WO2009088135A1

WO2009088135A1 - Heat dissipating device using heat pipe

Info

Publication number: WO2009088135A1
Application number: PCT/KR2008/003660
Authority: WO
Inventors: Sangcheol Lee
Original assignee: Sangcheol Lee
Priority date: 2008-01-07
Filing date: 2008-06-25
Publication date: 2009-07-16

Abstract

There is provided a heat dissipating device using a heat pipe mechanism. The heat dissipating device includes: a thermal plate on which a heat source is to be mounted; a thermal block which is coupled to the thermal plate, for transferring heat; and a pipe unit which is coupled to the thermal block, for dissipating heat transferred from the thermal block. A flow path part is formed in at least one of a first surface of the thermal block and a surface of the thermal plate facing the first surface of the thermal block. A coupling part is formed in a second surface of the thermal block to be connected with the flow path part. The pipe unit is coupled to the coupling part. A working fluid is to be provided inside of the pipe unit and the flow path part.

Description

Description HEAT DISSIPATING DEVICE USING HEAT PIPE

Technical Field

[1] The present invention relates to a heat dissipating device, and more particularly, to a heat dissipating device using a heat pipe. Background Art

[2] In general, an electronic component such as a central processing unit (CPU) of a computer, a chip set of a video card, a power transistor, and a light-emitting diode (LED) generates heat in operation. When overheated, the electronic component may be malfunctioned or damaged. Accordingly, a heat dissipating device is required to prevent the electronic component from overheating.

[3] The heat dissipating device dissipates heat generated in a heat source such as an electronic component to the outside to prevent overheat of the heat source.

[4] Conventionally, there is disclosed a heat sink type heat dissipating device. The heat sink type heat dissipating device includes a heat absorbing part and a heat dissipating part. The heat absorbing part is disposed adjacent to a heat source to absorb heat generated from the heat source through thermal conduction. The heat dissipating part is provided with heat dissipating fins which are integrated with the heat absorbing part and dissipate the absorbed heat to the outside through heat exchange.

[5] In the conventional heat sink type heat dissipating device having such a configuration, heat dissipating efficiency is determined according to the distance between the heat absorbing part and the heat dissipating part, a heat dissipating area of the heat dissipating fins, and thermal conductivity.

[6] However, the heat sink type heat dissipating device has difficulty maintaining a wide surface area of the heat dissipating fins considering that the size of the heat sink is required to get smaller and smaller according to the trend of integration and miniaturization of electronic components. Even if the surface area of the heat dissipating fins is enlarged, the distance between the heat absorbing part and the heat dissipating part becomes larger, thereby causing a limit to increasing heat dissipating efficiency.

[7] Further, the conventional heat dissipating device should further include a fan rotating at a high speed to dissipate heat, and thus, causes problems of electric power consumption for driving the fan and a noise generated while the fan is being operated.

[8] Furthermore, in the conventional heat dissipating device, it is difficult to make the thickness of the heat dissipating fins thin in consideration of structural stability and thermal conductivity, thereby causing a high manufacturing cost. Disclosure of Invention Technical Problem

[9] Accordingly, it is an aspect of the present invention to provide a heat dissipating device which employs a heat pipe type thermal exchange mechanism to enhance heat dissipating efficiency, can secure an enlarged heat dissipating area without limitation to the size thereof, can dissipate without a noise or with a low noise, and can minimize thermal resistance between components thereof.

Technical Solution [10] The foregoing and/or other aspects of the present invention can be achieved by providing a heat dissipating device including: [11] a thermal plate on which a heat source is to be mounted;

[12] a thermal block which is coupled to the thermal plate, for transferring heat; and

[13] a pipe unit which is coupled to the thermal block, for dissipating heat transferred from the thermal block, [14] a flow path part being formed in at least one of a first surface of the thermal block and a surface of the thermal plate facing the first surface of the thermal block, [15] a coupling part being formed in a second surface of the thermal block to be connected with the flow path part,

[16] the pipe unit being coupled to the coupling part, and

[17] a working fluid being to be provided inside of the pipe unit and the flow path part.

