KR20090128691A - Heat pipe type dissipating device - Google Patents

Abstract

PURPOSE: A heat dissipating device with a heat pipe type is provided to increase an effective heat dissipation area of a heat pipe by forming the heat pipe with a spiral or serpentine shape. CONSTITUTION: A heat source(1) is installed in a thermal plate(50). A thermal block(10) is installed in the thermal plate. A pipe part(30) is combined in the thermal block and discharges the heat from the thermal block. One end of the pipe is opened. The pipe part is comprised of a plurality of pipes. The pipes are radially arranged around the heat source. The thermal block has a flow part and a coupling unit. The flow part absorbs the heat from the heat source. The coupling unit is coupled with the pipe part. The operation fluid is injected to the pipe part and the flow part.

Description

Heat pipe type dissipation device

The present invention relates to a heat dissipation device, and more particularly, to a heat pipe type heat dissipation device.

Generally, electronic components such as a computer's central processing unit (hereinafter referred to as "CPU"), video card chipsets, power transistors, and light-emitting diodes (hereinafter referred to as "LEDs") are used. Generates heat during operation If the electronic component is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation device is necessary to prevent overheating.

In general, the heat dissipating device radiates heat generated from a heat generating source such as the electronic component to the outside to prevent the heat generating source from being overheated.

As an example of a heat dissipation device applied to the electronic component, a heat sink type heat dissipation device has been disclosed.

This heat sink type heat sink includes a heat absorbing portion and a heat radiating portion. The heat absorbing portion is disposed adjacent to the heat generating source to absorb heat emitted from the heat generating source through heat conduction. The heat dissipation unit is composed of the heat dissipation unit and consists of a heat dissipation fin that discharges the heat absorbed to the outside through heat exchange.

In the heat sink type heat dissipation device configured as described above, the heat dissipation efficiency is determined according to the distance between the heat absorbing portion and the heat dissipating portion, the heat dissipation area, and the thermal conductivity.

On the other hand, the heat sink type heat dissipation device is required to improve the performance of the heat sink in accordance with the trend of high integration of electronic components, it is practically difficult to maintain a large surface area of the heat sink fins. Further, even if the surface area of the heat dissipation fin is widened, the distance between the heat absorbing portion and the heat dissipation portion is increased, and thus there is a limit to improving the heat dissipation efficiency.

In addition, the conventional heat dissipation device further includes a heat dissipation fan that is rotated at high speed. Accordingly, power consumption for driving the heat radiation fan is accompanied, and noise is generated when the heat radiation fan is driven.

In addition, the conventional heat dissipation device has a limitation in reducing the thickness of the heat dissipation fin in consideration of securing structural stability and thermal conductivity, and thus has a disadvantage of high manufacturing cost.

The present invention has been made in view of the above problems, by adopting a heat pipe type heat exchange structure to increase the heat dissipation efficiency, to ensure a heat dissipation area without restriction on size, and to radiate heat with no noise or low noise It is an object of the present invention to provide a heat pipe type heat dissipation device capable of minimizing thermal resistance between components.

Heat pipe type heat dissipation device according to the present invention in order to achieve the above object,

A thermal plate on which a heating source is installed; A thermal block installed on the thermal plate and transferring heat; A pipe part coupled to the thermal block and dissipating heat transferred from the thermal block,

A flow path portion is formed on at least one of the first surface of the thermal block and one surface of the thermal plate facing the first surface, and the flow path portion communicates with the flow path portion on a second surface different from the first surface of the thermal block. And a coupling part to which the pipe part is coupled, and a working fluid is injected into the pipe part and the flow path part.

The pipe part has at least one end opening, and includes a plurality of pipes disposed radially around the heat generating source, and the length of each pipe is longer than a radial shortest straight line.

Each pipe has a first radiating portion arranged radially to have a length longer than a radial shortest straight line, and communicates with the first radiating portion, forms an outer periphery of the pipe portion, and is predetermined with respect to a plane formed by the first radiating portion. It includes a second heat radiating portion disposed at an angle. In addition, each pipe may include at least one projecting heat radiating portion between the first heat radiating portion and the second heat radiating portion.

