CN101622917B - Heat dissipating device using heat pipe - Google Patents
Heat dissipating device using heat pipe Download PDFInfo
- Publication number
- CN101622917B CN101622917B CN200880002583.4A CN200880002583A CN101622917B CN 101622917 B CN101622917 B CN 101622917B CN 200880002583 A CN200880002583 A CN 200880002583A CN 101622917 B CN101622917 B CN 101622917B
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- Prior art keywords
- loop
- heat abstractor
- unit pipes
- heat
- duct member
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- 239000012530 fluid Substances 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 210000005239 tubule Anatomy 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005068 transpiration Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
There is provided a heat dissipating device using a heat pipe. The heat dissipating device includes a plurality of unit pipe loops. Each unit pipe loop includes: a heat absorbing part arranged adjacent to a heat source; and a heat dissipating part which is connected with the heat absorbing part and dissipates heat transferred from the heat absorbing part. A working fluid is to be provided inside the heat absorbing part and the heat dissipating part. The plurality of unit pipe loops being arranged radially with respect to the heat source.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that uses heat pipe.
Background technology
Usually, the electronic component of chipset, power transistor and light-emitting diode (LED) of the CPU of computer (CPU), video card and so on can generate heat at work.When overheated, electronic component can break down or damage.Therefore, need heat abstractor to prevent that electronic component is overheated.
It is overheated that the heat that heat abstractor generates the thermal source of electronic component and so on distributes to prevent thermal source.
In the prior art, disclosed a kind of heat abstractor of heat radiation type.The heat abstractor of this heat radiation type comprises endothermic section and radiating part.It is neighbouring to absorb the heat that generates from thermal source through heat conduction that this endothermic section is located at thermal source.This radiating part is provided with radiating fin with the endothermic section one so that the heat that is absorbed is distributed through heat exchange.
In the heat abstractor of existing heat radiation type with this kind structure, radiating efficiency is by the area of dissipation and the thermal conductivity decision of the distance between endothermic section and the radiating part, radiating fin.
Yet, consider that fin need become more and more littler because of the trend of the integrated and miniaturization of electronic component, the heat abstractor of existing heat radiation type is difficult to make that radiating fin has the surface area of broad.Even the surface area of radiating fin increases, the distance between endothermic section and the radiating part becomes bigger, has so also limited the lifting of radiating efficiency.
In addition, existing heat abstractor should also comprise the fan of high speed rotating with heat radiation, the problems such as noise that produce in the time of can causing power consumption and the fan work of drive fan like this.
In addition, in the existing heat abstractor, consider structural stability and thermal conductivity, be difficult to do the thickness of heat radiating fin thinner, cause manufacturing cost higher thus.
Summary of the invention
Therefore; One aspect of the present invention provides a kind of heat abstractor, no matter but it adopts the heat pipe-type heat exchange mechanism how can guarantee that to improve distance between radiating efficiency endothermic section and the radiating part area of dissipation noiseless or low noise ground dispel the heat and can under the situation of thinner thickness, guarantee higher structural stability.
For reaching above-mentioned purpose, the invention provides a kind of heat abstractor, comprising: a plurality of unit pipes loop, each unit pipes loop comprises: be located near the endothermic section of thermal source; And be connected to said endothermic section and disperse the radiating part of the heat that passes over from said endothermic section, being fed to the working fluid in said endothermic section and the said radiating part, said a plurality of unit pipes loop radially is provided with respect to said thermal source.
The length in each said unit pipes loop is longer than short lines radially.
Said radiating part comprises: first radiating part, and it is connected to said endothermic section and radially is provided with so that its length is longer than said radially short lines; And second radiating part, the outer circle wall that it is connected to said first radiating part and forms each unit pipes loop.
Said radiating part also comprises at least one protuberance between said first radiating part and said second radiating part.
At least one end in each unit pipes loop is connected with adjacent unit pipes loop.
Said heat abstractor also comprises the auxiliary tube loop that is located between the said adjacent cells tube loop and helps heat radiation.
Said heat abstractor also comprises the thermal component that is connected to each unit pipes loop.
Said thermal component comprises the guide part that the heat flow of being distributed is led.
