KR101180495B1 - LED lighting apparatus and headlight having the same - Google Patents

Abstract

Disclosed are an LED lighting device and a vehicle headlight having the same. LED module, the light guide member which is disposed adjacent to the LED module and guides the light emitted from the LED module toward the object, the heat transfer member that is coupled to the LED module and absorbs heat of the LED module, tubular type LED lighting device comprising a heat pipe loop having a heat absorbing portion is formed into a working fluid is injected into the heat transfer member and absorbs heat and absorbs heat absorbed by the heat absorbing portion, a large heat dissipation area and high heat transfer By constructing a heat dissipating device having a high performance, it can have a simple structure without a cooling fan while having a high output, and since it can radiate itself without an additional cooling device such as a cooling fan, there can be no residual trouble and easy maintenance.

Description

LED lighting apparatus and headlight having same {LED lighting apparatus and headlight having the same}

The present invention relates to an LED lighting device and a vehicle headlight having the same.

In the lighting device using the LED (LED) generates a large amount of heat due to the heat generated by the LED. In general, when the electronic device is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation device is required for the LED lighting device to prevent overheating.

In particular, in the case of the headlights for vehicles using LEDs because the high output of the LED is used, the heat generation is also very large, and heat radiation to prevent overheating is important.

As a conventional heat dissipating device for a headlight using an LED, a heat dissipating device having a heat dissipation fin structure has been disclosed.

However, the heat dissipation device of the heat dissipation fin structure has a problem that it is difficult to keep the surface area of the heat dissipation fin wide in a situation where the size of the heat absorbing portion is small due to the small size of the LED module. In addition, even if the surface area of the heat dissipation fin is widened, the distance between the heat absorbing portion and the heat dissipating portion is farther, and thus the heat transfer speed is lowered.

Accordingly, a method of additionally providing a cooling fan has been proposed to overcome the limitations of the heat dissipation device of the heat dissipation fin structure. However, the structure is complicated by the installation of the cooling fan. have.

The present invention provides a LED lighting device having a high heat transfer performance and a high heat dissipation efficiency and a simple structure, and a vehicle headlight having the same.

In addition, the present invention is to provide an LED lighting device and a vehicle headlight having the same is easy to maintain without causing trouble.

According to an aspect of the present invention, an LED module (LED), disposed adjacent to the LED module, the light guide member for guiding the light so that the light emitted from the LED module toward the object, coupled to the LED module And a heat transfer member for absorbing heat of the LED module, formed in a tubular shape, and a working fluid is injected therein; An LED lighting device is provided that includes a heat pipe loop.

The heat transfer member may include a wick type heat transfer pipe having a wick formed on an inner wall thereof and into which a working fluid is injected.

The heat transfer pipe is bent to face both ends, and the heat pipe loop may be wound and coupled to opposite ends of the heat transfer pipe.

The heat transfer member may further include a heat transfer block coupled to the LED module and the heat transfer pipe and transferring heat generated from the LED module to the heat transfer pipe.

The heat transfer member may be coupled to support the LED module and the heat pipe loop, and may include a thermal base configured to transfer heat generated from the LED module to the heat pipe loop.

The thermal base is formed with a trench heat-transfer groove, the heat pipe loop is formed in a spiral structure that repeatedly forms the heat absorbing portion and the heat dissipating portion, the heat absorbing portion is inserted into the trench-shaped heat transfer groove. Can be combined.

The heat pipe loop may be radially disposed along an edge of the thermal base.

In addition, according to another aspect of the present invention, there is provided a vehicle headlight comprising the above-described LED lighting apparatus.

According to the present invention, a heat dissipation device having a large heat dissipation area and a high heat transfer performance can be configured to configure an LED lighting device having a simple structure without a cooling fan while having a high output.

In addition, since the LED lighting device is heat dissipated by itself without an additional cooling device, such as a cooling fan, there can be no trouble remaining and easy maintenance.

1 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.
Figure 2 is an exploded perspective view showing the LED lighting apparatus according to an embodiment of the present invention.
3 is a plan view showing the LED lighting apparatus according to an embodiment of the present invention.
Figure 4 is a side view showing the LED lighting apparatus according to an embodiment of the present invention.
Figure 5 is a perspective view showing a heat pipe loop of the LED lighting apparatus according to an embodiment of the present invention.
Figure 6 is a perspective view of the LED lighting apparatus according to another embodiment of the present invention.
Figure 7 is an exploded perspective view showing the LED lighting apparatus according to another embodiment of the present invention.
8 is a plan view showing the LED lighting apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing an LED lighting apparatus according to an embodiment of the present invention, Figure 3 is according to an embodiment of the present invention The top view which shows LED lighting apparatus.

