KR200401354Y1 - Cooling Structure for Liquid Crystal Display - Google Patents

Cooling Structure for Liquid Crystal Display Download PDF

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Publication number
KR200401354Y1
KR200401354Y1 KR20-2005-0025873U KR20050025873U KR200401354Y1 KR 200401354 Y1 KR200401354 Y1 KR 200401354Y1 KR 20050025873 U KR20050025873 U KR 20050025873U KR 200401354 Y1 KR200401354 Y1 KR 200401354Y1
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South Korea
Prior art keywords
heat
liquid crystal
crystal display
heat pipe
led
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KR20-2005-0025873U
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Korean (ko)
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장혁
최유진
이성봉
차준선
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티티엠주식회사
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Priority to KR20-2005-0025873U priority Critical patent/KR200401354Y1/en
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133382Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133608Direct backlight including particular frames or supporting means

Abstract

본 고안은 발열 광소자인 엘이디(LED)를 광원으로 사용하는 백라이트유닛(BLU)을 포함하는 액정표시장치의 방열구조에 있어서, 판형 히트파이프와 히트싱크가 결합된 방열성능이 우수한 냉각모듈을 제공하여 제품의 신뢰성과 내구성을 향상시킬 수 있다. 히트싱크를 액정표시장치 외부 샤시 상부 공간에 위치시켜 LED에서 발생되는 고발열량에 대응 가능하고 박형화가 가능한 액정표시장치 방열구조를 제공할 수 있다.The present invention provides a cooling module having excellent heat dissipation performance combined with a plate-type heat pipe and a heat sink in a heat dissipation structure of a liquid crystal display device including a backlight unit (BLU) using a heat generating optical element (LED) as a light source. Product reliability and durability can be improved. The heat sink may be positioned in an upper space of the outer chassis of the liquid crystal display to provide a heat dissipation structure capable of responding to high heat generated from the LED and making it thinner.

Description

액정표시장치의 방열구조{Cooling Structure for Liquid Crystal Display}      Cooling Structure for Liquid Crystal Display
본 고안은 엘이디(이하 LED)를 광원으로 하는 백라이트유닛(이하 BLU)을 포함하는 액정표시장치의 방열구조에 관한 것으로, 보다 상세하게는 LED에서 발생되는 열을 외부로 방열함에 있어, 열이송 능력이 일반금속에 비하여 매우 우수한 히트파이프를 열이송매체로 이용하고 액정표시장치 외부 샤시 상부 공간에 히트파이프로 이송된 열을 방열하는 히트싱크를 위치시킨 방열구조를 갖는다. 상기 히트파이프는 방열모듈의 박형화를 위하여 판형의 형태를 취한다. The present invention relates to a heat dissipation structure of a liquid crystal display device including a backlight unit (hereinafter referred to as a BLU) having an LED as a light source, and more particularly, in heat dissipating heat generated from the LED to the outside, It has a heat dissipation structure in which a heat pipe that is much superior to this general metal is used as a heat transfer medium, and a heat sink for dissipating heat transferred to the heat pipe is disposed in the upper space of the outer chassis of the liquid crystal display device. The heat pipe takes the form of a plate for thinning the heat dissipation module.
일반적으로 TFT-LCD 등 LCD는 자체적으로 발광할 수 없는 수광소자이므로 외부 광원의 공급이 필요하며, 이 빛을 제공하여 주는 장치가 BLU이다. BLU에 사용되는 광원에는 냉음극형광램프(CCFL),발광다이오드(LED),면광원(FFL)등이 있다. 최근 들어 냉음극형광램프가 주도하던 광원시장에서 고수명,저전력소모,친환경적,박형화의 장점을 갖는 LED 채용이 증가되고있다. LED 상기의 장점을 갖고 있는 반면, 광효율이 20~30%정도로 낮은 단점을 가지고 있다. 32인치 TFT-LCD의 BLU에 사용되는 LED의 개수는 약 400정도이며(LED 1개당 소모전력을 1W정도), 여기서 발생되는 열은 대략 280W정도이다. 이러한 고열을 방열하지 못하면, LED가 실장된 LED인쇄회로기판의 단락을 유발하여 BLU 동작 불능을 야기시키고, 관련 전자부품들이 고온 환경에서 동작함에 의하여 내구성 및 신뢰성이 크게 저하된다.In general, LCDs, such as TFT-LCDs, are light-receiving elements that cannot emit light on their own, and therefore, an external light source needs to be supplied. Light sources used in BLU include cold cathode fluorescent lamps (CCFL), light emitting diodes (LED), surface light sources (FFL), and the like. In recent years, the adoption of LEDs having the advantages of long life, low power consumption, eco-friendliness, and thinning in the light source market led by cold cathode fluorescent lamps has been increasing. LED has the above advantages, but has a low light efficiency of about 20 to 30%. The number of LEDs used in the BLU of 32-inch TFT-LCD is about 400 (about 1W of power consumption per LED), and the heat generated is about 280W. Failure to dissipate these high temperatures can cause short circuits of the LED printed circuit board on which the LEDs are mounted, causing the BLU to be inoperable, and the durability and reliability of the electronic components in the high temperature environment are greatly degraded.
