JPH04294570A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPH04294570A JPH04294570A JP3060014A JP6001491A JPH04294570A JP H04294570 A JPH04294570 A JP H04294570A JP 3060014 A JP3060014 A JP 3060014A JP 6001491 A JP6001491 A JP 6001491A JP H04294570 A JPH04294570 A JP H04294570A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- semiconductor element
- fin
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 abstract description 64
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000008646 thermal stress Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】［発明の目的］[Object of the invention]
【０００２】0002
【産業上の利用分野】本発明は、半導体素子等の発熱素
子の冷却に使用されるヒートシンクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink used for cooling heat generating elements such as semiconductor elements.
【０００３】0003
【従来の技術】半導体素子等の発熱素子は動作時に発熱
するので、性能を維持するためにヒートシンクによって
冷却が行われる。2. Description of the Related Art Heat-generating elements such as semiconductor devices generate heat during operation, so they are cooled by a heat sink in order to maintain performance.
【０００４】図５は、従来の半導体素子の冷却に使用さ
れるヒートシンクの一例を示す断面図である。この図に
示すように、半導体素子１０１の上部に接続されている
ヒートシンク１０２は、半導体素子１０１に熱的に接続
されている板状のベース１０３と、ベース１０３上に接
続されている複数のピン状のフィン１０４とで構成され
ている。半導体素子１０１は、複数の配線ピン１０５を
介して基板１０６上に実装されている。FIG. 5 is a sectional view showing an example of a conventional heat sink used for cooling semiconductor devices. As shown in this figure, a heat sink 102 connected to the top of a semiconductor element 101 has a plate-shaped base 103 that is thermally connected to the semiconductor element 101, and a plurality of pins connected to the base 103. It is composed of fins 104 having a shape. The semiconductor element 101 is mounted on a substrate 106 via a plurality of wiring pins 105.
【０００５】従来のヒートシンク１０２は上記のように
構成されており、半導体素子１０１で発熱が生じると、
この熱はベース１０３に伝えられてピン状のフィン１０
４によって放熱されることにより半導体素子１０１の冷
却が行われる。The conventional heat sink 102 is constructed as described above, and when heat is generated in the semiconductor element 101,
This heat is transferred to the base 103 and the pin-shaped fins 10
4 cools the semiconductor element 101.
【０００６】[0006]
【発明が解決しようとする課題】上記したように、従来
のヒートシンク１０２ではピン状のフィン１０４による
放熱によって半導体素子１０１の冷却が行われている。As described above, in the conventional heat sink 102, the semiconductor element 101 is cooled by heat dissipation by the pin-shaped fins 104.
【０００７】ところで、前記したピン状のフィン１０４
は径が細いので表面での局所的な熱伝達率を大きくする
ことはできるが、フィン１０４内部の熱伝導に関しては
好ましくない。従って、フィン１０４の先端側にいくに
つれて表面温度の低下が大きくなり、フィン効率が低下
する。By the way, the pin-shaped fin 104 mentioned above
Since the diameter of the fins is small, the local heat transfer coefficient on the surface can be increased, but this is not preferable in terms of heat conduction inside the fins 104. Therefore, the surface temperature decreases more toward the tip of the fin 104, and the fin efficiency decreases.
【０００８】このため、フィン１０４の高さ（長さ）は
その径の細さによって制限され、しかも、ヒートシンク
１０２の横方向の広がりはスペースの関係で半導体素子
１０１の上面の範囲内に収めることが望ましいため、十
分な放熱性能を得ることができず、効率のよい冷却を行
うことができなかった。For this reason, the height (length) of the fin 104 is limited by the narrowness of its diameter, and the lateral extent of the heat sink 102 must be kept within the upper surface of the semiconductor element 101 due to space considerations. is desirable, so sufficient heat dissipation performance could not be obtained and efficient cooling could not be achieved.