Said heat abstractor also comprises the installing rack that is provided with near said thermal source, and said a plurality of unit pipes loop is installed on the said installing rack.
Said heat abstractor also comprises the retainer that is connected to said installing rack, and said a plurality of unit pipes loop is put between said installing rack and the said retainer.
Said heat abstractor also comprises near said radiating part mounted fan.
Each unit pipes loop comprises first duct member and second duct member that has first end and the second end separately; And the first end of wherein said first duct member is connected to the first end of said second duct member, and the second end of said first duct member is connected to the second end of said second duct member of said adjacent cells tube loop.
A radial expansion in the end of the end of interconnected said first duct member and said second duct member.
Said first duct member is connected through soldering with the end of said duct member.
For other aspects of part of the present invention, a part been described in the description of hereinafter, and some is described for this is conspicuous, perhaps can acquistion from the process of embodiment of the present invention.
The first, heat abstractor of the present invention adopts the heat pipe mechanism of high cooling efficiency, can form multiple size and dimension according to the space around the thermal source by this.
The second, although the heat abstractor material thickness of the present invention hollow tube loop thinner than existing radiating fin, its Stability Analysis of Structures can be guaranteed, and reduces the consumption of material by this.
The 3rd, heat abstractor of the present invention adopts the tube loop that radially is provided with respect to thermal source on a plurality of directions, to dispel the heat, and under the situation of no fan, improves radiating efficiency by this.And, even comprise under the situation of fan, can under the lower situation of rotation speed of the fan, guarantee high cooling efficiency at this heat abstractor, reduce noise by this.
The 4th, in the heat abstractor of the present invention, first duct member and second duct member are provided separately, then they are connected to form the unit pipes loop mutually, increase productive rate by this.
The 5th, heat abstractor of the present invention provides multiple shapes such as spirality, snakelike or other multiple waveform, increases the area of dissipation in unit pipes loop by this.
Description of drawings
In conjunction with the description of referenced drawings execution mode, can more be expressly understood above-mentioned and/or other aspects of the present invention, wherein:
Fig. 1 is the exploded perspective view that the heat abstractor of first embodiment of the invention is shown;
Fig. 2 is the stereogram that the unit pipes loop and the auxiliary tube loop of first embodiment of the invention are shown;
Fig. 3 is unit pipes loop and the plane graph in auxiliary tube loop that illustrates among Fig. 2;
Fig. 4 shows the exploded perspective view according to the heat abstractor of second embodiment of the invention;
Fig. 5 shows the major part according to the heat abstractor of third embodiment of the invention;
Fig. 6 is the cutaway view along the VI-VI line of Fig. 5;
Fig. 7 is the stereogram that illustrates according to the unit pipes loop of fourth embodiment of the invention heat abstractor;
Fig. 8 and 9 shows the stereogram that illustrates according to the major part of fifth embodiment of the invention heat abstractor;
Figure 10 is the stereogram that illustrates according to the heat abstractor of sixth embodiment of the invention;
Figure 11 is the exploded perspective view that illustrates according to the heat abstractor of seventh embodiment of the invention;
Figure 12 is the plane graph that a plurality of unit pipes loop of heat abstractor in the seventh embodiment of the invention is shown; And
Figure 13 shows the unit pipes loop of the heat abstractor of seventh embodiment of the invention.
Embodiment
Existing its example illustrates in the accompanying drawings in detail with reference to embodiments of the invention, and wherein in whole part of explanation, similarly label means similar elements.Hereinafter will be described with reference to the drawings example embodiment of the present invention to explain the present invention
Fig. 1 is the exploded perspective view that the heat abstractor of first example embodiment according to the present invention is shown; Fig. 2 is unit pipes loop and the auxiliary tube loop that the heat abstractor of first example embodiment according to the present invention is shown; And Fig. 3 is unit pipes loop and the plane graph in auxiliary tube loop that illustrates among Fig. 2.
With reference to figure 1～3, the heat abstractor of first example embodiment comprises a plurality of radially contiguous each other unit pipes loops 20 that are provided with according to the present invention.Each unit pipes loop 20 radially is provided with (see figure 1) with respect to thermal source 1.Therefore, the heat that thermal source 1 generates can radially be distributed on a plurality of directions, promotes radiating efficiency by this.
