TWI694324B - A thermal management system for a thin electronics device - Google Patents

Abstract

A thermal management system for a thin electronics device is for managing the high density thermal energy of the microprocessor component in the thin electronic device. The system includes a casing having an inner surface, a flat micro heat pipe thermally contacted to the electronic component, and a vacuum insulation sheet component configured between the inner surface of the casing and the flat micro heat pipe and thermally contacted to the flat micro heat pipe. The vacuum insulation sheet component includes a ring-shaped welding material wall, a first sheet material and a second sheet material. By having collective operation of the casing and the flat micro heat pipe and the vacuum insulation sheet, the thermal management system of the present invention reduces both temperatures of microprocessor and skin of casing in the thin electronic device through the functions of heat liberation, heat insulation, heat conduction and heat dissipation.

Description

Thermal management system of thin electronic device

The invention relates to a thermal management system for a thin electronic device, which is used to manage a high-density thermal energy generated by a microprocessor element of a thin electronic device, so as to have heat release and resistance to the high-density thermal energy Heat (Heat Insulation), heat conduction (Heat Conduction), heat dissipation (Heat Dissipation) and other functions.

The development trend of electronic and handheld communication device products continues to be thinner and more functional, and people have increasingly higher requirements on the operation speed and function of the microprocessor in the device. Microprocessor is the core component of electronic and communication products. It is easy to generate heat under high-speed operation and become the main heating element of electronic devices. If the heat is not dissipated immediately, the heat energy will accumulate and generate local hot spots (Hot Spot) . Electronic and handheld communication systems are designed to generate thermal energy for the microprocessor. If there is no good thermal management system, the microprocessor will often overheat. At the same time, it will quickly cause the surface temperature of the casing above the Z axis to overheat and exceed the machine. The design tolerance of the surface temperature of the housing, which in turn initiates the frequency reduction of the microprocessor, thus fails to exert the proper function of the microprocessor in the design. If the heat generated by the microprocessor is not properly managed, it will also affect the life and reliability of the entire electronic device system. Therefore, electronic products need excellent thermal management design, especially like smartphones and tablet PCs. Thin electronic devices require excellent thermal management capabilities. At present, the effective solution for managing the hot spot generated by the microprocessor of the smart phone is to contact the heat source with one side of the graphite sheet or flattened micro heat pipe (Flatten Micro Heat Pipe) or Vapor Chamber. One side contacts the casing of the electronic device. It is hoped that the high-density thermal energy generated by the microprocessor can be quickly transmitted and distributed to the chassis in the X-Y axis direction through the graphite sheet, micro heat pipe or heat spreading sheet, thereby radiating the heat into the air to achieve the purpose of heat dissipation.

Because some electronic or communication products, such as smart phones, are designed to be very thin and light, the thickness space between the surface of the microprocessor and the surface of the case is often less than 1.5mm. Therefore, one side of the end of the flat micro heat pipe contacts the hot spot of the microprocessor, and the other side will directly contact the inner surface of the chassis. The high temperature generated by the microprocessor is easily transmitted directly from the Z axis direction to the chassis to cause the chassis The surface temperature is too high. In the design of general smart phones, the monitoring of the surface temperature of the case is a standard function. Once the surface temperature of the case exceeds the set standard, the phone will automatically start the frequency reduction process of the microprocessor to reduce the temperature, thereby avoiding the surface of the phone case Overheating affects consumers' handheld experience. However, the temperature value (45°C) that can be tolerated on the surface of the mobile phone casing is much lower than the temperature value that the microprocessor component itself can tolerate. The temperature threshold on the surface of the mobile phone casing restricts the functions that the microprocessor can play in design. Therefore, in addition to efficiently dissipating and dissipating the high-density thermal energy generated by microprocessors in thin and light electronic and communication devices, how to achieve high power in the limited thickness space at the local position where the microprocessor generates hot spots Efficient heat insulation to avoid excessive surface temperature of the cabinet above the Z axis has also become an urgent problem to be solved. Especially when the smartphone communication is moved from 4G to 5G generation, the power consumption of the system will be doubled, and the thermal management of the high-density thermal energy generated by the microprocessor will be more severe. An effective method for heat liberation (Heat Liberation) and heat resistance (Heat Insulation) , Heat conduction (Heat Conduction), heat dissipation (Heat Dissipation) and other functions The management system will become an important issue that must be solved in the design of 5G smartphones.

In view of this, the present invention proposes a thermal management system for thin devices to manage the high-density thermal energy generated by the microprocessor elements of the thin electronic devices, so that they have functions of heat dissipation, heat resistance, heat conduction, and heat dissipation to avoid The problem of excessively high temperature of the microprocessor element of the thin electronic device and the surface temperature of the casing.