종래 액정표시장치의 BLU 광원으로 주로 사용되는 냉음극형광램프는 발열량이 LED에 비하여 매우 적어, BLU를 수용하는 구조체인 BLU프레임(60)을 방열체로 사용하거나 또는 그 후면부에 핀 형상의 방열체(100)를 장착하여 광원 등 발열원으로부터 발생되는 열을 자연대류 혹은 강제대류를 이용하여 외부로 방열시킨다.The cold cathode fluorescent lamp mainly used as a BLU light source of a conventional liquid crystal display device has a very low heat generation compared to the LED, so that the BLU frame 60, which is a structure accommodating the BLU, is used as a heat sink or a fin-shaped heat sink at the rear side thereof. 100) to dissipate heat generated from heat sources such as light sources to the outside using natural or forced convection.
도2는 종래 기술에 의한 액정표시장치의 방열구조를 나타낸다. 최근 들어 액정표시장치의 BLU 광원으로 LED 채용이 증가되고 있는 추세이다. LED(51)에서 발생한 열을 BLU프레임(60) 후면에 장착된 방열체(100)를 통하여 외부로 방열시키고 있지만, 방열체(100)의 부피가 증가되어 액정표시장치의 박형화에 역행하는 문제점을 갖고 있다. 또한 방열을 촉진하기 위하여 대용량 냉각팬을 채용하고 있지만, 큰 소음이 발생하는 문제을 갖고 있다.2 shows a heat radiation structure of a liquid crystal display device according to the prior art. Recently, the adoption of LED as the BLU light source of the liquid crystal display device is increasing. The heat generated from the LED 51 is radiated to the outside through the heat sink 100 mounted on the rear of the BLU frame 60, but the volume of the heat sink 100 is increased to counteract the thinning of the liquid crystal display device. Have In addition, although a large-capacity cooling fan is employed to promote heat dissipation, it has a problem of generating loud noise.
이에 본 고안은 상기한 종래 기술상의 문제점을 해결하고 나아가 방열성능을 더욱 향상시키기 위하여 안출된 것으로, 본 고안의 목적은 액정표시장치의 박형화 요구를 만족시키면서 방열성능이 우수한 액정표시장치의 방열구조를 제공하는 것으로, 판형 히트파이프를 LED에서 발생되는 열을 이송하는 매체로 이용하고, 판형 히트파이프 응축부에 결합되어 그 열을 외부로 방열하는 주 수단인 히트싱크를 액정표시장치의 외부 샤시 상부 공간에 위치시킴으로서, 방열 성능이 우수하고 박형화, 경량화가 가능한 액정표시장치의 방열구조를 제공함에 있다.Accordingly, the present invention has been devised to solve the above-mentioned problems in the prior art and further improve heat dissipation performance. An object of the present invention is to provide a heat dissipation structure of a liquid crystal display device having excellent heat dissipation performance while satisfying the thinning requirements of the liquid crystal display device. It is provided by using a plate heat pipe as a medium for transferring heat generated from the LED, the heat sink which is the main means for heat dissipating heat to the outside is coupled to the plate heat pipe condensation unit of the upper chassis upper space of the liquid crystal display device By providing in the above, it is possible to provide a heat dissipation structure of a liquid crystal display device which is excellent in heat dissipation performance and which can be thin and lightweight.
이에 상기한 목적을 달성하기 위해 본 고안은 LED를 광원으로 사용하는 BLU(20)를 포함하는 액정표시장치에 있어서, 판형 히트파이프(200)와 히트싱크(220)가 결합된 냉각모듈이 구비되어 박형,경량화되고 방열성능을 향상시킨 것을 특징으로 한다.In order to achieve the above object, the present invention provides a liquid crystal display device including a BLU 20 using an LED as a light source, and includes a cooling module in which a plate heat pipe 200 and a heat sink 220 are combined. It is characterized in that it is thin and lightweight and has improved heat dissipation performance.
상기 판형 히트파이프(200)는 LED패키지회로기판(50) 또는 BLU프레임(60) 후면에 판형 히트파이프(200) 일측의 면이 부착되어 설치되는 것을 특징으로 한다.The plate heat pipe 200 is characterized in that the side surface of the plate-shaped heat pipe 200 is attached to the LED package circuit board 50 or the BLU frame 60 is attached.