Here, thermal source 1 comprises the electronic components such as chipset, power transistor and LED of CPU, video card.The size and dimension of heat abstractor can be made multiple change according to the type and the shape of thermal source 1.
As shown in Figure 3, each unit pipes loop 20 comprises endothermic section 21 and radiating part 23.As shown in Figure 2, endothermic section 21 provides the working fluid 15 that has bubble 13 with radiating part 23 inside.Endothermic section 21 is provided with to absorb the heat that thermal source 1 generates near thermal source 1.Radiating part 23 from the endothermic section 21 extend to radial structure the outside will be from the endothermic section 21 to transmit the thermal transpiration that comes and go out.
Each unit pipes loop 20 preferably but not necessarily processed by the high thermal conductivity metal of copper, aluminium and so on.Therefore, can conduct to unit pipes loop 20 at a high speed from the heat of thermal source 1, and the volume of its inner bubble 13 can change rapidly.
Each unit pipes loop 20 be shaped as open loop, and can be connected or separate with adjacent unit pipes loop 20.Some of a plurality of unit pipes loop 20 or all can connect mutually.Under all interconnected situation in all unit pipes loops 20, the shape in unit pipes loop 20 can be single open loop or single closed-loop path, under the situation of single open loop, and two end seals that it is relative.
A plurality of unit pipes loop 20 can be divided into two or more sets that carry out independent heat radiation.The unit pipes loop 20 that belongs to each group can connect mutually.
Between adjacent unit pipes loop 20, be provided with the auxiliary tube loop 25 that separates with thermal source 1.Fig. 2 shows three different auxiliary tube loops 25 of length on 20 sides in a unit pipes loop.Radiating efficiency is promoted in the heat radiation that auxiliary tube loop 25 helps between the adjacent unit pipes loop 20 by this.Can make multiple variation to the quantity and the length in auxiliary tube loop 25 according to design demand.
Each tube loop forms the heat pipe that uses hydrodynamic (FDP), the capillary heat pipe that for example vibrates (oscillatingcapillary tube heat pipe).Hereinafter, with reference to the operation principle of figure 2 summaries as the vibration capillary heat pipe of the example of hydrodynamic heat pipe.
As shown in Figure 2, the structure of vibration capillary heat pipe is that the inside of sealing tubule 11 just generates bubble 13 with estimated rate so within it behind the inside that working fluid is provided tubule 11.Through the volumetric expansion and the condensation of bubble 13 and working fluid 15, this heat pipe has the heat transfer mechanism of transmitting latent heat.
Along with the so many nucleate boilings of heat that endothermic section 21 is absorbed, the volumetric expansion of the bubble 13 in the endothermic section 21 take place.At this moment, because tubule 11 keeps uniform internal volume, the bubble shrinkage in the radiating part 23, amount of contraction are the swell increment of the bubble 13 in the endothermic section 21.Therefore, the pressure balance in the tubule 11 is broken, and thus, along with the vibration of working fluid 15 and bubble 13, in tubule 11, produces and flows.Therefore, this heat pipe carries out the latent heat transmission through the variations in temperature that the change in volume by bubble 13 causes, and dispels the heat by this.
Owing to there is not capillary wick, the vibration capillary heat pipe is easier to make.And, to compare with the thermal siphon heat pipe that radiating part must be placed under the endothermic section, the vibration capillary heat pipe has one of the less advantage of the restriction of installing.Moreover the heat transfer method of vibration capillary heat pipe is different with the heat radiation type heat abstractor, and does not have structural limitations, therefore, can have multiple size according to the kind and the shape of thermal source.
With reference to figure 1, also comprise the installing rack 40 and retainer 50 that is used to install a plurality of unit pipes loop 20 according to the heat abstractor of present embodiment.Form mounting groove 41 on the upper surface of installing rack 40, unit pipes loop 20 is coupled in the mounting groove 41.Unit pipes loop 20 can be coupled in the mounting groove 41 and keep its whole shape.Thermal source 1 can be connected to the lower surface of installing rack 40.
As previously mentioned, unit pipes loop 20 can stably fit into the mounting groove 41 of installing rack 40 and the link slot 51 of retainer 50, keeps its complete shape by this.
