CN113056157A - Thin thermal management assembly - Google Patents
Thin thermal management assembly Download PDFInfo
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- CN113056157A CN113056157A CN201911376764.XA CN201911376764A CN113056157A CN 113056157 A CN113056157 A CN 113056157A CN 201911376764 A CN201911376764 A CN 201911376764A CN 113056157 A CN113056157 A CN 113056157A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
A thin thermal management assembly includes a thermal conductive plate structure and a thermal insulation plate structure for managing thermal conduction of a heating element in a housing of a mobile electronic device. The surface of the heat conducting plate structure is provided with a heat source area coupled with the heating element. The heat shield structure covers a portion of the heat-conducting plate structure, and the heat shield structure extends outwardly from a portion proximate the heating element relative to the heat-conducting plate structure. The heat insulation plate structure is provided with a second vacuum cavity for preventing heat energy generated by the heating element from being transferred to the shell surface of the casing through the heat conduction plate structure towards the direction of the heat insulation plate structure.
Description
Technical Field
The invention relates to a thin thermal management component, which is used for managing a thin mobile electronic device, in particular to managing the heat conduction behavior of high-density heat energy generated by a microprocessor element of a thin smart phone in a mobile phone system; and more particularly to a thin thermal management assembly having both transverse (X-Y axis) rapid thermal conductivity and longitudinal (Z axis) thermal insulation in high density thermal regions of a heat-generating component. Therefore, the surface temperature of the shell corresponding to the heating element in the thin mobile electronic device is controlled to be in a lower temperature range or the temperature rising speed of the thin mobile electronic device is reduced, and the time that the microprocessor element is forced to reduce the frequency (thread) of the smart phone due to the overhigh temperature of a Hot Spot (Hot Spot) area on the surface of the shell is further delayed.
Background
The development trend of electronic and handheld communication devices is continuously towards thinning and high functionality, and demands on the operation speed and functions of a Microprocessor (Microprocessor) in the device are also increasing. The microprocessor is a core element of electronic and communication products, and is easy to generate heat under high-speed operation to become a main heating element of an electronic device, and if the heat cannot be dissipated instantly, the heat energy is accumulated to generate a local Hot Spot (Hot Spot). In the design of electronic and handheld communication systems, if there is no good thermal management system for the heat generated by the microprocessor, the microprocessor will be overheated, and at the same time, the surface temperature of the housing above the Z-axis will be overheated rapidly and exceed the design tolerance limit of the surface temperature of the housing, and the frequency reduction action of the microprocessor will be started, so that the proper function of the microprocessor in design cannot be exerted. If the heat generated by the microprocessor is not properly managed, it will not only affect the lifetime and reliability of the whole electronic device system, but also cause uneven temperature distribution on the surface of the housing, thereby generating Hot spots (Hot spots). Once the temperature of the hot spot on the surface of the shell exceeds 45 ℃, the system automatically starts the down-conversion mechanism of the microprocessor so as to reduce the temperature of the microprocessor and the temperature of the hot spot on the surface of the shell. With the popularization of 5G communication, the functions of mobile electronic devices are continuously improved, and the power consumption of microprocessors and systems is increased in order to process more huge and complicated data. However, mobile electronic devices, such as smart phones (smartphones) and Tablet PCs (Tablet PCs), are increasingly pursuing ultra-thin product designs, and thus present a greater challenge to thermal management of the system.
