KR101996554B1 - Led lighting apparatus and manufacturing method the same - Google Patents

Abstract

Disclosed is an LED lighting device. According to an aspect of the present invention, the LED lighting device comprises: a light source module having an LED light source; a thermal base coupled with the light source module on one surface thereof and receiving heat generated from the light source module; a spiral typed heat dissipation loop repeatedly formed with a heat absorption unit arranged in the other surface of the thermal base and in contact with the thermal base so as to receive heat and a heat radiation unit spaced apart from the heat absorption unit so as to radiate the absorbed heat; and a clamp to which the heat dissipation loop is inserted and supported and coupled to the thermal base. The heat absorption unit is bent to protrude outward of a spiral type structure, and the heat dissipation loop is pressed to the thermal base by the clamp, and the heat absorption unit is coupled to be compressed to the other surface of the thermal base.

Description

LED lighting device and its manufacturing method {LED LIGHTING APPARATUS AND MANUFACTURING METHOD THE SAME}

The present invention relates to an LED lighting device and a method of manufacturing the same. More particularly, the present invention relates to an LED lighting device and a method of manufacturing the same, which simply and reliably couple a heat dissipation loop as a heat dissipation member.

In the LED lighting device, a large amount of heat is generated due to the heat of the LED. In general, when the LED lighting device is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation structure is necessary to prevent overheating.

In the LED lighting apparatus according to the prior art, the LED package is packaged with the LED chip, the substrate on which the LED package is mounted, it may be composed of a heat radiating device coupled to the substrate. In addition, the heat dissipation device may be composed of a base and a heat dissipation member for dissipating heat to the outside coupled to the substrate.

By the way, in general, the heat dissipation device simply attaches the heat dissipation member to the base by using an adhesive or the like, so that the coupling between the base and the heat dissipation member has a low reliability. For example, the heat dissipation member adhered to the base does not come into direct contact with the base, causing the phenomenon of lifting.

Korean Patent Publication No. 2009-0076545

An embodiment of the present invention is to provide an LED lighting device and a method of manufacturing the same that reliably couples a heat radiating member to a thermal base that absorbs heat.

According to an aspect of the present invention, a light source module having an LED light source, is coupled to the light source module on one surface and is disposed on the other side of the thermal base, the thermal base to receive heat generated from the light source module and transmits heat in contact with the thermal base A heat dissipation loop having a spiral structure that repeatedly forms a heat dissipation portion receiving and dissipating heat absorbed from the heat absorbing portion, and a heat dissipation loop is inserted and supported, and a clamp coupled to the thermal base; The LED lighting device is bent to protrude, and the heat dissipation loop is pressed to the thermal base by the clamp, and the heat absorbing part is compressed to the other surface of the thermal base.

According to another aspect of the present invention, the step of winding the pipe in the form of a spiral structure to form a heat dissipation loop, the step of fitting the heat dissipation loop to the clamp and the clamp to the thermal base to adhere the heat dissipation loop to the other surface of the thermal base Provided is a method of manufacturing an LED lighting device comprising a.

According to an embodiment of the present invention, by using the characteristic structure of the heat radiation loop formed in a spiral structure, the heat radiation loop can be directly coupled to the thermal base.

In addition, it is possible to form a reliable heat transfer structure only by mechanical coupling, without using an adhesive or the like for coupling the thermal base and the heat dissipation loop.

1 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.
Figure 2 is an exploded view showing the LED lighting apparatus according to an embodiment of the present invention.
3 to 6 is a view showing a coupling structure thereof using a heat radiation loop, a thermal base and a clamp in the LED lighting apparatus according to an embodiment of the present invention.
7 is a view for explaining a close structure of the thermal base and the heat dissipation loop in the LED lighting apparatus according to an embodiment of the present invention.
8 is a diagram illustrating a method of forming a heat radiation loop of the LED lighting apparatus according to an embodiment of the present invention.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components, unless specifically stated otherwise. In addition, throughout the specification, "on" means to be located above or below the target portion, and does not necessarily mean to be located above the gravity direction.

In addition, the coupling does not only mean the case where the physical contact is directly between the components in the contact relationship between the components, other components are interposed between the components, the components in the other components Use it as a comprehensive concept until each contact.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated.

