CN203896662U - Mobile terminal composite type heat radiating structure and mobile phone - Google Patents

Mobile terminal composite type heat radiating structure and mobile phone Download PDF

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Publication number
CN203896662U
CN203896662U CN201420351810.7U CN201420351810U CN203896662U CN 203896662 U CN203896662 U CN 203896662U CN 201420351810 U CN201420351810 U CN 201420351810U CN 203896662 U CN203896662 U CN 203896662U
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China
Prior art keywords
pcb board
heat
supporting
mobile terminal
metal guide
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CN201420351810.7U
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Chinese (zh)
Inventor
杨璟
王小兵
万永高
廖新风
王杰
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201420351810.7U priority Critical patent/CN203896662U/en
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Abstract

The utility model discloses a mobile terminal composite type heat radiating structure and a mobile phone. The mobile terminal composite type heat radiating structure comprises a supporting piece and a PCB, wherein the supporting piece has a heat conduction function; components are arranged on the PCB; the supporting piece is provided with a supporting surface parallel to a component arrangement surface of the PCB; the PCB is detachably arranged in the supporting piece and radiates heat by virtue of the supporting surface; a metal heat conduction layer is laid at the back surface of a component arrangement area of the PCB; a phase change heat conduction material is arranged between the metal heat conduction layer and the supporting surface. The mobile phone comprises a hardware shell, wherein a supporting plate is arranged on the hardware shell; a heat radiating material is arranged between the supporting plate and a liquid crystal display module; a PCB and a battery are arranged between the supporting plate and a battery cover; a metal heat conduction layer is arranged on a plane, close to the supporting plate, of the PCB; a phase change heat conduction material is arranged between the metal heat conduction layer and the supporting plate.