[18] The pipe unit may include a plurality of pipe loops each having at least one open end part, and the plurality of pipe loops may be radially arranged with respect to the heat source.

[19] The length of each pipe loop may be longer than a shortest radial straight line.

[20] Each pipe loop may include a first heat dissipating part which is arranged to have a length longer than the shortest radial straight line; and a second heat dissipating part which is extended from the first heat dissipating part and forms an outside wall of the pipe unit. [21] Each pipe loop may include at least one protruding part between the first heat dissipating part and the second heat dissipating part. [22] A working fluid inlet may be formed in at least one of the thermal block and the thermal plate, in which the flow path part is formed, to be connected with the flow path part. [23] An adhesive groove may be formed in the second surface of the thermal block to be connected with the coupling part, and the plurality of pipe loops may be couplied to the coupling part by an adhesive provided through the adhesive groove. [24] The thermal plate may be coupled to the thermal block by an adhesive provided by silk-screening. [25] The thermal plate and the thermal block may be formed as one body.

[26] The thermal plate may include a thermal spreader of the heat source.

[27] The heat dissipating device may further include a heat dissipating member coupled to the pipe unit.

[28] The heat dissipating device may further include a fan installed adjacent to the pipe unit.

[29] The pipe unit may include at least one of alluminum, copper and alloy thereof.

[30] The thermal block may include at least one of alluminum, zinc and alloy thereof.

[31] The thermal block may include a block body comprising zinc alloy, and a coating layer including at least one of aluminum, copper and alloy thereof.

[32] The flow path part may include a plurlity of first flow paths radially arranged and each having an inside part disposed adjacent to a center area of the pipe unit; a plurality of second flow paths radially arranged between the plurality of first flow paths; and a plurality of third flow paths arranged in two rows outside of the first and second flow paths, the coupling part may include a plurality of first coupling parts each being connected with opposite end parts of each first flow path; a plurality of second coupling parts arranged in the substantially same radial position as the first coupling parts and each being connected with opposite end parts of each second flow path; a plurality of third coupling parts each being connected with opposite end parts of each inside third flow path; and a plurality of fourth coupling parts each being connected with opposite end parts of each outside third flow path, and one end part of each pipe loop may be coupled to each fourth coupling part, and the other end part of the pipe loop may be couplied to one of each first coupling part, each second coupling part and each third coupling part.

[33] The sum of the numbers of the first, second and inside third flow paths may be the same as the number of the outside third flow paths.

Advantageous Effects

[34] First, a heat dissipating device according to the present invention employs a heat pipe mechanism having high heat dissipating efficiency, to thereby have a variety of sizes and shapes in accordance with surrounding space of a heat source.

[35] Second, although the heat dissipating device according to the present invention employs a hollow pipe loop thinner in thickness than the conventional heat dissipating fins, its structural stability can be secured, thereby reducing consumption of material.

[36] Third, the heat dissipating device according to the present invention employs pipe loops arranged radially with respect to a heat source to dissipate heat in multiple directions, thereby enhancing heat dissipating efficiency without a fan. Also, even in the case of including the fan, high heat dissipating efficiency can be secured with a low rotational speed of the fan, thereby reducing noises. Further, the heat pipe may have a variety of arrangements other than the radial arrangement to be suitable for surrounding space and characteristics of the heat source. [37] Fourth, the heat dissipating device according to the present invention employs a thermal block, a thermal plate and a pipe unit to form a heat pipe mechanism, to thereby minimize thermal resistance and enhance heat dissipating characteristics. [38] Fifth, the heat dissipating device according to the present invention provides pipe loops in a variety of shapes such as spiral, serpentine or other waveforms, thereby enlarging a heat dissipating area of the pipe loops.