The flow path part may include: a plurality of first flow path parts of which an inner portion is located at a central portion of at least one of the thermal block and the thermal plate and is arranged radially; A plurality of second flow path portions radially arranged between the plurality of first flow path portions; And a plurality of third flow path parts arranged in at least one row on the outside of the first and second flow path parts. Here, the third flow path portion is arranged in two rows on the outside of the first and second flow path portion, the sum total of the number of the first and second flow path portion and the number of inner rows of the third flow path portion of the outer row of the third flow path portion. It is characterized by the same as the sum of the number.

The coupling part includes a plurality of first coupling parts connected to both ends of each of the plurality of first flow path parts; A plurality of second coupling portions communicating with both ends of each of the plurality of second flow path portions and arranged substantially on the same radius as the first coupling portion; A plurality of third coupling parts connected to both ends of each of the third channel parts arranged in an inner row of the plurality of third channel parts; And a plurality of fourth coupling parts connected to both ends of each of the third flow path parts arranged in an outer row of the plurality of third flow path parts. Here, each of the plurality of pipes, one end may be coupled to the fourth coupling portion and the other end may be coupled to any one of the first to third coupling portion.

In addition, an adhesive injection groove communicating with at least one of the first to fourth coupling parts is further formed on the second surface of the thermal block, and the adhesive is injected through the adhesive injection groove, thereby providing the first to fourth portions. The plurality of pipes may be coupled to a coupling portion.

In addition, the thermal plate may be coupled to the thermal block by an adhesive applied by a silk screen method to prevent leakage of the working fluid.

In addition, the thermal plate and the thermal block may be integrally formed.

In addition, the thermal plate may be a thermal spreader of the heating source.

In addition, at least one of the thermal block and the thermal plate may be provided with a fluid inlet so as to be in communication with the flow path part, thereby injecting the working fluid through the fluid inlet.

The present invention may further include a heat sink coupled to the pipe part, and may further include a heat radiating fan installed adjacent to the pipe part.

Since the heat dissipation device according to the present invention configured as described above uses a heat pipe method having excellent heat dissipation efficiency, the heat dissipation device may be designed in various sizes and shapes according to the space around the heat generating source.

In particular, the heat pipe type heat dissipation device according to the present invention can emit heat in all directions by employing a heat pipe arranged in a radial structure with respect to the heat generating source, thereby improving heat dissipation efficiency without noise. In addition, by optimizing the arrangement of the flow path portion, the coupling portion and the pipe when arranged in a radial structure, it is possible to further increase the heat dissipation efficiency by increasing the arrangement density of the plurality of pipes. In addition, the present invention can be arranged in a variety of shapes in addition to the arrangement of the radial structure, there is an advantage that it can be easily modified and applied according to the characteristics of the given space, the heating source.

In addition, the pipe has a hollow tubular tubular structure, so that the thickness can be kept thinner than that of the conventional heat dissipation fins, and the rigidity can be maintained. Therefore, the heat dissipation device according to the present invention has a low material consumption as compared with the conventional heat dissipation device, thereby reducing the material.

In addition, the heat pipe type heat dissipation device according to the present invention improves heat dissipation characteristics by improving heat absorption efficiency of heat generated from a heat source by minimizing heat resistance by configuring a heat pipe using a thermal block and / or a thermal plate and a pipe part. You can.

In addition, even when a heat radiating fan is further included, high heat dissipation efficiency can be ensured with low noise.

In addition, the heat pipe type heat dissipation device according to the present invention can expand the effective heat dissipation area of the bottom pipe by configuring the pipe in various shapes such as a spiral shape and a serpentine shape.

Hereinafter, a bottom pipe heat radiation device according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail. When describing different embodiments, the same or similar elements may be omitted as necessary.

1 and 2 are an exploded perspective view and a partial sectional view showing a heat pipe type heat dissipation device according to a first embodiment of the present invention.