Between adjacent unit pipes loop 20, be provided with under the situation in auxiliary tube loop 25, auxiliary tube loop 25 is connected to installing rack 40 and retainer 50 in a similar fashion.
Fig. 4 shows the heat abstractor of second example embodiment according to the present invention.
With reference to figure 4, be cylindrical according to the installing rack 140 of present embodiment.The outer peripheral face of installing rack 140 forms mounting groove 141, and unit pipes loop 20 fits into mounting groove 141.Like this, thermal source 1 ' can be connected to the upper surface or the lower surface of installing rack 140.Unit pipes loop 20 shapes in the heat abstractor among Fig. 4 and thermal source 1 ' shape different with the heat abstractor of Fig. 1.That is, can make various changes to the shape of installing rack according to the shape in unit pipes loop and the type and the shape of thermal source.Between adjacent unit pipes loop 20, be provided with under the situation in auxiliary tube loop 25, auxiliary tube loop 25 can be connected to installing rack 140.
Fig. 5 shows the major part according to the heat abstractor of third embodiment of the invention, and Fig. 6 is the cutaway view along the VI-VI line of Fig. 5.
With reference to figure 5 and 6, to compare with previous embodiment, the heat abstractor of present embodiment also comprises the thermal component 30 that is used to dispel the heat.Thermal component 30 is connected to each unit pipes loop 20.Thermal component 30 comprises that each unit pipes loop 20 fits into groove 31 wherein.Each unit pipes loop 20 can be connected with multiple known connected mode with thermal component 30.Thermal component 30 comprises guide part 35.Guide part 35 protrudes on surface of thermal component 30 or opposite two surfaces, leads with the area of dissipation that increases thermal component 30 and to the hot-fluid of being dispersed.Fig. 6 shows at the guide part 35 of thermal component 30 upper surfaces protrusions as an example.In this case, along " B " direction on the upper surface of thermal component 30 hot-fluid is led.Therefore, the scalable heat dissipation direction is to adapt to the structure of the device that heat abstractor of the present invention is installed.Thermal component 30 can be installed between the unit pipes loop 20, perhaps in the auxiliary tube loop 25.
Fig. 7 is the exploded perspective view that illustrates according to the major part of fourth embodiment of the invention heat abstractor.
With reference to figure 7, each unit pipes loop 120 comprises first duct member 121 and second duct member 125.Relative two ends that first duct member 121 has the shape of downward bending and opening is arranged, i.e. first end 121a and the second end 121b.
More specifically; The first end 121a of first duct member 121 is connected to the first end 125a of same unit pipes loop 120 second duct members 125, and the second end 121b of first duct member 121 is connected to the second end 125b of second duct member 125 of adjacent cells tube loop 120.
When the first end 125a of the first end 121a of first duct member 121 and second duct member 125 is connected and the second end 125b of the second end 121b of first duct member 121 and second duct member 125 when being connected; Through blowing method end 121a and the 121b of the duct member 121 of winning are expanded cooperating the end 125a and the 125b of second duct member 125 on Width, so that sealing and being connected.
The end 125a of second duct member 125 and the outer peripheral face of 125b are provided with adhering part 129.Adhering part 129 for example is a weld-ring.Therefore, connect the respective end of first duct member 121 and second duct member 125 through soldering, to form the unit pipes loop by this.
Fig. 8 and 9 shows the major part of the 5th example embodiment heat abstractor according to the present invention.
With reference to figure 8 and 9, thermal component 130 is connected at least one in first duct member 121 and second duct member 125.Thermal component 130 comprises first parts 131 and second parts 135 that are connected to second duct member 125 that are connected to first duct member 121.
First parts 131 and second parts 135 have groove 131a and 135a separately, and first duct member 121 and second duct member 125 fit into respectively among groove 131a and the 135a.In addition, first parts 131 and second parts 135 comprise guide part (seeing 137 among Fig. 9) respectively, and it increases area of dissipation and the hot-fluid of being dispersed is led.
Because this structure, but the manufacture process in unit pipes loop 120 is carried out in automation, increases productive rate by this.
