CN105188302B - Hand-hold electronic device radiator structure - Google Patents
Hand-hold electronic device radiator structure Download PDFInfo
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- CN105188302B CN105188302B CN201410269646.XA CN201410269646A CN105188302B CN 105188302 B CN105188302 B CN 105188302B CN 201410269646 A CN201410269646 A CN 201410269646A CN 105188302 B CN105188302 B CN 105188302B
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- supporter
- heat pipe
- heater element
- hand
- electronic device
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Abstract
The present invention relates to a kind of hand-hold electronic device radiator structures, are accommodated in the shell of a hand-hold electronic device, have an at least heater element in the shell.The radiator structure includes a supporter and a heat pipe.Supporter tool at least one thermal contact area of side delimited corresponds to the heater element and a cold-zone domain does not correspond to the heater element, and an open-work is arranged in the thermal contact area and runs through the supporter.There is a first part an at least side surface for the supporter is arranged in and be embedded in the open-work of the thermal contact area along cold-zone domain extension and a second part and amplexiform the heater element for the heat pipe, other than the heat of heater element is transmitted to cold-zone domain from thermal contact area and is radiated, and avoid interference with the heater element of thermal contact area.
Description
Technical field
The present invention relates to a kind of hand-hold electronic device radiator structures, more particularly to one kind to be applied to keep away in hand-hold electronic device
Exempt to interfere the radiator structure by the heater element in electronics dress is held.
Background technique
Existing hand held device with user its incline like it is frivolous with operation and under efficiency increasingly higher demands,
Internal central processing unit is then marched toward double-core or the even higher efficiency of four cores, and because of the treatment efficiency of central processing unit at
Reason its faster generated heat of speed is also bound to higher and higher, therefore how antipyretic also to become one with thinning and very important asks
Topic.
A kind of hand with radiator structure is disclosed in the prior art such as the novel case of Taiwan Patent application number 102209866
Communication device is held, this hand-hold communication device includes a shell, a heater element and a radiator, and enclosure interior is equipped with a cavity；
Heater element is accommodated in cavity；Radiator corresponds to heater element configuration, and radiator includes a heat pipe and a heat-conducting plate, heat pipe one
End heat posted is connected to heater element, and the other end is configured towards the direction far from heater element；Heat-conducting plate heat posted is connected to heat pipe.Whereby, hot
The even heat that heater element generates is directed on heat-conducting plate by pipe, avoids accumulation of heat around heater element, is mentioned with reaching
The effect of rising radiating efficiency.
The heat pipe of the prior art, which is arranged on the surface of heat-conducting plate, can interfere with heater element, so must be along avoiding sending out
The path of thermal element is extended, but the utilization for the confined space being thus unfavorable in hand-hold electronic device, thus how
It is original intention of the invention effectively to solve heat dissipation problem under conditions of not increasing thickness and space in existing space.
Summary of the invention
Therefore, effectively to solve the above problems, the main purpose of the present invention is to provide one kind, and hand-held electronics not only to be allowed to fill
Heat pipe in setting directly or indirectly amplexiforms heater element, and avoids heat pipe and heater element from interfering to efficiently use hand-held electronics and fill
The radiator structure in the space in setting.
In order to achieve the above objectives, the present invention provides a kind of hand-hold electronic device radiator structure, is accommodated in a hand-held electronics dress
In the shell set, there is an at least heater element in the shell, which includes: a supporter, has an at least side surface
Define that a thermal contact area corresponds to the heater element and a cold-zone domain does not correspond to the heater element, an open-work is arranged in the heat
In contact area and run through the supporter；There is one heat pipe a first part an at least side surface for the supporter is arranged in simultaneously
Extend along the cold-zone domain and a second part is embedded in the open-work of the thermal contact area and amplexiforms the heater element.
The heat pipe is located at the side or not ipsilateral that the supporter corresponds to the heater element.
Further include the second part that a heat exchange sheet amplexiforms the heat pipe.