Brief Description of the Drawings [39] The above and/or other aspects of the present invention will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings, in which: [40] FIG. 1 is an exploded perspective view illustrating a heat dissipating device according to a first exemplary embodiment of the present invention; [41] FIG. 2 is a section view partially illustrating the heat dissipating device according to the first exemplary embodiment of the present invention; [42] FIG. 3 is a perspective view illustrating a main part of the heat dissipating device according to the first exemplary embodiment of the present invention; [43] FIG. 4 is a plane view illustrating the main part of the heat dissipating device according to the first exemplary embodiment of the present invention; [44] FIG. 5 is a bottom view illustrating the main part of the heat dissipating device according to the first exemplary embodiment of the present invention; [45] FIG. 6 is an exploded perspective view illustrating a heat dissipating device according to a second exemplary embodiment of the present invention; [46] FIG. 7 is an exploded perspective view illustrating a heat dissipating device according to a third exemplary embodiment of the present invention; [47] FIG. 8 is a schematic section view illustrating a heat dissipating device according to a fourth exemplary embodiment of the present invention; [48] FIG. 9 is an exploded perspective view illustrating a heat dissipating device according to a fifth exemplary embodiment of the present invention; [49] FIG. 10 is a plane view illustrating a plurality of pipe loops radially arranged in the heat dissipating device according to the fifth exemplary embodiment of the present invention; and [50] FIG. 11 illustrates an example of a pipe loop in the heat dissipating device according to the fifth exemplary embodiment of the present invention.

Best Mode for Carrying Out the Invention [51] Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The exemplary embodiments are described below so as to explain the present invention by referring to the figures.

[52] FIG. 1 is an exploded perspective view illustrating a heat dissipating device according to a first exemplary embodiment of the present invention; and FIG. 2 is a section view partially illustrating the heat dissipating device according to the first exemplary embodiment of the present invention.

[53] Referring to FIGs. 1 and 2, a heat dissipating device according to a first exemplary embodiment of the present invention includes a thermal block 10 for heat transfer; a pipe unit 30 which is installed to the thermal block 10 and dissipates heat; and a thermal plate 50 on which a heat source 1 is mounted.

[54] The thermal block 10 is coupled to an electronic device having the heat source 1 and maintains the entire shape of the heat dissipating device. The thermal block 10 includes a flow path part 11 which absorbs heat from the heat source 1 and a coupling part 15 to which the pipe unit 30 is coupled.

[55] The flow path part 11 is formed on a first surface 10a, that is, a bottom surface of the thermal block 10, which faces the thermal plate 50. Heat genarated from the heat source 1 is transferred to the flow path part 11 via the thermal plate 50. Through the flow path part 11 flows a working fluid 41 having bubbles 45.

[56] The coupling part 15 is formed in a second surface 10b, that is, a top surface of the thermal block 10 to communicate with the flow path part 11. The second surface 10b is desirably the top surface, as shown in FIGs. 1 and 2, but may be a side surface or the top and side surfaces.

[57] The thermal block 10 may be made of material such as aluminum, zinc or alloy thereof, in consideration of the manufacturing cost, structural stability, and molding precision of the flow path part 11 and the coupling part 15.

[58] For example, as shown in FIG. 2, the thermal block 10 may include a block body 101 made of zinc alloy and a coating layer 103 plated on the block body 101. The coating layer 103 may be made of material such as aluminum, copper or alloy thereof. If the block body 101 is made of zinc alloy, molding precision of the thermal block 10 can be improved. However, zinc alloy has low adhesive force with respect to the pipe unit 30 which is made of different material. Thus, the coating layer 103, which is made of alluminum, copper or alloy thereof, is used to improve adhesive force between the block body 101 and the pipe unit 30.

[59] The thermal plate 50 is coupled to the thermal block 10 to seal the flow path part 11.