【０００９】また、半導体素子１０１は表面がセラミッ
ク等で形成され、半導体素子１０１に接続されるヒート
シンク１０２のベース１０３はアルミニウムや銅等で形
成されている。このため、半導体素子１０１とベース１
０３の熱膨張率には大きな違いがあるので半導体素子１
０１の発熱により、半導体素子１０１とベース１０３と
の接続面に熱膨張率の違いによって熱応力が作用する。The surface of the semiconductor element 101 is made of ceramic or the like, and the base 103 of the heat sink 102 connected to the semiconductor element 101 is made of aluminum, copper, or the like. Therefore, the semiconductor element 101 and the base 1
Since there is a large difference in the coefficient of thermal expansion of 03, semiconductor element 1
Due to the heat generation of 01, thermal stress acts on the connection surface between the semiconductor element 101 and the base 103 due to the difference in coefficient of thermal expansion.
【００１０】このため、高発熱量の半導体素子１０１で
は、ベース１０３との接合面に作用する熱応力が大きく
なるので、半導体素子１０１とベース１０３との接続が
難しく、最悪の場合には接続面が剥がれる虞れがある。For this reason, in the semiconductor element 101 that generates a high amount of heat, the thermal stress acting on the joint surface with the base 103 becomes large, making it difficult to connect the semiconductor element 101 and the base 103, and in the worst case, the connection surface There is a risk that it may peel off.
【００１１】本発明は上記した課題を解決する目的でな
され、効率のよい発熱体の冷却と、熱応力を低減して発
熱体との接続を良好に行うことができるヒートシンクを
提供しようとするものである。The present invention has been made to solve the above-mentioned problems, and aims to provide a heat sink that can efficiently cool a heating element, reduce thermal stress, and connect well to the heating element. It is.
【００１２】［発明の構成］[Configuration of the invention]
【００１３】[0013]
【課題を解決するための手段】前記した課題を解決する
ために第１の本発明は、発熱体の伝熱面に熱的に接続さ
れ前記発熱体の伝熱面に対してほぼ垂直方向に形成され
た放熱部材接続面を有する伝熱部材と、該伝熱部材の放
熱部材接続面に接続された複数の放熱部材とを具備した
ことを特徴とするヒートシンク。[Means for Solving the Problems] In order to solve the above-mentioned problems, a first aspect of the present invention provides a device that is thermally connected to a heat transfer surface of a heating element and that extends in a direction substantially perpendicular to the heat transfer surface of the heating element. A heat sink comprising: a heat transfer member having a formed heat dissipation member connection surface; and a plurality of heat dissipation members connected to the heat dissipation member connection surface of the heat transfer member.
【００１４】第２の本発明は、発熱体の伝熱面に熱的に
接続され前記発熱体の伝熱面に対してほぼ平行方向に形
成された少なくとも２つの放熱部材接続面を有する伝熱
部材と、該伝熱部材の前記少なくとも２つの放熱部材接
続面に各々の端部近傍が接続された複数の放熱部材とを
具備したことを特徴とするヒートシンク。[0014] A second aspect of the present invention provides a heat transfer device having at least two heat dissipating member connecting surfaces that are thermally connected to a heat transfer surface of a heat generating element and formed in a direction substantially parallel to the heat transfer surface of the heat generating element. A heat sink comprising: a member; and a plurality of heat radiating members, each of which has its end portion connected to the at least two heat radiating member connecting surfaces of the heat transmitting member.
【００１５】第３の本発明は、一端側が発熱体に熱的に
接続された可撓性を有する複数の放熱部材と、該放熱部
材の他端側に接続された保持部材とを具備したことを特
徴としている。[0015] The third aspect of the present invention includes a plurality of flexible heat radiating members whose one end side is thermally connected to a heating element, and a holding member connected to the other end side of the heat radiating member. It is characterized by
【００１６】[0016]
【作用】第１の本発明によれば、発熱体から発せられる
熱の大部分は、発熱体の伝熱面に対してほぼ垂直方向に
形成された伝熱部材の放熱部材接続面に伝えられること
によって、放熱部材接続面に接続した放熱部材により効
率よく放熱を行うことができる。[Operation] According to the first aspect of the present invention, most of the heat emitted from the heating element is transmitted to the heat radiating member connecting surface of the heat transmitting member, which is formed in a direction substantially perpendicular to the heat transmitting surface of the heating element. By this, heat can be efficiently radiated by the heat radiating member connected to the heat radiating member connecting surface.