LED lighting apparatus according to an embodiment of the present invention includes an LED module 10, the reflector 20, the heat transfer member 30, the heat pipe loop (40).

The LED module 10 is a part that generates the light necessary for lighting by having an LED (LED) 12 that can emit light using electrical energy.

2 and 3, the LED module 10 of the present embodiment includes an LED 12 and a module substrate 14 on which the LED 12 is mounted, and the LED module 10 includes a support member. It is supported by 15 and is disposed to face the reflector 20.

In addition, in this embodiment, a high output LED 12 is used so that the LED lighting device can be used as a vehicle headlight.

The light guide member 20 is a part that guides the light so that the light emitted from the LED module 10 is directed to the object. To this end, the light guide member 20 is disposed adjacent to the LED module 10 to receive the light emitted from the LED module 10.

In this embodiment, the reflector is used as the light guide member 20 for guiding light. Specifically, the reflector is disposed to surround the LED module 10 so that the light emitted from the LED module 10 can be reflected toward the object.

As shown in Figures 2 and 3, the reflector of the present embodiment receives the light emitted from the LED 12 as a concave reflector and converts it into a parallel bundle of rays, the shape of the light required for a vehicle headlight to shoot the light forward To form.

Meanwhile, in the present embodiment, the reflector is presented as the light guide member 20. However, the light guide member 20 is not limited thereto, and various optical means for adjusting the path of light by refracting or reflecting light, such as a lens, may be provided. It can be used as the light guide member (20).

The heat transfer member 30 is a portion directly or indirectly coupled to the LED module 10 to suck heat emitted from the LED module 10 and to absorb and absorb heat absorbed by the LED module 10 to the heat pipe loop 40 to be described later.

In particular, the heat transfer member 30 of the present embodiment is a weak heat transfer pipe 31 disposed adjacent to the LED module 10 so that a large amount of heat generated from the LED 12 module can be quickly transferred to the heat dissipation unit 40b. ).

The wick type heat transfer pipe 31 includes a sealed pipe into which a working fluid is injected, a wick in which the working fluid moves on the inner wall of the pipe, and a vapor moving space in which the working fluid vaporized in the pipe moves. Looking at a specific function, the working fluid vaporized in the heat transfer portion is moved to the heat transfer unit 32 for transferring heat to the outside through the steam moving space. Then, the vaporized working fluid moved to the heat transfer unit 32 is condensed to transfer the heat of vaporization to the heat transfer unit 32. The condensed working fluid is returned to its original position via the wick. Accordingly, a heat transfer cycle for transferring heat to the heat transfer part 32 is achieved.

The wick type heat transfer pipe 31 having the above-described heat transfer structure has a tube having a relatively large diameter as compared to the heat pipe loop 40, and a large amount of working fluid is injected therein. Accordingly, through the process of vaporizing and condensing a large number of working fluids at a time, a large amount of heat can be quickly transferred to the heat transfer section (32). Therefore, the heat generated from the LED module 10 may be quickly transferred to the heat pipe loop 40 so as not to accumulate heat, thereby improving heat dissipation efficiency.

Figure 4 is a side view showing the LED lighting apparatus according to an embodiment of the present invention.

As shown in Figs. 2 to 4, the heat transfer pipe 31 of the present embodiment is curved so that both ends thereof face each other (for example, in a 'U' shape). Then, heat pipe loops 40 are wound and coupled to opposite ends of the heat transfer pipe 31. Accordingly, both ends of the heat transfer pipe 31 may be the heat transfer portion 32 to transfer heat to the heat pipe loop 40.

In addition, the heat transfer pipe 31 of the present embodiment may be coupled to the LED module 10 through the heat transfer block 33 to absorb heat generated by the LED module 10. For example, the heat transfer pipe 31 is sandwiched and coupled between the heat transfer blocks 33 formed of the upper block 33a and the lower block 33b, and the LED module 10 is coupled to the upper block 33a. 10 and the heat transfer pipe 31 may be combined to enable heat transfer. At this time, the heat transfer block 33 is made of a material containing copper, aluminum and the like having a high heat transfer characteristics. In addition, the heat shield 33 may be assembled and supported with a reflector.