상기 LED패키지회로기판(50) 또는 BLU프레임(60) 후면에 설치되는 판형 히트파이프(200)는 중력방향 기준하여 예각으로 설치되는 것을 특징으로 한다. 여기서 판형 히트파이프(200) 내 작동유체 이동 공간인 채널(212)의 형성 방향은 상기 판형 히트파이프의 설치방향과 동일하다.The plate heat pipe 200 installed at the rear of the LED package circuit board 50 or the BLU frame 60 is installed at an acute angle based on the direction of gravity. Here, the direction in which the channel 212, which is the working fluid moving space in the plate heat pipe 200, is formed in the same direction as that of the plate heat pipe.
상기 판형 히트파이프(200)는 박형화와 저열저항화를 위하여 컨테이너(211) 상하면 중 적어도 한면이 일정한 평탄도를 갖는 판형인 것을 특징으로 한다.The plate-shaped heat pipe 200 is characterized in that at least one surface of the upper and lower surfaces of the container 211 has a flatness for thinning and low heat resistance.
상기 히트싱크(220)는 판형 히트파이프(200) 방열 수단으로 중력방향 기준하여 예각으로 설치된 판형 히트파이프(200) 상부에 설치되는 것을 특징으로 한다. The heat sink 220 is characterized in that it is installed on the plate heat pipe 200 is installed at an acute angle with respect to the gravity direction by the heat dissipation means of the plate heat pipe 200.
상기 평판형 히트파이프(200) 상부에 결합된 히트싱크(220)는 액정표시장치의 박형화를 위하여 제 2샤시(12) 상부의 공간에 설치되는 것을 특징으로 한다. 여기서 제1 샤시(11) 상부 공간에도 설치 될 수 있다.The heat sink 220 coupled to the upper portion of the flat heat pipe 200 may be installed in a space above the second chassis 12 to reduce the thickness of the liquid crystal display. Here, the first chassis 11 may be installed in the upper space.
상기 히트싱크(220)이 설치되는 제 2샤시(12) 상부 공간은 공기 이동의 통로 기능을 수행한다. 제2 샤시(12) 일면에 측면 환기구(110a), 상면 환기구(110b) 또는 경사면 환기구(110c)가 설치되는 것을 특징으로 한다. 또한 상기 환기구에 강제대류 유발 수단인 냉각팬(230)이 장착될 수도 있다.The upper space of the second chassis 12 in which the heat sink 220 is installed performs a passage function of air movement. A side ventilation port 110a, an upper surface ventilation port 110b or an inclined surface ventilation port 110c is installed on one surface of the second chassis 12. In addition, the ventilation port may be equipped with a cooling fan 230, which is a means for causing forced convection.
본 고안의 바람직한 실시예 의하면, 판형 히트파이프(200)를 발열 광소자인 LED(51) 후면측에 중력방향 기준하여 예각으로 설치하고, 히트싱크(220)를 판형 히트파이프 상부인 동시에 액정표시장치 외부 샤시 상부 공간에 설치함으로서, 액정표시장치의 박형화에 기여하며, 방열성능 향상을 시켜 액정표시장치 제품 신뢰성과 내구성을 향상시킨다.According to a preferred embodiment of the present invention, the plate-shaped heat pipe 200 is installed at an acute angle on the rear side of the LED 51, which is a heat generating optical element, based on the direction of gravity, and the heat sink 220 is on the plate-shaped heat pipe and at the same time outside the liquid crystal display. By installing in the upper space of the chassis, it contributes to the thinning of the liquid crystal display device and improves the heat dissipation performance to improve the reliability and durability of the liquid crystal display device.
(실시예)(Example)
이하, 본 고안의 바람직한 실시예를 첨부한 도면을 참조하여 상세히 설명한다. Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.
본 고안의 상세한 설명은 본 고안을 예시한 것으로, 여기서 설명되는 실시예에 한정되지 않고 다른 형태로 구현될 수 있음을 밝혀둔다. 상기에서 소개되는 실시예는 개시된 내용이 철저하고 완전해질 수 있도록 그리고 당업자에게 본 고안의 사상과 특징이 충분히 전달될 수 있도록 하기 위해 제공되는 것이다. 첨부된 도면에 있어서, 본 고안의 특징을 명확하게 전달하기 위하여 일부는 과장적으로 도시되었다. 또한 본 명세서에서 자세히 설명되지 아니한 액정표시장치의 일반적 부가부품 및 장치가 구비될 수 있다.The detailed description of the present invention is illustrative of the present invention, and is not limited to the embodiments described herein. The embodiments introduced above are provided to make the disclosed contents thorough and complete, and to fully convey the spirit and features of the present invention to those skilled in the art. In the accompanying drawings, some of the features have been exaggerated to clearly convey the features of the present invention. In addition, general additional parts and devices of the liquid crystal display device which are not described in detail herein may be provided.