【００１７】第２の本発明によれば、発熱体から発せら
れる熱の大部分は発熱体の伝熱面に対してほぼ平行方向
に形成された少なくとも２つの伝熱部材の放熱部材接続
面に各々の端部近傍を接続した放熱部材により、この放
熱部材の両端側から効率よく放熱を行うことができる。According to the second aspect of the invention, most of the heat emitted from the heating element is transferred to the heat radiating member connecting surfaces of at least two heat transmitting members that are formed in a direction substantially parallel to the heat transmitting surface of the heating element. With the heat radiating member connected near each end, heat can be efficiently radiated from both ends of the heat radiating member.
【００１８】第３の本発明によれば、発熱体の発熱によ
る熱膨張率によって発熱体と放熱部材との接続面に熱応
力が生じた場合でも、可撓性を有する放熱部材が撓むこ
とにより、熱応力を吸収することができる。According to the third aspect of the present invention, even when thermal stress is generated on the connection surface between the heat generating element and the heat radiating member due to the coefficient of thermal expansion due to the heat generated by the heat generating element, the flexible heat radiating member does not bend. This makes it possible to absorb thermal stress.
【００１９】[0019]
【実施例】以下、本発明を図示の一実施例に基づいて詳
細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in detail below based on an embodiment shown in the drawings.
【００２０】図１は、本発明の第１の実施例に係わるヒ
ートシンクを示す斜視図である。この図に示すように、
本実施例に係るヒートシンク１は、発熱体である半導体
素子２の上面（伝熱面）２ａの中央部に沿ってほぼ垂直
に熱的に接続されている板状の伝熱部材（例えば銅板）
３と、伝熱部材３の放熱部材接続面３ａ，３ｂにほぼ垂
直に熱的に接続されている複数のピン状のフィン４とで
構成されている。FIG. 1 is a perspective view showing a heat sink according to a first embodiment of the present invention. As shown in this figure,
The heat sink 1 according to this embodiment is a plate-shaped heat transfer member (for example, a copper plate) that is thermally connected almost vertically along the center of the upper surface (heat transfer surface) 2a of a semiconductor element 2, which is a heat generating element.
3, and a plurality of pin-shaped fins 4 that are thermally connected substantially perpendicularly to the heat dissipation member connecting surfaces 3a, 3b of the heat transfer member 3.
【００２１】伝熱部材３は、半導体素子２の中央部に封
入されている半導体チップ（不図示）上に位置し、放熱
部材接続面３ａ，３ｂは半導体素子２の上面（伝熱面）
２ａに対してほぼ垂直方向に形成されている。また、放
熱部材接続面３ａと３ｂの縦横幅は半導体チップ（不図
示）の大きさに対応して形成されている。よって、半導
体素子２の発熱によって生じる熱の大部分は、伝熱部材
３を通して半導体素子２の上面（伝熱面）２ａに対して
はほぼ垂直方向に伝わる。The heat transfer member 3 is located on a semiconductor chip (not shown) sealed in the center of the semiconductor element 2, and the heat dissipation member connecting surfaces 3a and 3b are the upper surfaces (heat transfer surfaces) of the semiconductor element 2.
It is formed in a direction substantially perpendicular to 2a. Further, the vertical and horizontal widths of the heat dissipating member connecting surfaces 3a and 3b are formed to correspond to the size of a semiconductor chip (not shown). Therefore, most of the heat generated by the heat generated by the semiconductor element 2 is transmitted through the heat transfer member 3 in a direction substantially perpendicular to the upper surface (heat transfer surface) 2a of the semiconductor element 2.
【００２２】フィン４は、半導体素子２の上面（伝熱面
）２ａ上に位置するようにして伝熱部材３の放熱部材接
続面３ａ，３ｂにほぼ垂直に接続されている。フィン４
の長さは、半導体素子２の上面（伝熱面）２ａから突出
しないように短く（従来のほぼ半分の長さ）形成されて
いる。The fin 4 is located on the upper surface (heat transfer surface) 2a of the semiconductor element 2 and is connected almost perpendicularly to the heat dissipation member connection surfaces 3a, 3b of the heat transfer member 3. fin 4
The length is short (approximately half the length of the conventional one) so as not to protrude from the upper surface (heat transfer surface) 2a of the semiconductor element 2.
