KR20100056715A - Heat pipe type dissipating device - Google Patents

Abstract

PURPOSE: By partly doubling install a plurality of pipe loops the heat pipe type radiator at the same time can secure the relatively wide heat absorption area and the wide radiating area about the miniature heat source. CONSTITUTION: In the pipe loop(20), the working fluid is inserted in inside. The pipe loop has the respective helical structure. The heat sink is neighbor-arranged in the heat source(1). The heat sink(20a) is formed in a part of the overlap region of a plurality of pipe loops. The radiating unit is communicated with the heat sink. The radiating unit(20b) emits the heat delivered from the heat sink.

Description

Heat pipe type heat dissipation device {HEAT PIPE TYPE DISSIPATING DEVICE}

The present invention relates to a heat dissipation device, and more particularly, to a heat pipe type heat dissipation device.

In general, electronic components such as a central processing unit (CPU) of a computer, a chipset of a video card, a power transistor, a light emitting diode (LED), and a high frequency (RF) module of a communication device generate heat during operation. If the electronic component is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation device is necessary to prevent overheating.

In general, the heat dissipating device radiates heat generated from a heat generating source such as the electronic component to the outside to prevent the heat generating source from being overheated.

As an example of a heat dissipation device applied to the electronic component, a heat dissipation device having a heat dissipation fin structure is conventionally known.

However, the heat dissipation device of the heat dissipation fin structure has a problem that it is difficult to keep the surface area of the heat dissipation fin wide in a situation where the size of the heat absorbing portion should be reduced according to the miniaturization of electronic components. Even if the surface area of the heat dissipation fin is widened, the distance between the heat absorbing part and the heat dissipating part is farther away, and the heat transfer rate is low, thereby limiting the improvement of heat dissipation efficiency.

On the contrary, in the case of a large heat generating source such as an RF module of a communication device, the heat dissipation fins of the conventional heat dissipation device are usually manufactured by extrusion molding, and thus have a limitation in size, so that it is difficult to apply the heat dissipation device.

In addition, the heat dissipation device of the heat dissipation fin structure has a disadvantage in that the thickness of the heat dissipation fin is relatively thick in consideration of structural stability and heat conduction efficiency, and thus, it is difficult to reduce the weight and increase the manufacturing cost.

In addition, the conventional heat dissipation device further includes a heat dissipation fan that is generally rotated at high speed. Accordingly, power consumption for driving the heat radiation fan is accompanied, and noise is generated when the heat radiation fan is driven.

Accordingly, an object of the present invention is to provide a heat pipe type heat dissipation device capable of securing a relatively large endothermic area and heat dissipation area even for a small heat generating source and enabling rapid heat transfer.

Another object of the present invention is to provide a heat pipe type heat dissipation device that is easy to apply to a large heat generating source.

Still another object of the present invention is to provide a heat pipe type heat dissipation device capable of dissipating heat with no noise or low noise and capable of reducing weight and reducing manufacturing costs.

In order to achieve the above object, the heat pipe type heat dissipation device according to the present invention includes a plurality of pipe loops each configured to be injected with a working fluid therein, each having a spiral structure, and forming the respective pipe loops. At least two of said pipe loops are partially overlapped so that unit loops of are alternately arranged.

Each of the plurality of pipe loops includes: a heat absorbing portion disposed adjacent to the heat generating source and formed in an overlapping region of the plurality of pipe loops; The heat absorbing portion may include a heat dissipating portion communicating with the heat absorbing portion and dissipating heat transferred from the heat absorbing portion.

The heat pipe type heat dissipation device may further include an endothermic plate provided on the endothermic portion and provided with the heat generating source.

Portions formed in the heat dissipation unit among the overlapping regions of the plurality of pipe loops may be coupled to each other by soldering.

At least two pipe loops of the plurality of pipe loops may communicate with each other to form a closed loop.

The plurality of pipe loops may include first and second pipe loops each having a rectangular spiral structure and communicating with each other to form one closed loop.

In addition, the plurality of pipe loops may include three or more pipe loops each formed in a rectangular spiral structure and in communication with each other to form a closed loop, and the plurality of pipe loops may be partially disposed between adjacent pipe loops. Can overlap.