Description

A kind of mobile terminal combined cooling structure and mobile phone
Technical field
The utility model relates to mobile communication equipment technical field, relates in particular to a kind of mobile terminal combined cooling structure and mobile phone.
Background technology
Along with user improves constantly the requirement of mobile product serviceability, mobile product hardware configuration is more and more higher.Under the environment that mobile terminal chip performance and integrated level progressively improve, its structure is compacter, heat radiation to pcb board is had higher requirement, due to the restriction of structure and volume, at present main radiating mode is that the heat at the large position of the caloric values such as central processing unit, memory is transmitted to and on fuselage metallic shield frame everywhere, is realized heat radiation by air or heat conductive silica gel uniformly.Although this mode can import to the heat of device in screening cover on screening cover and realize local heat radiation, with respect to mobile terminal complete machine, heat fails to disperse equably, causes regional area heating higher.
As shown in Figure 1, Chinese patent literature CN103037040A discloses the centralized radiator structure of a kind of mobile phone, be installed on mobile phone steel disc support 1, on steel disc support 1, carry pcb board 2, pcb board 2 is provided with several electronic devices and components that are mutually electrically connected to, between each electronic devices and components, by the screening cover 3 covering thereon, carry out shielded signal interference, described radiator structure comprises heat-conducting layer connected between each screening cover 34 and is connected in the fin 5 on steel disc support 1, and heat-conducting layer 4 is concentrated the heat of the components and parts on pcb board 2 to be transmitted to fin 5 heat radiations.
Heat radiation process is mainly heat-conducting layer and radiating surface and by the contact area between radiating surface, good heat dissipation effect when contact is respond well, when there is gap between loose contact even radiating effect by decline and can cause heat radiation inhomogeneous, local location excess Temperature, can not meet the radiating requirements of high performance chips, heat-conducting layer has certain thickness all the time, can impact mobile product integral thickness.
Utility model content
The purpose of this utility model is: reduce the thermal resistance between pcb board and other Heat Conduction Material, improve radiating efficiency, reduce chip temperature, guarantee chip performance.
Another object of the present utility model is: a kind of mobile terminal combined cooling structure is provided, and the gap minimum value realizing when can realize good heat radiating between pcb board and the metal shell of conduction heat is zero, reduces termination thickness.
Another object of the present utility model is: a kind of mobile phone is provided, and it has combined cooling structure, and radiating efficiency is high, contributes to improve the hardware configuration of mobile phone.
For reaching this object, the utility model by the following technical solutions:
A kind of mobile terminal combined cooling structure, comprise the strutting piece with thermal conducting function and the pcb board that is furnished with components and parts, described strutting piece has the supporting surface paralleling with the cloth part face of described pcb board, dismountable being arranged in described strutting piece and by described supporting surface of described pcb board dispelled the heat, metal guide thermosphere is laid at the back side in the cloth part region of described pcb board, between described metal guide thermosphere and described supporting surface, is provided with phase-change heat conductive material.
Because pcb board is made by hard material, supporting surface can produce space with the contacting of metal guide thermosphere on pcb board surface, so between arranges phase-change heat conductive material and can effectively to space, fill.
Concrete, in the mobile terminal course of work, heater element produces heat, heat is delivered to phase-change heat conductive material place by metal guide thermosphere, when phase-change heat conductive material is initial, be solid-state, after phase-change heat conductive material reaches phase transition temperature from the solid-state liquid state that becomes, because liquid material has flowable, liquid phase-change heat conductive material can be flow in the space between supporting surface and metal guide thermosphere, and then fully fill the air gap of metal guide thermosphere and supporting surface, reduce the thermal resistance between metal guide thermosphere and strutting piece, better by transfer of heat to strutting piece, so that heat further spreads, reach heat radiation object.
As a kind of preferred technical scheme, described supporting surface is provided with heat sink material away from a side of described phase-change heat conductive material.
Preferably, described heat sink material is conductive graphite.
After heat is diffused on rigidity heat conduction shell by pcb board, then by conductive graphite, local transfer of heat is arrived to other regions, increasing heat radiation area, improves radiating efficiency.
Heat sink material is not limited to conductive graphite, and it can also have for other heat sink material of excellent heat dispersion performance.
As a kind of preferred technical scheme, described pcb board is one side pcb board, and described metal guide thermosphere is copper layer, and described copper layer is paved with the non-cloth part face of described pcb board.
Concrete, one side pcb board can reduce the thickness of mobile terminal complete machine, and its non-cloth part plane opposed flattened is convenient to the layout of metal guide thermosphere, facilitates heat diffusion.
As a kind of preferred technical scheme, heater element is centralized arrangement on described pcb board, and described metal guide thermosphere is laid on the pcb board back side of arranging described heater element.