【００２３】本実施例に係るヒートシンク１は上記のよ
うに構成されており、半導体素子２で発熱が生じると、
この熱は伝熱部材３を通して各フィン４に伝わり、フィ
ン３の表面から放熱される。The heat sink 1 according to this embodiment is constructed as described above, and when heat is generated in the semiconductor element 2,
This heat is transmitted to each fin 4 through the heat transfer member 3, and is radiated from the surface of the fin 3.
【００２４】このように、半導体素子２で発生した熱の
大部分は、伝熱部材３を通して半導体素子２の上面（伝
熱面）２ａに対してほぼ垂直方向に伝わることにより、
伝熱部材３の放熱部材接続面３ａ，３ｂに接続した短め
のピン状のフィン４によって効率よく放熱される。In this way, most of the heat generated in the semiconductor element 2 is transmitted through the heat transfer member 3 in a direction substantially perpendicular to the upper surface (heat transfer surface) 2a of the semiconductor element 2.
Heat is efficiently radiated by short pin-shaped fins 4 connected to the heat radiating member connection surfaces 3a and 3b of the heat transfer member 3.
【００２５】また、伝熱部材３の放熱部材接続面３ａ，
３ｂに短く形成されたピン状のフィン４を半導体素子２
の上面（伝熱面）２ａとほぼ平行に多数接続することが
できるので、フィン効率の向上を図ることができる。[0025] Furthermore, the heat dissipation member connecting surface 3a of the heat transfer member 3,
The pin-shaped fin 4 formed short on the semiconductor element 2
Since a large number of fins can be connected substantially parallel to the upper surface (heat transfer surface) 2a, the fin efficiency can be improved.
【００２６】図２は、第１の実施例の変形例を示す断面
図である。本実施例では前記した伝熱部材３の下部に、
半導体素子２の上面（伝熱面）２ａのほぼ全面に熱的に
接続されるベース部３ｃを一体に形成した構成である。FIG. 2 is a sectional view showing a modification of the first embodiment. In this embodiment, at the bottom of the heat transfer member 3 described above,
It has a structure in which a base portion 3c that is thermally connected to substantially the entire upper surface (heat transfer surface) 2a of the semiconductor element 2 is integrally formed.
【００２７】本実施例においても前記実施例同様、半導
体素子２で発生した熱の大部分は、伝熱部材３のベース
部３ｃから半導体素子２の上面（伝熱面）２ａに対して
ほぼ垂直方向に伝わることにより、伝熱部材３の放熱部
材接続面３ａ，３ｂに接続した短めのピン状のフィン４
によって効率よく放熱される。In this embodiment, as in the previous embodiment, most of the heat generated in the semiconductor element 2 is transmitted from the base portion 3c of the heat transfer member 3 almost perpendicularly to the upper surface (heat transfer surface) 2a of the semiconductor element 2. By being transmitted in the direction, short pin-shaped fins 4 connected to the heat dissipation member connection surfaces 3a and 3b of the heat transfer member 3
Heat is dissipated efficiently.
【００２８】図３は、本発明の第２の実施例に係わるヒ
ートシンクを示す断面図である。本実施例に係るヒート
シンク１０では、半導体素子１１の上面（伝熱面）１１
ａの中央部に円柱状の第１の伝熱部材（例えば銅棒）１
２が、半導体素子１１の上面（伝熱面）１１ａに対して
はほぼ垂直に熱的に接続されており、半導体素子１１の
上面（伝熱面）１１ａに対してほぼ垂直方向に位置する
第１の伝熱部材１２の上部と下部側の半導体素子１１の
上面（伝熱面）１１ａ上の伝熱部材接続面１２ａ，１２
ｂには、それぞれ円盤状の第２の伝熱部材（例えば銅板
）１３ａ，１３ｂが対向して接続されている。これら第
２の伝熱部材１３ａ，１３ｂは半導体素子１１の伝熱面
１１ａとほぼ平行に設置されるもので、第１の伝熱部材
１２と予め一体に形成したものでもよい。よって、半導
体素子１１の発熱によって生じる熱の大部分は、伝熱部
材１２を通して半導体素子１１の上面（伝熱面）１１ａ
に対してほぼ垂直方向に伝わり、更に伝熱部材接続面１
２ａ，１２ｂを通して第２の伝熱部材１３ａ，１３ｂに
伝わる。第２の伝熱部材１３ａ，１３ｂ間には、ピン状
のフィン１４が複数接続されている。FIG. 3 is a sectional view showing a heat sink according to a second embodiment of the present invention. In the heat sink 10 according to this embodiment, the upper surface (heat transfer surface) 11 of the semiconductor element 11
A cylindrical first heat transfer member (for example, a copper rod) 1 is placed in the center of a.