On the other hand, the heat transfer pipe 31 may be directly coupled to the LED module 10 by soldering or the like, in addition to the method indirectly coupled to the LED module 10 through the heat transfer block 33.

The heat pipe loop 40 is coupled to the heat transfer member 30 to absorb heat and radiate the absorbed heat to the outside. In particular, in this embodiment, in order to dissipate a large amount of heat quickly, a vibrating tubular heat pipe loop 40 is used.

Figure 5 is a perspective view showing a heat pipe loop of the LED lighting apparatus according to an embodiment of the present invention.

As shown in FIGS. 4 and 5, the heat pipe loop 40 includes a heat absorbing portion 40a and a heat dissipating portion 40b, and bubbles 44 are provided in the heat absorbing portion 40a and the heat dissipating portion 40b. Together with the working fluid 43 is injected. The heat absorbing portion 40a is coupled to the heat transfer pipe 31 that transfers heat to absorb heat. Then, the heat radiating portion 40b is located away from the heat transfer pipe 31 and communicates with the heat absorbing portion 40a, thereby dissipating heat transferred from the heat absorbing portion 40a to the outside.

Specifically, the heat pipe loop 40 of this embodiment consists of a vibrating tubular heat pipe using fluid dynamic pressure.

The vibrating tubular heat pipe has a structure in which the working fluid 43 and the bubble 44 are injected at a predetermined ratio into the tubule 41 and the inside of the tubule 41 is sealed from the outside. Accordingly, the vibrating tubular heat pipe has a heat transfer cycle for transporting a large amount of heat in latent heat form by volume expansion and condensation of the bubble 44 and the working fluid 43.

Looking at the heat transfer mechanism, the nuclear boiling (Nucleate Boiling) occurs by the amount of heat absorbed in the heat absorbing portion (40a) and the bubbles 44 located in the heat absorbing portion (40a) is to expand the volume. At this time, since the tubule 41 maintains a constant internal volume, the bubbles 44 positioned in the heat dissipating portion 40b contract as the bubbles 44 positioned in the heat absorbing portion 40a have a volume expansion. Accordingly, as the pressure equilibrium in the tubule 41 collapses, the heat pipe is accompanied by a flow including vibrations of the working fluid 43 and the bubbles 44, and accordingly, the temperature rises due to the volume change of the bubbles 44. By the latent heat transport by the heat radiation function.

Here, the heat pipe loop 40 may include a capillary tube 41 made of a metal material such as copper and aluminum having high thermal conductivity. Accordingly, while conducting heat at a high speed, the volume change of the bubbles 44 injected therein can be caused quickly.

In addition, the communication structure of the heat pipe loop 40 may be both an open loop and a close loop. Also, when there are a plurality of heat pipe loops 40, all or part of the heat pipe loops 40 may be in communication with neighboring heat pipe loops 40. Accordingly, the plurality of heat pipe loops 40 may have an overall open loop shape or a closed loop shape as required by design.

At this time, as shown in Figure 4, the heat pipe loop 40 of the present embodiment is formed in a spiral structure wound on both ends of the heat transfer pipe (31). The tubular pipe 41 forming the heat pipe loop 40 has a smaller diameter than the heat pipe 31. Accordingly, the customs 41 forming the heat pipe loop 40 may be coupled to the heat transfer part 32 of the heat transfer pipe 31 in various parts. Therefore, the area of the heat absorbing portion 40a of the heat pipe loop 40 is greatly increased, so that the heat pipe loop 40 can efficiently absorb a large amount of heat transferred through the heat transfer pipe 31.

In the spiral heat pipe loop 40, a plurality of capillaries 41 arranged side by side between the heat transfer pipes 31 become the heat dissipation portion 40b. Therefore, the area of the heat dissipation portion 40b of the heat pipe loop 40 is greatly increased, so that heat inside the heat pipe loop 40 can be efficiently dissipated.

Therefore, it is possible to configure the LED lighting device having a simple structure without a cooling fan while having a high output by configuring a heat radiating device having a large heat dissipation area and high heat transfer performance. Accordingly, the LED lighting device capable of heat dissipation without the need for an additional cooling device such as a cooling fan may be configured so that there is no remaining trouble and easy maintenance.

Next, an LED lighting apparatus according to another embodiment of the present invention will be described.

