JP4324364B2 - Heat dissipation device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
INDUSTRIAL APPLICABILITY The present invention is a heat transfer type cooling device that is used in electronic equipment to collect and transfer the heat of a heat generating part, transfer it, and dissipate heat by means of a heat radiating means. The present invention relates to a cooling device for stealing and transferring to a heat generating part.
[0002]
[Prior art]
In various electronic devices having components that generate heat locally such as semiconductor devices and light-emitting elements inside the electronic device, failure due to overheating of the heating element (for example, malfunction or damage to the heating element or device members disposed around it) In order to prevent this, the heat generating means has a heat dissipating means for dissipating the heat generated by the heat generating elements, and the heat generating elements are cooled to operate.
For example, a computer has a heating element such as a CPU (MPU), a memory and a hard disk drive, and a cathode ray tube and a projector are equipped with a large number of heating elements such as a light source. In addition, natural air cooling that conducts heat to the outside of the housing and dissipates the heat, forced air cooling using a small fan, and the like have been performed.
[0003]
Further, in recent years, the increase in heat generation density for obtaining high performance and modularization of a microprocessor, high density of semiconductor elements, and a small and high-luminance light emitting body has been remarkable. Furthermore, for example, since notebook computers are thinned and miniaturized, heating elements are arranged at high density in a narrow space, which makes it difficult to secure a flow path for direct convection cooling (forced air cooling). There is a problem.
[0004]
To solve the above problems, as shown in FIG. 7, a single metal plate 10 as a heat collecting means, a conventional flat heat pipe 20 as a heat transfer means joined to the metal plate 10, and the flat heat. A heat transfer type cooling device composed of heat radiation fins 30 as heat radiation means fixedly disposed at the other end of the pipe 20 has been put into practical use. A conventional flat heat pipe is a heat pipe in which a vapor flow is transferred and a liquid flow is circulated, and hardly generates heat when used in a horizontal state and in a top heat state. Therefore, the conventional flat heat pipe is used in a bottom heat state in which the side joined to the metal plate 10 is lowered as seen in FIG.
In this heat transfer type cooling device, the metal plate 10 accommodated in the casing 50 is brought into close contact with the heating element 40 in the casing 50, and the heat of the collected heating elements 40 is flattened to the outside of the casing 50. The heat is transferred by the heat sink, and the heat transferred from the transferred heat is radiated and cooled by the radiating fins 30.
[0005]
One plate-type pore heat pipe itself has existed in the past, and the meandering pore is usually built in a relatively thin flat plate, and it is a heat pipe with the following characteristics: (For example, refer to Japanese Patent Laid-Open No. Hei 4-190090, Japanese Patent No. 2,714,883, and Japanese Patent Publication No. 2-35239).
(1) It has a plurality of pore tunnels in which a predetermined amount of hydraulic fluid is sealed, and the hydraulic fluid closes the pore tunnel by its surface tension and transports heat.
(2) A two-phase condensable fluid is sealed as a working fluid in the pore tunnel.
(3) The pressure waves generated by the nucleate boiling of the hydraulic fluid in the heat receiving part generate axial vibrations of the vapor bubbles and the liquid bubbles, and the vibrations transport heat from the high temperature part to the low temperature part.
[0006]
[Patent Document 1]
Japanese Patent Laid-Open No. 4-190090 [Patent Document 2]
Japanese Patent No. 2714883 [Patent Document 3]
Japanese Examined Patent Publication No. 2-35239 [0007]
[Problems to be solved by the invention]
However, even when the heat transfer type cooling device is used, it is composed of a large plate to increase heat collection with respect to a small heating element that generates a large amount of heat stored in a narrow space of a recent small device. Even if a single metal plate is brought into close contact with the heating element, the contact area itself is small, so a large amount of heat reception and heat transfer is not achieved. For example, a semiconductor device or a high-intensity small light bulb is destroyed by heat. There was a problem. In order to improve the heat dissipation effect even for a small amount of heat receiving and heat transfer, it is necessary to provide a large radiating fin, but in recent years it has become a small device containing a heating element that generates a large amount of heat. Has a problem that a large radiating fin cannot be mounted.
For example, in recent years, projectors that have become increasingly large and highly bright have become more compact, so it is not possible to take sufficient cooling space in the light-emitting bulb, and the light bulb breaks down in a short time due to the heat generated by the light-emitting bulb. There was a big problem.