Referring to the drawings, the heat pipe type heat dissipation device according to the first embodiment of the present invention is a thermal block 10 for transmitting heat, the pipe portion 30 is installed in the thermal block 10 and discharges heat; And a working plate 41 and a thermal plate 50 on which the heat generating source 1 is installed.

The thermal block 10 is a portion to be mounted on an electronic component (not shown) having the heat generating source 1 so that the heat dissipation device is supported while maintaining the overall shape. The thermal block 10 includes a flow path part 11 that absorbs heat from the heat generating source 1, and a coupling part 15 to which the pipe part 30 is coupled.

The flow path part 11 is formed in the first surface 10a facing the thermal plate 50. Therefore, heat generated in the heat generating source 1 is transferred to the flow path part 11 through the thermal plate 50.

The working fluid 41 is injected into the flow path part 11, and bubbles 45 are formed in some spaces in the flow path part 11. The coupling part 15 is formed to communicate with the flow path part 11 through the second surface 10b of the thermal block 10. Here, the second surface 10b is formed on at least one surface of the thermal block 10 different from the first surface 10a. That is, the second surface 10b may be formed on the rear surface of the first surface 10a or the side surface of the first surface 10a as shown in FIGS. 1 and 2.

The thermal block 10 may be made of aluminum, zinc or an alloy thereof. This is in consideration of the manufacturing cost, firmness of the thermal block 10 and the precision of the flow path part 11 and the coupling part 15 during manufacturing by the injection mold.

More preferably, as shown in FIG. 2, the thermal block 10 may include a block body 101 made of a zinc alloy and a plating layer 103 plated on the block body 101. The plating layer 103 is composed of aluminum, copper or alloys thereof. As such, when the block body 101 is formed of zinc alloy, the molding precision of the thermal block 10 can be improved. On the other hand, zinc alloy improves the bonding strength by forming a plating layer 103 composed of aluminum, copper or their alloys in consideration of the fact that the bonding strength is reduced when bonding by the pipe portion 30 and the adhesive composed of different materials due to the material properties. You can.

The thermal plate 50 is installed to seal the flow path part 11 in the thermal block 10. For example, the thermal plate 50 may be coupled to the thermal block 10 by an adhesive 55 applied to the first surface 10a of the thermal block 10 by a silk screen method. In this case, even when a complicated flow path part 11 is formed as shown in FIG. 3, it is possible to prevent the outflow of the working fluid 41 injected into the flow path part 11.

In addition, the thermal plate 50 is made of a material having a high thermal conductivity, and has a thin structure. Therefore, the thermal plate 50 prevents the leakage of the working fluid 41 and the bubbles 45 in the flow path part 11, and the heat radiated from the heat source 1 effectively prevents the flow path part 11. To be evangelized).

The pipe part 30 is coupled to the coupling part 15 on the second surface 10b of the thermal block 10 so as to communicate with the flow path part 11. The inside of the pipe part 30 includes a working fluid 41 and a bubble 45 that can flow between the flow path part 11.

The pipe part 30 may include a plurality of pipes 31 having at least one end opened. As shown in FIG. 1, the plurality of pipes 31 may be disposed radially about the heat generating source 1. Therefore, the heat generated from the heat source 1 can be radiated radially in all directions radially, thereby improving heat dissipation efficiency. Here, examples of the heat source 1 include electronic components such as a CPU, a chipset of a video card, a power transistor, an LED, and the like, and a heat pipe type according to an embodiment of the present invention according to the type or shape of the heat source 1 The size and shape of the heat dissipation device can be modified into various structures as well as the radial structure.

The flow path part 11 and the pipe part 30 are in communication with each other, and has a sealed inner space in which a working fluid 41 and a bubble 45 are formed. Accordingly, the flow path part 11, the pipe part 30, and the working fluid 41 form a heat pipe type heat dissipation structure.

The flow path part 11 is disposed adjacent to the heat generating source 1 to absorb heat generated from the heat generating source 1. In addition, the pipe part 30 communicates with the flow path part 11 to the outside of the radial structure and discharges heat transferred from the flow path part 11 to the outside.