As a kind of preferred technical scheme, described phase-change heat conductive material is arranged on the metal guide thermosphere on described pcb board surface by steel mesh printing, or described phase-change heat conductive material is made on the metal guide thermosphere that laminated structure sticks on described pcb board surface.
As a kind of preferred technical scheme, cloth part face one side of described pcb board is provided with for preventing that heat is to the heat-barrier material of this side diffusion.
Preferably, on described pcb board and at the perimembranous button of described components and parts, be provided with the radome that shields, prevents signal phase mutual interference between each components and parts for the signal to components and parts, described heat-barrier material is arranged on the outside of described radome, setting by heat-barrier material can reduce the back side that heat is delivered to mobile terminal as far as possible, reduce the temperature at the mobile terminal back side, promote user and experience.
As a kind of preferred technical scheme, described heat-barrier material is covered with described pcb board region.
The layout scope of heat-barrier material can affect effect of heat insulation, heat-barrier material is covered with to described pcb board region and can stops as much as possible heat in the diffusion of this direction.
A kind of mobile phone, comprise five metals housing, be arranged on the liquid crystal display module in described five metals housing front and the battery cover that is located at described five metals back side of shell, on described five metals housing, be provided with supporting bracket, between described supporting bracket and described liquid crystal display module, be provided with heat sink material, between described supporting bracket and described battery cover, be provided with pcb board and battery, in the plane of described pcb board near described supporting bracket, be provided with metal guide thermosphere, between described metal guide thermosphere and described supporting bracket, be provided with phase-change heat conductive material.
As a kind of preferred technical scheme, described pcb board is C type one side pcb board, and components and parts are arranged in described C type one side pcb board near a side of described battery cover.
As a kind of preferred technical scheme, between described battery cover and described C type one side pcb board, be provided with for preventing that heat is to the heat-barrier material of battery cover direction diffusion.
The beneficial effects of the utility model are: at pcb board radiating surface, arrange metal guide thermosphere, can contribute to the diffusion of heat in pcb board plane, uniform high-efficiency more makes to dispel the heat; Phase-change heat conductive material is set, and under heating status, the physical state of Heat Conduction Material changes, and can fill voluntarily the space between strutting piece and metal guide thermosphere, reduces thermal resistance and improves heat conduction efficiency; Setting by heat-barrier material can reduce the back side that heat is delivered to mobile terminal as far as possible, reduce the temperature at the mobile terminal back side, promoting user experiences, adopt the mobile terminal of the utility model radiator structure to there is good radiating effect, be suitable for installing the element of high-performance golf calorific value, contribute to improve mobile phone configuration.
Accompanying drawing explanation
According to drawings and embodiments the utility model is described in further detail below.
Fig. 1 is the centralized radiator structure schematic diagram of a kind of mobile phone in prior art.
Fig. 2 is combined cooling structure profile described in embodiment mono-.
Fig. 3 is I place enlarged drawing in Fig. 2.
Fig. 4 is combined cooling structure profile described in embodiment bis-.
Fig. 5 is II place enlarged drawing in Fig. 4.
Fig. 6 is handset structure three-dimensional exploded view described in embodiment tri-.
Fig. 7 is C type one side pcb board structural representation described in embodiment tri-.
Fig. 8 is III place enlarged drawing in Fig. 7.
In Fig. 1:
1, steel disc support; 2, pcb board; 3, screening cover; 4, heat-conducting layer; 5, fin.
In Fig. 2,3:
200, pcb board; 201, strutting piece; 202, metal guide thermosphere; 203, phase-change heat conductive material; 204, components and parts; 205, heat sink material.
In Fig. 4,5:
300, pcb board; 301, strutting piece; 302, metal guide thermosphere; 303, phase-change heat conductive material; 304, components and parts; 305, heat sink material; 306, heat-barrier material.
In Fig. 6,7,8:
400, five metals housing; 401, liquid crystal display module; 402, battery cover; 403, supporting bracket; 404, conductive graphite sheet; 405, C type one side pcb board; 406, battery; 407, heat-barrier material; 408, phase-change heat conductive material; 409, metal guide thermosphere.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, further illustrate the technical solution of the utility model.
Embodiment mono-:
As shown in Figure 2,3, in the present embodiment, a kind of mobile terminal combined cooling structure described in the utility model, comprise there is thermal conducting function, the pcb board 200 for supporting the strutting piece 201 of pcb board 200 and being furnished with components and parts 204, strutting piece 201 has the supporting surface paralleling with the cloth part face of pcb board 200, dismountable being arranged in strutting piece 201 and by supporting surface of pcb board 200 dispelled the heat, metal guide thermosphere 202 is laid at the back side in the cloth part region of pcb board 200, is provided with phase-change heat conductive material 203 between metal guide thermosphere 202 and supporting surface.
Pcb board 200 adopts one side pcb board, in the side away from supporting surface, arranges components and parts 204, and metal guide thermosphere 202 is copper layer, and copper layer is paved with the non-cloth part face of pcb board 200.At supporting surface, away from a side of pcb board 200, be provided with for conducting to transfer of heat on strutting piece 201 heat sink material 205 to other region.Phase-change heat conductive material 203 is arranged on the metal guide thermosphere 202 on pcb board 200 surfaces by steel mesh printing.