6 is a perspective view showing the LED lighting apparatus according to another embodiment of the present invention, Figure 7 is an exploded perspective view showing the LED lighting apparatus according to another embodiment of the present invention, Figure 8 is a different embodiment according to the present invention The top view which shows LED lighting apparatus.

The LED lighting apparatus according to the present embodiment is different from the above-described embodiment in that the thermal base 35 supporting the LED module 10 and the heat pipe loop 45 is used as a heat transfer member.

The thermal base 35 receives heat generated by the LED module 10 and transmits the heat generated by the LED module 10 to the heat pipe loop 45, and also supports the LED module 10 and the heat pipe loop 45. To this end, the thermal base 35 is coupled to the LED module 10 and the heat pipe loop 45 to enable heat transfer.

In particular, the thermal base 35 of the present embodiment is formed with heat transfer grooves 36 into which the heat pipe loops 45 are inserted and coupled. At this time, the heat transfer grooves 36 are formed in a trench shape, that is, in the form of a trench so that the heat pipe loop 45 may be easily inserted and stably supported. After the heat pipe loop 45 is inserted, the heat transfer groove 36 is filled with solder or the like, such that the heat pipe loop 45 may be easily coupled to the thermal base 35.

6 and 7, the thermal base 35 of this embodiment is formed in a disc shape, and an annular heat transfer groove 36 is formed along the edge region of the thermal base 35. As shown in FIG. Accordingly, the heat pipe loop 45 inserted into the heat transfer grooves 36 may be disposed in a cylindrical shape to secure a large surface area. In addition, the cylindrical heat pipe loop 45 has a radial structure that is advantageous to dissipate heat of the heat generating source and the thermal base 35 disposed inside.

At this time, the heat pipe loop 45 is formed in a spiral structure that repeatedly forms the heat absorbing portion 45a and the heat dissipating portion 45b, and the heat absorbing portion 45a repeatedly formed is formed in the trench-shaped heat transfer grooves 36. Inserted and combined successively.

The heat transfer grooves 36 and the heat pipe loops 45 are not limited thereto, but the heat transfer grooves 36 are formed in a polygonal structure or the plurality of heat transfer grooves 36 are arranged in a predetermined pattern. It can have various arrangements.

Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

10: LED module
12: LED
14: module substrate
20: optical guide member
30: heat transfer member
31: electric pipe
32: electric heating part
33: electric heating block
35: thermal base
36: electric heat groove
40, 45: heat pipe loop
41: customs
43: working fluid
44: bubble
40a, 45a: heat absorbing portion
40b, 45b: heat dissipation unit

Claims (8)

LED module;
An optical guide member disposed adjacent to the LED module and configured to guide the light so that light emitted from the LED module is directed to an object;
A heat transfer member coupled to the LED module to absorb heat of the LED module; And
A heat pipe loop formed in a tubular shape, in which a working fluid is injected, and having a heat absorbing portion coupled to the heat transfer member to absorb heat and a heat dissipating portion releasing heat absorbed from the heat absorbing portion,
The heat transfer member,
The LED lighting device is coupled to support the LED module and the heat pipe loop, characterized in that it comprises a thermal base for transferring the heat generated in the LED module to the heat pipe loop.
The method of claim 1,
The heat transfer member,
LED lighting device, characterized in that the wick is formed on the inner wall and comprises a wick-type heat transfer pipe is injected into the working fluid.
The method of claim 2,
The heat transfer pipe is bent to face both ends,
LED lighting apparatus, characterized in that the heat pipe loop is wound and coupled to opposite ends of the heat transfer pipe.
The method of claim 2,
The heat transfer member,
The LED lighting device is coupled to the LED module and the heat transfer pipe, and further comprising a heat transfer block for transferring the heat generated in the LED module to the heat transfer pipe.
delete The method of claim 1,
Trench-shaped heat-transfer grooves are formed in the thermal base.
The heat pipe loop is formed of a spiral structure that repeatedly forms the heat absorbing portion and the heat dissipating portion, the heat absorbing portion LED lighting apparatus, characterized in that the insertion is coupled to the trench-shaped heat transfer groove.
The method of claim 1,
The heat pipe loop, LED lighting apparatus, characterized in that disposed radially along the edge of the thermal base.
A vehicle headlight comprising the LED lighting device according to any one of claims 1 to 4, 6 and 7.

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