CN105188302A - Hand-held electronic device heat radiation structure - Google Patents
Hand-held electronic device heat radiation structure Download PDFInfo
- Publication number
- CN105188302A CN105188302A CN201410269646.XA CN201410269646A CN105188302A CN 105188302 A CN105188302 A CN 105188302A CN 201410269646 A CN201410269646 A CN 201410269646A CN 105188302 A CN105188302 A CN 105188302A
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- hand
- electronic device
- heat pipe
- supporter
- heat
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Abstract
The invention relates to a hand-held electronic device heat radiation structure. The heat radiation structure is held in a housing of a hand-held electronic device. The housing comprises at least a heating element inside. The heat radiation structure comprises a support body and a heat pipe. The support body comprises at least a side surface defining a thermal contact region corresponding to the heating element and a cold region which does not correspond to the heating element and a through hole arranged in the thermal contact region and goes through the support body. The heat pipe comprises a first section arranged on the at least side surface of the support body and extending along the cold region, and a second section embedded in the through hole of the thermal contact region and in contact connection with the heating element. Heat of the heating element is transferred from the thermal contact region to the cold region for heat radiation, and interference to the heating element in the thermal contact region is avoided.
Description
Technical field
The present invention relates to a kind of hand-hold electronic device radiator structure, particularly relate to a kind of being applied in hand-hold electronic device and avoid interfering the radiator structure by the heater element held in electronics dress.
Background technology
Existing hand held device along with user its incline like frivolous with computing and under the more and more higher requirement of usefulness, its internal central processing unit is then marched toward double-core or the even higher usefulness of four cores, and because of the faster heat that it produces for the treatment of efficiency processing speed of central processing unit also certainly will be more and more higher, therefore how antipyreticly also become a very important problem with thinning.
Prior art is as disclosed a kind of hand-hold communication device with radiator structure in the novel case of Taiwan Patent application number 102209866, and this hand-hold communication device comprises a housing, a heater element and a radiator, and enclosure interior is provided with a cavity volume; Heater element is contained in cavity volume; The corresponding heater element configuration of radiator, radiator comprises a heat pipe and a heat-conducting plate, and heat pipe one end heat posted is connected to heater element, and the other end configures towards the direction away from heater element; Heat-conducting plate heat posted is connected to heat pipe.Whereby, the even heat that heater element produces is directed on heat-conducting plate by heat pipe, avoids accumulation of heat around heater element, to reach effect of improving heat radiation efficiency.
The surface that the heat pipe of prior art is arranged on heat-conducting plate can interfere with heater element, so must be extended along the path avoiding heater element, but be so just unfavorable for the utilization of the confined space in hand-hold electronic device, therefore how in existing space under the condition not increasing thickness and space effectively to solve heat dissipation problem, be original intention of the present invention.
Summary of the invention
Therefore, for effectively solving the problem, main purpose of the present invention is to provide a kind of not only allows the heat pipe in hand-hold electronic device directly or indirectly amplexiform heater element, and avoids heat pipe and heater element to interfere radiator structure effectively to utilize the space in hand-hold electronic device.
For achieving the above object, the invention provides a kind of hand-hold electronic device radiator structure, be contained in the housing of a hand-hold electronic device, in this housing, there is at least one heater element, this radiator structure comprises: a supporter, at least one side surface of tool defines a thermo-contact region to should heater element, and a cool region is not to should heater element, and an open-work to be arranged in this thermo-contact region and to run through this supporter; One heat pipe, has a first part and is arranged at least one side surface of this supporter and amplexiforms this heater element in the open-work that this cool region extends and a Part II is embedded in this thermo-contact region.
This heat pipe is positioned at this supporter to should the side of heater element or not homonymy.
More comprise the Part II that a heat exchange sheet amplexiforms this heat pipe.
This heat exchange sheet and this heat pipe are at the same side of this supporter or not homonymy.
The pyroconductivity of the composition material of this heat exchange sheet is higher than the composition material of supporter.
This support system is that stainless steel or aluminum alloy material are formed; This heat exchange sheet is that the metal such as copper, aluminium or graphite material are formed.
This heat exchange sheet is between the Part II and this heater element of this heat pipe.
Have a sloping portion between the first part of this heat pipe and Part II, this sloping portion tilts to enter this open-work from least one side surface of this supporter.
A high low head is had between the first part of this heat pipe and Part II.