For example, the thermal plate 50 may be coupled to the thermal block 10 by an adhesive 55 coated on the first surface 10a of the thermal block 10 by silk-screening. Accordingly, the working fluid 41 in the flow path part 11 can be prevented from leakage in spite of complex arrangement of the flow path part 11 as shown in FIG. 3.

[60] The thermal plate 50 is made of material having high thermal conductivity to effectively transfer heat from the heat source 1 to the flow path part 11.

[61] The pipe unit 30 is coupled to the coupling part 15 of the thermal block 10 on the second surface 10b thereof. The working fluid 41 in the pipe unit 30 is connected with the working fluid 41 in the flow path part 11 of the thermal block 10.

[62] The pipe unit 30 includes a plurality of pipe loops 31 each having at least one open end part. As shown in FIG. 1, the plurality of pipe loops 31 may be arranged in a radial way with respect to the heat source 1. Accordingly, heat from the heat source 1 can be dissipated radially in multiple directions, thereby enhancing heat dissipating efficiency.

[63] Here, the heat source 1 may include an electronic component such as a CPU, a chip set of a video card, a power transistor, and an LED. The size and the shape of the heat dissipating device may be varied according to the kind or the shape of the heat source 1.

[64] The flow path part 11 and the pipe unit 30 communicate with each other, so that the working fluid 41 with bubbles 45 can be connected therebetween. Thus, the pipe unit 30, the flow path part 11 and the working fluid 41 form a heat pipe type heat dissipating mechanism.

[65] The flow path part 11 is disposed adjacent to the heat source 1 and absorbs heat generated from the heat source 1. The pipe unit 30 is radially extended from the flow path part 11 and dissipates heat transferred via the flow path part 11.

[66] The pipe unit 30 is, desirably but not necessarily, made of metal having high thermal conductivity such as copper, alluminum or alloy thereof. Accordingly, heat from the heat source 1 can be conducted to the pipe unit 30 at a high speed and the volume of the bubbles 45 in the inside thereof can be changed quickly.

[67] Each pipe loop 31 of the pipe unit 30 has an open loop, and may be connected with a neighboring pipe loop 31 via the flow path part 11 or may be separated from the neighboring pipe loop 31. All or some of the plurality of pipe loops 31 may be connected with each other. In the case that all the plurality of pipe loops 31 are connected with each other, the pipe unit 30 may have the shape of a single open loop or a single closed loop. In the case of the single open loop, opposite end parts thereof are sealed.

[68] In order to enhance the density of arrangement of the plurality of pipe loops 31 , it is preferable but not necessary that the flow path part 11 and the coupling part 15 are arranged as shown in FIGs. 2 to 4; and the plurality of pipe loops 31 are arranged as shown in FIG. 5.

[69] Referring to FIGs. 2 and 3, the flow path part 11 may have a plurality of first flow paths 1 Ia, a plurality of second flow paths 1 Ib and a plurality of third flow paths 1 Ic and 1 Id, by way of example. Referring to FIGs. 2 to 4, the coupling part 15 may have a plurality of first to fourth coupling parts 15a, 15b, 15c and 15d.

[70] The plurality of first flow paths 11a are arranged radially being spaced from each other, with the inside thereof being disposed adjacent to a center part of the thermal block 10. In FIG. 3, five first flow paths 11a are arranged, by way of example. With this arrangement, heat generated in the heat source 1 disposed at the center part of the thermal block 10 can be effectively dissipated. The plurality of coupling parts 15a communicate with opposite end parts of the first flow paths 11a, respectively.

[71] As shown in FIG. 3, the plurality of second flow paths 1 Ib are radially arranged between the plurality of first flow paths 1 Ia to cover an area which is not covered by the first flow paths 11a. The plurality of second coupling parts 15b communicate with opposite end parts of the plurality of second flow paths 1 Ib, respectively, and are arranged in the substantially same radial position as the first coupling parts 15a.