The thermal management system of a thin electronic device according to the present invention is used to manage a high-density thermal energy generated by a microprocessor element of a thin electronic device, which includes a casing, a flat micro heat pipe and a sheet-shaped vacuum partition Thermal element. The casing has an inner surface. The flat micro heat pipe is in thermal contact with the microprocessor element. The sheet vacuum heat insulation element is arranged between the inner surface of the casing and the flat heat pipe and is in thermal contact with the heat absorbing end of the flat micro heat pipe. The sheet vacuum heat insulation element includes a ring-shaped welding material wall and a first A sheet material, a second sheet material opposite to one of the first sheet materials, and a plurality of support columns, the first sheet material and the second sheet material are formed by airtightly welding each other by a ring-shaped welding material wall An enclosed space, which is a vacuum state below atmospheric pressure.

In a specific embodiment, the inner surface of the casing further has a groove corresponding to the position of the electronic component, and the sheet-shaped vacuum heat insulation element is disposed in the groove.

Among them, the thermal management system of the thin electronic device further includes a thin display screen disposed between the groove on the inner surface of the casing and the sheet-shaped vacuum heat insulation element, and the material of the casing is a transparent glass material.

The thermal management system of the thin electronic device may further include a graphite sheet attached to the inner surface of the casing.

In a specific embodiment, the graphite sheet has a first graphite surface and a second graphite surface opposite to the first graphite surface, the first graphite surface is in thermal contact with the inner surface of the casing, and the second graphite surface is partially hot Contact the condensing end of the flat micro heat pipe.

In a specific embodiment, the graphite sheet has a first graphite surface and a second graphite surface opposite to the first graphite surface, the first graphite surface is in thermal contact with the inner surface of the casing and the flat micro heat pipe Condensation side.

In a specific embodiment, the graphite sheet has a first graphite surface and a second graphite surface opposite to the first graphite surface, the first graphite surface is in thermal contact with the inner surface of the casing and in thermal contact with the sheet vacuum insulation The second sheet material of the element, and the second graphite surface is in thermal contact with the heat-absorbing end of the flat micro-heat pipe.

In a specific embodiment, the graphite sheet has a first graphite surface and a second graphite surface opposite to the first graphite surface, the first graphite surface thermally contacts the inner surface of the casing, and the second graphite surface thermally contacts the The first sheet material of the sheet vacuum heat insulation element.

In a specific embodiment, the graphite sheet has a first graphite surface and a second graphite surface opposite to the first graphite surface, the first graphite surface is in thermal contact with the flat micro heat pipe, and the second graphite surface is in thermal contact with the micro Processor element.

The thin electronic device includes a circuit board, a middle frame structure and a display screen. The microprocessor component is located on the circuit board facing the direction of the chassis, and the relative positions in the thin electronic device are thermal management system, microprocessor component, Circuit board, middle frame structure, display screen.

In summary, the thermal management system of a thin electronic device of the present invention achieves the heat dissipation, heat resistance, and heat conduction of the hot spot through the cooperative operation of flat micro heat pipes, sheet vacuum heat insulation elements, graphite sheets, and casings. And heat dissipation and other functions, manage the details of thin electronic devices The high-density thermal energy generated by the processor element prevents the rapid rise of the temperature of the microprocessor element and the surface of the chassis in the thin electronic device.

1‧‧‧thin electronic device

11‧‧‧ thermal management system

111, 111’‧‧‧Chassis

1112, 1112’‧‧‧ inner surface

1115, 1115’‧‧‧groove

114‧‧‧flat micro heat pipe

116, 116’‧‧‧ Sheet vacuum heat insulation elements

1161‧‧‧First sheet material

1162‧‧‧Second sheet material

1165‧‧‧Welding material wall

1166‧‧‧Confined space

117‧‧‧Slim display

118‧‧‧Graphite

1181‧‧‧The first graphite surface

1182‧‧‧Second graphite surface

12‧‧‧Microprocessor components

13‧‧‧ circuit board

14‧‧‧Medium frame structure

15‧‧‧Display

FIG. 1 is a schematic sectional view of a thermal management system according to an embodiment of the invention.

FIG. 2 is a schematic diagram illustrating a simple structure of a thin electronic device with a case removed according to the embodiment of FIG. 1.

FIG. 3a is a schematic structural diagram of a sheet-shaped vacuum heat insulating element according to an embodiment of the invention.

FIG. 3b is a cross-sectional view according to line A-A in FIG. 3a.

FIG. 3c is a cross-sectional view according to line B-B in FIG. 3a.

FIG. 4a is a schematic cross-sectional view of a casing according to an embodiment of the invention.