Because some electronic or communication products, such as smart phones, are very thin and light, the thickness space between the surface of the microprocessor and the surface of the housing is often less than 1.5 mm. This makes the high temperature generated by the microprocessor during operation easily conducted to the housing along the Z-axis direction, which results in excessive temperature on the surface of the housing. According to the international safety standard UL/IEC 62368-1, the surface temperature of the hand-held device can only reach 48 ℃ and if the hand-held device is overheated, the hand-held device may have safety concerns such as scalding and battery damage …. When the intelligent mobile phone is used in a normal on-line or communication mode, the temperature of the mobile phone is normal at a micro temperature of 35-40 ℃. However, since most of the existing smart phones have multiple functions, the temperature of the smart phone will be continuously high due to the use of energy consuming APP software (such as games, Flash, camera, watching video or mass data transmission), which raises the safety concern. Especially, when the smart phone communication is advanced from 4G to 5G generation, the system power consumption will be doubled, and the thermal management of the high density thermal energy generated by the microprocessor will be more severe. If any area of the surface of the housing of a general smart phone exceeds 45 ℃, the user feels very uncomfortable, so the design of the general smart phone starts to reduce the frequency, so that the temperature of the surface of the housing is controlled below 45 ℃. In this regard, it is becoming very important to incorporate an ultra-thin and highly efficient thermal management element or assembly within a smartphone.
The prior art has dealt with this problem, most of them using flat thin Heat Pipe elements (Heat Pipe) or Vapor Chamber elements (Vapor Chamber). A flat thin type heat pipe element or a temperature-equalizing plate element is placed on a middle frame metal sheet of a smart phone, and a heat absorption end (Evaporrator) of the heat pipe or the temperature-equalizing plate is tightly attached to a heating element of a microprocessor, so that heat energy generated by the heating element of the microprocessor is quickly guided to a condensation end (Condensor) to reduce the surface temperature of the microprocessor. Although the heat absorbing end of the heat pipe or the vapor chamber does not contact the inner surface of the casing, the temperature of the casing surface is still too high due to other heat conduction actions in the casing.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a thin thermal management assembly, which combines a thin heat conducting plate structure, a thin heat insulating plate structure and a special design, and can effectively solve the problem of too fast temperature rise in a hot spot area on a surface of a housing of a thin mobile electronic device. Therefore, the problem that the mobile electronic device cannot exert the due function because the microprocessor starts a frequency reduction (Throttling) measure too fast due to too fast temperature rise of the hot spot area of the system is solved.
To achieve the above objects, the present invention discloses a thin thermal management assembly for managing the thermal conduction behavior of a heat generating component in a housing of a mobile electronic device, comprising:
a heat conducting plate structure having a first vacuum cavity containing a capillary structure, a working fluid and an air channel, the heat conducting plate structure further having a heat conducting surface having a heat source region coupled to the heating element; and
a heat insulation plate structure arranged between the heat conduction plate structure and the casing, wherein the heat insulation plate structure covers a part of the heat conduction plate structure, extends outwards from a part close to the heating element relative to the heat conduction plate structure, and is provided with;
a second vacuum chamber; and
a plurality of supports arranged in the second vacuum cavity, wherein the heat conduction coefficients of the plurality of supports are less than 0.5W/mk;
the heat insulation plate structure is used for preventing high-density heat energy generated by the heating element from being transmitted to a shell surface of the shell through the heat conduction plate structure towards the direction of the heat insulation plate structure, and the total thickness of the thin heat management assembly is not more than 600 micrometers (um).
The heat-insulating plate further comprises a first area, wherein the first area comprises a first heat-insulating part close to the heat-insulating plate structure of the heating element and a first heat-conducting part of the heat-conducting plate structure, and the area of the first heat-insulating part is larger than that of the first heat-conducting plate part.
The heat conducting plate structure further comprises a heat absorbing end and a condensing end, the heat absorbing end is positioned in the heat source area, and the condensing end is far away from the heat source area; the thin heat management assembly further includes a second region including a second heat conducting portion of the heat conducting plate structure between the heat absorbing end and the condensing end, and a second heat insulating portion of the heat insulating plate structure opposite to the second heat conducting portion, wherein an area ratio of an area of the second heat insulating portion to an area of the second heat conducting portion is 0.9 to 1.1.
The heat-conducting plate structure further comprises a third area, wherein the third area comprises a third heat-conducting part of the heat-conducting plate structure, and the third heat-conducting part is not covered by the heat-insulating plate structure.
The heat insulation plate structure is attached to the casing, the heat conduction plate structure is provided with a condensation end, the condensation end is far away from the heating element, and the condensation end is also attached to the casing.