[72] The plurality of third flow paths l ie and 1 Id are radially arranged outside of the first and second flow paths 11a and 1 Ib, forming at least one row. FIG. 3 illustrates the third flow paths l ie and 1 Id which are arranged in two rows. The third flow paths l ie and 1 Id are used for transferring heat absorbed by the first and second flow paths 11a and 1 Ib and transferred via the pipe loops 31.

[73] Here, the sum of the numbers of the first and second flow paths 11a and 1 Ib and the number of the inside third flow paths 1 Ic is, desirably but not necessarily, the same as the number of the outside third flow paths 1 Id, so as to enhance the density of the arrangement of the pipe loops 31. For example, if the numbers of first, second and inside third flow paths 1 Ia, 1 Ib and 1 Ic are five, ten and fifteen, respectively, the number of the outside third flow paths 1 Id is thirty.

[74] Referring to FIG. 4, the third coupling parts 15c communicate with opposite end parts of the inside third flow paths l ie, respectively, and the fourth coupling parts 15d communicate with opposite end parts of the outside third flow paths 1 Id.

[75] In coupling the pipe loops 31 to the coupling parts 15, one end part of each pipe loop

31 is coupled to the fourth coupling part 15d, and the other end part thereof is coupled to one of the first, second and third coupling parts 15a, 15b and 15c.

[76] FIG. 5 illustrates exemplary connections of the pipe loops 31 and the flow path part

11. Referring to FIG. 5, in the case that one end part of each pipe loop 31 is connected to the fourth coupling part 15d and the other end part thereof is coupled to one of the first, second and third coupling parts 15a, 15b and 15c, the first to third flow paths 11a, 1 Ib and l ie and 1 Id may form a single flow path via the plurality of pipe loops 31 as represented by arrows, thereby forming a single closed loop.

[77] The pipe unit 30 employs a heat pipe mechanism using fluid dynamic pressure (FDP), for example, an oscillating capillary tube heat pipe. Hereinafter, an operational principle of the oscillating capillary tube heat pipe as an example of the fluid dynamic pressure heat pipe will be briefly described by referring to FIG. 2.

[78] As shown in FIG. 2, the oscillating capillary tube heat pipe has a configuration in which the inside of a fine tube, that is, the pipe loops 31 and the flow path part 11 are filled with the working fluid 41 so that bubbles 45 are generated therein in a predetermined ratio and sealed from the outside. This heat pipe has a heat transfer mechanism which transfers heat as latent heat by volume expansion and condensation of the bubbles 45 and the working fluid 41.

[79] While nucleate boiling takes place as much as the amount of heat absorbed in the flow path part 11, the bubbles 45 in the flow path part 11 expand in volume. At this time, as the pipe loops 31 and the flow path part 11 maintain a uniform internal volume, the bubbles 45 in the pipe loops 31 contract in volume as much as the bubbles 45 in the flow path 11 are expanded. Accordingly, pressure equilibrium inside the pipe loops 31 and the flow path part 11 collapses, and thus, flow accompanying oscillations of the working fluid 41 and the bubbles 45 is generated in the flow path part 11 and the pipe loops 31. Accordingly, the heat pipe performs latent heat transfer by temperature change caused by the volume change of the bubbles 45, thereby performing heat dissipation.

[80] The oscillating capillary tube heat pipe can be manufactured easily since it has no wick. Also, the oscillating capillary tube heat pipe has an advantage of less restriction in installation in comparison with a thermosyphon heat pipe having a configuration in which a heat dissipating part has to be disposed below a heat absorbing part. Also, the oscillating capillary tube heat pipe has no structural limitationa due to a heat transfer mechanism different from a heat sink type heat dissipating device, and thus, may have various sizes according to the kind or the shape of the heat source.