The pipe portion 30 is preferably made of a metal material such as copper, aluminum or alloys thereof having high thermal conductivity. This is to allow the pipe part 30 to conduct heat generated by the heat generating source 1 at a high speed and to cause a volume change of the bubbles 45 formed therein.

Each pipe 31 constituting the pipe part 30 has an open loop shape, and may be communicated or separated through a neighboring pipe 31 and the flow path part 11. That is, all or part of the plurality of pipes 31 may be in communication with neighboring pipes 31. Here, in the case of forming a plurality of pipes 31 in which all are in communication with each other, it is possible to have an open loop or a closed loop shape as a whole as required by the design. In the case of an open loop, the distal end of the pipe 31 is closed.

Here, in the radial configuration of the plurality of pipes 31, in order to increase the overall arrangement density of the pipe portion 30, the flow path portion 11 and the coupling portion 15 are as shown in Figs. Arranged together, the plurality of pipes 31 are preferably joined as shown in FIG.

2 and 3, the flow path part 11 includes a plurality of first to third flow path parts 11a, 11b, 11c, and 11d that are distinguished according to the arrangement position. 2 and 4, the coupling part 15 includes a plurality of first to fourth coupling parts 15a, 15b, 15c, and 15d that are distinguished according to the arrangement position.

The plurality of first flow path portions 11a are radially spaced apart from each other, and respective inner portions thereof are positioned at the center of the thermal block 10. FIG. 3 illustrates an example in which the flow path part 11 includes five first flow path parts 11a. In this case, it is possible to efficiently dissipate heat generated from the heat generating source 1 provided in the central portion of the thermal block 10 by the heat transfer mechanism described later. The plurality of first coupling parts 15a are formed in communication with both ends of each of the plurality of first flow path parts 11a.

As shown in FIG. 3, the plurality of second flow path portions 11b are radially formed between the plurality of first flow path portions 11a and are disposed in an area not covered by the first flow path portion 11a. . The plurality of second coupling parts 15b are formed in communication with both ends of each of the plurality of second flow path parts 11b, and are arranged on substantially the same radius as the first coupling part 15a.

The plurality of third flow passage portions 11c and 11d are arranged in at least one row on the outside of the first and second flow passage portions 11a and 11b. The third flow path portions 11c and 11d absorb heat generated from the heat generating source 1. In addition, the third flow paths 11c and 11d are endothermic in the first and second flow paths 11a and 11b and used as a transfer path for heat transferred through the pipe 31.

FIG. 3 shows an example in which the third flow path portions 11c and 11d are arranged in two rows on the outside of the first and second flow path portions 11a and 11b.

Here, the sum of the number of the first and second flow path parts 11a and 11b and the number of the inner row 11c of the third flow path part is equal to the sum of the number of the outer rows 11d of the third flow path part. It is preferable. This is for increasing the arrangement density of the plurality of pipes 31. For example, when each of the first and second flow path portions 11a and 11b and the inner row 11c is composed of five, ten, and fifteen pieces, the outer row 11d is formed of thirty.

Referring to FIG. 4, each of the plurality of third coupling parts 15c is formed in communication with both ends of each of the third flow path parts arranged in the inner row 11c of the plurality of third flow path parts, and the plurality of fourth coupling parts 15c. Each of the portions 15d is communicated with both ends of each of the third passage portions arranged in the outer row 11d of the plurality of third passage portions.

Here, when each pipe 31 is coupled with the coupling portion 15, one end of each pipe 31 is coupled to the fourth coupling portion 15d, and the other end of each pipe 31 is first to It is coupled to any one of the third coupling parts 15a, 15b and 15c. By arranging the pipes 31 in this manner, the arrangement density of the pipes 31 can be increased.