The heat pipe type heat radiation device according to the present invention also includes a configuration in which a plurality of pipe loop units including the plurality of pipe loops are arranged.

The heat pipe type heat dissipation device according to the present invention configured as described above has the following effects.

First, since the heat pipe with high heat transfer rate is used, it can be designed in various sizes and shapes according to the heating source installation environment.

Second, because the tubular heat pipe is used, it is possible to secure structural stability in a thin thickness, and to reduce the weight and manufacturing cost.

Third, since the plurality of pipe loops are partially overlapped, it is possible to secure a relatively large heat absorbing area and a relatively large heat dissipation area for the small heat generating source at the same time.

Fourth, since a plurality of pipe loop units can be disposed on a relatively wide endothermic plate, it can be easily applied even in the case of a large heat generating source.

Fifth, even if you do not use or use a heat radiating fan can use a low-speed radiating fan is possible to radiate noise or low noise.

Hereinafter, a heat pipe type heat dissipation device according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail. When describing different embodiments, the same or similar elements may be omitted as necessary.

1 is a perspective view illustrating a heat pipe type heat dissipation device according to a first embodiment of the present invention, and FIG. 2 is a view showing first and second pipe loops of the heat pipe type heat dissipation device according to a first embodiment of the present invention. 3 is a partial perspective view, and FIG. 3 is a plan view showing the heat pipe type heat dissipation device according to the first embodiment.

Referring to the drawings, the heat pipe type heat dissipation device according to the first embodiment of the present invention is for dissipating heat generated from the heat source 1, and a pipe loop unit having two spiral pipe loops 21 and 25. And 20.

Examples of the heat generator 1 include electronic components such as a CPU, a chipset of a video card, a power transistor, an LED, an RF module of a communication device, and the like, and according to the type or shape of the heat generator 1, a heat pipe type according to the present embodiment The size and shape of the heat dissipation device can be appropriately modified.

Although two pipe loops 21 and 25 are shown in FIGS. 1 to 3, the number of pipe loops is not limited thereto and may be three or more as described below. In addition, although each pipe loop 21, 25 is shown to have a substantially rectangular shape when viewed from the front of each loop (see also FIG. 4), the shape of the pipe loop is not limited thereto, but the shape of the heat generating source 1. However, it can be variously modified according to the installation space of the heat radiator.

As shown in FIG. 2, each of the first and second pipe loops 21 and 25 has an open loop shape in a separated state. However, in the assembled state, it is preferable that the first and second pipe loops 21 and 25 communicate with each other to form one closed loop. However, the present invention is not necessarily limited to the closed loop, and each pipe loop may be closed independently without communicating with a neighboring pipe loop. When the first and second pipe loops 21 and 25 communicate with each other to form a closed loop, the connection portions of the respective pipe loops 21 and 25 may be connected by the connection pipe 23. Alternatively, in order to facilitate the connecting process of the pipe loops 21 and 25, for example, the end of one pipe loop is expanded through blow processing or the like, and then the other pipe loop is connected to the extended end. After fitting the end of the can be bonded by an adhesive member. This configuration is advantageous for sealing the inside of each pipe loop 21, 25 from the outside.

1 and 3, the first pipe loop 21 and the second pipe loop 25 may be partially arranged such that a plurality of unit loops forming the respective pipe loops 21 and 25 are alternately arranged with each other. Nested As the first and second pipe loops 21, 25 partially overlap, the overlapping region occurs in two places, left and right in FIG. 1. It can be seen that the overlapping region has twice the density of the unit loop compared to the non-overlapping region. By providing one of these overlapping regions (the left side in FIG. 1) as the heat absorbing portion, a relatively large heat absorbing area is ensured for a heat generating source 1 of the same size or a heat absorbing plate 30 of the same size (to be described later). It can increase. In addition, since the remaining area except the overlapped area used as the heat absorbing part can be used as the heat radiating part, at the same time, a large heat radiating area can be secured to increase the heat radiating efficiency.