In the course of the work, components and parts 204 work on pcb board 200 produce heat, heat is diffused into rapidly whole pcb board 200 surfaces by the copper layer of laying on pcb board 200, and by phase-change heat conductive material 203 or the copper layer contacting with supporting surface, heat is delivered on strutting piece 201.
The pcb board 200 that is furnished with copper layer under perfect condition is a plane, and the supporting surface of strutting piece 201 is also a plane, can not produce space, so heat can be good at being delivered to strutting piece 201 by copper layer in the middle of two plane joints.But under reality, be subject to the restriction of processing technology, it is completely smooth that pcb board 200 and supporting surface all can not reach, therefore between the plane that both contact, can form certain space, in this space, can have air, the thermal resistance of air is larger, therefore can reduce heat-conducting effect between the two.
Phase-change heat conductive material 203 is set between copper layer and supporting surface, the in the situation that of components and parts 204 heating, heat passes to phase-change heat conductive material 203 by copper layer, after phase-change heat conductive material 203 reaches phase transition temperature, physical property changes, by solid-state liquefy originally, because liquid phase-change heat conductive material 203 has mobility, it can be filled the space between copper layer and supporting surface, replace air to carry out heat conduction, can effectively heat be passed to strutting piece 201 by pcb board 200, and then pass through heat sink material 205 by heat diffusion, increase area of dissipation, improve radiating efficiency.
The liquid phase-change Heat Conduction Material 203 that fill compare great position in space between copper layer and supporting surface can be more, the liquid phase-change Heat Conduction Material 203 that fill compare little position, space can be less, the thickness of mobile terminal, without the filling of liquid phase-change Heat Conduction Material 203, therefore can effectively be reduced in the position that copper layer on pcb board 200 can directly contact with supporting surface even.
It is to be noted that the set-up mode of phase-change heat conductive material 203 is not limited to steel mesh printing, phase-change heat conductive material 203 can also be made in other embodiments on the metal guide thermosphere 202 that laminated structure sticks on pcb board 200 surfaces.
Embodiment bis-:
As shown in Figure 4,5, in the present embodiment, a kind of mobile terminal combined cooling structure described in the utility model, comprise there is thermal conducting function, the pcb board 300 for supporting the strutting piece 301 of pcb board 300 and being furnished with components and parts 304, pcb board 300 is one side pcb board, and it arranges components and parts 304 in one side.Strutting piece 301 has the supporting surface paralleling with the cloth part face of pcb board 300, dismountable being arranged in strutting piece 301 and by supporting surface of pcb board 300 dispelled the heat, metal guide thermosphere 302 is laid at the back side in the cloth part region of pcb board 300, is provided with phase-change heat conductive material 303 between metal guide thermosphere 302 and supporting surface.
Pcb board 300 adopts one side pcb board 300, in the side away from supporting surface, arranges components and parts 304, and metal guide thermosphere 302 is copper layer, and copper layer is paved with the non-cloth part face of pcb board 300.At supporting surface, away from a side of pcb board 300, be provided with for conducting to transfer of heat on strutting piece 301 heat sink material 305 to other region.Phase-change heat conductive material 303 is arranged on the side of supporting surface near pcb board 300, in cloth part face one side of pcb board 300, is covered with for preventing that heat is to the heat-barrier material 306 of this direction diffusion.
Mobile terminal combined cooling structure described in the present embodiment, it also has the function that prevents that heat from spreading voluntarily in the function described in realizing embodiment mono-, can control heat in the direction diffusion of needs, contributes to improve customer experience.
Embodiment tri-:
As Fig. 6, 7, shown in 8, in the present embodiment, a kind of mobile phone described in the utility model, comprise five metals housing 400, the battery cover 402 that is arranged on the liquid crystal display module 401 in five metals housing 400 fronts and is located at five metals housing 400 back sides, on five metals housing 400, be provided with supporting bracket 403, between supporting bracket 403 and liquid crystal display module 401, be provided with conductive graphite sheet 404, between supporting bracket 403 and battery cover 402, be provided with C type one side pcb board 405, components and parts are arranged in C type one side pcb board 405 near a side of battery cover 402, the groove of C type one side pcb board 405 arranges battery 406, in the plane of C type one side pcb board 405 near supporting bracket 403, be provided with metal guide thermosphere 409, between metal guide thermosphere 409 and supporting bracket 403, be provided with phase-change heat conductive material 408.Between battery cover 402 and C type one side pcb board 405, be provided with for preventing that heat is to the heat-barrier material 407 of battery cover 402 direction diffusions.
What need statement is; above-mentioned embodiment is only preferred embodiment of the present utility model and institute's application technology principle; in technical scope disclosed in the utility model; the variation that any those skilled in the art of being familiar with easily expect or replacement, all should be encompassed in protection range of the present utility model.