Accompanying drawing explanation
Figure 1A is that the present invention first implements perspective exploded view;
Figure 1B is that the present invention first implements three-dimensional combination schematic diagram;
Fig. 1 C is that the present invention first implements to analyse and observe decomposing schematic representation;
Fig. 1 D is that the present invention first implements to analyse and observe combination schematic diagram;
Fig. 2 A be the present invention second implement analyse and observe decomposing schematic representation;
Fig. 2 B be the present invention second implement analyse and observe combination schematic diagram:
Fig. 3 A be the present invention the 3rd implement analyse and observe decomposing schematic representation;
Fig. 3 B be the present invention the 3rd implement analyse and observe combination schematic diagram:
Fig. 4 A be the present invention the 4th implement analyse and observe decomposing schematic representation;
Fig. 4 B be the present invention the 4th implement analyse and observe combination schematic diagram:
Fig. 5 A is the schematic diagram that the present invention is contained in the housing of hand-hold electronic device;
Fig. 5 B is the cross-sectional schematic of Fig. 5 A.
Symbol description
10 hand-hold electronic device radiator structures
11 supporters
111 first side surfaces
1111 thermo-contact regions
1112 cool regions
112 second side surfaces
113 open-works
12 heat pipes
121 Part I
122 Part II
123 sloping portions
13 heat exchange sheets
14 circuit boards
141 heater elements
20 hand-hold electronic devices
21 housings
211 protecgulums
2111 forms
212 back of the body lids
213 spaces
24 display touch control screens
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawings.
Figure 1A is perspective exploded view of the present invention; Figure 1B is solid combination schematic diagram of the present invention; Fig. 1 C is that the present invention analyses and observe decomposing schematic representation; Fig. 1 D is that the present invention analyses and observe combination schematic diagram.As shown in Figure 1A to 1D, hand-hold electronic device radiator structure 10 comprises supporter 11, heat pipe 12.This supporter 11 can be called as again center and be arranged in the housing of hand-hold electronic device (such as mobile phone or omniselector), and as the supporting construction that other components in hand-hold electronic device such as a circuit board 14 or a battery (not shown) etc. connect.Circuit board 14 comprises a heater element 141.
Supporter 11 has at least one side surface and defines a thermo-contact region to should heater element 141, in this enforcement, represent that this supporter 11 has the first contrary side surface 111 and one second side surface 112, and this first side surface 111 defines a thermo-contact region 1111 to should heater element 141.The remaining area of the first side surface 111 is to being defined as cool region 1112 by heater element 141.Although this enforcement is still not limited thereto using the first side surface 111 as explanation, the second side surface 112 can define the corresponding heater element in a thermo-contact region and a cool region does not have corresponding heater element.One open-work 113 to be arranged in this thermo-contact region 1111 and to run through this supporter 11, and open-work 113 coordinates the shape of heat pipe 12 to be preferably strip.
Heat pipe 12 is positioned at this supporter 11 to should the side of heater element 141, and this heat pipe 12 has a first part 121 and is arranged on the first side surface 111 of this supporter 11 and extends to this thermo-contact region 1111 along the cool region 1112 of this first side surface 111 and to be formed in open-work 113 that Part II 122 is embedded in this thermo-contact region 1111 and to amplexiform this heater element 141.Between the first part 121 and Part II 122 of heat pipe 12, have a sloping portion 123, this sloping portion 123 tilts to enter this open-work 113 from the first side surface 111 of this supporter 11.Because sloping portion 123 connects this Part I 121 and Part II 122, therefore define a high low head h between this first part 121 and Part II 122.Heat pipe 12 is preferably thin flat formula heat pipe and has two contrary planes, there is in heat pipe 12 chamber closed and extend to sloping portion 123 until Part II 122 from Part I 121, working fluid and capillary structure is provided with in this chamber, be heated by the working fluid in chamber and produce liquid vapour two phase change of circulation, and gas and the liquid convection current that vapour returns toward liquid between the Part I 121 and Part II 122 of heat pipe 12 and reach the object of heat transfer.Because the Part II 122 of heat pipe 12 is embedded in the open-work 113 in the thermo-contact region 1111 of supporter 11, therefore avoid heat pipe 12 to interfere with corresponding to the heater element 141 in the thermo-contact region 1111 of supporter 11.
Moreover, this enforcement graphic in more indicate that a heat exchange sheet 13 is arranged on the second side surface 112 of supporter 11 with heat pipe 12 not homonymy, and amplexiform the Part II 122 of the heat pipe 12 open-work 113 from the second side surface 112.And the second side surface 112 of this supporter 11 is to should the region in thermo-contact region 1111 of the first side surface 111 then be covered by this heat exchange sheet 13, this heat exchange sheet 13 more can extend and covers the region that the second side surface 112 does not have the heat pipe 12 of corresponding first side surface 111.