2 is thermally connected almost perpendicularly to the upper surface (heat transfer surface) 11a of the semiconductor element 11; Heat transfer member connection surfaces 12a, 12 on the upper surface (heat transfer surface) 11a of the semiconductor element 11 on the upper and lower sides of the heat transfer member 12 of No. 1
Disk-shaped second heat transfer members (for example, copper plates) 13a and 13b are connected to b, facing each other. These second heat transfer members 13a and 13b are installed substantially parallel to the heat transfer surface 11a of the semiconductor element 11, and may be formed integrally with the first heat transfer member 12 in advance. Therefore, most of the heat generated by the heat generation of the semiconductor element 11 is transferred to the upper surface (heat transfer surface) 11a of the semiconductor element 11 through the heat transfer member 12.
The heat is transmitted almost perpendicularly to the heat transfer member connecting surface 1.
It is transmitted to the second heat transfer members 13a, 13b through 2a, 12b. A plurality of pin-shaped fins 14 are connected between the second heat transfer members 13a and 13b.
【００２９】第１の伝熱部材１２が接続される半導体素
子１１の上面（伝熱面）１１ａの中央部には半導体チッ
プ（不図示）が封入されている。また、半導体素子１１
は、複数の配線ピン１５を介して基板１６に実装されて
いる。A semiconductor chip (not shown) is enclosed in the center of the upper surface (heat transfer surface) 11a of the semiconductor element 11 to which the first heat transfer member 12 is connected. In addition, the semiconductor element 11
is mounted on the board 16 via a plurality of wiring pins 15.
【００３０】本実施例に係るヒートシンク１０は上記の
ように構成されており、半導体素子１１で発熱が生じる
と、この熱は伝熱部材１２から第２の伝熱部材１３ａ，
１３ｂを通して各フィン１４に伝わり、フィン１４の表
面から放熱される。The heat sink 10 according to this embodiment is constructed as described above, and when heat is generated in the semiconductor element 11, this heat is transferred from the heat transfer member 12 to the second heat transfer member 13a,
The heat is transmitted to each fin 14 through 13b, and is radiated from the surface of the fin 14.
【００３１】このように、半導体素子１１で発生した熱
の大部分は、第１の伝熱部材１２を通して半導体素子１
１の上面（伝熱面）１１ａに対してほぼ垂直方向に伝わ
り、更に、第１の伝熱部材１２の伝熱部材接続面１２ａ
，１２ｂに接続され半導体素子１１の上面（伝熱面）１
１ａとほぼ平行に配置された第２の伝熱部材１３ａ，１
３ｂを通して各フィン１４の両端に伝わる（従来はフィ
ンの片端からしか伝わらない）ことによって効率よく放
熱されるので、高い放熱効果が得られる。In this way, most of the heat generated in the semiconductor element 11 is transferred to the semiconductor element 1 through the first heat transfer member 12.
The heat is transmitted in a substantially perpendicular direction to the upper surface (heat transfer surface) 11a of the first heat transfer member 12, and the heat transfer member connecting surface 12a of the first heat transfer member 12
, 12b and the upper surface (heat transfer surface) 1 of the semiconductor element 11
A second heat transfer member 13a, 1 arranged substantially parallel to 1a.
3b to both ends of each fin 14 (conventionally, heat is transmitted only from one end of the fin), and the heat is efficiently dissipated, so a high heat dissipation effect can be obtained.