[81] As shown in FIG. 4, on the second surface 10b of the thermal block 10 may be formed an adhesive groove 25 to be connected with at least one of the first to fourth coupling parts 15a, 15b, 15c and 15d. A liquid adhesive 55 is provided into the adhesive groove 25, with the pipe loops 31 being coupled to the coupling part 15, and moves into the coupling part 15. Accordingly, the plurality of pipe loops 31 can be simultaneously coupled to the first to fourth coupling parts 15a, 15b, 15c and 15d by the adhesive, thereby enhancing coupling efficiency.

[82] As shown in FIGs. 2 and 3, in the thermal block 10 may be formed at least one working fluid inlet 21 to be connected with the flow path part 11. In this regard, the heat dissipating device according to the present embodiment may further include a cap which sealingly covers the working fluid inlet 21.

[83] The working fluid inlet 21 may be formed in a side of the thermal block 10. The working fluid 41 is provided into the working fluid inlet 21, with the pipe unit 30 being installed to the thermal block 10 and the flow path part 11 being sealed by the thermal plate 50, and is fed into the flow path part 11 and the pipe unit 30. Then, the working fluid inlet 21 is sealingly covered by the cap 23, to thereby complete a heat pipe mechanism.

[84] As shown in FIGs. 1 and 3, the heat dissipating device according to the present embodiment may further include a heat dissipating member 35 which is coupled to the pipe unit 30 for heat dissipation. The heat dissipating member 35 may include a guide part 35a for guiding heat and a grip part 35b for coupling to each of the pipe loops 31. The guide part 35a is protruded on at least one surface of the heat dissipating member 35 to enlarge a heat dissipating area of the heat dissipating member and to guide flow of heat dissipated. Accordingly, a heat dissipating direction may be adjusted to be suitable for arrangement of an apparatus to which the heat dissipating device according to the present embodiment is applied. The grip part 35b may be elastically coupled to each pipe loop 31.

[85] As shown in FIG. 1, the heat dissipating device according to the present embodiment may further include a fan 60 installed adjacent to the pipe unit 30 to expedite heat dissipation. The fan 60 is installed to a support 61 screw-coupled to the thermal block 10. The fan 60 includes a driving part 63 mounted to the support 61 and a fan body 65 coupled with the driving part 63. The fan 60 rotates in a relatively low speed in comparison with the conventional heat dissipating device, thereby reducing a noise generated while the fan 60 rotates and reducing electric power consumption.

[86] In the above-described embodiment, the flow path part 11 is formed in the first surface 10a of the thermal block 10. Alternatively, as shown in FIG. 6, a flow path part 151 may be formed in a surface of a thermal plate 150 which faces a thermal block 110. In this case, in the thermal block 110 is formed a coupling part 110a for coupling to the pipe unit 30. Further, the flow path part 151 may be formed in both of the thermal block 110 and the thermal plate 150. In this case, the working fluid inlet 21 may be formed in a side of at least one of the thermal block 110 and the thermal plate 150.

[87] In the above-described embodiment, the thermal block 10 and the thermal plate 50 are coupled each other by the adhesive 55. Alternatively, the thermal block 10 and the the thermal plate 50 may be integrally formed in one body. In this case, the flow path part 11 is formed inside of the integrated body of the thermal block 10 and the thermal plate 50.

[88] In the above-described embodiment, the pipe unit 30 is arranged radially, but the arrangement may be changed differently in consideration of installation space of the heat dissipating device, the shape of the heat source, heat dissipating efficiency, etc. [89] FIG. 7 illustrates a heat dissipating device according to a third embodiment of the present invention, having arrangement different from the radial arrangement.

[90] Referring to FIG. 7, the heat dissipating device according to the present embodiment includes: a thermal block 110 which is formed with a flow path part 111 and a coupling part 115; a pipe unit 130 which is couplied to the coupling part 115 for heat dissipation; a thermal plate 150 to which a heat source 1' is to be mounted. The heat dissipating device according to the present embodiment is different from the heat dissipating device in FIGs. 1 through 5 in that arrangements of the flow path part 111 and the coupling part 115 are changed and the pipe unit 130 is arranged in a rectangular shape. In this case, the heat dissipating device may be easily applied to the heat source 1' having a rectangular shape. A plurality of pipe loops 131 of the pipe unit 130 may be connected each other to form a single loop, or may be disconnected each other.