Especially be noted that, supporter 11 is made up with the material that hardness is higher of intensity, and the pyroconductivity of the composition material of this heat exchange sheet 13 is higher than the pyroconductivity of the composition material of supporter 11, so the second side surface 112 heat of heat pipe 12 being evenly spread to supporter 11 by heat exchange sheet 13 does not have the region of the heat pipe 12 of corresponding first side surface 111, concentrate on the corresponding heater element 141 of supporter 11 around to avoid heat.Implement this supporter 11 one and be preferably stainless steel or aluminum alloy material (such as AL5052) formation, this heat exchange sheet 13 is preferably the metal such as copper, aluminium or graphite radiating film (or claiming graphite samming sheet (GraphiteHeatSpreader)) is formed.
Particularly graphite radiating film is the component of a kind of nanocomposite as temperature uniforming heat radiation, adapt to any surface uniform heat conduction, have EMI effectiveness, it has unique grain orientation, along both direction uniform heat conduction, laminar structuredly any surface can be adapted to well.Graphite radiating membrane plane interior (horizontal heat conduction) has the super-high heat-conductive performance within the scope of 150-1500W/m-K, and vertical thermal conductivity is only 5 ~ 20W/mK, almost serves heat insulation effect.Also because graphite radiating film has horizontal direction and allows other metals be difficult to the coefficient of heat conduction reached, and the feature that the coefficient of heat conduction is in vertical direction on the low side.Because graphite radiating film has higher horizontal conductive coefficient, therefore, heat can be carried out the conduction of horizontal direction fast by it, makes the whole surperficial uniform heat distribution of horizontal direction, eliminates hot localised points.So accurate, graphite radiating film is serve heat conduction in fact, and the effect that even heat scatters, indirectly namely plays thermolysis.
Please continue to refer to Fig. 2 A be the present invention second implement analyse and observe decomposing schematic representation; Fig. 2 B be the present invention second implement analyse and observe combination schematic diagram.As shown in figs. 2 a and 2b, this heat exchange sheet 13 is represented with this heat pipe 12 in the same side of supporter 11.More specifically, aforesaid heat exchange sheet 13 can also be arranged on the thermo-contact region 1111 of the first side surface 111.The Part II 122 of the heat pipe 12 in open-work 113 is amplexiformed in the side of heat exchange sheet 13, and opposite side amplexiforms this heater element 141, therefore this heater element 141 across this heat exchange sheet 13 to should the Part II of heat pipe 12.This heat exchange sheet 13 can extend and covers the region that the first side surface 111 does not arrange heat pipe 12.The heat penetration of heater element 141 is crossed heat exchange sheet 13 and is delivered to this heat pipe 12, by heat pipe 12, heat is delivered to first part 121 away from thermo-contact region 1111 by Part II 122, the heat of this heater element 141 is delivered to via heat exchange sheet 13 region that first side surface 111 does not arrange heat pipe 12 simultaneously.Therefore the various point locations of the first side surface 112 or the temperature in each region are worthwhile for equally distributed state, and improve the concentrated corresponding heater element 141 of supporter 11 of heat around by such arranging.
Please continue to refer to Fig. 3 A be the present invention the 3rd implement analyse and observe decomposing schematic representation; Fig. 3 B be the present invention the 3rd implement analyse and observe combination schematic diagram; Fig. 4 A be the present invention the 4th implement analyse and observe decomposing schematic representation; Fig. 4 B be the present invention the 4th implement analyse and observe combination schematic diagram.As shown in the figure, with difference of the first embodiment, it is that this heat pipe 12 is positioned at this supporter 11 to should the not homonymy of heater element 141, namely the first part 121 of this heat pipe 12 is positioned at supporter 11 second side surface 112, the Part II 122 of heat pipe 12 is embedded in open-work 113, and the sloping portion 123 of heat pipe 12 tilts to enter in this open-work 113 from this second side surface 112.Moreover this heat exchange sheet 13 with heat pipe 12 at the same side (as shown in figures 3 a and 3b) of supporter 11 or not homonymy (as shown in fig. 4 a and 4b).
Below detailed description hand-hold electronic device radiator structure is applied in the concrete enforcement in a hand-hold electronic device, the hand-hold electronic device of indication of the present invention comprises,
Mobile phone (comprising intelligent mobile phone), flat computer, PDA, display and smart watch, will with intelligent mobile phone illustratively the graphic of this explanation.