The heat exchange sheet and the heat pipe are in the same side of the supporter or not ipsilateral.
The pyroconductivity of the composition material of the heat exchange sheet is higher than the composition material of supporter.
The support system is that stainless steel or aluminum alloy material are constituted；The heat exchange sheet system is metals or the graphite materials such as copper, aluminium
Texture at.
The heat exchange sheet is between the second part of the heat pipe and the heater element.
There is between the first part and second part of the heat pipe sloping portion, the sloping portion from the supporter to
A few side surface is tilted into the open-work.
There is a high and low fall between the first part and second part of the heat pipe.
Detailed description of the invention
Figure 1A is that the present invention first implements perspective exploded view；
Figure 1B is that the present invention first implements Three-dimensional combination diagram；
Fig. 1 C is that the present invention first implements section view decomposition diagram；
Fig. 1 D is that the present invention first implements section view combination diagram；
Fig. 2A is the section view decomposition diagram that the present invention second is implemented；
Fig. 2 B is the section view combination diagram that the present invention second is implemented:
Fig. 3 A is the section view decomposition diagram that third of the present invention is implemented；
Fig. 3 B is the section view combination diagram that third of the present invention is implemented:
Fig. 4 A is the section view decomposition diagram that the present invention the 4th is implemented；
Fig. 4 B is the section view combination diagram that the present invention the 4th is implemented:
Fig. 5 A is the intracorporal schematic diagram of shell that the present invention is accommodated in hand-hold electronic device；
Fig. 5 B is the schematic cross-sectional view of Fig. 5 A.
Symbol description
10 hand-hold electronic device radiator structures
11 supporters
111 first side surfaces
1111 thermal contact areas
1112 cold-zones domain
112 second side surfaces
113 open-works
12 heat pipes
121 first parts
122 second parts
123 sloping portions
13 heat exchange sheets
14 circuit boards
141 heater elements
20 hand-hold electronic devices
21 shells
211 front covers
2111 forms
212 back-covers
213 spaces
24 display touch control screens
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and detailed description:
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given
Explanation.
Figure 1A is perspective exploded view of the present invention；Figure 1B is Three-dimensional combination diagram of the invention；Fig. 1 C is the present invention
Section view decomposition diagram；Fig. 1 D is section view combination diagram of the present invention.As shown in Figure 1A to 1D, hand-hold electronic device radiator structure
10 include a supporter 11, a heat pipe 12.The supporter 11 is referred to alternatively as center setting in hand-hold electronic device (such as mobile phone again
Or omniselector) shell in, and as other components in hand-hold electronic device such as a circuit board 14 or a battery (no figure
Show) etc. connections support construction.It include a heater element 141 on circuit board 14.
There is supporter 11 at least one thermal contact area of side delimited to correspond to the heater element 141, in this embodiment
Indicate that the supporter 11 has opposite the first side surface 111 and one second side surface 112, and first side surface 111 is defined
One thermal contact area 1111 corresponds to the heater element 141.The remaining area of first side surface 111 does not correspond to the heater element
141 are defined as cold-zone domain 1112.Although this implementation is using the first side surface 111 as explanation, but not limited to this, second side table
Face 112 can define that a thermal contact area corresponds to heater element and a cold-zone domain does not correspond to heater element.The setting of one open-work 113 exists
In the thermal contact area 1111 and run through the supporter 11, open-work 113 cooperates the shape of heat pipe 12 to be preferably strip.