【００３２】尚、図１，２，３に示した各実施例におい
て、伝熱部材３および第１の伝熱部材１２は、半導体素
子２，１１内に封入されている半導体チップ（不図示）
の位置に対応して、半導体素子２，１１の上面２ａ，１
１ａに接続される。In each of the embodiments shown in FIGS. 1, 2, and 3, the heat transfer member 3 and the first heat transfer member 12 are semiconductor chips (not shown) enclosed within the semiconductor elements 2 and 11.
The upper surfaces 2a, 1 of the semiconductor elements 2, 11 correspond to the positions of
1a.
【００３３】また、図１，２，３に示した各実施例にお
いて、伝熱部材３，１２内に空間部を形成してこの中に
代替フロン等の冷媒を封入し一種のヒートパイプを形成
することによって、より効果的な冷却を行うことができ
る。In each of the embodiments shown in FIGS. 1, 2, and 3, a space is formed in the heat transfer members 3 and 12, and a refrigerant such as a fluorocarbon substitute is sealed in the space to form a kind of heat pipe. By doing so, more effective cooling can be achieved.
【００３４】図４は、本発明の第３の実施例に係わるヒ
ートシンクを示す断面図である。この図に示すように、
本実施例に係るヒートシンク２０では、発熱体である半
導体素子２１の上面（伝熱面）２１ａ上に可撓性を有す
る複数のピン状のフィン２２が熱的に接続されており、
各フィン２２の先端部にはアルミニウムや銅等から成る
板状のベース２３が接続されている。半導体素子２１は
、表面がセラミック等で被覆されており、配線ピン２４
を介して基板２５上に実装されている。FIG. 4 is a sectional view showing a heat sink according to a third embodiment of the present invention. As shown in this figure,
In the heat sink 20 according to this embodiment, a plurality of flexible pin-shaped fins 22 are thermally connected to the upper surface (heat transfer surface) 21a of the semiconductor element 21, which is a heat generating body.
A plate-shaped base 23 made of aluminum, copper, or the like is connected to the tip of each fin 22. The surface of the semiconductor element 21 is coated with ceramic or the like, and the wiring pin 24
It is mounted on the substrate 25 via.
【００３５】半導体素子２１とピン状のフィン２２との
接続方法としては、例えば半導体素子２１の上面（伝熱
面）２１ａに金属の薄膜をコーティングし、このコーテ
ィング面にベース２３で一端側が固着されている各フィ
ン２２のハンダメッキを付けた先端部を接触状態に保持
し、この状態で炉の中に入れて加熱することによって半
導体素子２１の上面（伝熱面）２１ａにフィン２２を簡
単に接続することができる。As a method of connecting the semiconductor element 21 and the pin-shaped fins 22, for example, the upper surface (heat transfer surface) 21a of the semiconductor element 21 is coated with a thin metal film, and one end side is fixed to this coated surface with a base 23. The solder-plated tips of each fin 22 are held in contact with each other, and the fins 22 are easily attached to the upper surface (heat transfer surface) 21a of the semiconductor element 21 by placing them in a furnace and heating them. Can be connected.
【００３６】本実施例に係るヒートシンク２０は上記の
ように構成されており、半導体素子２１で発熱が生じる
と、この熱はピン状のフィン２２に伝わって放熱される
。The heat sink 20 according to this embodiment is constructed as described above, and when heat is generated in the semiconductor element 21, this heat is transmitted to the pin-shaped fins 22 and radiated.
【００３７】この時、半導体素子２１に発熱による熱膨
張が生じても接続されている可撓性を有するピン状のフ
ィン２２が撓むことにより、半導体素子２１とフィン２
２の接続面に作用する熱応力を吸収して、半導体素子２
１とフィン２２の接続面の剥がれ等を防止することがで
きる。At this time, even if the semiconductor element 21 undergoes thermal expansion due to heat generation, the connected flexible pin-shaped fins 22 are bent, so that the semiconductor element 21 and the fins 2
The semiconductor element 2 absorbs the thermal stress acting on the connection surface of the semiconductor element 2.
Peeling of the connection surface between 1 and the fin 22 can be prevented.