The heat conducting plate structure is provided with a heat absorbing end and a condensing end, the heat absorbing end is close to the heating element, the condensing end is far away from the heating element, and the Z-axis heat insulating area comprises an area which is at least 50% of the heat conducting plate structure and extends from the heat absorbing end to the condensing end, so that the heat insulating plate structure prevents the high-density heat energy generated by the heating element from being directly conducted to the surface of the shell through the heat insulating plate structure.
Wherein, the heat conducting plate structure is a temperature equalizing plate element structure or a flat heat conducting pipe element structure.
Wherein, the heat conducting plate structure and the heat insulating plate structure are two independent elements respectively.
Wherein, the heat conducting plate structure and the heat insulating plate structure are combined to form a single element.
Wherein, the heat conducting plate structure and the heat insulating plate structure share a structural panel.
In order to prevent the high-density heat source of the heating element from being rapidly conducted to the casing, the temperature of the casing surface is too high, and the microprocessor frequency reduction mechanism is further started. In the conventional thermal management technology for a high-density heat source of a heat generating element in a thin mobile electronic device (especially a smart phone), a flat heat pipe or a temperature-uniforming plate element is generally placed on a frame plate in a mobile phone. The heat absorbing end of the flat heat pipe or the temperature equalizing plate element is attached to the heat absorbing end but not directly attached to the inner surface of the casing, so that the heat energy generated by the microprocessor is directly transmitted to the frame of the mobile phone to dissipate the heat. However, due to the power increase of the 5G mobile phone microprocessor, some heat conduction and dissipation methods are not used, which causes the problem of overheating inside the mobile phone, and further affects the function and life of the electronic components.
The thin thermal management assembly of the present invention can rapidly transmit the high-density heat of the microprocessor to the housing at the condensation end for heat dissipation by contacting the heat absorption end of the heat conduction plate structure with the heat generation element, and prevent the high-density heat from being longitudinally transmitted to the housing surface by the heat insulation plate structure with a larger area of the heat source area, thereby reducing the temperature gradient generated on the housing surface of the smart phone housing due to the Hot Spot (Hot Spot). In other words, the temperature distribution on the surface of the shell is balanced, and the time for the temperature of the system setting starting microprocessor frequency reduction mechanism to be reached anywhere on the surface of the machine body is slowed down. The total thickness of the thin thermal management assembly is not more than 600 micrometers, and the high-efficiency X-Y axis heat conduction and Z axis heat insulation of the heat energy of the heating element can be achieved simultaneously in an ultrathin thickness space, so that the high-power 5G smart phone can effectively reduce the temperature of a hot spot on the surface of a shell while maintaining the thin design.
Drawings
FIG. 1A: a schematic structural diagram of a thin thermal management assembly according to an embodiment of the invention is shown.
FIG. 1B: an exploded view of a thin thermal management assembly according to one embodiment of the present invention is shown.
FIG. 2: a schematic diagram of a thin thermal management assembly application according to an embodiment of the present invention is shown.
FIG. 3: a schematic temperature profile of a chassis used for a thin thermal management assembly according to an embodiment of the present invention is shown.
FIG. 4A: a schematic temperature profile of an enclosure for use with a thin thermal management assembly according to another embodiment of the present invention is shown.
FIG. 4B: the structure of FIG. 4A is schematically shown.
FIG. 5: a schematic diagram of a thin thermal management assembly according to an embodiment of the invention is shown.
FIG. 6: a schematic diagram of an arrangement of a thin thermal management assembly according to another embodiment of the present invention is shown.
FIG. 7: a schematic diagram of a thin thermal management assembly according to yet another embodiment of the present invention is shown.
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described in detail hereinafter with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative of the present invention, and that the specific methods, devices, conditions, materials, etc., described herein are not intended to limit the present invention or the corresponding embodiments. Also, the devices shown in the drawings are merely for relative positional representation and are not drawn to scale as they are actually drawn.