[0008]
The present invention has been made in view of such problems, and has a structure in which a large amount of heat can be absorbed by the heat receiving portion even when the heating element side is a small space, and a structure in which the heat radiating portion has a large amount of heat radiation. An object of the present invention is to provide a high heat dissipation heat dissipating device that can be installed in correspondence with downsizing of an electronic device or the like that accommodates a heat generating element that is small and generates a large amount of heat.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, a heat dissipation device of the present invention includes a heat receiving portion that absorbs heat from a heating element, a transfer portion that transfers heat absorbed by the heat receiving portion, and a heat dissipation portion that releases heat. The heat receiving section, the transfer section, and the heat radiating section are provided in a plurality of plate-type pore heat pipes, and the plurality of plate-type pore heat pipes have a plurality of pore tunnels filled with a predetermined amount of hydraulic fluid. be one in which the working fluid to transport heat to close the inside pores tunnel by its surface tension, are closely fixed is superimposed flat surface of the heat receiving portion of the plate pores heat pipe of the plurality of, The flat surfaces of the heat radiating portions of the plurality of plate-type fine pore heat pipes are arranged in parallel by twisting in a plane without being twisted with respect to the flat surfaces of the heat receiving portions, and the planes of the heat radiating portions arranged in parallel Closely fix the heat dissipation means It is characterized in that was. Therefore, it can be installed corresponding to a small heat generating element that generates a large amount of heat or an electronic device that accommodates the heat generating element, and the heat receiving part absorbs a large amount of heat and the heat radiating area of the heat radiating part. Therefore, it is possible to provide a heat dissipation device that can dissipate a large amount of heat.
[0010]
In addition, the flat surface of each one end side of the plurality of plate-type fine pore heat pipes are overlapped and fixed tightly, and further, the flat surface of each other end side is also overlapped and fixed closely to form two heat receiving portions, The plurality of plate-type pores are formed by arranging in parallel by twisting the intermediate portions of the plurality of plate-type fine pore heat pipes in a plane without being twisted with respect to the flat surface of the heat-receiving portion. The flat surfaces of the heat dissipating parts of the heat pipe are arranged in parallel, and the heat dissipating means is tightly fixed to the flat surface of the heat dissipating parts arranged in parallel, and the plurality of heat dissipating parts are in close contact with the heat generating elements according to the shape of the heat generating elements. It is characterized by bending and deforming a plate-type pore heat pipe. Therefore, it is possible to provide a heat dissipation device that can absorb a large amount of heat at the heat receiving portion.
Further, in a heat radiating device having a heat receiving part that absorbs heat from the heating element, a transfer part that transfers heat absorbed by the heat receiving part, and a heat radiating part that releases heat, the heat receiving part, the transfer part, and the heat radiating part include: A plurality of plate-type fine pore heat pipes, each of the plurality of plate-type fine pore heat pipes has a plurality of fine pore tunnels filled with a predetermined amount of hydraulic fluid, and the hydraulic fluid is subjected to the pore tension by the surface tension. The inside of the plurality of plate-type pore heat pipes is used to transport heat, and the flat surfaces of the heat receiving portions of the plurality of plate-type fine pore heat pipes are overlapped and closely fixed, and the heat dissipation of the plurality of plate-type fine pore heat pipes Two heat dissipating devices arranged in parallel by twisting the flat surface of the heat receiving portion flat without twisting with respect to the flat surface of the heat receiving portion are arranged so that the flat surfaces of the heat dissipating portion are parallel to each other. Common heat dissipation means It is characterized in that closely fixed to the heat radiation section, deforming folding the plurality of plate-type pores heat pipe so as to be in close contact with the heating element to the shape of the heating element. Therefore, it is possible to provide a heat dissipation device that can dissipate a larger amount of heat.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are a plan view and a side view showing a first embodiment applied to cooling a CPU in a personal computer. 1 and 2, reference numerals 101, 102, and 103 denote plate-type pore heat pipes each having a heat receiving portion, a transfer portion, and a heat radiating portion. The plurality of plate-type pore heat pipes have a plurality of pore tunnels filled with a predetermined amount of hydraulic fluid, and the hydraulic fluid closes the pore tunnel by its surface tension and transports heat. .