With reference to Figure 10, compare with previous embodiment, the heat abstractor of the 6th example embodiment also comprises fan 60 according to the present invention.Fan 60 is located near the to quicken the heat radiation of radiating part 23 of radiating part 23, promotes radiating efficiency by this.The existing heat abstractor of the rotating ratio of fan 60 is low, the noise that produces when reducing fan 60 rotations by this, and reduce power consumption.
Figure 11 is the exploded perspective view that the heat abstractor of the 7th example embodiment according to the present invention is shown; Figure 12 is the plane graph that a plurality of unit pipes loop that radially is arranged in the 7th example embodiment in the heat abstractor is shown according to the present invention, and Figure 13 shows the unit pipes loop of the heat abstractor of the present invention's the 7th example embodiment.
With reference to Figure 11～13, comprise a plurality of unit pipes loop 220 that radially is provided with adjacent to each other according to the heat abstractor of this example embodiment.Each unit pipes loop 220 is set to respect to thermal source 1 " radially near.Each unit pipes loop 220 comprises endothermic section 221 and radiating part 223.Radiating part 223 comprises that from the endothermic section 221 extend and first radiating part 224 that approximate horizontal is provided with, and extends and form second radiating part 225 of the outer circle wall in unit pipes loop 220 from first radiating part 224.
Shown in figure 12; Be that according to unit pipes loop of this example embodiment 220 and difference the length in each unit pipes loop 220 is longer than the length of the radially short lines on the plane according to the unit pipes loop of previous exemplary property embodiment (for example, referring to Fig. 1 20).For this reason, unit pipes loop 220 forms spirality, and is shown in figure 12.Perhaps, unit pipes loop 220 forms snakelike and so on other curve, becomes the shape such as straight line or other multiple waveform of predetermined angular with said short lines.Here, be longer than said radially unit pipes loop 220 parts of short lines and comprise radiating part 223, but also can comprise endothermic section 221.Like this, the length in each unit pipes loop 220, the particularly length of radiating part 223 can be made as longer relatively, increase area of dissipation by this.
Shown in figure 13, radiating part 223 also comprises at least one protuberance 226 and 227.First protuberance 226 is roughly parallel to first radiating part, 224 protrusions, and second protuberance 227 is roughly parallel to second radiating part, 225 protrusions, but can make multiple change to the protrusion direction of protuberance 226 and 227.
Embodiment is similar with previous exemplary property, according to the heat abstractor of this example embodiment also comprise installing rack 240, the first duct member 220a and the second duct member 220b, fan 260, with other assembly (not shown).
Although described example embodiment of the present invention already, the technical staff in present technique field should understand and can modify and do not exceed purport of the present invention and spirit these embodiment, and scope of the present invention is limited accompanying claims and equivalent thereof.
Industrial applicibility
Can be widely used in the overheated of electronic components such as preventing computer CPU, video card chipset, power transistor, LED according to heat abstractor of the present invention.
Claims (14)
1. heat abstractor comprises:
A plurality of unit pipes loop,
Each unit pipes loop comprises: be located near the endothermic section of thermal source; Reach the radiating part that is connected and disperses the heat that passes over from said endothermic section with said endothermic section,
Be fed to the working fluid in said endothermic section and the said radiating part,
Said a plurality of unit pipes loop radially is provided with respect to said thermal source,
Wherein said a plurality of unit pipes loop connects to form single loop mutually.
2. heat abstractor as claimed in claim 1, wherein the length of each said unit pipes loop horizontal-extending part is longer than short lines radially.
3. heat abstractor as claimed in claim 2, wherein said radiating part comprises: first radiating part, it is connected with said endothermic section and radially is provided with so that its length is longer than said radially short lines; And second radiating part, it is connected and forms the outer circle wall in each unit pipes loop with said first radiating part.
4. heat abstractor as claimed in claim 3, wherein said radiating part also comprise at least one protuberance between said first radiating part and said second radiating part.
5. heat abstractor as claimed in claim 4, wherein at least one end in each unit pipes loop is connected with adjacent unit pipes loop.
6. heat abstractor as claimed in claim 5 also comprises the auxiliary tube loop that is located between the said adjacent cells tube loop and helps heat radiation.
7. heat abstractor as claimed in claim 6 also comprises the thermal component that is connected to each unit pipes loop.