Claims (10)

1. a mobile terminal combined cooling structure, it is characterized in that, comprise the strutting piece with thermal conducting function and the pcb board that is furnished with components and parts, described strutting piece has the supporting surface paralleling with the cloth part face of described pcb board, dismountable being arranged in described strutting piece and by described supporting surface of described pcb board dispelled the heat, metal guide thermosphere is laid at the back side in the cloth part region of described pcb board, between described metal guide thermosphere and described supporting surface, is provided with phase-change heat conductive material.
2. mobile terminal combined cooling structure according to claim 1, is characterized in that, described supporting surface is provided with heat sink material away from a side of described phase-change heat conductive material.
3. mobile terminal combined cooling structure according to claim 1, is characterized in that, described pcb board is one side pcb board, and described metal guide thermosphere is copper layer, and described copper layer is paved with the non-cloth part face of described pcb board.
4. mobile terminal combined cooling structure according to claim 1, is characterized in that, heater element is centralized arrangement on described pcb board, and described metal guide thermosphere is laid on the pcb board back side of arranging described heater element.
5. according to the mobile terminal combined cooling structure described in any one in claim 1 to 4, it is characterized in that, described phase-change heat conductive material is arranged on the metal guide thermosphere on described pcb board surface by steel mesh printing, or described phase-change heat conductive material is made on the metal guide thermosphere that laminated structure sticks on described pcb board surface.
6. mobile terminal combined cooling structure according to claim 5, is characterized in that, cloth part face one side of described pcb board is provided with for preventing that heat is to the heat-barrier material of this side diffusion.
7. mobile terminal combined cooling structure according to claim 6, is characterized in that, described heat-barrier material is covered with described pcb board region.
8. a mobile phone, it is characterized in that, comprise five metals housing, be arranged on the liquid crystal display module in described five metals housing front and the battery cover that is located at described five metals back side of shell, on described five metals housing, be provided with supporting bracket, between described supporting bracket and described liquid crystal display module, be provided with heat sink material, between described supporting bracket and described battery cover, be provided with pcb board and battery, in the plane of described pcb board near described supporting bracket, be provided with metal guide thermosphere, between described metal guide thermosphere and described supporting bracket, be provided with phase-change heat conductive material.
9. mobile phone according to claim 8, is characterized in that, described pcb board is C type one side pcb board, and components and parts are arranged in described C type one side pcb board near a side of described battery cover.
10. mobile phone according to claim 9, is characterized in that, is provided with for preventing that heat is to the heat-barrier material of battery cover direction diffusion between described battery cover and described C type one side pcb board.
CN201420351810.7U 2014-06-27 2014-06-27 Mobile terminal composite type heat radiating structure and mobile phone Active CN203896662U (en)

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Cited By (21)

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CN104441830A (en) * 2014-12-17 2015-03-25 衡山县佳诚新材料有限公司 Heat conduction film structure of electronic product
CN104981134A (en) * 2015-07-14 2015-10-14 广东欧珀移动通信有限公司 Electronic device
CN104994712A (en) * 2015-07-14 2015-10-21 广东欧珀移动通信有限公司 Mobile terminal and method for dissipating heat of mobile terminal
CN105072868A (en) * 2015-07-14 2015-11-18 广东欧珀移动通信有限公司 Mobile terminal and method for heat radiation of mobile terminal
CN105658020A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Wearable host device with heat radiation structure
CN105739618A (en) * 2016-01-26 2016-07-06 努比亚技术有限公司 Middle frame and mobile terminal
CN105828551A (en) * 2016-04-29 2016-08-03 广东欧珀移动通信有限公司 Rear shell and mobile terminal
CN105827758A (en) * 2016-04-29 2016-08-03 广东欧珀移动通信有限公司 Telephone receiver component and mobile terminal
CN106304799A (en) * 2016-09-29 2017-01-04 努比亚技术有限公司 The encapsulating method of a kind of conducting-heat elements and mobile terminal
CN106455419A (en) * 2016-09-05 2017-02-22 珠海格力电器股份有限公司 Heat dissipation structure of electronic equipment
CN106473773A (en) * 2016-10-12 2017-03-08 湖南润泽医疗影像科技有限公司 A kind of integrated wireless palm color ultrasound
CN107205329A (en) * 2017-07-31 2017-09-26 京东方科技集团股份有限公司 A kind of containment vessel
WO2017185975A1 (en) * 2016-04-29 2017-11-02 广东欧珀移动通信有限公司 Display screen frame and terminal
CN107343375A (en) * 2016-04-29 2017-11-10 广东欧珀移动通信有限公司 A kind of rear shell and mobile terminal
WO2017197846A1 (en) * 2016-05-17 2017-11-23 中兴通讯股份有限公司 Terminal device and heat-dissipation structure thereof
CN108093604A (en) * 2016-11-23 2018-05-29 三星电子株式会社 Steam including being used to absorb heat(Two-phase)The electronic device of chamber
CN109952820A (en) * 2016-11-15 2019-06-28 华为技术有限公司 A kind of terminal
CN110121925A (en) * 2016-12-29 2019-08-13 华为技术有限公司 Radiator and its terminal device
CN110191625A (en) * 2019-06-28 2019-08-30 Oppo广东移动通信有限公司 Radiating subassembly, preparation method and electronic equipment
WO2020093364A1 (en) * 2018-11-09 2020-05-14 深圳市柔宇科技有限公司 Electronic device and circuit board assembly
US10729036B2 (en) 2016-09-28 2020-07-28 Huawei Technologies Co., Ltd. Heat dissipation structure for electronic device and electronic device