Referring to fig. 1A, fig. 1B and fig. 2, fig. 1A is a schematic structural diagram of a thin thermal management component 1 according to an embodiment of the invention, fig. 1B is an exploded structural diagram of the thin thermal management component 1 according to an embodiment of the invention, and fig. 2 is an application diagram of the thin thermal management component 1 according to an embodiment of the invention. As shown in fig. 1A and 1B, the thin thermal management module 1 can be composed of a combination of a separate thin heat-conducting plate structure 11 and a thin heat-insulating plate structure 12. As shown in fig. 1B and fig. 2, the heat-conducting plate structure 11 includes a first structural sheet 111, a second structural sheet 112 opposite to the first structural sheet 111, and a first vacuum cavity 113 formed between the first structural sheet 111 and the second structural sheet 112. The heat conducting plate structure 11 has a heat absorbing end 114 and a condensing end 115, the first vacuum chamber 113 contains a capillary structure, a working fluid and an air channel, and the second structural sheet 112 at the heat absorbing end 114 has a contact surface to contact the heating element 21. In practical applications, a layer of heat conductive paste (instead of the heat conductive pad 14) may be coated on the contact surface between the second structure sheet 112 and the heating element 21 to reduce the thermal resistance value of the contact surface. In another practical application, the second structural piece 112 of the heat absorbing end 114 contacts the heating element 21, so that the liquid working fluid flowing between the capillary structures is boiled in a vacuum environment by receiving the heat energy of the heating element 21, so as to be converted into a gaseous working fluid with heat energy. The gaseous working fluid rapidly conducts heat energy along the air path to the condensation end 115 away from the heating element 21 and the housing 22, thereby achieving the effects of heat removal, heat conduction and heat dissipation. The heat insulation plate structure 12 includes a third structural sheet 121, a fourth structural sheet 122 opposite to the third structural sheet 121, and a second vacuum cavity 123 formed between the third structural sheet 121 and the fourth structural sheet 122. Wherein the third structural sheet 121 closely covers the first structural sheet 111. In one embodiment, the first structural sheet 111 of the heat-conducting plate structure 11 and the third structural sheet 121 of the heat-insulating plate structure 12 may be combined into one to share one structural panel. The heat insulation plate 12 blocks the high-density heat generated by the heating element 21 from being conducted to the surface of the housing of the casing 22 in the Z-axis direction by the vacuum state of the second vacuum chamber 123, so as to achieve the effect of heat insulation. The area of the first structural sheet 111 of the heat-conducting plate structure 11 covered by the third structural sheet of the heat-insulating plate structure 12 is the Z-axis heat-insulating region 13. In this Z-axis insulation region 13, the thermal energy is blocked from being transferred in a direction away from the heating element 21 toward the Z-axis due to the heat blocking function of the heat shield structure 12.
In practical applications, the thin thermal management assembly 1 of the present invention can be applied to a mobile electronic device 2, such as a smart phone, a tablet computer, smart glasses, etc. The mobile electronic device 2 may include a heating element 21 and a housing 22. As shown in fig. 2, the thin thermal management component 1 is disposed between the heating element 21 and the housing 22, the portion of the first structural sheet 111 of the heat-conducting plate structure 11 other than the Z-axis insulation region 13 is attached to the housing 22, and the fourth structural sheet 122 of the heat-insulating plate structure 12 is also attached to the housing 22. In one embodiment, the condensation end of the heat conducting plate 11 is attached to the housing 22. In another embodiment, the thickness of the thermal insulation plate structure 12 is not greater than 200 micrometers (um), the thickness of the thermal conductive plate structure 11 is not greater than 400 micrometers (um), and the thickness of the thin thermal management assembly 1 is not greater than 600 micrometers (um). The heat insulation plate structure 12 can be tightly covered on the Z-axis heat insulation region 13 of the first structural sheet 111 of the heat conduction plate structure 11 by structural clamping, welding, bonding or attaching.