FIG. 4b is a schematic cross-sectional structural view showing a combination of a casing and a sheet-shaped vacuum heat insulation element according to an embodiment of the invention.

FIG. 4c is a schematic cross-sectional structure diagram of a combination of a casing and a sheet-shaped vacuum heat insulation element according to another embodiment of the present invention.

FIG. 5a is a schematic diagram illustrating a combined cross-sectional structure of a cabinet, a sheet-shaped vacuum heat insulating element, and a thin display screen according to an embodiment of the present invention.

FIG. 5b is a simplified schematic diagram of a thin electronic device according to an embodiment of the present invention from a housing perspective.

6 is a schematic cross-sectional structure diagram of a thermal management system according to an embodiment of the present invention Figure.

7 is a schematic cross-sectional view of a thermal management system according to another embodiment of the invention.

8a is a simplified schematic diagram showing the internal structure of a thin electronic device according to an embodiment of the invention.

FIG. 8b is a cross-sectional view according to line C-C in FIG. 8a.

9a is a simplified schematic diagram showing the internal structure of a thin electronic device according to an embodiment of the invention.

9b is a cross-sectional view according to the line D-D in FIG. 9a.

10 is a schematic cross-sectional view of a thermal management system according to an embodiment of the invention.

11 is a schematic diagram showing a simple structure of a thin electronic device with a case removed according to an embodiment of the invention.

12a is a simplified schematic diagram of an electronic device according to an embodiment of the invention.

FIG. 12b is a schematic diagram showing a simple cross-sectional structure of the thin electronic device according to the line segment E-E in FIG. 12a.

In order to make the advantages, spirit and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with specific embodiments and with reference to the accompanying drawings. It is worth noting that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the devices in the figure are only used to express their relative positions and are not drawn according to their actual proportions.

Please refer to Figure 1, Figure 2, Figure 3a, Figure 3b, and Figure 3c. FIG. 1 is a schematic cross-sectional view of a thermal management system 11 according to an embodiment of the invention. FIG. 2 is a schematic diagram illustrating a simple structure of the thin electronic device with the casing 111 removed according to the embodiment of FIG. 1. FIG. 3a is a schematic structural diagram of a sheet-shaped vacuum heat insulating element 116 according to an embodiment of the present invention. FIG. 3b is a cross-sectional view according to line A-A in FIG. 3a. FIG. 3c is a cross-sectional view according to line B-B in FIG. 3a. A thermal management system 11 for a thin electronic device according to an embodiment of the present invention is used to manage a high-density thermal energy generated by a microprocessor element 12 of a thin electronic device, which includes a casing 111 and a flat micro-heat The duct 114 and the sheet-shaped vacuum insulation element 116. The casing 111 has an inner surface 1112. The flat micro heat pipe 114 has a heat absorption end 1141 and a condensation end 1142, and the heat absorption end 1141 is in thermal contact with the microprocessor element 12. The sheet-shaped vacuum heat insulating element 116 is disposed between the inner surface 1112 and the flat micro heat pipe 114 and is in thermal contact with the heat absorbing end 1141 of the flat micro heat pipe 114. The sheet vacuum heat insulating element 116 includes a ring-shaped welding material wall 1165 , A first sheet material 1161 and a second sheet material 1162 opposite to the first sheet material 1161, the first sheet material 1161 and the second sheet material 1162 are airtight by a ring-shaped welding material wall 1165 The ground is welded to each other to form a closed space 1166. The closed space 1166 is in a vacuum state below atmospheric pressure.