One end of each of the three plate-type pore heat pipes 101, 102, and 103 is a heat receiving portion 104 that is in close contact with 105 as a heating element. The flat surfaces of the heat receiving portions 104 are overlapped to absorb heat from the heating element 105. By interposing a material 110 having a high thermal conductivity such as an electric heating sheet or a copper plate between the heating element 105 and the heat receiving portion 104, the thermal conductivity to the heat receiving portion 104 is improved. The heat absorbed from the heat receiving unit 104 is transmitted from each transfer unit 106 near the center to each heat radiating unit 107 on the other end side. The vicinity of the center is twisted in the plane direction, and the flat surfaces of the heat radiating portions 107 are arranged in parallel to increase the heat radiating area. Fins 108 as heat radiating means are joined on the heat radiating portion 107 so that heat can be radiated more.
[0012]
By adopting such a configuration, it can be installed corresponding to a small-sized heating element that generates a large amount of heat or an electronic device that accommodates the heating element, and absorbs a large amount of heat at the heat receiving part. It can dissipate a large amount of heat. In addition, heat is transferred to a narrow space where a heat-dissipating fan or cooler cannot be directly attached, or to a portion where there is sufficient space for installing a heat-dissipating fan or cooler to dissipate more heat. A heat dissipating device (such as a fin or a fan) can be easily attached.
In the present embodiment, an example using three plate-type fine hole heat pipes has been shown, but the number is appropriately determined as two or four or more depending on the amount of heat generated.
[0013]
Next, a second embodiment applied to cooling a high-intensity small lamp will be described with reference to FIG. 3 in a plan view and FIG. 4 in a side view. 3 and 4, reference numeral 201 denotes a high-intensity lamp as a heating element. One end side and the other end side of the two plate-type capillary tube heat pipes 203 and 204 are heat receiving portions 209 and 210 that are in close contact with the case side surface of the lamp 201. The flat surfaces of the heat receiving portions 209 and 210 are overlapped to absorb heat from the lamp 201. Two portions of the plate-type thin tube heat pipes 203 and 204 are bent portions 205, 206, 207, and 208 bent at about 90 degrees.
The heat receiving side immediately before the bent portion is a transfer unit 211 that transfers heat absorbed from the heat receiving units 209 and 210 to the heat radiating units 211 on the other end side. The transferred heat is radiated and cooled by the radiating section 212 at the center.
The heat receiving side immediately before the bent places 205, 206, 207 and 208 is twisted in the plane direction, and the bent places, the heat receiving side immediately before the bent places, and the flat surfaces of the heat radiation portions 212 are arranged in parallel. ing.
Since the flat surfaces of the heat radiation portions 212 are arranged in parallel, the heat radiation area is widened. Fins 213 as a heat radiating means are joined on the heat radiating portion 212 so that heat can be radiated more.
[0014]
By adopting such a configuration, it can be installed corresponding to a small-sized heating element that generates a large amount of heat or an electronic device that accommodates the heating element, and absorbs a large amount of heat at the heat receiving part. It can dissipate a large amount of heat. In the present embodiment, an example using two plate-type fine hole heat pipes has been described, but the number is appropriately determined as a plurality of three or more according to the amount of heat generated.
[0015]
Next, a third embodiment applied to cooling a small high-intensity lamp will be described with reference to FIG. 5 in a plan view and FIG. 6 in a side view. 5 and 6, reference numeral 301 denotes a high-intensity lamp as a heating element. Reference numerals 302, 303, 304, and 305 denote plate-type capillary heat pipes. One end portions 306 and 307 of the plate-type heat pipes 302 and 303 and 304 and 305 are heat receiving portions, and two end portions are overlapped and adhered to the side surface of the case of the lamp 301. To absorb.
The heat absorbed from the lamp 301 is transferred from the transfer units 308 near the center to the heat dissipating units 309 and 310 on the other end side. The vicinity of the center is twisted in the plane direction, and the flat surfaces of the heat radiating portions 309 and 310 are arranged in parallel to increase the heat radiating area. A fin 311 as a heat radiating means is joined between the heat radiating portions 309 and 310 so that heat can be radiated more.
[0016]
By adopting such a configuration, it can be installed corresponding to a small-sized heating element that generates a large amount of heat or an electronic device that accommodates the heating element, and absorbs a large amount of heat at the heat receiving part. It can dissipate a large amount of heat. In addition, heat is transferred to a narrow space where a heat-dissipating fan or cooler cannot be directly attached, or to a portion where there is sufficient space for installing a heat-dissipating fan or cooler to dissipate more heat. A heat dissipating device (such as a fin or a fan) can be easily attached.
In the present embodiment, an example using two plate-type fine hole heat pipes has been described, but the number is appropriately determined as a plurality of three or more according to the amount of heat generated.