FIG. 5 is a diagram illustrating a connection relationship between the plurality of pipes 31 and the flow path part 11 by way of example. Referring to the drawings, when one end of each pipe 31 is coupled to the fourth coupling portion 15d, and the other end is coupled to any one of the first to third coupling portions 15a, 15b, 15c, The first to third flow path portions 11a, 11b, 11c, and 11d form one communication path as a whole as indicated by the arrows through the pipe 31. Accordingly, the pipe 31 into which the working fluid 41 is injected and the inner sealed space of the flow path part 11 may form one closed loop.

In this embodiment, the pipe portion 30 preferably includes a heat pipe using a fluid dynamic pressure (FDP), such as a vibrating tubular heat pipe. Hereinafter, as an example of a hydrodynamic type heat pipe, a basic operation principle of a vibrating tubular heat pipe will be described with reference to FIG. 2.

As shown in FIG. 2, the vibrating tubular heat pipe injects the working fluid 41 into the pipe 31 and the flow path part 11 forming the tubular pipe to form the working fluid 41 and the bubble 45. After forming at a predetermined ratio, the interior of the customs can be sealed from the outside. This heat pipe has a heat transfer mechanism for transporting a large amount of heat in latent heat by volume expansion and condensation of the working fluid 41 and the bubble 45.

Looking at the basic principle, as the nuclear boiling (Nucleate Boiling) occurs in the flow path portion 11 absorbed heat bubbles are located in the flow path portion 11 to expand the volume. At this time, since the flow path part 11 and the pipe 31 maintain a constant internal volume, the bubbles located in the pipe part 30 contract as much as the bubbles located in the flow path part 11 expand their volume. . Accordingly, as the pressure equilibrium in the flow path part 11 and the pipe 31 collapses, the pipe part 30 is accompanied by a flow including vibrations of the working fluid 41 and the bubble 45, and the bubble 45. The heat dissipation function is performed by carrying out latent heat transfer by the temperature increase and decrease by the volume change of.

Unlike conventional heat pipes, these vibrating tubular heat pipes do not contain wicks, making them easy to manufacture. In addition, since there is no restriction on the installation direction, there is an advantage that the installation constraint is less than the thermosyphon type heat pipe of the structure that the heat radiating portion must be located below the flow path portion. In addition, since the heat transfer type is different from that of the heat sink type heat dissipation device, since the size limitation due to the structural limitation of the heat pipe itself is not limited, the size may be varied according to the type or shape of the heat generating source.

In addition, in the heat pipe type heat dissipation device according to the embodiment of the present invention, as shown in FIGS. 2 and 4, the first to fourth coupling portions (2) are formed on the second surface 10b of the thermal block 10. The adhesive injection groove 25 may be further formed to communicate with at least one of the 15a, 15b, 15c, and 15d. In this case, the liquid adhesive 27 is applied to the adhesive injection groove 25 in a state where the pipes 31 are respectively inserted into the first to fourth coupling parts 15a, 15b, 15c, and 15d. Inject. The injected adhesive 27 is supplied along the adhesive injection groove 25 to the coupling portion 15 in communication therewith, and the first to fourth coupling portions 15a, 15b, 15c, and 15d are connected to the coupling portion 15. Each of the plurality of pipes 31 is coupled. In this way, by further forming the adhesive injection groove 25, there is an advantage that the number of assembling can be reduced compared to the method of combining the pipes individually when the plurality of pipes are combined on the thermal block 10.

In addition, in the heat pipe type heat dissipation device according to the embodiment of the present invention, as shown in FIGS. 2 and 3, the fluid inlet 21 is provided in the thermal block 10 so as to communicate with the flow path part 11. Can be formed. In addition, the present invention may further include a sealing cap 23 for sealing the fluid inlet (21).

The fluid inlet and outlet 21 is formed through at least one position of the side surface of the thermal block 10. Here, the injection process of the working fluid 41 is performed after the pipe part 30 is installed in the thermal block 10 and the flow path part 11 is sealed by the thermal plate 50. The working fluid 41 may be injected into the internal space of the flow path part 11 and the internal space of the pipe part 30 communicated with the fluid inlet and outlet 21. After the injection of the working fluid 41 is completed, by sealing the fluid inlet 21 through the sealing cap 23, it is possible to form a heat pipe structure. As such, by forming the fluid inlet and outlet 21, there is an advantage that the working fluid 41 can be easily injected into the pipe part 30.

