid that display module second of the present invention is implemented combines another visual angle:
Fig. 3 D is the partial schematic sectional view of the 3d-3d hatching line of Fig. 3 C:
Fig. 3 E is the partial schematic sectional view of the 3e-3e hatching line of Fig. 3 C:
Fig. 4 A is that the present invention first practices the perspective exploded view at electronic installation;
Fig. 4 B is that the solid that the present invention first practices at electronic installation combines schematic diagram;
Fig. 4 C is the 3c-3c cross-sectional schematic of Fig. 3 B;
Fig. 4 D is the 3d-3d cross-sectional schematic of Fig. 3 B;
Fig. 5 A is that the present invention second practices the perspective exploded view at electronic installation;
Fig. 5 B is that the solid that the present invention second practices at electronic installation combines schematic diagram;
Fig. 5 C is the 4c-4c cross-sectional schematic of Fig. 4 B;
Fig. 5 D is the 4d-4d cross-sectional schematic of Fig. 4 B;
Fig. 6 A is that the present invention the 3rd practices the perspective exploded view at electronic installation;
Fig. 6 B is that the solid that the present invention the 3rd practices at electronic installation combines schematic diagram;
Fig. 6 C is the 6c-6c cross-sectional schematic of Fig. 6 B;
Fig. 6 D is the 6d-6d cross-sectional schematic of Fig. 6 B.
Symbol description
10 display modules
11 touch-control display panels
111 touch-control display sides
112,212,412 backboard
1121,2121,4121 back side
1122,2122 are embedded into position
116 printing opacity plate bodys
12,22 thermal transmission element
121,221 Part I
1211,2211 first surface
122,222 Part II
1221,2221 second surface
123 chambers
124 capillary structures
125 working fluids
227 sloping portions
2271 first bending sides
2272 second bending sides
H height low head
30 electronic installations
31 electronic component groups
311 electronic components
32 housings
321 fore shells
322 shell on the backs
323 chambers
33 centers
34 batteries
Detailed description of the invention
Below with reference to drawing, embodiments of the invention of explaining in detail:
The above-mentioned purpose of the present invention and structure thereof and characteristic functionally, will be explained according to the preferred embodiment of institute's accompanying drawing.
Referring to Figure 1A to Fig. 1 E is the schematic diagram that the present invention first preferably implements, as shown in the figure a display module 10 include a touch-control display panel 11 have one touch-control display side 111 and this touch-control contrary display side 111 backboard 112 1 printing opacity plate body 116 be sticked this touch-control display side on 111, this printing opacity plate body 116 is as made with materials such as transparent tripoli glass, polymethyl methacrylate (PMMA), polycarbonate (PC), poly-second p-phthalic acid fat (PET), and provides a touch surface to carry out touch for user with finger or pointer. This backboard 112 has a back side 1121 and one and is embedded into position 1122, the back side 1121 (such as Fig. 1 C) this touch-control on the contrary display side 111 of this backboard 112. This is embedded into position 1122 is that the position corresponding to a pyrotoxin (such as an electronic components) from this back side 1121 extends to the position not corresponding to pyrotoxin. This is embedded into position 1122 is that a through hole runs through this back side 1121.
One thermal transmission element 12 has a Part I 121 and a Part II 122 connects this Part I 121, this Part I 121 has a first surface 1211 (such as Fig. 1 C), and this Part II 122 has a second surface 1221 (such as Fig. 1 C). Implementing this thermal transmission element 12 at this is all be embedded in this to be embedded into position 1122, as 1C figure represents that the Part I 121 of this thermal transmission element 12 and Part II 122 are embedded in this in friction tight mode and are embedded into position 1122, the first surface 1211 of this Part I 121 and second surface 1221 level of Part II 122 trim this back side 1121. This Part I 121 and Part II 122 any of which are as heat absorbing end, and another is then release end of heat.