In practical applications, the thin electronic device may be a smart phone, a tablet computer or a wearable device, and the microprocessor element 12 may be a central processing unit (CPU) or graphics processor (GPU) or other heat-generating components. When a user uses a mobile phone or tablet computer, the CPU generates heat energy due to the operation. At this time, the flat micro heat pipe 114 quickly transfers this heat energy from the Evaporator to the condenser and dissipates heat through the chassis. In order to prevent the thermal energy from continuously accumulating at the position of the CPU and forming a hot spot, which causes the CPU to overheat, the local temperature of the CPU 111 on the upper surface of the upper case of the Z axis is too high. However, the longer a smartphone or tablet is used, the There will be more and more heat energy generated. However, if the heat transfer and heat dissipation capacity of the flat micro heat pipe 114 and the casing 111 can not keep up with the heat energy accumulated by the CPU, the temperature of the CPU will become higher and higher, which also causes the upper end of the Z axis of the CPU The local temperature on the surface of the casing 111 is also relatively increased. In this specific embodiment, the first sheet material 1161 of the sheet vacuum heat insulating element 116 is in contact with the inner surface 1112 and the second sheet material 1162 is in thermal contact with the heat absorbing end of the flat micro heat pipe 114, while the sheet vacuum The first sheet material 1161 and the second sheet material 1162 of the heat element 116 may be the same metal material, for example, a stainless steel sheet coated with a solderable material on the surface. The soldering material may be a soldering solder alloy or a brazing copper alloy material. The thermal conductivity of the general solder material is about 60W/mk, and the solder material of the ring-shaped solder material wall 1165 can be tin-lead alloy (Sn/Pb) or tin-silver-copper alloy (Sn/Ag/Cu) or other solder materials . In practical applications, since the welding material wall 1165 is only annularly joined to the first sheet material 1161 and the second sheet material 1162, the enclosed space 1166 in the annular welding material wall 1165 is in a vacuum state, while the CPU and flat type The heat-absorbing ends of the heat pipes 114 are located below the enclosed space 1166, and the vacuum state of the enclosed space 1166 blocks most of the heat conduction and convection in the Z-axis direction of the cabinet. Compared with the copper material of the flat heat pipe 114 and the ring-shaped welding material wall 1165, stainless steel is a metal with poor thermal conductivity, and its thermal conductivity is less than 20W/mk. The high-density heat energy generated by the CPU is conducted away from the heat-absorbing end 1141 by the flat micro-heat pipe 114, the second sheet material 1162 receives part of the heat energy from the flat micro-heat pipe 114, and then uses the XY of the second sheet material 1162 Conduction in the direction of the axis plane. Since the vacuum enclosed space 1166 isolates heat energy from the second sheet material 1162 to the first sheet material 1161, and the support column in the enclosed space 1166 of the sheet vacuum heat insulation element 116 can be made of a material with high strength and low thermal conductivity, The heat conduction effect for the Z axis can be ignored. Therefore, the sheet-shaped vacuum heat insulation element 116 can block heat conduction to the Z-axis casing 111 for the CPU, and thus prevent the surface temperature of the casing at the hot spot from reaching the CPU frequency down setting too quickly value.

Please refer to Figures 4a, 4b and 4c. FIG. 4a is a schematic cross-sectional structure diagram of a casing 111 according to an embodiment of the invention. FIG. 4b is a schematic cross-sectional structural diagram of a combination of a casing 111 and a sheet-shaped vacuum insulation element 116 according to an embodiment of the present invention. FIG. 4c is a schematic cross-sectional structural diagram of a combination of a casing 111 and a sheet-shaped vacuum heat insulating element 116 according to another embodiment of the present invention. In a specific embodiment, the inner surface 1112 of the casing 111 further has a groove 1115 corresponding to the position of the center of the microprocessor element, and the sheet-shaped vacuum heat insulating element 116 is disposed in the groove 1115. In practical applications, the depth of the groove 1115 of the casing 111 can be determined according to the thickness of the sheet-shaped vacuum heat insulating element 116. In this specific embodiment, the depth of the groove 1115 of the casing 111 is the same as the thickness of the sheet-shaped vacuum insulation element 116 (as shown in FIG. 4b), for example: the total thickness of the sheet-shaped vacuum insulation element 116 is 0.15mm Between 0.2 and 0.2 mm, the vacuum thickness of the enclosed space 1166 may be between 0.05 mm and 0.1 mm, and the thickness of the groove is also between 0.15 mm and 0.2 mm. At this time, the sheet-shaped vacuum insulation element 116 can be completely embedded in the groove 1115 of the casing 111, and the second sheet material 1162 of the sheet-shaped vacuum insulation element 116 is on the same plane as the inner surface 1112 of the casing 111. When the microprocessor element 12 generates high-density thermal energy, the flat micro-heat pipes that are in thermal contact with the microprocessor element 12 perform heat removal and heat conduction, and the sheet-shaped vacuum heat insulating element 116 can block the heat energy generated by the microprocessor element 12 by The flat micro heat pipe is conducted from the Z-axis direction to the casing 111 and its surface. Therefore, the structure of this specific embodiment can not only achieve the effect of heat resistance, but also save system space. In another specific embodiment, the depth of the groove 1115' of the casing 111' may be slightly smaller than the thickness of the sheet-shaped vacuum insulation element 116' (as shown in FIG. 3c), for example: the sheet-shaped vacuum insulation element 116' The thickness is 0.2 mm, and the thickness of the groove 1115' is 0.18 mm. The functions and efficiencies of the unit of this specific embodiment are substantially the same as the functions and efficiencies of the corresponding unit of the foregoing specific embodiment, and will not be repeated here.