[0017]
【The invention's effect】
According to the first aspect of the present invention, it can be installed in correspondence with a small-sized heating element that generates a large amount of heat or in response to downsizing of an electronic device or the like that houses the heating element. Further, it is possible to provide a heat dissipating device that can absorb heat and can dissipate a large amount of heat because the heat dissipating area of the heat dissipating part is large.
According to the second aspect of the present invention, it is possible to provide a heat dissipation device that can absorb a large amount of heat at the heat receiving portion.
According to claim 3 of the present invention, it is possible to provide a heat dissipation device that can dissipate a larger amount of heat.
[Brief description of the drawings]
FIG. 1 is a plan view showing a first embodiment.
FIG. 2 is a side view showing the first embodiment.
FIG. 3 is a plan view showing a second embodiment.
FIG. 4 is a side view showing a second embodiment.
FIG. 5 is a plan view showing a third embodiment.
FIG. 6 is a side view showing a third embodiment.
FIG. 7 is a diagram showing a conventional heat dissipation device.
101, 102, 103... Plate-type pore heat pipe 104... Heat receiving part 105... CPU (heating element)
106 ... Transporting section 107 ... Heat dissipation section 108 ... Heat dissipation means 201 ... Lamp (heating element)
203, 204 ... Plate type fine pore heat pipes 209, 210 ... Heat receiving part 211 ... Transfer part 212 ... Heat radiation part 213 ... Heat radiation means 301 ... Lamp (heating element)
302, 303, 304, 305... Plate-type pore heat pipes 306, 307... Heat receiving part 308 .. transfer part 309, 310.

Claims (3)

  In a heat radiating device having a heat receiving part that absorbs heat from a heating element, a transfer part that transfers heat absorbed by the heat receiving part, and a heat radiating part that releases heat, the heat receiving part, the transfer part, and the heat radiating part include a plurality of heat receiving parts. The plate-type pore heat pipe has a plurality of pore tunnels filled with a predetermined amount of hydraulic fluid, and the hydraulic fluid passes through the pore tunnel by its surface tension. It is closed and transports the amount of heat, and the flat surfaces of the heat receiving portions of the plurality of plate-type fine pore heat pipes are overlapped and fixed tightly, and the heat dissipation portions of the plurality of plate-type fine pore heat pipes A heat dissipating device characterized in that the flat surfaces are arranged in parallel by twisting in a plane without being twisted with respect to the flat surface of the heat receiving portion, and the heat dissipating means is closely fixed to the flat surface of the heat dissipating portions arranged in parallel. .   The flat surfaces on one end side of the plurality of plate type fine pore heat pipes are overlapped and fixed in close contact, and the flat surfaces on the other end side are overlapped and fixed in close contact to form two heat receiving portions. A plurality of plate type pore heat pipes are formed by arranging the intermediate portions of the plate type pore heat pipes in parallel by twisting them flatly without being twisted with respect to the flat surface of the heat receiving portion. The flat surfaces of the heat dissipating parts are arranged in parallel, and the heat dissipating means is closely fixed to the flat surface of the heat dissipating parts arranged in parallel, and the plurality of plate types are arranged so as to be in close contact with the heat generating elements according to the shape of the heat generating elements. The heat dissipation device according to claim 1, wherein the heat sink is bent and deformed.   In a heat radiating device having a heat receiving part that absorbs heat from a heating element, a transfer part that transfers heat absorbed by the heat receiving part, and a heat radiating part that releases heat, the heat receiving part, the transfer part, and the heat radiating part include a plurality of heat receiving parts. The plate-type pore heat pipe has a plurality of pore tunnels filled with a predetermined amount of hydraulic fluid, and the hydraulic fluid passes through the pore tunnel by its surface tension. It is closed and transports the amount of heat, and the flat surfaces of the heat receiving portions of the plurality of plate-type fine pore heat pipes are overlapped and fixed tightly, and the heat dissipation portions of the plurality of plate-type fine pore heat pipes Two heat dissipating devices arranged in parallel by twisting in a plane without twisting the flat surface with respect to the flat surface of the heat receiving part are arranged so that each flat surface of the heat dissipating part is parallel to the heat dissipating part. Arranging common heat dissipation means The heat radiating portion is tightly fixed, heat dissipation and wherein the deforming folding the plurality of plate-type pores heat pipe so as to be in close contact with the heating element to the shape of the heating element.

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