The region that this Part I 121 is positioned at the not corresponding electronic component group in the back side 1121 of this backboard 112 is implemented at this, use as release end of heat, this Part II 122 is positioned at this by the back side 1121 of frame 112 to should the region of electronic component group, using as heat absorbing end, the conduction of heat produced by electronic components by this Part II 122 is to Part I 121 heat release (or samming).
Optionally, the region that this Part I 121 is positioned at the corresponding electronic component group in the back side 1121 of this backboard 112 is implemented at another, use as heat absorbing end, this Part II 122 is positioned at the back side 1121 of this backboard 112 not to should the region of electronic component group, use as release end of heat, by this Part I 121, the conduction of heat that electronic components produces is dispelled the heat to Part II 122.
This thermal transmission element 12 such as but is not limited to a thin type heat pipe, and it has a chamber 123, is equipped with capillary structure 124 and a working fluid 125 in this chamber 123. This capillary structure 124 is explain with agglomerated powder opisthosoma, but is not limited thereto, and this capillary structure also may be selected to be groove or wire netting or corpus fibrosum or spirillum. Capillary structure 124 is formed on the inwall of this chamber 123. This working fluid 125 such as pure water, pure water, inorganic compound, alcohols, ketone, liquid metal, cold coal or organic compound, by working fluid 144 effect of steam-condensate circulating in thermal transmission element 12, so that heat is delivered to release end of heat heat radiation from heat absorbing end.
All it is embedded in backboard 112 by thermal transmission element 12 to dispel the heat to the position away from electronic component group with heat conduction electronic component group produced, reduces heat and concentrate and be applicable to light and thin type electronic installation.
Referring to 2A to 2E figure is the schematic diagram that the present invention second preferably implements, it generally preferably implements identical with described first, identical element uses identical symbol to represent, the different place of this enforcement is in that this thermal transmission element 22 is partially embedded into and is embedded into position at this, it is embodied as this backboard 212 there is a back side 2121 (such as Fig. 2 C) and one to be embedded into position 2122, contrary this touch-control display side 111, the back side 2121 of this backboard 212. This is embedded into position 2122 and is provided only on this back side 2121 and does not correspond to the position of a pyrotoxin (such as an electronic components). Optionally, implement this at another to be embedded into position 2122 and also can be provided only on this back side 2121 and correspond to the position of pyrotoxin. In all enforcements, this is embedded into position 2122 is that a through hole runs through this back side 2121.
This thermal transmission element 22 has a Part I 221 and a Part II 222 connects this Part I 221. This Part I 221 has a first surface 2211 (such as Fig. 2 C), and this Part II 222 has a second surface 2221 (such as Fig. 2 C). One sloping portion 227 is between this Part I 221 and Part II 222, and this sloping portion 227 has one first bending side 2271 and connects this Part I 221, and one second bending side 2272 connects this Part II 222 (such as Fig. 2 C). Representing that the Part I 221 of this thermal transmission element 22 in the way of close-fitting (or mode of embedment injection) is embedded in this enforcement and be embedded into position 2122 at this, this first surface 2211 level trims this back side 2121. The Part II 222 of this thermal transmission element 22 is sticked at the back side 2121 of this backboard 212, and the back side 2121 of this second surface 2221 this backboard 212 contrary. What this sloping portion 227 was tilted into this backboard 212 from the back side 2121 of this backboard 212 is embedded into position 2122, and the first bending side 2271 of this sloping portion 227 is positioned at this and is embedded into position 2122, the second bending side 2272 of this sloping portion 227 is positioned at the back side 2121 of this backboard 212 and tilts to extend to this first bending side 2271. Make to have between Part I 221 and the Part II 222 of this thermal transmission element 22 a high low head h by this sloping portion 227.
It is embedded in backboard 212 by thermal transmission element 22 local to dispel the heat to the position away from electronic component group with heat conduction electronic component group produced, reduces the problem that heat is concentrated, and make the present invention must be applicable to light and thin type electronic installation.