The thermal contact described in this specification includes direct contact or indirect contact. Direct contact means that an object containing higher thermal energy is in direct contact with an object containing lower thermal energy, and heat conduction is conducted between the two; while indirect contact is between an object containing higher thermal energy and an object containing lower thermal energy. Contains a medium and conducts heat through the medium. The medium may be a very thin thermally conductive element, non-thermally conductive element, or bonding element, such as: graphite sheet, graphite thin sheet, thermal paste, thermal paste, or adhesive.

Please refer to Figure 5a and Figure 5b. FIG. 5a is a schematic cross-sectional structural view of a casing 111, a sheet-shaped vacuum heat insulating element 116, and a thin display screen 117 according to an embodiment of the present invention. FIG. 5b is a simplified schematic view of the thin electronic device 1 according to an embodiment of the present invention from the perspective of the casing 111. FIG. In a specific embodiment, the thermal management system of the thin electronic device of the present invention further includes a thin display screen 117 disposed between the groove 1115 and the sheet-shaped vacuum insulation element 116, and the material of the casing 111 is a transparent or Translucent glass. In practical applications, when the material of the casing 111 is selected to be glass due to design requirements, the thin electronic device covered by the casing 111 may expose internal components to the outside of the casing due to the transparency of the glass. Therefore, for the beauty of the product, a layer of opaque color material is sprayed on the inner surface 1112 of the casing 111. Since any groove is dug on the inner surface 1112 of the casing 111, even if any layer of opaque color material is sprayed, the groove pattern will still be seen on the outer surface of the casing 111, which affects the appearance of the casing 111. Therefore, in this specific embodiment, a thin display screen 117 is provided between the recess 1115 of the casing 111 and the sheet-shaped vacuum heat insulating element 116 to increase the appearance. In practical applications, the thin display 117 may be a clock display (as shown in FIG. 5b) or a case back display that can display simple information according to user needs. Therefore, as viewed from the outer surface of the cabinet 111, the pattern of the grooves 1115, 1115' of the sheet-shaped vacuum heat insulating element 116 disposed on the inner surface 1112 of the cabinet 111 becomes a display buried in the glass cabinet 111. When the microprocessor component 12 When generating thermal energy, the flat micro heat pipe that is in thermal contact with the microprocessor element 12 conducts heat in the XY axis direction, and the sheet vacuum heat insulation element 116 can block the heat energy generated by the microprocessor element 12 from passing through the flat micro heat pipe 114 toward The Z-axis direction is transmitted to the thin display screen 117 and the cabinet 111. Therefore, the design of the groove 1115 and the thin display screen 117 can increase the function and aesthetics of the product, and also the heat insulation effect of the sheet-shaped vacuum heat insulating element 116 can prevent the heat energy from affecting the function of the thin display screen 117. The OLED thin display screens currently known on the market can reach a thickness of only 0.01 mm, so the grooves 1115, 1115' in the inner surface 1112 of the housing 111 can make up for the grooves 1115, 1115', causing the glass housing to fail The problem of beauty.

Please refer to Figure 6. FIG. 6 is a schematic cross-sectional view of a thermal management system 11 according to an embodiment of the invention. In a specific embodiment, the thermal management system 11 of the thin electronic device of the present invention further includes a graphite sheet 118 disposed between the microprocessor element 12 and the sheet vacuum heat insulation element 116. The graphite sheet 118 has a first graphite surface 1181 and a second graphite surface 1182 opposite to the first graphite surface 1181. The first graphite surface 1181 is in thermal contact with the sheet-shaped vacuum heat insulating element 116, and the second graphite surface 1182 is in thermal contact with the flat micro heat pipe 114. Further, a part of the first graphite surface 1181 is in thermal contact with the inner surface 1112, and another part of the first graphite surface 1181 is in thermal contact with the second sheet material 1162 of the sheet vacuum heat insulating element 116. In practical applications, when the microprocessor element 12 generates thermal energy, the flat micro heat pipe 114 thermally contacting the microprocessor element 12 conducts X-Y heat conduction. Due to the limited space of the thin electronic device, the width of the flat micro heat pipe 114 is also limited. Therefore, the degree and range of heat conduction and heat dissipation of the X-Y axis can be enhanced by the bonding of the graphite sheet 118 and the inner surface 1112 of the casing 111. The graphite sheet 118 has a good thermal conductivity (approximately 1500 W/mk) in the planar direction (XY axis direction). When the second graphite surface 1182 of the graphite sheet 118 thermally contacts the flat micro heat pipe 114, the flat micro heat pipe 114 Thermal energy is transferred to the graphite sheet 118. At this time, the thermal energy will Quickly conduct and disperse to the entire graphite sheet 118 and its attached casing 111. Therefore, due to the rapid thermal conduction effect of the graphite sheet 118, the thermal energy of the area where the second graphite surface 1182 thermally contacts the flat micro heat pipe 114 is conducted away To avoid excessive temperature in a single area. Furthermore, the range in which the graphite sheet 118 conducts heat energy to the casing 111 is also more dispersed, so the graphite sheet 118 can dissipate heat more efficiently.