도3을 참조하여, 본 고안에 따른 액정표시장치의 냉각구조는 LCD패널(30)과 수광소자인 LCD패널(30)에 광원을 제공하는 백라이트유닛(20), 발열 광소자인 LED(51)에서 발생되는 열을 처리하기 위한 판형 히트파이프(200)와 히트싱크(220)가 결합된 냉각모듈 그리고 상기부품을 결합하는 제1 샤시(11)와 제 2샤시(12) 및 LED 구동회로 등 제어판(70)을 포함하여 구성된다.Referring to Figure 3, the cooling structure of the liquid crystal display device according to the present invention is the LCD panel 30 and the backlight unit 20 for providing a light source to the LCD panel 30 as a light receiving element, the LED 51 as a heating optical element A cooling module in which the plate heat pipe 200 and the heat sink 220 are combined to process the generated heat, and the control panel such as the first chassis 11, the second chassis 12, and the LED driving circuit which combine the components. 70).
백라이트유닛(20)은 도광판(44), 반사시트(43), 확산시트(42), 프리즘시트(41) 등으로 구성되는 광정달부(40)와 그 하부에 위치되는 광원제공원인 LED(51)가 실장된 LED패키지회로기판(50) 그리고 상기 광전달부(40)와 LED패키지회로기판(50) 등 BLU 구성요소를 결합시키는 구조체 역할을 하는 BLU프레임(60)으로 구성된다. BLU프레임(60)은 BLU(20) 구성요소를 지지하는 구조체 역할 외에 부가적으로 LED(51)에서 발생된 열을 확산시키는 방열체 역할도 수행한다.The backlight unit 20 includes a light guide part 40 formed of a light guide plate 44, a reflective sheet 43, a diffusion sheet 42, a prism sheet 41, and the like, and an LED 51 that is a light source park located at a lower portion thereof. The LED package circuit board 50 is mounted, and the BLU frame 60 serving as a structure for coupling the BLU components such as the light transmitting unit 40 and the LED package circuit board 50. The BLU frame 60 additionally serves as a heat sink for diffusing heat generated from the LED 51 in addition to the structure supporting the BLU 20 component.
도4를 참조하여, 판형 히트파이프(200) 상부에 결합되는 히트싱크(220)는 한개 이상으로 분할되어 결합될 수 있으며, 판형 히트파이프(200)를 통하여 이송된 열이 히트싱크(220)를 통하여 방출됨에 있어, 서로간의 열간섭을 최소화 하기 위하여 제2 샤시(12) 상면에 분리벽(120)이 설치된다. 분리벽은 분할된 히트싱크(220) 개수에 비례하여 설치된다. 또한 내외부의 공기유출입이 원활히 이루어지도록 상면에 상면 환기구(110b)가 형성될 수 있다. 도4와 도5는 강제대류 유발 수단인 냉각팬(230)이 구비된 강제대류에 의한 방열구조를 나타낸다. Referring to FIG. 4, the heat sink 220 coupled to the upper portion of the plate heat pipe 200 may be divided into one or more, and heat transferred through the plate heat pipe 200 may cause the heat sink 220 to be separated. In the discharge through, the separation wall 120 is installed on the upper surface of the second chassis 12 in order to minimize the mutual interference between each other. The partition wall is installed in proportion to the number of divided heat sinks 220. In addition, the upper surface ventilating opening (110b) may be formed on the upper surface to facilitate the air flow in and out. 4 and 5 illustrate a heat dissipation structure by forced convection provided with a cooling fan 230 that is a forced convection inducing means.
도5를 참조하여, 강제대류 수단인 냉각팬(230)이 없이 판형 히트파이프(200)를 통하여 히트싱크(220)로 이송된 열이 자연대류에 의하여 열원을 외부로 방열하는 구조를 나타낸 것이다. 자연대류에 의한 방열이 원활히 이루어지도록 하기 위하여 제2 샤시(12)에 측면 환기구(110a)와 경사면 환기구(110c)를 형성시킨다. 측면 환기구(110a)로 외부의 저온 공기가 유입되고, 유입된 공기가 히트싱크(220)에서 열을 취득하여, 경사면 환기구(110c)를 통하여 가열된 공기가 외부로 방출되게 된다.Referring to FIG. 5, the heat transferred to the heat sink 220 through the plate heat pipe 200 without the cooling fan 230, which is the forced convection means, radiates the heat source to the outside by natural convection. In order to facilitate heat dissipation due to natural convection, side ventilation holes 110a and inclined plane ventilation holes 110c are formed in the second chassis 12. External low-temperature air flows into the side vent hole 110a, and the introduced air gets heat from the heat sink 220, and the heated air is discharged to the outside through the inclined plane vent port 110c.