Specifically, the first and second pipe loops 21 and 25 each include a heat absorbing portion 20a and a heat dissipating portion 20b. The heat absorbing portion 20a is disposed adjacent to the heat generating source 1 and absorbs heat generated from the heat generating source 1. The heat radiating portion 20b communicates with the heat absorbing portion 20a and releases heat transferred from the heat absorbing portion 20a. The heat absorbing portion 20a is preferably provided so that the unit loops adjacent to the region where the first and second pipe loops overlap each other are in close contact with each other. The heat radiating part 20b points out the remaining part except the overlapping area | region of the heat absorbing part 20a. With such a configuration, even if the size of the heat generating source 1 or the heat absorbing plate 30 is constant, the heat absorbing area can be maximized while the heat absorbing area is maximized.

The heat pipe type heat dissipation device according to the first embodiment of the present invention may further include an endothermic plate 30 provided in the endothermic portion 20a and in which the heat generating source 1 is installed. The heat absorbing plate 30 primarily absorbs heat radiated from the heat generating source 1 to transfer the heat absorbing portion to the heat absorbing portion 20a, and also serves to fix the pipe loop unit 20. The endothermic plate 30 may be made of a metal material such as copper, aluminum, or an alloy thereof having high thermal conductivity.

In addition, the heat pipe type heat dissipation device according to the first embodiment of the present invention may further include a coupling member (40). The coupling member 40 is for mutually coupling the heat dissipation portion 20b among the overlapping regions of the first and second pipe loops 21 and 25. The coupling member 40 is preferably formed by soldering, but is not limited thereto, and any means known in the art may be used as the coupling member 40. Accordingly, the pipe loop unit 20 can be firmly fixed on the opposite side of the heat absorbing portion 20a. In addition, the vibration of the working fluid (to be described later) in the unit loop in close contact with each other can be activated to improve the heat radiation efficiency.

Inside each of the first and second pipe loops 21 and 25, the working fluid 13 is injected together with the bubbles 11 as shown in FIG. 1, and thus, the pipe loop unit according to the present embodiment ( 20) forms a fluid dynamic pressure (FDP) type heat pipe loop. The plurality of pipe loops 20 may be electrically conducting heat generated from the heat generating source 1 at a high speed and rapidly induce a volume change of bubbles injected therein. It may be made of a metal material such as an alloy.

The fluid dynamic heat pipe according to the present invention includes, for example, a vibrating tubular heat pipe. Hereinafter, as an example of a hydrodynamic type heat pipe, a basic operation principle of a vibrating tubular heat pipe will be described with reference to FIG. 1.

As shown in FIG. 1, the vibrating tubular heat pipe has a structure in which the working fluid 13 and the bubble 11 are injected into the tubule at a predetermined ratio and the inside of the tubule is sealed from the outside. This heat pipe has a heat transfer mechanism for transporting a large amount of heat in latent heat form by volume expansion and condensation of the bubbles 11 and the working fluid 13.

Looking at the basic principle, in the heat absorbing portion (20a), the nuclear boiling (Nucleate Boiling) occurs by the amount of heat absorbed as the bubbles located in the heat absorbing portion (20a) is a volume expansion. At this time, since the tubule maintains a constant internal volume, the bubbles located in the heat dissipating portion 20b contract as much as the bubbles located in the heat absorbing portion 20a have a volume expansion. Accordingly, as the pressure balance in the tubules collapses, the heat pipe is accompanied by a flow including vibrations of the working fluid 13 and the bubbles 11. As described above, the heat radiation function is performed by latent heat transportation by raising and lowering the temperature due to the volume change of the bubble 11.

The vibrating tubular heat pipe is easy to manufacture because it does not include a wick unlike a general heat pipe. In addition, since there is no restriction in the installation direction, there are fewer installation restrictions compared to thermophonic heat pipes in which the heat dissipation unit must be located under the heat absorbing unit. In addition, since the heat transfer method is different from that of the heat sink type heat dissipation device, the size and shape of the heat sink may not be limited by the structural limitations of the heat pipe itself.

Figure 4 is a schematic front view showing a heat pipe type heat dissipation device according to a second embodiment of the present invention.