Hereinafter, an embodiment of the LED lighting apparatus according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated thereto The description will be omitted.

1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention, Figure 2 is an exploded view showing the LED lighting apparatus according to an embodiment of the present invention.

LED lighting apparatus according to an embodiment of the present invention, including the light source module 10, the thermal base 20, the heat dissipation loop 30 and the clamp 40, the heat dissipation loop 30 by the clamp 40 Has a structure that is pressed to the thermal base 20 is coupled.

The light source module 10 is an LED light source 12 that emits light using electrical energy, thereby generating light necessary for illumination.

2, the light source module 10 of the present embodiment includes an LED light source 12 and a substrate on which the LED light source 12 is mounted.

The thermal base 20 is a portion which receives heat generated by the LED light source 12 and transmits it to the heat radiation loop 30 to be described later.

2, the light source module 10 is heat-coupled to one surface (front surface) of the thermal base 20 so that the thermal base 20 receives heat generated from the light source module 10. In addition, the heat dissipation loop 30 is coupled to the other surface (rear surface) of the thermal base 20 to enable heat transfer.

The heat dissipation roof 30 receives heat from the thermal base 20 and discharges heat to the outside. The heat dissipation loop 30 is disposed on the other surface of the thermal base 20, and the heat dissipation part 30a that is in contact with the thermal base 20 to transfer heat and the heat dissipation part that is spaced apart from the heat dissipation part 30a to release the absorbed heat. It has a spiral structure formed repeatedly.

3 to 6 is a view showing a coupling structure thereof using a heat radiation loop, a thermal base and a clamp in the LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 3, the heat dissipation loop 30 may have a spiral structure in which unit loops are continuously connected. For example, the rectangular unit loop may have a continuous structure such as a spring. As such, the spiral structure in which the pipes 32 are wound at tight intervals allows the long pipes 32 to be efficiently disposed in a limited space.

In addition, the heat dissipation loop 30 formed in a spiral structure like a spring may be disposed to face both ends to be disposed radially. That is, the heat dissipation loop 30 of the spiral structure may be disposed in the form of a hollow ring as a whole.

7 is a view for explaining a close structure of the thermal base and the heat dissipation loop in the LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 7, a portion of the heat dissipation loop 30 disposed on the other surface (rear) of the thermal base 20 may be a heat absorbing portion 30a for absorbing heat, and the remaining portion may be a heat dissipating portion for dissipating heat. have. For example, the lower surface of the rectangular structure may be the heat absorbing portion 30a, and both side surfaces and the upper surface may be heat radiating portions.

At this time, the heat absorbing portion 30a may have a shape that is bent to protrude to the outside of the spiral structure. Since the heat dissipation loop 30 of the present embodiment is formed by winding the pipe 32 in a spiral structure in a mold, the side surface of the spiral may be gently protruded outward to have a curved shape.

8 is a diagram illustrating a method of forming a heat radiation loop of the LED lighting apparatus according to an embodiment of the present invention.

As shown in FIG. 8, the mold 1 and the tubular pipe 32 having a predetermined shape are prepared, and the pipe 32 is wound around the mold 1 in a spiral structure to have a plurality of unit loops. It is possible to form a spiral pipe 32.

Specifically, the pipe 32 can be easily wound on the mold 1 by rotating the rotary shaft 1a coupled to the mold 1 of the rectangular structure. In addition, after the die 1 is fixedly arranged, the pipe 32 may be wound around the die 1 using a separate winding machine (not shown) to form a spiral pipe 32.

At this time, the pipe 32 wound and molded in the mold 1 remains in a state where part of the elastic deformation. That is, some of the edges of the spiral pipe 32 are not elastically deformed in a form in which they are in close contact with the edges of the mold and remain elastically deformed. Accordingly, when the spiral pipe 32 is immediately removed from the mold 1 after the winding, the elastically deformed portion is restored.

Referring to FIG. 7, in particular, the heat absorbing portion 30a of the present embodiment is disposed between the corners of the rectangular structure and a part of the corner is restored, and the heat absorbing portion 30a has a convex shape toward the center from the corner. That is, the heat absorbing portion 30a has a shape that is bent to protrude to the outside of the helical structure based on the straight line 32a connecting the edges.