도6와 도7을 참조하여, 제2 샤시(12)에 수용되어 있는 판형 히트파이프(200)와 히트싱크(220)가 결합된 액정표시장치의 방열구조를 보여준다. 도6은 냉각팬(230)이 구비된 강제대류에 의한 본 고안의 바람직한 실시예에 의한 액정표시장치의 방열구조이다. LED(51)에서 발생된 열은 판형 히트파이프(200)를 통하여 상부의 히트싱크(220)로 전달되며, 측면 환기구(110a) 내측에 장착된 냉각팬(230)에 의한 강제대류에 의하여 외부로 열을 방출하게 된다. 도7은 냉각팬이 구비되지 않은 자연대류에 의한 본 고안의 또 다른 바람직한 실시예에 의한 액정표시장치의 방열구조이다. LED(51)에서 발생된 열은 판형 히트파이프(200)를 통하여 상부의 히트싱크(220)로 이송되며 측면 환기구(110a) 등에서 유입된 공기는 히트싱크(220)로부터 열을 취득하여 후면의 경사면 환기구(110c) 등으로 방출된다.6 and 7, the heat dissipation structure of the liquid crystal display device in which the plate heat pipe 200 and the heat sink 220 are accommodated in the second chassis 12 is illustrated. 6 is a heat dissipation structure of a liquid crystal display according to a preferred embodiment of the present invention by forced convection with a cooling fan 230. Heat generated from the LED 51 is transferred to the upper heat sink 220 through the plate-shaped heat pipe 200, and is forced to the outside by forced convection by the cooling fan 230 mounted inside the side vent 110a. It will release heat. 7 is a heat dissipation structure of a liquid crystal display device according to another preferred embodiment of the present invention by natural convection without a cooling fan. Heat generated from the LED 51 is transferred to the upper heat sink 220 through the plate heat pipe 200, and the air introduced from the side ventilation holes 110a and the like acquires heat from the heat sink 220 to incline the rear surface. It is discharged to the ventilation port 110c and the like.
도8을 참조하여, LED(51)에서 발생된 열이 외부로 방열되는 과정을 설명한다. LED패키지회로기판(50)에 다수개로 실장된 LED(51)에서 발생된 열은 LED패키지회로기판(50)을 통하여 BLU프레임(60)으로 전달된다. BLU프레임(60)은 BLU 구성요소를 수용시키는 구조체 역활을 수행 하는 동시에 넓은 면적을 이용하여 LED(51)에서 전달된 열을 확산시켜 단위 면적당 열량을 낮추는 방열기능을 수행한다. 따라서, BLU프레임(60)의 재질은 열전도성이 우수한 알루미늄 등이 바람직하다. BLU프레임(60)으로 전달되어 확산된 열은 판형 히트파이프(200)로 전달되며, 그 열은 내부 작동유체로 전달되어 액상의 작동유체가 열을 흡수하여 기상으로 변화되어 상부로 이동하게 된다. 이동된 작동유체는 히트싱크(220)가 결합된 응축부에서 냉각팬 또는 자연대류에 의한 측면 환기구에서 유입된 저온의 외부공기에 의하여 열을 방출한다. 외부로 열을 방출한 기상의 작동유체는 액화되어 중력과 모세관력에 의하여 중력방향으로 귀환된다. 이러한 일련의 과정이 반복적으로 이루어짐에 의하여 LED(51)에서 발생한 열을 외부로 방출하게 된다.Referring to FIG. 8, a process of radiating heat generated from the LED 51 to the outside will be described. Heat generated from the LEDs 51 mounted on the LED package circuit board 50 in a plurality is transferred to the BLU frame 60 through the LED package circuit board 50. The BLU frame 60 serves as a structure for accommodating the BLU component, and at the same time, spreads heat transmitted from the LED 51 using a large area to perform a heat dissipation function to lower the amount of heat per unit area. Therefore, the material of the BLU frame 60 is preferably aluminum and the like excellent in thermal conductivity. The heat transferred to the BLU frame 60 is transferred to the plate heat pipe 200, and the heat is transferred to the inner working fluid so that the working fluid in the liquid absorbs heat, changes into the gas phase, and moves upward. The moved working fluid releases heat by the low temperature external air introduced from the side vents by the cooling fan or the natural convection in the condensation unit to which the heat sink 220 is coupled. The working fluid of the gaseous phase which has released heat to the outside is liquefied and returned to the direction of gravity by gravity and capillary force. By repeatedly performing this series of processes, heat generated from the LEDs 51 is released to the outside.