Fig. 5 A is the schematic diagram that the present invention is contained in the housing of hand-hold electronic device; Fig. 5 B is the cross-sectional schematic of Fig. 5 A.As Fig. 5 A and 5B and in the lump referring to figs. 1A to shown in 1D, this hand-hold electronic device 20 comprises a housing 21 and is made up of a protecgulum 211 and a back of the body lid 212, between this protecgulum 211 and back of the body lid 212, define a space 213, protecgulum 211 offers a form 2111 and is equiped with a display touch control screen 24.It is interior between protecgulum 211 and back of the body lid 212 that aforesaid hand-hold electronic device radiator structure 10 is placed on this space 213, is in addition more equipped with the part such as this circuit board 14 and battery (not shown) in space 213.Heater element 141 on circuit board 14 in hand-hold electronic device 20 is to should the thermo-contact region 1111 of the first side 111 of supporter 11, and directly amplexiform the Part II 122 of the heat pipe 12 of the open-work 113 be embedded in thermo-contact region 1111, to conduct the heat to Part I 121 through heat pipe 12.By this heat exchange sheet 13, the heat of heat pipe 12 is evenly spread to the region of the heat pipe 12 of not corresponding first side surface of the second side surface 112 of supporter 11 in addition.Therefore the various point locations of the second side surface 112 or the temperature value in each region are equally distributed state, and concentrate on the problem of the correspondence position of the corresponding heater element 141 of supporter 11 by the heat that such arranging improves heater element 141.
In sum, the present invention can be used in various handheld apparatus, as electronic installations such as mobile phone, flat computer, PDA and Digital displays, not only allow the heat pipe in hand-hold electronic device directly or indirectly amplexiform heater element, and avoid heat pipe and heater element to interfere radiator structure effectively to utilize the space in hand-hold electronic device.
Although the present invention discloses as above with execution mode; so itself and be not used to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is when being decided to be standard with claims.
Claims (9)
1. a hand-hold electronic device radiator structure, be contained in the housing of a hand-hold electronic device, have at least one heater element in this housing, this radiator structure comprises:
One supporter, at least one side surface of tool defines a thermo-contact region to should heater element, and a cool region is not to should heater element, and an open-work to be arranged in this thermo-contact region and to run through this supporter;
One heat pipe, has a first part and is arranged at least one side surface of this supporter and amplexiforms this heater element in the open-work that this cool region extends and a Part II is embedded in this thermo-contact region.
2. hand-hold electronic device radiator structure as claimed in claim 1, this heat pipe is positioned at this supporter to should the side of heater element or not homonymy.
3. hand-hold electronic device radiator structure as claimed in claim 2, more comprises the Part II that a heat exchange sheet amplexiforms this heat pipe.
4. hand-hold electronic device radiator structure as claimed in claim 3, wherein this heat exchange sheet and this heat pipe are at the same side of this supporter or not homonymy.
5. hand-hold electronic device radiator structure as claimed in claim 3, hand-hold electronic device radiator structure, wherein the pyroconductivity of the composition material of this heat exchange sheet is higher than the composition material of supporter.
6. hand-hold electronic device radiator structure as claimed in claim 5, wherein this supporter is that stainless steel or aluminum alloy material are formed; This heat exchange sheet is that the metal such as copper, aluminium or graphite material are formed.
7. hand-hold electronic device radiator structure as claimed in claim 4, wherein this heat exchange sheet is between the Part II and this heater element of this heat pipe.
8. hand-hold electronic device radiator structure as claimed in claim 3, wherein have a sloping portion between the first part of this heat pipe and Part II, this sloping portion tilts to enter this open-work from least one side surface of this supporter.