Referring to fig. 3, fig. 4A and fig. 4B, fig. 3 is a schematic diagram showing a temperature distribution of the chassis 22 used in the thin heat management assembly 1 according to an embodiment of the present invention, fig. 4 is a schematic diagram showing a temperature distribution of the chassis 22 used in the thin heat management assembly 1 according to another embodiment of the present invention, and fig. 4B is a schematic diagram showing a structure according to fig. 4A. As shown in fig. 3 and 4A, the positions outlined by the dotted lines in the figures are the heat insulation plate structure 12, the positions outlined by the chain lines are the heat absorption end 114 and the condensation end 115, respectively, the diagonal line regions are the Z-axis heat insulation regions, and the temperature of the lattice-shaped regions is higher than that of the transverse line regions.
The heat conducting plate structure 11 has a heat source region 116 at the heat sink 114 for contacting the heat generating element 21 of fig. 2, and in the preferred embodiment, at the heat generating element 21, the edge of the heat insulating plate structure 12 is spaced from the heat source region 116 by at least a width of the heat conducting plate structure 11; alternatively, the edge of the heat shield structure 12 is at least 5mm from the heat source zone 116. That is, the area of the heat shield structure 12 is larger than the area of the heat-conducting plate structure 11 in the heat source region 116.
Because the heat conduction direction of the heat conducting plate structure 11 is to transfer heat energy from the heat absorbing end 114 to the condensing end 115, and the heat resistance characteristic of the heat conducting plate structure 11 itself is added, a temperature difference (Delta T) exists between the heat absorbing end 114 and the condensing end 115 of the heat conducting plate structure 11, and in a specific embodiment, the temperature difference is 5 ℃. The high density heat generated by the heating element 21 in the thin mobile electronic device 2 is quickly transferred from the heat absorption end 114 to the condensation end 115 through the heat conduction plate structure 11, and then transferred to the surface of the casing 22, so as to achieve heat conduction and heat dissipation. The temperature of the shell surface of the casing 22 will be lower than the temperature of the first structural piece 111 of the thermally conductive plate structure 11 at the heat absorbing end 114. In order to prevent the temperature of the surface of the housing 22 of the heat source region 116 from rapidly increasing due to the proximity of the heat generating element 21, the setting temperature for enabling the system to start the microprocessor to reduce the frequency, the area of the heat shield structure 12 above the adiabatic region 13 plays a significant role.
In detail, referring to fig. 4B, the thin thermal management device 1 can be further divided into a first region S1, a second region S2 and a third region S3. Taking the thin thermal management assembly 1 of fig. 4B as an example, the first area S1 includes the first thermal insulation portion 125 of the thermal baffle structure 12 near the heating element 21 and the first thermal conduction portion 117 of the thermal conduction plate structure 11. The second region S2 includes the second heat-conducting portion 118 of the heat-conducting plate structure 11 between the heat-absorbing end 114 and the condensation end 115 and the second heat-insulating portion 126 of the heat-insulating plate structure 12. The third area S3 contains the third heat-conducting portion 119 of the heat-conducting plate structure 11. The third area S3 includes the third heat-conducting portion 119 of the heat-conducting plate structure 11, and the third heat-conducting portion 119 is not covered by the heat-insulating plate structure.
In the first region S1, when the area of the first heat-conducting portion 117 of the heat-conducting plate structure 11 covered by the first heat-insulating portion 125 of the heat-insulating plate structure 12 is more than the area of the first heat-conducting portion 125, the temperature of the surface of the housing 22 above the heat-generating element 21 is increased less. The heat generated by the heating element 21 is transmitted to the casing 22 through the heat conducting plate structure 11, and during the transmission process, the heat is transmitted to the condensing end 115 along the heat conducting plate structure 11 by the blocking of the heat insulating plate structure 12, and the temperature of the heat is gradually released during the transmission process, so the temperature finally transmitted to the casing surface of the casing 22 is greatly reduced.