Refer to Fig. 3 A to 3E and show the schematic diagram that the present invention the 3rd preferably implements, it generally preferably implements identical with described first and second, identical element uses identical symbol to represent, the different place of this enforcement is in that this display module 10 includes a touch-control display panel 11 and has a touch-control display side 111 and the backboard 412 of this touch-control contrary display side 111. One printing opacity plate body 116 is sticked and shows on side 111 at this touch-control. This backboard 412 has the back side 4121 (such as Fig. 3 C) this touch-control on the contrary display side 111, and this back side 4121 is not provided with being embedded into position compared to described embodiment, is a physical plane.
This thermal transmission element 12 to should the side of backboard 412 be sticked on the back side 4121 of this backboard 412, the back side 4121 of the first surface 1211 of this Part I 121 and second surface 1221 this backboard 412 contrary of this Part II 122. Because thermal transmission element 12 is sticked at the back side 4121 of this backboard 412, so that this thermal transmission element 12 is positioned at the lower section of this display module 10.
Be sticked at the back side 4121 of backboard 112 by thermal transmission element 12, pasted touch to should the electronic component group at the back side 4121, and then heat conduction electronic component group produced dispel the heat to the position away from electronic component group, reduces heat concentration.
Refer to Fig. 4 A to 4D to show the display module 10 that the present invention first preferably implements and be applied to the schematic diagram of an electronic installation 30, and please also refer to Figure 1A to 1E, explain with intelligent mobile phone in this electronic installation 30 preferably implemented, but it is not limited thereto, it is embodied as in other, also may be selected to be a tablet PC or Wearable device.
Electronic installation 30 includes display module 10, electronic component group 31 and a housing 32, and wherein its connection relationship of the structure of this display module 10 and effect thereof illustrate in described first preferred embodiment, therefore again do not repeat at this. This housing 32 includes fore shell 321 and a shell on the back 322, defines a chamber 323 by this fore shell 321 and shell on the back 322. The touch-control display side 111 of this display module 10 is to should fore shell 321. This electronic component group 31 (such as circuit board) is arranged on a center 33, the side of this electronic component group 31 is to should the back side 1121 of backboard 112 of display module 10 and be provided with multiple electronic component 311, such electronic component 311 comprises central processing unit (CentralProcessorUnit, CPU), graphic process unit (GraphicProcessingUnit, GPU), memorizer (such as flash memory) and other elements (such as elements such as electric capacity, resistance, transistor or IC chips) etc. One battery 34 is arranged on this center 33 and adjoins this electronic component group 31.
This display module 10, electronic component group 31 and housing 32 are installed in this chamber 323 with center 33, and the Part II 122 being embedded in the thermal transmission element 12 being embedded into position 1122 of backboard 112 directly contacts the electronic component 311 in electronic component group 31, this Part I 121 is positioned at the position not contacting electronic component, when electronic installation 30 in use, the heat that electronic component 311 produces is delivered to Part I 121 from the Part II 122 of thermal transmission element 12 and dispels the heat, and can pass through this backboard (plate for aluminium sheet or metal material) 112 and carry out temperature uniforming heat radiation. Heat conduction electronic component group 31 produced whereby is dispelled the heat to the position away from electronic component group 31, improves the problem that heat is concentrated. Furthermore it is embedded into position 1122 so being useful in the electronic installation 30 of slim chamber 323 due to what thermal transmission element 12 was embedded in backboard 112.
Refer to Fig. 5 A to 5D to show the display module 10 that the present invention second preferably implements and be applied to the schematic diagram of an electronic installation 30, and scheme please also refer to 2A to 2E, it is explain with intelligent mobile phone in the basis preferably electronic installation 30 of enforcement, but it is not limited thereto, it is embodied as in other, also may be selected to be a tablet PC or Wearable device. Before electronic installation 30 has been described in, display module 10 has been described in described second preferably to be implemented, and identical element uses same-sign to represent, does not hereby repeat at this.