도9을 참조하여, 본 고안에 따른 액정표시장치의 냉각구조에 의하면 히트싱크(200)는 판형 히트파이프(200) 상부에 결합되어진다. 판형 히트파이프(200)는 LED(51)의 배치에 따라 소폭을 갖은 다수개가 병렬되어 설치되거나 광폭을 갖는 한개의 판형 히트파이프(200)가 설치된다. Referring to FIG. 9, according to the cooling structure of the liquid crystal display according to the present invention, the heat sink 200 is coupled to the upper portion of the plate heat pipe 200. The plate heat pipes 200 are provided with a plurality of plate-shaped heat pipes 200 having a wide width or a plurality of plates having a wide width in accordance with the arrangement of the LEDs 51.
도10를 참조하여, 판형 히트파이프(200)와 그 상부에 결합된 히트싱크(220)로 구성되는 냉각모듈에서 히트싱크(220)는 제2 샤시(12) 상부의 공간에 위치되어 액정표시장치의 박형화를 가능하게 한다. 판형 히트파이프(200)는 LED패키지회로기판(50) 후면 또는 BLU프레임(60) 후면에 중력방향 기준하여 예각으로 설치되며, 그 계면에는 열저항을 저감시키기 위하여 방열 패드 등 열계면재료가 사용된다. 판형 히트파이프(200)의 채널방향은 길이방향이며, 그 설치 방향이 중력방향일 때 최대 성능을 발휘한다.Referring to FIG. 10, in a cooling module including a plate heat pipe 200 and a heat sink 220 coupled thereon, the heat sink 220 is positioned in a space above the second chassis 12 to form a liquid crystal display device. Enables thinning of The plate heat pipe 200 is installed at an acute angle based on the direction of gravity on the rear surface of the LED package circuit board 50 or the rear surface of the BLU frame 60, and thermal interface materials such as heat dissipation pads are used at the interface to reduce thermal resistance. . The channel direction of the plate heat pipe 200 is in the longitudinal direction, and exhibits maximum performance when the installation direction is in the gravity direction.
도11을 참조하여, 상기 판형 히트파이프(200)의 채널(212)은 단일로 구성되거나 다수개가 병렬하여 형성된다. 단일채널인 경우에는 내부 윅을 갖는 원형의 컨테이너(211) 또는 원형 히트파이프를 프레스 등으로 압착하여 평평한 면을 형성시켜 판형의 히트파이프를 형성한다. 도11의 (b)경우 처럼 압출 또는 인발가공으로 다수개의 채널이 병렬하여 형성된 판형 히트파이프는 프레스 등 부가적 가공이 필요 없으나, 평탄도를 향상하기 위하여 연삭 등 표면연마 가공이 추가될 수 있다.Referring to FIG. 11, the channel 212 of the plate heat pipe 200 may be configured as a single unit or a plurality of channels 212 may be formed in parallel. In the case of a single channel, a circular container 211 or a circular heat pipe having an inner wick is pressed by a press or the like to form a flat surface to form a plate-shaped heat pipe. As shown in (b) of FIG. 11, the plate-shaped heat pipe in which a plurality of channels are formed in parallel by extrusion or drawing process does not need additional processing such as pressing, but surface polishing such as grinding may be added to improve flatness.
이상에서 설명한 바와 같이, 본 고안에 의한 액정표시장치의 냉각구조에 의하면, 엘이디(51)에서 발생되는 열을 외부로 방열함에 있어, 방열성능이 우수하고 박형화, 경량화된 액정표시장치의 냉각구조를 제공할 수 있다.As described above, according to the cooling structure of the liquid crystal display device according to the present invention, in dissipating heat generated from the LED 51 to the outside, the cooling structure of the liquid crystal display device having excellent heat dissipation performance and a thinner and lighter weight is provided. Can provide.
도1은 본 고안에 의한 액정표시장치의 외관을 나타내는 사시도.1 is a perspective view showing the appearance of a liquid crystal display device according to the present invention;
도2는 종래 기술에 의한 액정표시장치의 방열구조를 나타내는 분해 사시도.2 is an exploded perspective view showing a heat radiation structure of a liquid crystal display device according to the prior art;
도3은 본 고안에 의한 액정표시장치의 방열구조를 나타내는 분해 사시도.Figure 3 is an exploded perspective view showing a heat radiation structure of the liquid crystal display device according to the present invention.