Referring to FIG. 4, the heat pipe type heat dissipation device according to the present embodiment includes a pipe loop unit 120 having three spiral pipe loops 121, 125, and 127. The first pipe loop 121 partially overlaps the second pipe loop 125, and the third pipe loop 127 also partially overlaps the second pipe loop 125. The first pipe loop 121 and the third pipe loop 127 do not overlap. As shown in FIG. 4, in order to increase the density of the unit loops per unit area, the first pipe loop 121 and the third pipe loop 127 are preferably disposed adjacent to each other, but are not limited thereto and according to design. May be spaced apart from each other. The first to third pipe loops 121, 125 and 127 are preferably communicated with each other to form a closed loop, but each of them may be configured independently or only two or three of them.

According to the present embodiment, the overlapping area of the pipe loops 121, 125 and 127, that is, the heat absorbing area can be formed wide, so that the heat generating source 1 'or the heat absorbing plate 130 having a relatively large size can be formed. May be suitably applied.

5 is a perspective view showing a heat pipe type heat dissipation device according to a third embodiment of the present invention. Referring to FIG. 5, the heat pipe type heat dissipation device according to the present embodiment includes a large heat absorbing plate 230 and a plurality of pipe loop units 220 disposed on the heat absorbing plate 230 and independently performing a heat dissipation function. Pipe loop unit array (200). Each pipe loop unit 220 includes at least one of the pipe loop units 20 and 120 according to the first and second embodiments.

With this arrangement, it is possible to efficiently dissipate heat generated from a large heat generating source 1 ″, for example, a backlight light source of a display device, a large heat generating source such as an RF module of a communication device.

Heat pipe type heat dissipation device according to the embodiments of the present invention can be used without a heat dissipation fan, unlike a conventional heat dissipation device, and even a heat dissipation fan can be used even when a heat dissipation fan is included. Can be done.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

1 is a perspective view showing a heat pipe type heat dissipation device according to a first embodiment of the present invention.

Figure 2 is an exploded perspective view showing the first and second pipe loops of the heat pipe type heat dissipation device according to the first embodiment of the present invention.

3 is a plan view showing a heat pipe type heat dissipation device according to a first embodiment of the present invention.

Figure 4 is a schematic front view showing a heat pipe type heat dissipation device according to a second embodiment of the present invention.

Figure 5 is a schematic front view showing a heat pipe type heat dissipation device according to a third embodiment of the present invention.

* List of Reference Numbers in Drawings

1, 1 ', 1 ": pyrogen 11: bubble

13: working fluid 20, 120, 220: pipe roof unit

20a: heat absorbing portion 20b: heat dissipating portion

21, 121: first pipe loop 25, 125: second pipe loop

127: third pipe loop 30, 130, 230: endothermic plate

40: coupling member 200: pipe loop unit array

23: connector

Claims (8)

In the heat pipe type radiator, It is configured to inject a working fluid therein, each comprising a plurality of pipe loops having a spiral structure, At least two pipe loops of the plurality of pipe loops are partially overlapped with each other so that a plurality of unit loops forming the pipe loops are alternately arranged. The method of claim 1, Each of the plurality of pipe loops, A heat absorbing portion disposed adjacent to a heat generating source and formed in a part of an overlapping area of the plurality of pipe loops; A heat pipe type heat dissipation device in communication with the heat absorbing portion, characterized in that it comprises a heat dissipating portion for dissipating heat transferred from the heat absorbing portion. The method of claim 2, The heat pipe type heat dissipation device is provided on the heat absorbing portion, and further comprising a heat absorbing plate on which the heat generating source is installed. The method of claim 3, And a coupling member configured to mutually couple portions formed in the heat dissipation portion among the overlapping regions of the plurality of pipe loops. The method according to any one of claims 1 to 4, At least two pipe loops of the plurality of pipe loops are in communication with each other to form a closed loop heat pipe type heat sink. The method of claim 5, The plurality of pipe loops, each of the heat pipe type heat dissipation device, characterized in that it comprises a first and second pipe loops are formed in a spiral spiral structure and communicate with each other to form a closed loop. The method of claim 5, The pipe loops may include three or more pipe loops each formed in a rectangular spiral structure and communicating with each other to form a closed loop. And the plurality of pipe loops are partially overlapping each other between adjacent pipe loops. The method according to any one of claims 1 to 4, And a plurality of pipe loop units including the plurality of pipe loops.

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