When display module 10, after electronic component group 31 and housing 32 are installed in this chamber 323 with center 33, the Part II 222 of this thermal transmission element 22 is sticked at the back side 2121 of this backboard 212, the second surface 2221 of this Part II 222 contacts the electronic component 311 in this electronic component group 31, the Part I 221 of this thermal transmission element 22 is embedded in the position 1122 that is embedded into of backboard 112 and is positioned at the position not contacting electronic component, when electronic installation 30 in use, the heat that electronic component 311 produces is delivered to Part I 221 from the Part II 222 of thermal transmission element 12 via this sloping portion 227 and dispels the heat. heat conduction electronic component group 31 produced whereby is dispelled the heat to the position away from electronic component group 31, improves the problem that heat is concentrated. furthermore it is embedded into position 1122 due to what the Part I of thermal transmission element 12 was embedded in backboard 112, is useful in the electronic installation 30 of slim chamber 323.
Refer to Fig. 6 A to 6D to show the display module 10 that the present invention the 3rd preferably implements and be applied to the schematic diagram of an electronic installation 30, and please also refer to Fig. 3 A to 3E, explain with intelligent mobile phone in this electronic installation 30 preferably implemented, but it is not limited thereto, it is embodied as in other, also may be selected to be a tablet PC or Wearable device. Before electronic installation 30 has been described in, display module 10 has been described in the described 3rd preferably to be implemented, and identical element uses same-sign to represent, does not hereby repeat at this.
When display module 10, after electronic component group 31 and housing 32 are installed in this chamber 323 with center 33, the Part I 121 of this thermal transmission element 12 and Part II 122 are sticked at the back side 2121 of this backboard 212, and it is positioned at the lower section of this display module 10, wherein the second surface 1221 of this Part II 122 contacts the electronic component 311 in this electronic component group 31, this first part 121 is positioned at the position not contacting this electronic component group 31, when electronic installation 30 in use, the heat that electronic component 311 produces is delivered to Part I 121 from the Part II 122 of thermal transmission element 12 and dispels the heat. heat conduction electronic component group 31 produced whereby is dispelled the heat to the position away from electronic component group 31, improves the problem that heat is concentrated.
Therefore, it is applied to the design on electronic installation 30 by the display module 10 of the present invention, the heat conduction that thermal source produces can be dispelled the heat to the position away from thermal source, reduce heat and concentrate, furthermore thermal transmission element is partially or fully embedded at backboard with suitable in the electronic installation of light and thin type.
Although embodiment of the present invention are disclosed as above, but listed utilization that it is not restricted in description and embodiment, it can be applied to various applicable the field of the invention completely, for those skilled in the art, it is easily achieved other amendment, therefore, under the general concept limited without departing substantially from claim and equivalency range, the present invention is not limited to specific details and shown here as the legend with description.
Claims (28)
1. a display module radiator structure, including:
One touch-control display panel, has a touch-control display side and the backboard of this touch-control contrary display side, and this backboard has a thermal transmission element and a back side this touch-control contrary and shows side.
2. display module radiator structure as claimed in claim 1, wherein this thermal transmission element is to be sticked on this back side.
3. display module radiator structure as claimed in claim 2, wherein this thermal transmission element has side to should backboard, and it is sticked at the back side of this backboard, and this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, the back side of this first surface and this second surface this backboard contrary.
4. display module radiator structure as claimed in claim 1, wherein this thermal transmission element is embedded on this backboard.
5. display module radiator structure as claimed in claim 4, wherein this backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I and Part II are embedded in this and are embedded into position, and this first surface and this second surface level trim this back side.
6. display module radiator structure as claimed in claim 1, wherein this thermal transmission element local is embedded on this backboard, and part is sticked on this back side.
7. display module radiator structure as claimed in claim 6, wherein this backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I is embedded in this and is embedded into position, and this first surface level trims this back side.
8. display module radiator structure as claimed in claim 7, wherein the Part II of this thermal transmission element is sticked at the back side of this backboard, and the back side of this second surface this backboard contrary.