Heat pipe 12 is located at the side of the corresponding heater element 141 of the supporter 11, which has a first part 121
First side surface 111 of the supporter 11 is set and extends to the heat along the cold-zone domain 1112 of first side surface 111 and is connect
Touching region 1111 forms second part 122 and is embedded in the open-work 113 of the thermal contact area 1111 and amplexiforms the heater element
141.There is a sloping portion 123, the sloping portion 123 from this between the first part 121 and second part 122 of heat pipe 12
First side surface 111 of supporter 11 is tilted into the open-work 113.Since sloping portion 123 connects the first part 121 and the
Two parts 122, therefore a high and low fall h is defined between the first part 121 and second part 122.Heat pipe 12 is preferably slim
Flat plate heat tube has two opposite planes, in heat pipe 12 there is a closed chamber to extend to rake from first part 121
Points 123 until being equipped with working fluid and capillary structure in second part 122, the chamber, by the indoor working fluid of chamber by
Heat generates two phase change of liquid vapour recycled and steam and liquid vapour between the first part 121 and second part 122 of heat pipe 12 is past
Convection current that liquid returns and achieve the purpose that heat transfer.Since the second part 122 of heat pipe 12 is embedded in the thermal contact area of supporter 11
In 1111 open-work 113, therefore heat pipe 12 is avoided to interfere with the heater element for corresponding to the thermal contact area 1111 of supporter 11
141。
Furthermore more indicate that the second side surface of supporter 11 is arranged in a heat exchange sheet 13 in the schema of this implementation
112 is ipsilateral with heat pipe 12, and amplexiforms from the second side surface 112 second part 122 of the heat pipe 12 in open-work 113.And
The region of the thermal contact area 1111 of corresponding first side surface 111 in second side surface 112 of the supporter 11 is then passed by the heat
Guide card 13 covers, which can more extend over the heat to not corresponding first side surface 111 in the second side surface 112
The region of pipe 12.
Especially it is noted that supporter 11 is made of intensity with the higher material of hardness, and the group of the heat exchange sheet 13
It is higher than the pyroconductivity of the composition material of supporter 11 at the pyroconductivity of material, so by heat exchange sheet 13 by heat pipe 12
Heat evenly spreads to the region of the heat pipe 12 of not corresponding first side surface 111 in the second side surface 112 of supporter 11, to avoid
Heat concentrates on around the corresponding heater element 141 of supporter 11.Implement the supporter 11 one and is preferably stainless steel or aluminium alloy
Material (such as AL5052) composition, the metals such as heat exchange sheet 13 preferably copper, aluminium or graphite radiating film (or graphite samming piece
(Graphite Heat Spreader)) it constitutes.
Especially graphite radiating film is a kind of component of nanocomposite as temperature uniforming heat radiation, and it is uniform to adapt to any surface
It is thermally conductive, there is EMI effectiveness, be orientated with unique crystal grain, uniform heat conduction in both directions, it is laminar structured can
It is well adapted for any surface.(horizontal thermally conductive) is with the ultra-high conducting within the scope of 150-1500W/m-K in graphite radiating membrane plane
Hot property, and vertical thermal conductivity is only 5~20W/mK, almost plays heat-insulated effect.Also because graphite radiating film possesses
The coefficient of heat conduction that horizontal direction allows other metals to be difficult to reach, and the feature that the coefficient of heat conduction in vertical direction is relatively low.
Due to graphite radiating film horizontal thermal conductivity factor with higher, heat can be carried out the biography of quick horizontal direction by it
It leads, makes horizontal direction whole surface uniform heat distribution, eliminate hot localised points.So graphite radiating film is in fact for accurate
Play it is thermally conductive, and even heat spread effect, indirectly for namely play heat spreading function.
It is the section view decomposition diagram that the present invention second is implemented please continue to refer to Fig. 2A；Fig. 2 B is what the present invention second was implemented
Section view combination diagram.As shown in figs. 2 a and 2b, indicate the heat exchange sheet 13 and the heat pipe 12 in the same side of supporter 11.More
Specifically, the thermal contact area 1111 of the first side surface 111 can also be arranged in heat exchange sheet 13 above-mentioned.Heat exchange sheet 13
The second part 122 of the heat pipe 12 in open-work 113 is amplexiformed in side, and the heater element 141, therefore the heater element are amplexiformed in the other side
141 correspond to the second part of the heat pipe 12 across the heat exchange sheet 13.The heat exchange sheet 13 can be extended over to the first side table
The region of the not set heat pipe 12 in face 111.The heat penetration of heater element 141 crosses heat exchange sheet 13 and is transmitted to the heat pipe 12, by heat pipe
Heat is transmitted to first part 121 far from thermal contact area 1111 by second part 122 by 12, while the heat of the heater element 141
The region of the not set heat pipe 12 in the first side surface 111 is transmitted to via heat exchange sheet 13.Therefore each point of the first side surface 112
It sets or the temperature in each region is worthwhile for equally distributed state, and improve heat by such setting and concentrate the corresponding hair of supporter 11
Around thermal element 141.