Please refer to Figure 7. 7 is a schematic cross-sectional view of a thermal management system 11 according to another embodiment of the invention. In a specific embodiment, the graphite sheet 118 also has a first graphite surface 1181 and a second graphite surface 1182 opposite to the first graphite surface 1181. The first graphite surface 1181 is in thermal contact with the flat micro heat pipe 114, and the second graphite surface 1182 is in thermal contact with the microprocessor element 12. In practical applications, when the microprocessor element 12 generates thermal energy, the second graphite surface 1182 that thermally contacts the graphite sheet 118 of the microprocessor element 12 disperses the thermal energy to the entire graphite sheet 118 and the attached casing 111. Then, the flat micro-heat pipe 114 and the sheet-shaped vacuum heat insulating element 116 are used to reduce the local high temperature of the casing 111 through the functions of heat conduction and heat resistance. The functions and efficiencies of the unit of this specific embodiment are substantially the same as the functions and efficiencies of the corresponding unit of the foregoing specific embodiment, and will not be repeated here.

Please refer to FIG. 8a and FIG. 8b. 8a is a simplified schematic diagram showing the internal structure of a thin electronic device according to an embodiment of the invention. FIG. 8b is a cross-sectional view according to line C-C in FIG. 8a. In a specific embodiment, the graphite sheet 118 also has a first graphite surface 1181 and a second graphite surface 1182 opposite to the first graphite surface 1181. The first graphite surface 1181 is in thermal contact with the inner surface 1112 of the casing 111, and the second graphite surface 1182 is in thermal contact with the condensation end 1142 of the flat micro heat pipe 114. In practical applications, when the heat generated by the microprocessor element 12 is transferred from the heat-absorbing end 1141 of the flat micro-heat pipe 114 to the condensation end 1142 for heat dissipation, if the microprocessor element 12 is operated for a long time or processing high-efficiency calculations When high-density heat is continuously generated, the flat micro-heat pipe 114 will also Long-term heat conduction increases the temperature, which in turn affects and raises the temperature of the condensing end 1142 of the flat micro-heat pipe 114. Therefore, the high thermal conductivity of the graphite sheet 118 on the XY axis can be quickly dispersed to the inner surface 1112 of the casing 111, Not only can the condensation end 1142 of the flat micro heat pipe 114 be operated for a long time to form another hot spot, but also the heat dissipation speed of the casing 111 can be improved.

Please refer to FIG. 9a and FIG. 9b. 9a is a simplified schematic diagram showing the internal structure of a thin electronic device according to an embodiment of the invention. 9b is a cross-sectional view according to the line D-D in FIG. 9a. In another embodiment, a graphite sheet 118 also has a first graphite surface 1181 and a second graphite surface 1182 opposite to the first graphite surface 1181. The first graphite surface 1181 is in thermal contact with the inner surface 1112 of the casing and the condensation end 1142 of the flat micro heat pipe 114 at the same time. When the heat generated by the microprocessor element 12 is transferred from the heat absorbing end 1141 of the flat micro heat pipe 114 to the condensation end 1142, the high thermal conductivity of the graphite sheet in the X-Y axis can quickly disperse the heat energy to the inner surface 1112 of the casing 111. The function of the graphite sheet 118 of this specific embodiment is the same as that of the specific embodiments of FIG. 8a and FIG. 8b, and will not be repeated here.

Please refer to Figure 10. 10 is a schematic cross-sectional view of a thermal management system according to an embodiment of the invention. In another embodiment, the graphite sheet 118 also has a first graphite surface 1181 and a second graphite surface 1182 opposite to the first graphite surface 1181. The first graphite surface 1181 is in thermal contact with the inner surface 1112 of the casing 111, and the second graphite surface 1182 is in thermal contact with the first sheet material 1161 of the sheet vacuum heat insulation sheet 116. In practical applications, when the microprocessor element 12 continuously generates high-density heat energy due to long-term operation or processing high-efficiency calculations, the heat-absorbing end 1141 of the flat micro-heat pipe 114 will also contact the microprocessor element 12 for a long time. The high-density heat energy increases the temperature. At this time, the heat conduction effect of the flat micro-heat pipe 114 is gradually poor, resulting in the inability to disperse the high-density heat energy and reducing the performance of the microprocessor element 12. Therefore, in this embodiment, the graphite sheet 118 The heat energy transmitted to the first sheet material 1161 of the sheet-shaped vacuum heat insulating element 116 is quickly dispersed to the inner surface 1112 of the casing 111.