【００３８】また、各フィン２２を固着しているベース
２３によって、半導体素子２１の上面（伝熱面）２１ａ
との間に流路が形成される。よって、この流路内に空気
等の流体を流すことによってフィン２２による放熱効果
が向上し、より効果的な冷却を行うことができる。Furthermore, the base 23 to which each fin 22 is fixed allows the upper surface (heat transfer surface) 21a of the semiconductor element 21 to be
A flow path is formed between the two. Therefore, by flowing fluid such as air into this flow path, the heat dissipation effect by the fins 22 is improved, and more effective cooling can be performed.
【００３９】また、前記した実施例では、可撓性を有す
る放熱部材としてピン状のフィン２２を使用したが、こ
れに限定されることなく、例えば可撓性を有する板状の
放熱部材等でもよい。Further, in the above-described embodiment, the pin-shaped fins 22 were used as the flexible heat dissipating member, but the present invention is not limited to this, and for example, a flexible plate-like heat dissipating member may also be used. good.
【００４０】更に、ベース２３によってフィン２２が保
護されているので、外力によるフィン２２の変形や破損
等を防止することができる。Furthermore, since the fins 22 are protected by the base 23, it is possible to prevent the fins 22 from being deformed or damaged by external forces.
【００４１】[0041]
【発明の効果】以上、実施例に基づいて具体的に説明し
たように第１，第２の本発明によれば、フィン効率を高
めることができるので、放熱効果の高いヒートシンク提
供することができる。[Effects of the Invention] As described above in detail based on the embodiments, according to the first and second aspects of the present invention, the fin efficiency can be increased, so a heat sink with high heat dissipation effect can be provided. .
【００４２】また、第３の本発明によれば、発熱体の発
熱時に可撓性を有する放熱部材が撓むことによって、発
熱体と放熱部材の接続部に作用する熱応力を吸収するこ
とができるので、放熱部材の接続不良が防止されて信頼
性の高いヒートシンクを提供することができる。Further, according to the third aspect of the present invention, the flexible heat radiating member bends when the heating element generates heat, thereby absorbing thermal stress acting on the connection portion between the heating element and the heat radiating member. Therefore, connection failures of the heat dissipating member can be prevented, and a highly reliable heat sink can be provided.
【図面の簡単な説明】[Brief explanation of drawings]
【図１】本発明の第１の実施例に係わるヒートシンクを
示す斜視図である。FIG. 1 is a perspective view showing a heat sink according to a first embodiment of the present invention.
【図２】第１の実施例の変形例に係わるヒートシンクを
示す断面図である。FIG. 2 is a sectional view showing a heat sink according to a modification of the first embodiment.
【図３】第２の実施例に係わるヒートシンクを示す断面
図である。FIG. 3 is a sectional view showing a heat sink according to a second embodiment.
【図４】第３の実施例に係わるヒートシンクを示す断面
図である。FIG. 4 is a sectional view showing a heat sink according to a third embodiment.
【図５】従来のヒートシンクを示す断面図である。FIG. 5 is a sectional view showing a conventional heat sink.
１，１０，２０ ヒートシンク
２，１１，２１ 半導体素子（発熱体）２ａ，１１ａ
，２１ａ 上面（伝熱面）３ 伝熱部材
３ａ，３ｂ 放熱部材接続面
４，１４，２２ フィン（放熱部材）１２ 第１の
伝熱部材
１２ａ，１２ｂ 伝熱部材接続面
１３ａ，１３ｂ 第２の伝熱部材
２３ ベース1, 10, 20 Heat sink 2, 11, 21 Semiconductor element (heating element) 2a, 11a
, 21a Upper surface (heat transfer surface) 3 Heat transfer member 3a, 3b Heat transfer member connection surface 4, 14, 22 Fin (heat transfer member) 12 First heat transfer member 12a, 12b Heat transfer member connection surface 13a, 13b Second Heat transfer member 23 base
Claims (3)
発熱体の伝熱面に対してほぼ垂直方向に形成された放熱
部材接続面を有する伝熱部材と、該伝熱部材の放熱部材
接続面に接続された複数の放熱部材とを具備したことを
特徴とするヒートシンク。1. A heat transfer member having a heat dissipating member connecting surface that is thermally connected to a heat transfer surface of a heat generating element and formed in a direction substantially perpendicular to the heat transfer surface of the heat generating element; A heat sink comprising a plurality of heat radiating members connected to a heat radiating member connection surface.