도4는 본 고안에 의한 또 다른 액정표시장치의 방열구조를 나타내는 분해 사시도.Figure 4 is an exploded perspective view showing a heat radiation structure of another liquid crystal display device according to the present invention.
도5는 본 고안에 의한 또 다른 액정표시장치의 방열구조를 나타내는 분해 사시도.5 is an exploded perspective view showing a heat radiation structure of another liquid crystal display according to the present invention;
도6은 본 고안의 바람직한 실시예에 따른 액정표시장치의 방열구조를 나타내는 사시도.6 is a perspective view showing a heat dissipation structure of a liquid crystal display according to a preferred embodiment of the present invention.
도7은 본 고안의 또 다른 바람직한 실시예에 따른 액정표시장치의 방열구조를 나타내는 사시도.7 is a perspective view illustrating a heat dissipation structure of a liquid crystal display according to another exemplary embodiment of the present invention.
도8은 본 고안에 의한 액정표시장치의 방열구조의 열원 흐름을 나타내는 설명도.8 is an explanatory view showing a heat source flow of a heat dissipation structure of a liquid crystal display device according to the present invention;
도9는 본 고안의 바람직한 실시예에 따른 판형 히트파이프와 히트싱크의 결합 구현예를 나타내는 사시도.Figure 9 is a perspective view showing a coupling embodiment of the plate-shaped heat pipe and the heat sink in accordance with a preferred embodiment of the present invention.
도10은 본 고안의 바람직한 실시예에 따른 액정표시장치의 상구 결합구조를 나타내는 부분도.FIG. 10 is a partial view showing a top sphere coupling structure of a liquid crystal display according to an exemplary embodiment of the present invention. FIG.
도11은 본 고안의 바람직한 실시예에 적용되는 판형 히트파이프의 내부 단면을 나타내는 부분 단면도.11 is a partial cross-sectional view showing an internal cross section of a plate heat pipe applied to a preferred embodiment of the present invention.
(도면 주요부분에 대한 부호의 설명)(Explanation of symbols for main parts of drawing)
10;외부 샤시 11;제1 샤시 12;제2 샤시10; external chassis 11; first chassis 12; second chassis
12a;제2 샤시 경사면 20;백라이트유닛(BLU) 30;엘시디패널(LCD패널)12a; second chassis inclined surface 20; backlight unit (BLU) 30; LCD panel (LCD panel)
40;광전달부 41;프리즘시트 42;확산시트40; light transmitting part 41; prism sheet 42; diffusion sheet
43;반사시트 44;도광판 50;엘이디패키지회로기판(LED패키지회로기판)43; reflective sheet 44; light guide plate 50; LED package circuit board (LED package circuit board)
51;엘이디(LED) 60;백라이트유닛프레임(BLU프레임) 70:제어판51; LED 60; backlight unit frame (BLU frame) 70: control panel
100;방열판 110a;측면 환기구 110b;상면 환기구100; heat sink 110a; side vent 110b; top vent
110c;경사면 환기구 120;분리벽 200;판형히트파이프110c; slope inlet vent 120; dividing wall 200; plate heat pipe
211;판형 히트파이프 컨테이너 212; 판형 히트파이프 채널211; plate heat pipe container 212; Plate Heat Pipe Channel
220;히트싱크 230;냉각팬220; Heatsink 230; Cooling fan

Claims (5)

  1. 엘이디(LED)를 광원으로 사용하는 백라이트유닛(BLU)을 포함하는 액정표시장치의 냉각구조에 있어서, In the cooling structure of the liquid crystal display device including a backlight unit (BLU) using an LED (LED) as a light source,
    상기 엘이디에서 발생하는 열을 확산 및 이송하는 판형 히트파이프;A plate heat pipe for diffusing and transferring heat generated from the LED;
    상기 판형 히트파이프의 방열수단으로 판형 히트파이프 상부에 결합되는 다수개의 핀을 갖는 히트싱크;A heat sink having a plurality of fins coupled to an upper portion of the plate heat pipe by heat radiating means of the plate heat pipe;
    상기 판형 히트파이프와 히트싱크를 수용하는 제2 샤시;A second chassis for receiving the plate heat pipe and the heat sink;
    상기 히트싱크가 위치되고 공기유동의 이동구간을 형성하는 제2 샤시 상부 공간;A second chassis upper space in which the heat sink is located and forms a moving section of air flow;
    상기 히트싱크에 외부 공기의 유출입을 위한 제 2샤시 상부의 측면,상면 또는 경사면에 형성된 환기구를 포함하는 것을 특징으로 하는 액정표시장치의 냉각구조.      And a ventilation hole formed in a side surface, an upper surface, or an inclined surface of an upper portion of the second chassis for inflow and outflow of external air to the heat sink.