Please refer to Figure 11. FIG. 11 is a schematic diagram showing a simple structure of the thin electronic device 1 with the casing removed according to an embodiment of the invention. In a specific embodiment, the heat-absorbing end 1141 of the flat micro-heat pipe 114 is in thermal contact with the microprocessor element 12 and the sheet-shaped vacuum heat insulating element 116. In practical applications, the flat micro heat pipe 114 can have different shapes and sizes according to the structural design of the thin electronic device. In this specific embodiment, the shape of the flat micro heat pipe 114 is as shown in the figure, and the heat absorbing end 1141 of the flat micro heat pipe 114 is located between the microprocessor element 12 and the sheet-shaped vacuum heat insulating element 116. The condensing end 1142 of 114 is away from the microprocessor element 12 and the sheet-shaped vacuum heat insulating element 116. When the microprocessor element 12 generates heat energy, the heat-absorbing end 1141 of the flat micro heat pipe 114 thermally contacting the microprocessor element 12 conducts the heat energy to the condensation end 1142 of the flat micro heat pipe 114. Finally, the heat energy is transferred from the condensation end 1142 to the housing 111 or the frame of the electronic device, etc., and then radiates the heat energy from this to the surrounding air. At this time, the steam generated by the heat energy in the flat micro heat pipe 114 is conducted from the heat absorption end 1141 to the condensation end 1142, and the capillary structure on the inner wall of the flat micro heat pipe 114 transmits the condensed working fluid to the heat absorption end 1141 again. The water located at the heat-absorbing end 1141 again forms water vapor due to the heat energy and conducts to the condensation end 1142. Therefore, after continuous air-water circulation, the flat micro heat pipe 114 achieves the functions of heat liberation (Heat Liberation) and heat conduction (Heat Conduction).

Please refer to FIG. 6 and FIG. 7 again. The graphite sheet 118 may be a graphite thin sheet, and may have any shape on the X-Y plane. In a specific embodiment, the area where the graphite sheet 118 is attached to the thin electronic device may be larger than the area of the heat absorbing end 1141 of the flat micro heat pipe 114. In the specific embodiment of FIG. 6, when the area of the graphite sheet 118 is larger than the area of the heat absorbing end 1141 of the flat micro heat pipe 114 At this time, the graphite sheet 118 is more capable of dispersing the heat energy of the heat absorbing end 1141 of the flat micro heat pipe 114, and then dispersing the heat energy on the casing 111. Therefore, with the rapid heat conduction effect of the graphite sheet 118 in the X-Y axis plane, the temperature of a single area of the casing 111 is prevented from being too high. Similarly, in the specific embodiment of FIG. 7, the graphite sheet 118 first dissipates the thermal energy located in the microprocessor element 12 to reduce the temperature there. Then, the flat micro heat pipe 114 attached to the graphite sheet 118 further conducts heat energy to the casing 111 evenly. Therefore, the temperature of a single area of the casing 111 can be prevented from being too high. In another embodiment, the graphite sheet 118 can be attached to more than one side of the flat micro heat pipe 114. Therefore, the graphite sheet 118 can not only assist the flat micro heat pipe 114 to conduct thermal energy but also disperse the thermal energy.

Please refer to FIG. 12a and FIG. 12b. 12a is a simplified schematic diagram of an electronic device according to an embodiment of the invention. FIG. 12b is a schematic diagram showing a simple cross-sectional structure of the thin electronic device 1 according to the line segment E-E in FIG. 12a. In an embodiment, the thin electronic device 1 further includes a circuit board 13, a middle frame structure 14 and a display screen 15, the microprocessor element 12 is located on the circuit board 13 toward the casing 111, and the thin electronic device The relative position order in 1 is the thermal management system 11, the microprocessor element 12, the circuit board 13, the middle frame structure 14 and the display screen 15. In the conventional technology, in order to solve the problem of rapid conduction of heat energy to the surface of the chassis and the temperature is too high, which causes the CPU to reduce the frequency, the thin heat pipe plate is installed on the middle frame of the mobile phone and the CPU is flipped On the PCB, let the CPU contact the heat sink of the thin heat pipe plate. However, this design makes the thermal energy generated by the CPU is stuffed in the mobile phone, and the battery and other related components must withstand more thermal energy. In practical applications, the thin electronic device 1 is a mobile phone or tablet computer, and the microprocessor element 12 is a CPU or GPU. The performance requirements of today's mobile phones or tablets are getting higher and higher, and the operating temperature of their CPUs has also increased. Therefore, the thin electronic device 1 can reduce the surface temperature of the cabinet by the functions of heat removal, heat resistance, heat conduction and heat dissipation of the thermal management system 11.