8. heat abstractor as claimed in claim 7, wherein said thermal component comprises the guide part that the heat flow of being dispersed is led.
9. like each described heat abstractor in the claim 1～8, also comprise the installing rack that is provided with near said thermal source, and said a plurality of unit pipes loop is installed on the said installing rack.
10. heat abstractor as claimed in claim 9 also comprises the retainer that is connected to said installing rack, and said a plurality of unit pipes loop is put between said installing rack and the said retainer.
11. heat abstractor as claimed in claim 10 also comprises near said radiating part mounted fan.
12. like each described heat abstractor in the claim 1～8; Wherein each unit pipes loop comprises first duct member and second duct member that has first end and the second end separately; And the first end of wherein said first duct member is connected to the first end of said second duct member, and the second end of said first duct member is connected to the second end of said second duct member of said adjacent cells tube loop.
13. heat abstractor as claimed in claim 12, a radial expansion in the end of the end of wherein interconnected said first duct member and said second duct member.
14. heat abstractor as claimed in claim 13, wherein said first duct member is connected through mutual soldering with the end of said second duct member.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070100852A KR100895694B1 (en) | 2007-10-08 | 2007-10-08 | Heat pipe type dissipating device |
| KR10-2007-0100852 | 2007-10-08 | ||
| KR1020070100852 | 2007-10-08 | ||
| KR1020080054549A KR20090128684A (en) | 2008-06-11 | 2008-06-11 | Heat pipe type dissipating device |
| KR10-2008-0054549 | 2008-06-11 | ||
| KR1020080054549 | 2008-06-11 | ||
| PCT/KR2008/003629 WO2009048218A1 (en) | 2007-10-08 | 2008-06-25 | Heat dissipating device using heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101622917A CN101622917A (en) | 2010-01-06 |
| CN101622917B true CN101622917B (en) | 2012-08-22 |
Family
ID=40760986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880002583.4A Expired - Fee Related CN101622917B (en) | 2007-10-08 | 2008-06-25 | Heat dissipating device using heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100895694B1 (en) |
| CN (1) | CN101622917B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101084349B1 (en) | 2009-10-21 | 2011-11-17 | 주식회사 자온지 | Manufacturing method for heat pipe type dissipating device |
| KR101079777B1 (en) * | 2009-11-12 | 2011-11-04 | 아이스파이프 주식회사 | LED lighting apparatus, back-light unit and display apparatus |
| KR101081550B1 (en) * | 2010-02-25 | 2011-11-08 | 주식회사 자온지 | LED lighting apparatus |
| KR101217224B1 (en) * | 2010-05-24 | 2012-12-31 | 아이스파이프 주식회사 | Heat-dissipating device for electronic apparatus |
| KR101081548B1 (en) * | 2010-09-06 | 2011-11-08 | 주식회사 자온지 | Led lighting apparatus and streetlight having the same |
| KR101996554B1 (en) * | 2018-10-08 | 2019-10-01 | 아이스파이프 주식회사 | Led lighting apparatus and manufacturing method the same |
| KR102166978B1 (en) | 2018-12-13 | 2020-10-16 | (주)메탈라이프 | A cooling component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2636418Y (en) * | 2003-06-16 | 2004-08-25 | 中国科学院广州能源研究所 | Pulse heat pipe type electron element heat radiation cooling device |
| CN1764363A (en) * | 2004-10-20 | 2006-04-26 | Lg电子株式会社 | Heat radiating apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040091171A (en) * | 2003-04-19 | 2004-10-28 | (주)프라임테크 | A method and apparatus for cooling type heat pipe |
-
2007
- 2007-10-08 KR KR1020070100852A patent/KR100895694B1/en active IP Right Grant
-
2008
- 2008-06-25 CN CN200880002583.4A patent/CN101622917B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2636418Y (en) * | 2003-06-16 | 2004-08-25 | 中国科学院广州能源研究所 | Pulse heat pipe type electron element heat radiation cooling device |
| CN1764363A (en) * | 2004-10-20 | 2006-04-26 | Lg电子株式会社 | Heat radiating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090035845A (en) | 2009-04-13 |
| KR100895694B1 (en) | 2009-04-30 |
| CN101622917A (en) | 2010-01-06 |
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