発熱体の伝熱面に対してほぼ平行方向に形成された少な
くとも２つの放熱部材接続面を有する伝熱部材と、該伝
熱部材の前記少なくとも２つの放熱部材接続面に各々の
端部近傍が接続された複数の放熱部材とを具備したこと
を特徴とするヒートシンク。2. A heat transfer member, the heat transfer member having at least two heat transfer member connecting surfaces that are thermally connected to a heat transfer surface of a heat generating element and formed in a direction substantially parallel to the heat transfer surface of the heat generating element; A heat sink comprising: a plurality of heat radiating members each having an end portion connected to the at least two heat radiating member connecting surfaces of the heat member.
撓性を有する複数の放熱部材と、該放熱部材の他端側に
接続された保持部材とを具備したことを特徴とするヒー
トシンク。3. A heat sink comprising: a plurality of flexible heat radiating members whose one end side is thermally connected to a heating element; and a holding member connected to the other end side of the heat radiating member. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3060014A JPH04294570A (en) | 1991-03-25 | 1991-03-25 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3060014A JPH04294570A (en) | 1991-03-25 | 1991-03-25 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04294570A true JPH04294570A (en) | 1992-10-19 |
Family
ID=13129792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3060014A Pending JPH04294570A (en) | 1991-03-25 | 1991-03-25 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04294570A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5829514A (en) * | 1997-10-29 | 1998-11-03 | Eastman Kodak Company | Bonded cast, pin-finned heat sink and method of manufacture |
| WO2002041396A2 (en) * | 2000-11-20 | 2002-05-23 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
| US6598666B2 (en) * | 2001-06-18 | 2003-07-29 | Global Win Technology Co., Ltd. | CPU cooling arrangement |
| US6657862B2 (en) | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
| US6671172B2 (en) | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
| US6735864B2 (en) | 2000-01-26 | 2004-05-18 | Matsushita Electric Industrial Co., Ltd. | Heatsink method of manufacturing the same and cooling apparatus using the same |
| US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
| JP2013239675A (en) * | 2012-05-17 | 2013-11-28 | Toyota Industries Corp | Cooler |
| CN105611806A (en) * | 2016-01-26 | 2016-05-25 | 张波 | Thermal dissipation system for electrical equipment |
-
1991
- 1991-03-25 JP JP3060014A patent/JPH04294570A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5829514A (en) * | 1997-10-29 | 1998-11-03 | Eastman Kodak Company | Bonded cast, pin-finned heat sink and method of manufacture |
| US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
| US6735864B2 (en) | 2000-01-26 | 2004-05-18 | Matsushita Electric Industrial Co., Ltd. | Heatsink method of manufacturing the same and cooling apparatus using the same |
| US6845010B2 (en) | 2000-11-20 | 2005-01-18 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
| WO2002041396A2 (en) * | 2000-11-20 | 2002-05-23 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
| WO2002041396A3 (en) * | 2000-11-20 | 2002-08-29 | Intel Corp | High performance heat sink configurations for use in high density packaging applications |
| CN1305131C (en) * | 2000-11-20 | 2007-03-14 | 英特尔公司 | High performance heat sink configurations for use in high density packaging applications |
| US6598666B2 (en) * | 2001-06-18 | 2003-07-29 | Global Win Technology Co., Ltd. | CPU cooling arrangement |
| US6671172B2 (en) | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
| US7120020B2 (en) | 2001-09-10 | 2006-10-10 | Intel Corporation | Electronic assemblies with high capacity bent fin heat sinks |
| US6657862B2 (en) | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
| US7200934B2 (en) | 2001-09-10 | 2007-04-10 | Intel Corporation | Electronic assemblies with high capacity heat sinks and methods of manufacture |
| US7911790B2 (en) | 2001-09-10 | 2011-03-22 | Intel Corporation | Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods |
| JP2013239675A (en) * | 2012-05-17 | 2013-11-28 | Toyota Industries Corp | Cooler |
| CN105611806A (en) * | 2016-01-26 | 2016-05-25 | 张波 | Thermal dissipation system for electrical equipment |
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