Since the volume and thickness of mobile phones or tablets are getting smaller and smaller, the volume of internal components is limited. Therefore, in a specific embodiment, the thickness of the sheet-shaped vacuum heat insulating element 116 is less than 0.3 mm, and the thickness of the flat micro heat pipe 114 is less than 0.5 mm.

In summary, the thermal management system of a thin electronic device of the present invention, through the physical conditions of the thin smartphone, is limited by the case, the flat micro heat pipe and the sheet-shaped vacuum heat insulation element for heat removal, heat resistance and heat conduction With the help of functions such as heat dissipation and graphite sheet materials, the thermal energy generated by the electronic components of the thin electronic device can be managed to reduce the temperature of the thin electronic device. Further, the processor is prevented from being forced to reduce the frequency to ensure that the function of the processor is in an optimal operation.

With the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention can be described more clearly, rather than limiting the scope of the present invention with the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent application of the present invention. Therefore, the scope of the patent application scope of the present invention should be interpreted broadly based on the above description, so that it covers all possible changes and equivalent arrangements.

11‧‧‧ thermal management system

111‧‧‧Chassis

1112‧‧‧Inner surface

114‧‧‧flat micro heat pipe

116‧‧‧Flake Vacuum Insulation Element

12‧‧‧Microprocessor components

Claims (10)

A thermal management system for a thin electronic device for managing a thermal energy generated by a microprocessor element of a thin electronic device, which includes: a casing with an inner surface; a flat micro heat pipe with a heat absorbing end And a condensing end, the heat absorbing end is in thermal contact with the microprocessor element; and a sheet-shaped vacuum heat insulating element is disposed between the inner surface and the heat absorbing end of the flat micro heat pipe and is in thermal contact with the flat type The heat-absorbing end of the micro-heat pipe, the sheet-shaped vacuum insulation element includes a ring-shaped welding material wall, a plurality of support columns, a first sheet-shaped material and a second sheet-shaped material opposite to the first sheet-shaped material , The first sheet material and the second sheet material are hermetically welded to each other by the ring-shaped wall of the welding material to form a closed space, the closed space is in a vacuum state below atmospheric pressure, the supports The column is located between the first sheet material and the second sheet material, and the thickness of the sheet vacuum insulation element is less than 0.3 mm. The thermal management system of a thin electronic device as described in item 1 of the scope of the patent application further includes a graphite sheet having a first graphite surface, and the first graphite surface is at least partially attached to the chassis The inner surface. The thermal management system of a thin electronic device as described in item 2 of the patent application scope, wherein the graphite sheet has a second graphite surface opposite to the first graphite surface, and the second graphite surface is in thermal contact with the flat micro heat pipe The condensing end. The thermal management system of the thin electronic device as described in item 2 of the patent application scope, wherein part of the first graphite surface is in thermal contact with the condensing end of the flat micro heat pipe. The thermal management system of a thin electronic device as described in item 2 of the patent application scope, wherein the graphite sheet has a second graphite surface opposite to the first graphite surface, and a portion of the first graphite surface is in thermal contact with the sheet vacuum The second sheet material of the heat insulating element, and the second graphite surface is in thermal contact with the heat absorbing end of the flat micro heat pipe. A thermal management system for a thin electronic device as described in item 2 of the patent application, wherein the graphite sheet has a second graphite surface opposite to the first graphite sheet, and the second graphite surface is in thermal contact with the sheet-shaped vacuum barrier The first sheet material of the heat element. The thermal management system of a thin electronic device as described in item 2 of the patent application scope, wherein the graphite sheet has a second graphite surface opposite to the first graphite surface, and a portion of the first graphite surface is in thermal contact with the flat micro-heat The catheter, and the second graphite surface is in thermal contact with the microprocessor element. The thermal management system of the thin electronic device as described in item 1 of the patent application scope, wherein the inner surface of the casing further has a groove corresponding to the position of the microprocessor element, and the sheet-shaped vacuum heat insulating element is provided at In the groove. The thermal management system of the thin electronic device as described in item 8 of the patent application scope further includes a thin display screen disposed between the groove and the sheet-shaped vacuum heat insulating element, and the material of the casing is glass. A thermal management system for a thin electronic device as described in item 1 of the patent scope, wherein the thin electronic device further includes a circuit board, a middle frame structure, and a display screen, the microprocessor element is located on the circuit board, and The relative position sequence in the thin electronic device is the thermal management system, the microprocessor element, the circuit board, the middle frame structure and the display screen.

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