In one embodiment, in the second region S2, the area of the second heat insulating portion 126 of the heat shield structure 12 above the heat absorbing end 114 and the condensing end 115 regions (i.e., the second heat conducting portion 118) of the heat conductive plate structure 11 is approximately equal to the area of the second heat conducting portion 118 of the heat conductive plate structure 11. In practical applications, the ratio of the area of the second heat insulation portion 126 to the area of the second heat conducting portion 118 is 0.9-1.1. As shown in fig. 3, since the heat insulation plate structure 12 in the embodiment of fig. 3 has a small area, the area that can be covered on the heat conduction plate structure 11 to form the heat insulation region 13 is also small. When high-density heat energy starts to be transferred from the heat source region 116 located at the heat absorbing end 114 to the condensing end 115, the heat energy is transferred to the casing 22 without being sufficiently cooled due to the small area of the heat insulating region 13, so that the temperature sensed by the casing surface of the casing 22 includes a relatively high-temperature grid line region and a relatively low-temperature transverse line region. In practical applications, when the area of the second heat insulation portion 126 is similar to the area of the second heat conduction portion 118, not only a moderate heat dissipation can be achieved, but also the temperature of the surface of the casing 22 is not greatly increased.
However, as shown in FIG. 4, in the embodiment of FIG. 4, the area of the heat insulation plate structure 12 is enlarged to increase the area of the heat insulation region 13. When high-density heat energy starts to be transferred from the heat source region 116 located at the heat absorbing end 114 to the condensing end 115, since the area of the heat insulating region 13 is large, the heat conducting plate structure 11 can be in contact with the casing 22 under the condition that the residual heat energy from the heat source region 116 is small, so that the temperature sensed by the casing surface of the casing 22 only includes the horizontal line region with a low temperature, thereby achieving the effect of reducing the surface temperature of the casing 22 above the heat source region. In a preferred embodiment, the insulation region 13 comprises a first structural sheet 111 extending from the suction end 114 to the condensation end 115 over an area of the first structural sheet 111 at least greater than 2/3.
Referring to fig. 5, 6 and 7, fig. 5 is a schematic diagram illustrating an arrangement of a thin thermal management component 1 according to an embodiment of the invention, fig. 6 is a schematic diagram illustrating an arrangement of a thin thermal management component 1 according to another embodiment of the invention, and fig. 7 is a schematic diagram illustrating an arrangement of a thin thermal management component 1 according to still another embodiment of the invention. The technical features of the thin thermal management element 1 in the embodiments of fig. 5, 6 and 7 that are the same as those in the previous embodiments will not be described again, and the difference is the shape and size of the thin thermal management element 1. It should be understood that, since the placement positions of the heating elements 21 of different mobile electronic devices 2 are different and the electronic components of the mobile electronic devices 2 are complicated, in order to avoid design conflicts, the size of the space in the housing 22 where the thin thermal management assembly 1 with the heat conducting and insulating functions of the present invention can be installed is also different. Therefore, the shape and relative position and size of the components are only provided as references that can be designed by one skilled in the art, and the thin thermal management component 1 can be rectangular as shown in fig. 5, long strip as shown in fig. 6, and ladder as shown in fig. 7, but not limited thereto.
In order to improve the heat conduction effect of the thin thermal management assembly 1 of the present invention, the heat conduction plate 11 further includes a capillary structure layer having a capillary structure, which is located on the inner surface of the second structure sheet 112 in the first vacuum cavity 113, so that the working fluid can flow from the condensation end 115 to the heat absorption end 114 by the capillary action of the capillary structure layer, and the working fluid is vaporized to release latent heat, so as to rapidly transfer heat energy to the condensation end 115 through the air channel of the first vacuum cavity 113, thereby achieving the purpose of rapid heat conduction and heat dissipation. In one embodiment, the thickness of the capillary structure layer is not greater than 0.15 mm. In practical application, the thickness of the capillary structure layer is not more than 100 micrometers (um).
In one embodiment, in order to make the second structural surface 112 of the thin thermal management assembly 1 of the present invention have better thermal contact with the heat generating element 21, a layer of thermal conductive pad 14 or thermal conductive paste is further provided, please refer to fig. 2, which is disposed between the heat generating element 21 and the second structural sheet 112.