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CN105658020A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Wearable host device with heat radiation structure
CN105658020B (en) * 2014-11-10 2019-07-05 奇鋐科技股份有限公司 Has the wearable host apparatus of radiator structure
CN104441830A (en) * 2014-12-17 2015-03-25 衡山县佳诚新材料有限公司 Heat conduction film structure of electronic product
CN104981134A (en) * 2015-07-14 2015-10-14 广东欧珀移动通信有限公司 Electronic device
CN104994712A (en) * 2015-07-14 2015-10-21 广东欧珀移动通信有限公司 Mobile terminal and method for dissipating heat of mobile terminal
CN105072868A (en) * 2015-07-14 2015-11-18 广东欧珀移动通信有限公司 Mobile terminal and method for heat radiation of mobile terminal
WO2017008575A1 (en) * 2015-07-14 2017-01-19 广东欧珀移动通信有限公司 Mobile terminal and method for dissipating heat of said mobile terminal
CN105072868B (en) * 2015-07-14 2018-04-27 广东欧珀移动通信有限公司 Mobile terminal and the method to mobile terminal heat dissipation
CN105739618A (en) * 2016-01-26 2016-07-06 努比亚技术有限公司 Middle frame and mobile terminal
CN105739618B (en) * 2016-01-26 2019-08-16 努比亚技术有限公司 Center and mobile terminal
CN105828551A (en) * 2016-04-29 2016-08-03 广东欧珀移动通信有限公司 Rear shell and mobile terminal
CN107343375B (en) * 2016-04-29 2021-03-12 Oppo广东移动通信有限公司 Rear shell and mobile terminal
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WO2017185975A1 (en) * 2016-04-29 2017-11-02 广东欧珀移动通信有限公司 Display screen frame and terminal
CN107343375A (en) * 2016-04-29 2017-11-10 广东欧珀移动通信有限公司 A kind of rear shell and mobile terminal
CN105827758A (en) * 2016-04-29 2016-08-03 广东欧珀移动通信有限公司 Telephone receiver component and mobile terminal
CN108601292A (en) * 2016-04-29 2018-09-28 广东欧珀移动通信有限公司 Rear shell and mobile terminal
WO2017197846A1 (en) * 2016-05-17 2017-11-23 中兴通讯股份有限公司 Terminal device and heat-dissipation structure thereof
CN107396592A (en) * 2016-05-17 2017-11-24 中兴通讯股份有限公司 Terminal device and its radiator structure
CN107396592B (en) * 2016-05-17 2021-02-02 中兴通讯股份有限公司 Terminal device and heat radiation structure thereof
CN106455419A (en) * 2016-09-05 2017-02-22 珠海格力电器股份有限公司 Heat dissipation structure of electronic equipment
US10729036B2 (en) 2016-09-28 2020-07-28 Huawei Technologies Co., Ltd. Heat dissipation structure for electronic device and electronic device
CN106304799B (en) * 2016-09-29 2019-03-08 努比亚技术有限公司 A kind of encapsulating method and mobile terminal of conducting-heat elements
CN106304799A (en) * 2016-09-29 2017-01-04 努比亚技术有限公司 The encapsulating method of a kind of conducting-heat elements and mobile terminal
CN106473773A (en) * 2016-10-12 2017-03-08 湖南润泽医疗影像科技有限公司 A kind of integrated wireless palm color ultrasound
CN109952820A (en) * 2016-11-15 2019-06-28 华为技术有限公司 A kind of terminal
CN108093604A (en) * 2016-11-23 2018-05-29 三星电子株式会社 Steam including being used to absorb heat(Two-phase)The electronic device of chamber
US10739830B2 (en) 2016-11-23 2020-08-11 Samsung Electronics Co., Ltd. Electronic device including vapor (two phase) chamber for absorbing heat
CN110121925A (en) * 2016-12-29 2019-08-13 华为技术有限公司 Radiator and its terminal device
US11016546B2 (en) 2016-12-29 2021-05-25 Huawei Technologies Co., Ltd. Heat dissipation apparatus and terminal device having same
CN107205329A (en) * 2017-07-31 2017-09-26 京东方科技集团股份有限公司 A kind of containment vessel
CN107205329B (en) * 2017-07-31 2019-05-28 京东方科技集团股份有限公司 A kind of protective shell
WO2020093364A1 (en) * 2018-11-09 2020-05-14 深圳市柔宇科技有限公司 Electronic device and circuit board assembly
CN110191625A (en) * 2019-06-28 2019-08-30 Oppo广东移动通信有限公司 Radiating subassembly, preparation method and electronic equipment

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