[91] In FIG. 7, each pipe loop 131 has a straight line shape, but may have a curved line shape such as helical and serpentine, or various waveforms. In this case, the length of each pipe loop 131 can be increased, thereby increasing a heat dissipating area.

[92] FIG. 8 is a schematic section view illustrating a heat dissipating device according to a fourth exemplary embodiment of the present invention.

[93] Referring to FIG. 8, the heat dissipating device according to the present embodiment includes a thermal block 210 which is formed with a flow path part 211 for absorbing heat from a heat source 5 and a coupling part 215, and a pipe unit 230 which is coupled to the coupling part 215 for heat dissipation.

[94] The heat dissipating according to the present embodiment further includes a thermal spreader 9 which functions as a thermal plate (refer to 50 in FIG. 1), which is different from the preceding embodiments. That is, the heat dissipating device according to the present embodiment is applied to a heat source 5 including a substrate 6, a semiconductor chip 7 which is mounted on the substrate 6, and the thermal spreader 9 which is provided on the substrate 6 to cover the chip 7 and spreads heat generated from the chip 7. The thermal block 210 is formed to be suitable for the size and shape of the thermal spreader 9, and the flow path part 211 is sealed by the thermal spreader 9. In this case, heat from the heat source 5 is directly trasferred to the flow path part 211, thereby enhancing heat efficiency. Further, a separate thermal plate can be removed, thereby reducing the production cost.

[95] FIG. 9 is an explored perspective view illustrating a heat dissipating device according to a fifth exemplary embodiment of the present invention; FIG. 10 is a plane view il- lusrating a plurality of pipe loops radially arranged in the heat dissipating device according to the fifth exemplary embodiment of the present invention; and FIG. 11 is a perspective view illustrating a pipe loop in the dissipating device according to the fifth exemplary embodiment of the present invention.

[96] Referring to FIGs. 9 to 11, the heat dissipating device according to the present embodiment includes a pipe unit 330 including a plurality of pipe loops 331 having an open end part 331a. Each pipe loop 331 is arranged radially with respect to a heat source 1'. The pipe loop 331 includes a first heat dissipaing part 333 which is connected with a flow path part 321 and is horizontally disposed, and a second heat dissipating part 335 which is connected with the first heat dissipating part 333 and forms an outside wall.

[97] The pipe loop 331 is different from the pipe loop 31 (see FIG. 1) of the first exemplary embodiment of the present invention in that the length of the pipe loop 331 is longer than the shortest radial straight line, in a plane view (refer to FIG. 10). To this end, the pipe loop 331 may be formed in a curved shape such as helical or serpentine, or may be formed in a straight line making a predetermined angle with respect to the shortest straight line, or in other various waveforms. In this way, the length of the pipe loop 331 can be lengthened to thereby increase a heat dissipating area.

[98] As shown in FIG. 11, the pipe loop 331 may further include at least one protruding part 337 and 338. In FIG. 11, the first protruding part 337 is approximately parallel with the first heat dissipating part 333, and the second protruding part 338 is approximately parallel with the second heat dissipating part 338. However, protruding directions of the protruding parts 337 and 338 may be modified as necessary.

[99] The heat dissipating device according to present embodiment may further include a thermal block 310, a thermal plate 350, a fan 360 and other components, like the preceding embodiments.

[100] Although a few exemplary embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents. Industrial Applicability

[101] The heat dissipating device according to the present invention can be widely used to prevent overheat of an electronic component such as a CPU of a computer, a chip set of a video card, a power transistor, an LED.