In addition, the heat pipe type heat dissipation device according to the embodiment of the present invention may further include a heat sink 35 coupled to the pipe portion 30, as shown in FIG.

The heat sink 35 may include a guide part 35a for guiding heat flow and a grip part 35b coupled to each of the plurality of pipes 31. The guide part 35a is formed to protrude on one side or both sides of the heat sink 35, expands the heat dissipation area of the heat sink 35, and guides the flow of heat. As such, by forming the guide part 35a, the heat dissipation direction can be determined so as to be suitable for the arrangement of the device to which the heat dissipation device according to the present invention is applied. The grip part 35b may be provided to be elastically coupled to the pipe 31 to allow the heat sink 35 to be coupled to each of the pipes 31 without using a separate fastening structure or adhesive.

In addition, the heat pipe type heat dissipation device according to the embodiment of the present invention may further include a heat dissipation fan 60 installed adjacent to the pipe portion 30, as shown in FIG.

The heat dissipation fan 60 is installed with the pipe part 30 interposed on the thermal block 10 through a support 61 screwed to the thermal block 10. The heat dissipation fan 60 includes a driving source 63 fixed to the support 61 and a rotation blade 65 installed at the driving source 63.

As such, when the heat dissipation fan 60 is further included, heat dissipation efficiency may be improved by promoting diffusion of heat radiated from the pipe part 30. At this time, the heat dissipation fan 60 is rotationally driven in a state in which the rotation speed is reduced as compared with the conventional heat dissipation device of the heat sink type. This is to reduce the noise generated during the rotation of the heat radiating fan 60 and to reduce power consumption.

In addition, in the above-described first embodiment, the flow path portion 11 is shown as an example formed on the first surface 10a of the thermal block 10, but is not limited thereto. That is, as shown in FIG. 6, the flow path part 151 may be formed on one surface of the thermal plate 150 facing the thermal block 110. In this case, the thermal block 110 has a coupling part 110a through which the pipe part 30 is coupled.

In addition, the flow path portions 11 and 151 may be formed in both the thermal blocks 10 and 110 and the thermal plates 50 and 151. In this case, the fluid inlet and outlet 21 penetrates at least one part of the side surface of at least one of the thermal blocks 10 and 110 and the thermal plates 50 and 150.

In addition, in the above-described first embodiment, a structure in which the thermal block 10 and the thermal plate 50 are combined by an adhesive 55 is illustrated as an example, but is not limited thereto. For example, the thermal block 10 may be integrally formed with the thermal plate 50. In this case, the flow path portion 11 is formed inside the thermal block and the thermal plate formed integrally with each other.

In addition, in the above embodiment, a configuration in which the pipe part 30 is radially disposed as an example of the heat pipe type heat dissipation device is illustrated as an example, but is not limited thereto. That is, the heat pipe type heat dissipation device may be deformed into various shapes in consideration of a space, a shape of a heat generating source, a size, and a heat dissipation efficiency.

7 is a schematic cross-sectional view showing a heat pipe type heat dissipation device according to a third embodiment of the present invention.

Referring to the drawings, a heat pipe type heat dissipation device according to a third embodiment of the present invention includes a thermal block 210 having a flow path portion 211 and a coupling portion 215 for absorbing heat from a heat source 5. It is installed on the coupling portion 215, and includes a pipe portion 230 for dissipating heat, and a working fluid 241.