It is the section view decomposition diagram that third of the present invention is implemented please continue to refer to Fig. 3 A；Fig. 3 B is what third of the present invention was implemented
Section view combination diagram；Fig. 4 A is the section view decomposition diagram that the present invention the 4th is implemented；Fig. 4 B is cuing open for the 4th implementation of the present invention
Depending on combination diagram.As shown, it is with first embodiment the difference is that the heat pipe 12 is located at the corresponding hair of the supporter 11
Thermal element 141 it is not ipsilateral, that is, the first part 121 of the heat pipe 12 is located at 11 second side surface 112 of supporter, heat pipe 12
Second part 122 be embedded in open-work 113, the sloping portion 123 of heat pipe 12 is tilted into this thoroughly from second side surface 112
In hole 113.Furthermore the heat exchange sheet 13 with heat pipe 12 supporter 11 the same side (as shown in figures 3 a and 3b) or it is not ipsilateral (such as
Shown in Fig. 4 A and 4B).
It will be detailed below hand-hold electronic device radiator structure and apply the specific implementation in a hand-hold electronic device, this
Inventing signified hand-hold electronic device includes,
Mobile phone (including smartphone), tablet computer, PDA, display and smart watch, in the schema of this explanation
It will be using smartphone as illustration.
Fig. 5 A is the intracorporal schematic diagram of shell that the present invention is accommodated in hand-hold electronic device；The section view that Fig. 5 B is Fig. 5 A is illustrated
Figure.Such as Fig. 5 A and 5B and together referring to figs. 1A to shown in 1D, the hand-hold electronic device 20 include a shell 21 by a front cover 211 and
One back-cover 212 composition, defines a space 213 between the front cover 211 and back-cover 212, and front cover 211 offers a form 2111 dress
Equipped with a display touch control screen 24.Hand-hold electronic device radiator structure 10 above-mentioned, which is placed in the space 213, is located at front cover 211
Between back-cover 212, the parts such as the circuit board 14 and battery (not shown) are in addition to this more equipped in space 213.Hand-held
The thermal contact area of the first side 111 of the corresponding supporter 11 of heater element 141 on circuit board 14 in electronic device 20
1111, and the second part 122 of the heat pipe 12 for the open-work 113 being embedded in thermal contact area 1111 is directly amplexiformed, through heat
Pipe 12 conducts the heat to first part 121.In addition the heat of heat pipe 12 is evenly spread into supporter 11 by the heat exchange sheet 13
Corresponding first side surface in the second side surface 112 heat pipe 12 region.Therefore the various point locations of the second side surface 112 or each
The temperature value in region is equally distributed state, and concentrates on supporter by the heat that such setting improves heater element 141
The problem of corresponding position of 11 corresponding heater elements 141.
In conclusion the present invention can be used in various handheld apparatus, such as mobile phone, tablet computer, PDA and numerical digit
The electronic devices such as display not only allow the heat pipe in hand-hold electronic device directly or indirectly to amplexiform heater element, and avoid heat pipe
Interfere with heater element to efficiently use the radiator structure in the space in hand-hold electronic device.
Although the present invention is disclosed above with embodiment, however, it is not to limit the invention, any to be familiar with technique
Personnel, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection model of the invention
It encloses when with the be set to standard of claims.