9. display module radiator structure as claimed in claim 8, has a sloping portion between Part I and the Part II of this thermal transmission element, and what this sloping portion was tilted into this backboard from the back side of this backboard is embedded into position.
10. display module radiator structure as claimed in claim 9, wherein the sloping portion of this thermal transmission element have one first bending side connect this Part I, and one second bending side connect this Part II, this the first bending side is positioned at this and is embedded into position, and this second bending side is positioned at the back side of this backboard and inclination extends to this first bending side.
11. display module radiator structure as claimed in claim 10, wherein between Part I and the Part II of this thermal transmission element, define a high low head.
12. the display module radiator structure as described in claim 5 or 6, this is embedded into position is a through hole.
13. display module radiator structure as claimed in claim 1, this thermal transmission element is that a thin type heat pipe has a chamber, is equipped with a capillary structure and a working fluid in this chamber.
14. display module radiator structure as claimed in claim 1, this touch-control display side is sticked a printing opacity plate body.
15. an electronic installation, including:
One display module includes:
One touch-control display panel, has a touch-control display side and the backboard of this touch-control contrary display side, and this backboard has a thermal transmission element and a back side this touch-control contrary and shows side;
One electronic component group, be to should the back side of backboard of touch-control display panel, and it is to should this thermal transmission element of a side contacts at the back side; And
One housing, has an accommodation space to be installed with this display module and electronic component group.
16. display module radiator structure as claimed in claim 15, wherein this thermal transmission element is sticked on this back side.
17. display module radiator structure as claimed in claim 16, wherein this thermal transmission element has side to should backboard, and it is sticked at the back side of this backboard, and this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, the back side of this first surface and this second surface this backboard contrary.
18. display module radiator structure as claimed in claim 15, wherein this thermal transmission element is embedded on this backboard.
19. display module radiator structure as claimed in claim 18, wherein this backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I and Part II are embedded in this and are embedded into position, and this first surface and this second surface level trim this back side.
20. display module radiator structure as claimed in claim 15, wherein this thermal transmission element local is embedded on this backboard, and part is sticked on this back side, part this back side non-bulging.
21. display module radiator structure as claimed in claim 20, wherein this backboard has one and is embedded into position, this thermal transmission element has a Part I and and connects the Part II of this Part I, this Part I has a first surface, this Part II has a second surface, wherein this Part I is embedded in this and is embedded into position, and this first surface level trims this back side.
22. display module radiator structure as claimed in claim 21, wherein the Part II system of this thermal transmission element is sticked at the back side of this backboard, and the back side of this second surface this backboard contrary.
23. display module radiator structure as claimed in claim 22, having a sloping portion between Part I and the Part II of this thermal transmission element, what this sloping portion was tilted into this backboard from the back side of this backboard is embedded into position.
24. display module radiator structure as claimed in claim 23, wherein the sloping portion of this thermal transmission element have one first bending side connect this Part I, and one second bending side connect this Part II, this the first bending side is positioned at this and is embedded into position, and this second bending side is positioned at the back side of this backboard and inclination extends to this first bending side.
25. display module radiator structure as claimed in claim 24, wherein between Part I and the Part II of this thermal transmission element, define a high low head.
26. the display module radiator structure as described in claim 19 or 21, this is embedded into position is a through hole.
27. display module radiator structure as claimed in claim 15, this thermal transmission element is that a thin type heat pipe has a chamber, is equipped with a capillary structure and a working fluid in this chamber.
28. display module radiator structure as claimed in claim 15, this touch-control display side is sticked a printing opacity plate body.
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| CN201410582466.7A CN105636400B (en) | 2014-10-27 | 2014-10-27 | Display module radiator structure and its electronic device |
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| CN201410582466.7A CN105636400B (en) | 2014-10-27 | 2014-10-27 | Display module radiator structure and its electronic device |
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| CN105636400A true CN105636400A (en) | 2016-06-01 |
| CN105636400B CN105636400B (en) | 2018-08-10 |
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| CN105636400B (en) | 2018-08-10 |
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