In the heat dissipation device according to the third embodiment of the present invention, the thermal spreader 9 of the heat generating source 5 is a thermal plate (compared with the heat dissipation device according to the first embodiment described with reference to FIGS. 1 to 5). It distinguishes in the role of 50) of FIG. That is, the heat generating source 5 applied to this embodiment is formed on the substrate 6, the semiconductor chip 7 mounted on the substrate 6, and the semiconductor chip 7 so as to surround the semiconductor chip 7. And a thermal spreader 9 for diffusing and dissipating heat generated in the semiconductor chip 7. Here, the thermal block 210 may be formed according to the size of the thermal spreader 9, and the flow path part 211 may be sealed through the thermal spreader 9. In this case, since heat generated in the heat generating source 5 is directly transmitted to the flow path part 211, heat dissipation efficiency can be further increased, and manufacturing cost can be reduced by not using a separate thermal plate 50. .

8 is an exploded perspective view illustrating a heat pipe type heat dissipation device according to a fourth embodiment of the present invention, and FIG. 9 is a view illustrating a plurality of pipes disposed radially in the heat pipe type heat dissipation device according to a fourth embodiment of the present invention. 10 is a perspective view showing a pipe of a heat pipe type heat dissipation device according to a fourth embodiment of the present invention.

Referring to the drawings, the pipe part 330 of the heat pipe type heat dissipation device according to the fourth embodiment of the present invention includes a plurality of pipes 331 having one end 331a open. Each pipe 331 is disposed radially adjacent to the heat generating source 1 ′. The pipe 331 communicates with the flow path part 321 and is arranged substantially horizontally, and the first heat dissipation part 333 communicates with the first heat dissipation part 333, and the second heat dissipation that forms the outer circumference of the pipe part 330. A portion 335 is included.

The pipe 331 according to the present embodiment is a pipe according to the preceding embodiments in that the length of the pipe 331 is disposed relatively longer than the radial shortest straight line when viewed in plan view (see FIG. 9). (See 31 in FIG. 1). For this purpose, the pipe 331 may be formed in a helical shape as shown in FIG. 9. Alternatively, it may be formed in another curved shape such as a serpentine shape, may be formed in a straight line having a predetermined angle with a shortest straight line, or may be formed in various waveforms. In this way, the heat dissipation area can be increased by lengthening the pipe 331.

As shown in FIG. 10, the pipe 331 may further include at least one protrusion radiator 337 and 338. In FIG. 10, the first protrusion heat dissipation part 337 protrudes substantially parallel to the first heat dissipation part 333, and the second protrusion heat dissipation part 338 protrudes substantially parallel to the second heat dissipation part 335. The protruding direction of the protruding radiators 337 and 338 may be changed in various ways according to design needs.

The heat pipe type heat dissipation device according to the present embodiment may further include a thermal block 310, a thermal plate 350, a heat dissipation fan 360, and other components not shown in the same manner as in the preceding embodiments. .

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the invention described in the claims below.

1 is an exploded perspective view showing a heat pipe type heat dissipation device according to a first embodiment of the present invention.

2 is a partial cross-sectional view showing a heat pipe type heat dissipation device according to a first embodiment of the present invention.

Figure 3 is a partial perspective view showing the main portion of the heat pipe type heat dissipation device according to the first embodiment of the present invention.

Figure 4 is a partial plan view showing the main portion of the heat pipe type heat dissipating device according to the first embodiment of the present invention.

Figure 5 is a rear view showing the main portion of the heat pipe type heat dissipating device according to the first embodiment of the present invention.

Figure 6 is an exploded perspective view showing a heat pipe type heat dissipation device according to a second embodiment of the present invention.

Figure 7 is a schematic cross-sectional view showing a heat pipe type heat dissipation device according to a third embodiment of the present invention.

Figure 8 is an exploded perspective view showing a heat pipe type heat dissipation device according to a fourth embodiment of the present invention.

9 is a plan view showing a plurality of pipes disposed radially in the heat pipe type heat dissipation device according to the fourth embodiment of the present invention.