Referring again to fig. 2, since the heat insulation plate structure 12 includes the second vacuum chamber 123, in order to prevent the second vacuum chamber 123 from being deformed or attached by the atmospheric pressure, the heat insulation plate structure 12 further includes a plurality of high-strength supports 124 with low thermal conductivity. The support 124 is formed in the second vacuum chamber 123 for supporting the third structural sheet 121 and the fourth structural sheet 122, so as to prevent the second vacuum chamber 123 between the third structural sheet 121 and the fourth structural sheet 122 from being deformed or attached by atmospheric pressure. In practical applications, the thermal conductivity of the support 124 is not greater than 0.5W/mk. In practical applications, the supporting members 124 are in a column structure.
In one embodiment, the thin thermal management component 1 is disposed between the heat generating element 21 and the housing 22. The heat absorbing end 114 of the outer surface of the second structural sheet 112 of the heat conducting plate structure 11 is attached to the heating element 21, and the third structural sheet 121 of the heat insulating plate structure 12 and the condensing end 115 of the first structural sheet 111 of the heat conducting plate structure 11 are attached to the inner surface of the casing 22. Here, the adhesion means direct adhesion or indirect adhesion through a thin graphite sheet or a thermal conductive paste. In an embodiment, the third structural sheet 121 and the fourth structural sheet 122 of the heat shield structure 12 are metal sheets with surfaces having solderability, and the thermal conductivity of the third structural sheet 121 and the fourth structural sheet 122 is not greater than 20W/mk, so as to reduce the speed of transferring heat energy to the X-Y axis plane. The third structural piece 121 and the fourth structural piece 122 can be connected together by a solder wall in an airtight manner, or can be glued together to form an airtight wall structure, so that a second vacuum chamber 123 is formed between the third structural piece 121 and the fourth structural piece 122 and the solder wall or the glue.
In one embodiment, the third structural piece 121 and the fourth structural piece 122 of the heat shield structure 12 are made of stainless steel and plated with a tin layer to form a solderable surface.
In summary, the thin thermal management assembly of the present invention is applied to a thin mobile electronic device to manage the thermal conduction behavior thereof, and particularly applied to a 5G smart phone. The invention has the following advantages:
1. the heat absorbing end 114 of the outer surface of the second structural sheet 112 of the heat conducting plate structure 11 of the thin heat management assembly 1 of the invention is attached to the surface of the microprocessor element which generates heat, the liquid working fluid in the capillary structure is boiled to be gaseous in the vacuum environment to release latent heat, and then the vapor is quickly taken away to the condensation area by the air passage to be conducted to the shell, so that the purposes of quick heat conduction and heat dissipation are achieved, and the high-density heat energy of the original microprocessor element cannot be quickly accumulated to be overheated;
2. the thin thermal management assembly 1 of the present invention is disposed between the heat generating element 21 and the housing 22, and the efficiency of conducting high-density thermal energy toward the Z-axis direction of the housing is blocked by the second vacuum cavity 123 of the heat insulating plate structure 12 located above the Z-axis insulator region 13 of the heat conducting plate structure 11 and the support 124 with low thermal conductivity;
3. because the thin heat management component 1 of the invention has the transverse axis (X-Y axis) for fast heat conduction of high-density heat energy and the longitudinal axis (Z axis) for effectively blocking heat energy, the temperature rise of the surface of the shell in a hot spot area can be delayed, the temperature gradient of the surface of the shell can be reduced, the starting time of forced frequency reduction of a microprocessor can be further delayed, or the operating efficiency of the microprocessor can be improved under the same temperature of the surface of the shell forced frequency reduction;
4. the total thickness of the thin thermal management component 1 of the invention is not more than 600 micrometers (um), so that the thickness of the mobile electronic device 2 with high power can be reduced, especially for a 5G smart phone, the thin thermal management component 1 of the invention can provide a challenge for facing thermal management in a thin design for manufacturers.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.