On the other hand, the heat dissipation loop 30 of the present embodiment may include a loop of the vibrating tubular heat pipe 32 into which the working fluid is injected.

Referring to FIG. 7, the vibrating tubular heat pipe has a structure in which the inside of the pipe 32 is sealed from the outside after the working fluid 34 and the bubble 36 are injected into the tubular pipe 32 at a predetermined ratio. Has Accordingly, the vibrating tubular heat pipe has a heat transfer cycle for transporting a large amount of heat in latent form by volume expansion and condensation of the bubble 36 and the working fluid 34.

Looking at the heat transfer mechanism, the heat absorbing portion (30a) is nucleate boiling (Nucleate Boiling) by the amount of heat absorbed as the bubbles located in the heat absorbing portion (30a) is to expand the volume. At this time, since the tubule maintains a constant internal volume, the bubbles located in the heat dissipating part that dissipate heat by the volume of the bubbles located in the heat absorbing part 30a are contracted.

Therefore, as the pressure equilibrium in the tubules collapses, the flow including the oscillation of the working fluid and the bubbles in the tubules is accompanied, and thus heat radiation is performed by the latent heat transfer by the temperature rise due to the volume change of the bubbles.

Here, the vibrating tubular heat pipe may include a pipe 32 made of a metal material such as copper and aluminum having high thermal conductivity. Accordingly, while conducting heat at a high speed, the volume change of the bubbles injected therein can be rapidly induced.

In addition, the vibrating tubular heat pipe may communicate with both open ends to form one closed loop.

Referring to FIG. 7, the heat dissipation loop 30 may be sealed using the connection pipe 34. For example, both open ends of the heat dissipation loop 30 may be inserted into the connection pipe 34 to communicate with each other to form a closed loop and seal the internal space. On the other hand, the heat dissipation loop 30 may be configured as an open loop by sealing each end portion independently.

The clamp 40 is a part of which the heat dissipation loop 30 is fitted and supported and coupled to the thermal base 20. The heat dissipation loop 30 is pressed to the thermal base 20 by the clamp 40 and is coupled.

2 and 4, the clamp 40 may be formed in a disc shape corresponding to the heat dissipation loop 30 disposed radially, and a plurality of coupling grooves 42 disposed radially may be formed. Accordingly, a plurality of unit loops constituting the heat dissipation loop 30 may be inserted into the coupling groove 42 of the clamp 40 to maintain a predetermined interval.

In addition, the heat dissipation loop 30 is elastically deformed when fitted to the clamp 40, thereby pressing the inner wall of the coupling groove 42. Therefore, the heat dissipation loop 30 fitted to the clamp 40 is held by the clamp 40 by the restoring force of the elastically deformed portion, and is mechanically fixed until more than a force is applied to overcome the restoring force.

5 and 6, the clamp 40 may be coupled to the thermal base 20 while pressing the heat dissipation loop 30 held by the clamp 40 to the thermal base 20. Accordingly, the heat dissipation loop 30 is coupled to the thermal base 20 by the clamp 40, and the heat absorbing portion 30a may be compressed to the other surface of the thermal base 20.

At this time, the clamp 40 may be coupled to the thermal base 20 by screwing. For example, a plurality of screw coupling portions 44 may be formed on the outer circumference of the clamp 40, and a thread through portion 22 may be formed on the outer circumference of the thermal base 20. Accordingly, the screw passing through the threaded through portion 22 of the thermal base 20 is coupled to the screw coupling portion 44 of the clamp 40 so that the clamp 40 may be fixed to the thermal base 20 by screwing. have.

In particular, referring to FIG. 7, since the heat absorbing portion 30a has a shape that is bent to protrude outward of the helical structure, when the heat dissipation loop 30 is pressed against the thermal base 20, the heat absorbing portion 30a is the thermal base. It is elastically deformed to be in close contact with the other surface of (20). That is, while the shape of the heat absorbing portion 30a convex to the other surface of the thermal base 20 is in close contact with the thermal base 20, the elastic base may be elastically deformed and flattened according to the shape of the other surface of the thermal base 20. Accordingly, the thermal base 20 and the heat absorbing portion 30a may be completely in contact with each other without any gap.