10 is a perspective view showing a pipe of a heat pipe type heat dissipation device according to a fourth embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

1, 1 ', 5: Heating source 6: Substrate

7: semiconductor chip 9: thermal spreader

10, 110, 210, 310: thermal block 11, 151, 211: flow path part

15, 110a, 215: coupling part 30, 230, 330: pipe part

31, 331: pipe 35: heat sink

41, 241: working fluid 45: bubble

50, 150, 350: thermal plate 60, 360: heat dissipation fan

Claims (17)

A thermal plate on which a heating source is installed; A thermal block installed on the thermal plate and transferring heat; A pipe part coupled to the thermal block and dissipating heat transferred from the thermal block, A flow path portion is formed on at least one of the first surface of the thermal block and one surface of the thermal plate facing the first surface, and the flow path portion communicates with the flow path portion on a second surface different from the first surface of the thermal block. And a coupling part to which the pipe part is coupled, and a working fluid is injected into the pipe part and the flow path part. The pipe part has at least one end opening and includes a plurality of pipes disposed radially about the heat generating source. And the length of each pipe is longer than the radially shortest straight line. The method of claim 1, Each pipe is A first heat radiating part disposed radially to have a length longer than a radial shortest straight line; And a second heat dissipation unit communicating with the first heat dissipation unit, forming an outer periphery of the pipe unit, and arranged at an angle with respect to a plane formed by the first heat dissipation unit. The method of claim 2, Each pipe is And at least one projecting heat dissipation part between the first heat dissipation part and the second heat dissipation part. The method of claim 1, The flow path unit, A plurality of first flow path portions having an inner portion located in a central portion of at least one of the thermal block and the thermal plate and arranged radially; A plurality of second flow path portions radially arranged between the plurality of first flow path portions; And a plurality of third flow path parts arranged in at least one row on the outside of the first and second flow path parts. The method of claim 4, wherein The third passage portion is arranged in two rows on the outside of the first and second passage portion, And a sum of the number of the first and second flow path parts and the number of the inner rows of the third flow path part is equal to the sum of the number of the outer rows of the third flow path part. The method of claim 5, The coupling part A plurality of first coupling parts communicated with both ends of each of the plurality of first flow path parts; A plurality of second coupling portions communicating with both ends of each of the plurality of second flow path portions and arranged substantially on the same radius as the first coupling portion; A plurality of third coupling parts connected to both ends of each of the third channel parts arranged in an inner row of the plurality of third channel parts; And a plurality of fourth coupling parts connected to both ends of each of the third flow path parts arranged in an outer row of the plurality of third flow path parts. The method of claim 6, Each of the plurality of pipes, One end is coupled to the fourth coupling portion, the other end is coupled to any one of the first to third coupling portion heat pipe type heat dissipation device. The method of claim 7, wherein On the second surface of the thermal block The adhesive injection groove is further formed in communication with at least one of the first to fourth coupling portion, The heat pipe type heat dissipation device, characterized in that the plurality of pipes can be coupled to the first to fourth coupling portion by injecting adhesive through the adhesive injection groove. The method according to any one of claims 1 to 8, And the thermal plate is coupled to the thermal block by an adhesive applied by a silk screen method to prevent leakage of the working fluid. The method according to any one of claims 1 to 8, And said thermal plate and said thermal block are integrally formed. The method according to any one of claims 1 to 8, And said thermal plate is a thermal spreader of said heat generating source. The method according to any one of claims 1 to 8, At least one of the thermal block and the thermal plate is a fluid inlet is formed in communication with the flow path portion, the heat pipe type heat dissipating device, characterized in that the injection of the working fluid through the fluid inlet. The method according to any one of claims 1 to 8, Heat pipe type heat dissipation device further comprises a heat sink coupled to the pipe part. The method according to any one of claims 1 to 8, And a heat radiation fan installed adjacent to the pipe portion. The method according to any one of claims 1 to 8, And the pipe part is formed of at least one material selected from aluminum, copper, and alloys thereof. The method according to any one of claims 1 to 8, The thermal block is a heat pipe type heat dissipation device, characterized in that formed of at least one material selected from aluminum, zinc and alloys thereof. The method of claim 15, The thermal block A block body made of a zinc alloy; And a plating layer made of at least one material selected from aluminum, copper, and alloys thereof on the block body.

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