Claims (10)
1. A thin thermal management assembly for managing the thermal conduction behavior of a heat generating component within a housing of a mobile electronic device, comprising:
a heat conducting plate structure having a first vacuum cavity containing a capillary structure, a working fluid and an air channel, the heat conducting plate structure further having a heat conducting surface having a heat source region coupled to the heating element; and
a heat insulation plate structure arranged between the heat conduction plate structure and the casing, wherein the heat insulation plate structure covers a part of the heat conduction plate structure, extends outwards from a part close to the heating element relative to the heat conduction plate structure, and is provided with;
a second vacuum chamber; and
a plurality of supports arranged in the second vacuum cavity, wherein the heat conduction coefficients of the plurality of supports are less than 0.5W/mk;
the heat insulation plate structure is used for preventing high-density heat energy generated by the heating element from being transmitted to a shell surface of the shell through the heat conduction plate structure towards the direction of the heat insulation plate structure, and the total thickness of the thin heat management assembly is not more than 600 micrometers (um).
2. The thin thermal management assembly of claim 1, further comprising a first region comprising a first thermally insulating portion of the thermally insulating plate structure proximate the heating element and a first thermally conductive portion of the thermally conductive plate structure, wherein the first thermally insulating portion has an area greater than an area of the first thermally conductive plate portion.
3. The thin thermal management assembly of claim 1, wherein the thermally conductive plate structure further comprises a heat sink end and a condenser end, the heat sink end being located in the heat source region and the condenser end being remote from the heat source region; the thin heat management assembly further includes a second region including a second heat conducting portion of the heat conducting plate structure between the heat absorbing end and the condensing end, and a second heat insulating portion of the heat insulating plate structure opposite to the second heat conducting portion, wherein an area ratio of an area of the second heat insulating portion to an area of the second heat conducting portion is 0.9 to 1.1.
4. The thin thermal management assembly of claim 1, further comprising a third area comprising a third heat conducting portion of the plate structure, wherein the third heat conducting portion is not covered by the heat shield structure.
5. The thin thermal management assembly of claim 1, wherein the heat shield structure is attached to the housing, and the thermally conductive plate structure has a condensation end, the condensation end being remote from the heat generating component, and the condensation end also being attached to the housing.
6. The thin thermal management assembly of claim 1, wherein the area of the thermal plate structure covered by the thermal plate structure is a Z-axis thermal insulation region, the thermal plate structure having a heat absorbing end and a condensing end, the heat absorbing end being proximate to the heating element and the condensing end being distal from the heating element, the Z-axis thermal insulation region comprising the thermal plate structure extending at least 50% of the area of the thermal plate structure from the heat absorbing end to the condensing end such that the thermal plate structure blocks the high density thermal energy generated by the heating element from being conducted directly to the housing surface through the thermal plate structure.
7. The thin thermal management assembly of claim 1, wherein the thermal plate structure is a vapor plate element structure or a flat heat pipe element structure.
8. The thin heat management assembly of claim 1, wherein the heat conducting plate structure and the heat shield plate structure are each two separate elements.
9. The thin heat management assembly of claim 1, wherein the heat conducting plate structure and the heat shield plate structure are combined to form a single element.
10. The thin thermal management assembly of claim 9, wherein the thermal plate structure and the thermal baffle structure share a structural panel.
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|---|---|---|---|
| CN201911376764.XA CN113056157B (en) | 2019-12-27 | 2019-12-27 | Thin thermal management assembly |
| TW109140554A TWI786469B (en) | 2019-12-27 | 2020-11-19 | Thin thermal management module |
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| CN201911376764.XA CN113056157B (en) | 2019-12-27 | 2019-12-27 | Thin thermal management assembly |
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| CN113056157B CN113056157B (en) | 2022-08-26 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI786469B (en) | 2022-12-11 |
| CN113056157B (en) | 2022-08-26 |
| TW202124902A (en) | 2021-07-01 |
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