9. hand-hold electronic device radiator structure as claimed in claim 8, wherein has a high low head between the first part of this heat pipe and Part II.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269646.XA CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269646.XA CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
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| CN105188302A true CN105188302A (en) | 2015-12-23 |
| CN105188302B CN105188302B (en) | 2019-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410269646.XA Active CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304755A (en) * | 2015-05-25 | 2017-01-04 | 奇鋐科技股份有限公司 | Hand-hold electronic device radiator structure |
| CN108702858A (en) * | 2016-02-18 | 2018-10-23 | 三星电子株式会社 | Electronic equipment with thermal-arrest/radiator structure |
| CN109074138A (en) * | 2016-03-28 | 2018-12-21 | 微软技术许可有限责任公司 | Calculate the black body radiation in equipment |
| CN110365815A (en) * | 2018-03-26 | 2019-10-22 | 华为技术有限公司 | Heat-conductive assembly and terminal |
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| CN112198942A (en) * | 2019-07-08 | 2021-01-08 | 联想（新加坡）私人有限公司 | Heat radiation module, electronic device, and heat radiation plate for heat radiation module |
| CN113056157A (en) * | 2019-12-27 | 2021-06-29 | 广州力及热管理科技有限公司 | Thin thermal management assembly |
| WO2022078109A1 (en) * | 2020-10-16 | 2022-04-21 | 华为技术有限公司 | Middle frame and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020080584A1 (en) * | 2000-12-22 | 2002-06-27 | Intel Corporation. | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
| CN101573017A (en) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | Radiating device |
| TWM459692U (en) * | 2013-05-17 | 2013-08-11 | Chaun Choung Technology Corp | Portable communication device with heat dissipation structure |
| CN203912442U (en) * | 2014-06-17 | 2014-10-29 | 奇鋐科技股份有限公司 | Hand-held electronic device heat-radiating structure |
-
2014
- 2014-06-17 CN CN201410269646.XA patent/CN105188302B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020080584A1 (en) * | 2000-12-22 | 2002-06-27 | Intel Corporation. | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
| CN101573017A (en) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | Radiating device |
| TWM459692U (en) * | 2013-05-17 | 2013-08-11 | Chaun Choung Technology Corp | Portable communication device with heat dissipation structure |
| CN203912442U (en) * | 2014-06-17 | 2014-10-29 | 奇鋐科技股份有限公司 | Hand-held electronic device heat-radiating structure |
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| CN106304755A (en) * | 2015-05-25 | 2017-01-04 | 奇鋐科技股份有限公司 | Hand-hold electronic device radiator structure |
| CN113438876A (en) * | 2016-02-18 | 2021-09-24 | 三星电子株式会社 | Electronic equipment with heat collection/radiation structure |
| CN113438876B (en) * | 2016-02-18 | 2022-11-08 | 三星电子株式会社 | Electronic equipment with heat collection/radiation structure |
| CN108702858A (en) * | 2016-02-18 | 2018-10-23 | 三星电子株式会社 | Electronic equipment with thermal-arrest/radiator structure |
| US11047628B2 (en) | 2016-02-18 | 2021-06-29 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| CN111683509A (en) * | 2016-02-18 | 2020-09-18 | 三星电子株式会社 | Electronic equipment with heat collection/radiation structure |
| US10798849B2 (en) | 2016-02-18 | 2020-10-06 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| EP3742877A1 (en) * | 2016-02-18 | 2020-11-25 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11555657B2 (en) | 2016-02-18 | 2023-01-17 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| EP3860324A1 (en) * | 2016-02-18 | 2021-08-04 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| CN114845530A (en) * | 2016-02-18 | 2022-08-02 | 三星电子株式会社 | Electronic equipment with heat collection/radiation structure |
| CN111683509B (en) * | 2016-02-18 | 2022-12-06 | 三星电子株式会社 | Electronic equipment with heat collection/radiation structure |
| US11098959B2 (en) | 2016-02-18 | 2021-08-24 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| CN109074138B (en) * | 2016-03-28 | 2021-12-31 | 微软技术许可有限责任公司 | Blackbody radiation in computing devices |
| CN109074138A (en) * | 2016-03-28 | 2018-12-21 | 微软技术许可有限责任公司 | Calculate the black body radiation in equipment |
| CN110365815A (en) * | 2018-03-26 | 2019-10-22 | 华为技术有限公司 | Heat-conductive assembly and terminal |
| US11284537B2 (en) | 2018-03-26 | 2022-03-22 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
| EP3764760A4 (en) * | 2018-03-26 | 2021-04-21 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
| US11839055B2 (en) | 2018-03-26 | 2023-12-05 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| JP2021012590A (en) * | 2019-07-08 | 2021-02-04 | レノボ・シンガポール・プライベート・リミテッド | Thermal module and electronic device |
| CN112198942B (en) * | 2019-07-08 | 2024-05-07 | 联想（新加坡）私人有限公司 | Radiating module, electronic equipment and radiating plate for radiating module |
| CN112198942A (en) * | 2019-07-08 | 2021-01-08 | 联想（新加坡）私人有限公司 | Heat radiation module, electronic device, and heat radiation plate for heat radiation module |
| CN113056157A (en) * | 2019-12-27 | 2021-06-29 | 广州力及热管理科技有限公司 | Thin thermal management assembly |
| CN113056157B (en) * | 2019-12-27 | 2022-08-26 | 广州力及热管理科技有限公司 | Thin thermal management assembly |
| WO2022078109A1 (en) * | 2020-10-16 | 2022-04-21 | 华为技术有限公司 | Middle frame and electronic device |
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