Therefore, by using the characteristic structure of the heat dissipation loop 30 formed in a spiral structure, the heat dissipation loop 30 can be directly in close contact with the thermal base 20. In addition, a reliable heat transfer structure may be formed only by mechanical coupling without using an adhesive or the like for coupling the thermal base 20 and the heat dissipation loop 30.

Meanwhile, the LED lighting apparatus of the present embodiment may further include a housing 50, a power supply unit 70, and a cover unit 60.

The housing 50 forms a space for accommodating the light source module 10, the thermal base 20, the heat dissipation loop 30, the clamp 40, and the like.

Referring to FIG. 1, a plurality of vent holes 55 may be formed in the housing 50 so that heat radiated from the heat dissipation loop 30 may be transferred to the outside air.

The power supply unit 70 is a part for supplying power to the light source module 10 and may include various power supply devices that can be applied to the LED lighting device.

1 and 2, the power supply unit 70 may be coupled to the housing 50 in a structure protruding from the rear of the housing 50, and may include a connection ring 75 supporting the entire LED lighting apparatus. Can be.

The cover unit 60 may be installed in front of the light source module 10 to induce efficient air flow along with protection of the light source module 10. The cover member may be made of a transparent material to transmit light, and a vent may be formed to smoothly move air.

1 and 2, the cover part 60 includes a plurality of support protrusions 65 protruding to the front, so that the LED lighting device can be placed toward the bottom of the cover part 60.

As mentioned above, although preferred embodiment of this invention was described, those of ordinary skill in the art added, changed, deleted, or added the component within the range which does not deviate from the idea of this invention described in the claim. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

10: light source module
12: LED light source
20: thermal base
30: heat dissipation loop
30a: endothermic portion
32: pipe
40: clamp
42: coupling groove
50: housing
60: cover part
70: power supply

Claims (6)

A light source module having an LED light source;
A thermal base coupled to the light source module on one surface and receiving heat generated from the light source module;
A heat dissipation loop disposed on the other surface of the thermal base, the heat dissipation loop repeatedly forming a heat dissipation unit in contact with the thermal base to receive heat and a heat dissipation unit dissipating heat absorbed by the heat dissipation unit; And
The heat dissipation loop is inserted and supported, and includes a clamp coupled to the thermal base,
The heat absorbing portion is curved to protrude outward of the helical structure and has a convex shape.
The heat dissipation loop fitted to the clamp is held and fixed by the clamp by the restoring force of the elastically deformed portion,
The clamp is screwed to the thermal base, the heat dissipation loop is pressed by the clamp is coupled to the thermal base, the LED lighting device is coupled to the heat absorbing portion convex to the other surface of the thermal base.
The method of claim 1,
The heat absorbing portion is an LED lighting device is elastically deformed to be in close contact with the other surface of the thermal base.
The method of claim 2,
The heat dissipation loop,
LED lighting device comprising a vibrating tubular heat pipe loop is injected into the working fluid.
The method of claim 3,
The heat pipe loop,
An LED lighting device, which is made of metal and communicates with both open ends to form a closed loop.
Winding a pipe in a mold in a spiral structure to form a heat dissipation loop;
Inserting the heat dissipation loop into the clamp such that the heat dissipation loop is held by the clamp and fixed; And
Coupling the clamp to the thermal base to bring the heat absorbing portion of the heat dissipation loop having a convex shape into close contact with the other surface of the thermal base;
The heat dissipation loop fitted to the clamp is held and fixed by the clamp by the restoring force of the elastically deformed portion,
The clamp is screwed to the thermal base, so that the heat dissipation loop is pressed to the thermal base by the clamp is coupled to the LED lighting device manufacturing method. The method of claim 5
The heat dissipation loop has a heat absorbing part that protrudes outward of the spiral structure,
The step of closely contacting the heat dissipation loop to the other surface of the thermal base,
And holding the heat dissipation loop with the clamp to couple the heat dissipation loop to the thermal base and to couple the heat dissipation loop to the other surface of the thermal base.

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