[102]

Claims

[1] A heat dissipating device comprising: a thermal plate on which a heat source is to be mounted; a thermal block which is coupled to the thermal plate, for transferring heat; and a pipe unit which is coupled to the thermal block, for dissipating heat transferred from the thermal block, a flow path part being formed in at least one of a first surface of the thermal block and a surface of the thermal plate facing the first surface of the thermal block, a coupling part being formed in a second surface of the thermal block to be connected with the flow path part, the pipe unit being coupled to the coupling part, and a working fluid being to be provided inside of the pipe unit and the flow path part.

[2] A heat dissipating device according to claim 1, wherein the pipe unit comprises a plurality of pipe loops each having at least one open end part, and the plurality of pipe loops are radially arranged with respect to the heat source.

[3] A heat dissipating device according to claim 2, wherein the length of each pipe loop is longer than a shortest radial straight line.

[4] A heat dissipating device accordign to claim 3, wherein each pipe loop comprises a first heat dissipating part which is arranged to have a length longer than the shortest radial straight line; and a second heat dissipating part which is extended from the first heat dissipating part and forms an outside wall of the pipe unit.

[5] A heat dissipating device according to claim 4, wherein each pipe loop comprises at least one protruding part between the first heat dissipating part and the second heat dissipating part.

[6] A heat dissipating device according to one of claims 1 through 5, wherein a working fluid inlet is formed in at least one of the thermal block and the thermal plate, in which the flow path part is formed, to be connected with the flow path part.

[7] A heat dissipating device according to one of claims 1 through 5, wherein an adhesive groove is formed in the second surface of the thermal block to be connected with the coupling part, and the plurality of pipe loops are couplied to the coupling part by an adhesive provided through the adhesive groove.

[8] A heat dissipating device according to one of claims 1 through 5, wherein the thermal plate is coupled to the thermal block by an adhesive provided by silk- screening.

[9] A heat dissipating device according to one of claims 1 through 5, wherein the thermal plate and the thermal block are formed as one body.

[10] A heat dissipating device according to one of claims 1 through 5, wherein the thermal plate comprises a thermal spreader of the heat source.

[11] A heat dissipating device according to one of claims 1 through 5, further comprising a heat dissipating member coupled to the pipe unit.

[12] A heat dissipating device according to one of claims 1 through 5, further comprising a fan installed adjacent to the pipe unit.

[13] A heat dissipating device according to one of claims 1 through 5, wherein the pipe unit comprises at least one of alluminum, copper and alloy thereof.

[14] A heat dissipating device according to one of claims 1 through 5, wherein the thermal block comprises at least one of alluminum, zinc and alloy thereof.

[15] A heat dissipating device according to claim 14, wherein the thermal block comprises a block body comprising zinc alloy, and a coating layer comprising at least one of aluminum, copper and alloy thereof.

[16] A heat dissipating device according to one of claims 1 through 5, wherein the flow path part comprises a plurlity of first flow paths radially arranged and each having an inside part disposed adjacent to a center area of the pipe unit; a plurality of second flow paths radially arranged between the plurality of first flow paths; and a plurality of third flow paths arranged in two rows outside of the first and second flow paths, wherein the coupling part comprises a plurality of first coupling parts each being connected with opposite end parts of each first flow path; a plurality of second coupling parts arranged in the substantially same radial position as the first coupling parts and each being connected with opposite end parts of each second flow path; a plurality of third coupling parts each being connected with opposite end parts of each inside third flow path; and a plurality of fourth coupling parts each being connected with opposite end parts of each outside third flow path, and wherein one end part of each pipe loop is coupled to each fourth coupling part, and the other end part of the pipe loop is couplied to one of each first coupling part, each second coupling part and each third coupling part.

[17] A heat dissipating device according to claim 16, wherein the sum of the numbers of the first, second and inside third flow paths is the same as the number of the outside third flow paths.