Claims (6)
1. a kind of hand-hold electronic device radiator structure, is accommodated in the shell of a hand-hold electronic device, have at least in the shell
One heater element, the radiator structure include:
One supporter, at least delimited one thermal contact area in side corresponds to the heater element to tool and a cold-zone domain does not correspond to
The heater element, an open-work are arranged in the thermal contact area and run through the supporter；
One heat pipe, with a first part part be arranged in the supporter an at least side surface and along the cold-zone domain extend and
One second part is embedded in the open-work of the thermal contact area and amplexiforms the heater element, the first part of the heat pipe and second
/ there is a sloping portion, which is tilted into the open-work from an at least side surface for the supporter, the heat pipe
First part and second part between have a high and low fall, there is a closed chamber to extend in heat pipe from first part and incline
Inclined portion point is until being equipped with working fluid and capillary structure in second part, the chamber, by heated in the indoor working fluid of chamber
Generate two phase change of liquid vapour recycled and steam and liquid pair that vapour is returned toward liquid between the first part and second part of heat pipe
Stream；
Heat pipe is located at supporter and corresponds to the not ipsilateral of heater element.
2. hand-hold electronic device radiator structure as described in claim 1 further includes a heat exchange sheet amplexiforms the heat pipe second
Part.
3. hand-hold electronic device radiator structure as claimed in claim 2, wherein the heat exchange sheet and the heat pipe are in the supporter
The same side or not ipsilateral.
4. hand-hold electronic device radiator structure as claimed in claim 2, hand-hold electronic device radiator structure, the wherein heat transfer
The pyroconductivity of the composition material of piece is higher than the composition material of supporter.
5. hand-hold electronic device radiator structure as claimed in claim 4, wherein the supporter is stainless steel or aluminum alloy material
It constitutes；The heat exchange sheet is that the metals such as copper, aluminium or graphite material are constituted.
6. hand-hold electronic device radiator structure as claimed in claim 3, wherein second part of the heat exchange sheet in the heat pipe
Between the heater element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269646.XA CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269646.XA CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105188302A CN105188302A (en) | 2015-12-23 |
| CN105188302B true CN105188302B (en) | 2019-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410269646.XA Active CN105188302B (en) | 2014-06-17 | 2014-06-17 | Hand-hold electronic device radiator structure |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304755A (en) * | 2015-05-25 | 2017-01-04 | 奇鋐科技股份有限公司 | Hand-hold electronic device radiator structure |
| KR102583890B1 (en) * | 2016-02-18 | 2023-10-05 | 삼성전자주식회사 | Electronic device with thermal spreader |
| US10429908B2 (en) * | 2016-03-28 | 2019-10-01 | Microsoft Technology Licensing, Llc | Black body radiation in a computing device |
| CN110365815B (en) | 2018-03-26 | 2021-03-30 | 华为技术有限公司 | Heat conduction assembly and terminal |
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| JP2021012590A (en) * | 2019-07-08 | 2021-02-04 | レノボ・シンガポール・プライベート・リミテッド | Thermal module and electronic device |
| CN113056157B (en) * | 2019-12-27 | 2022-08-26 | 广州力及热管理科技有限公司 | Thin thermal management assembly |
| CN114375130B (en) * | 2020-10-16 | 2023-09-12 | 华为技术有限公司 | Middle frame and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101573017A (en) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN203912442U (en) * | 2014-06-17 | 2014-10-29 | 奇鋐科技股份有限公司 | Hand-held electronic device heat-radiating structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
| TWM459692U (en) * | 2013-05-17 | 2013-08-11 | Chaun Choung Technology Corp | Portable communication device with heat dissipation structure |
-
2014
- 2014-06-17 CN CN201410269646.XA patent/CN105188302B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101573017A (en) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN203912442U (en) * | 2014-06-17 | 2014-10-29 | 奇鋐科技股份有限公司 | Hand-held electronic device heat-radiating structure |
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| CN105188302A (en) | 2015-12-23 |
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