  2. 제 1항에 있어서,The method of claim 1,
    판형 히트파이프는 엘이디패키지회로기판 또는 백라이트유닛프레임 후면에 설치되는 것을 특징으로 하는 액정표시장치의 냉각구조.The plate heat pipe is a cooling structure of the liquid crystal display device, characterized in that installed on the LED package circuit board or the back of the backlight unit frame.
  3. 제 1항에 있어서,The method of claim 1,
    판형 히트파이프는 적어도 한개 이상의 채널을 갖고, 1개 이상의 외부면이 평탄한 것을 특징으로 하는 액정표시장치의 냉각구조.The plate heat pipe has at least one channel, and at least one outer surface is flat, the cooling structure of the liquid crystal display device.
  4. 제 1항에 있어서,The method of claim 1,
    판형 히트파이프와 히트싱크는 일체형 또는 분리형으로 결합되는 것을 특징으로 하는 액정표시장치의 냉각구조.Cooling structure of the liquid crystal display device, characterized in that the plate-type heat pipe and the heat sink is combined in one piece or separate.
  5. 제1항에 있어서, 제 2샤시 상부의 측면,상면 또는 경사면에 형성된 환기구에 강제대류 유발 수단인 냉각팬이 구비되는 것을 특징으로 하는 액정표시장치의 냉각구조.      The cooling structure of a liquid crystal display device according to claim 1, wherein a cooling fan serving as a forced convection means is provided at a ventilation hole formed in a side surface, an upper surface, or an inclined surface of the second chassis.
KR20-2005-0025873U 2005-09-07 2005-09-07 Cooling Structure for Liquid Crystal Display KR200401354Y1 (en)

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KR101047726B1 (en) 2010-01-07 2011-07-08 엘지이노텍 주식회사 Backlight unit and display appratus having the same
US8314901B2 (en) 2010-06-03 2012-11-20 Lg Innotek Co., Ltd. Backlight unit and display device
US8540411B2 (en) 2010-01-07 2013-09-24 Lg Innotek Co., Ltd. Backlight unit and display device
US9274269B2 (en) 2011-05-31 2016-03-01 Lg Innotek Co., Ltd. Backlight unit and display device
US9964690B2 (en) 2015-12-10 2018-05-08 Sti Co., Ltd. Heat dissipating case for liquid crystal display panel
US10080316B2 (en) 2009-11-13 2018-09-18 Manufacturing Resources International, Inc. Electronic display assembly having thermal cooling plate and optional convective air cooling loop
US10088702B2 (en) 2013-07-08 2018-10-02 Manufacturing Resources International, Inc. Figure eight closed loop cooling system for electronic display
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US10278311B2 (en) 2015-02-17 2019-04-30 Manufacturing Resources International, Inc. Perimeter ventilation system
US10314212B2 (en) 2008-12-18 2019-06-04 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10398066B2 (en) 2017-04-27 2019-08-27 Manufacturing Resources International, Inc. System and method for preventing display bowing
US10420257B2 (en) 2008-03-26 2019-09-17 Manufacturing Resources International, Inc. System and method for maintaining a consistent temperature gradient across an electronic display
US10485113B2 (en) 2017-04-27 2019-11-19 Manufacturing Resources International, Inc. Field serviceable and replaceable display
US10506740B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Electronic display with cooling
US10506738B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Constricted convection cooling for an electronic display
US10524397B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Heat exchanger assembly for an electronic display
US10524384B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Cooling assembly for an electronic display
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US10660245B2 (en) 2012-10-16 2020-05-19 Manufacturing Resources International, Inc. Back pan cooling assembly for electronic display
US10795413B1 (en) 2019-04-03 2020-10-06 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
US10820445B2 (en) 2016-03-04 2020-10-27 Manufacturing Resources International, Inc. Cooling system for double sided display assembly
US10827656B2 (en) 2008-12-18 2020-11-03 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
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US11013142B2 (en) 2008-03-03 2021-05-18 Manufacturing Resources International, Inc. Electronic display with cooling
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US10506740B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Electronic display with cooling
US10506738B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Constricted convection cooling for an electronic display
US10420257B2 (en) 2008-03-26 2019-09-17 Manufacturing Resources International, Inc. System and method for maintaining a consistent temperature gradient across an electronic display
US10314212B2 (en) 2008-12-18 2019-06-04 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10827656B2 (en) 2008-12-18 2020-11-03 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10080316B2 (en) 2009-11-13 2018-09-18 Manufacturing Resources International, Inc. Electronic display assembly having thermal cooling plate and optional convective air cooling loop
US10736245B2 (en) 2009-11-13 2020-08-04 Manufacturing Resources International, Inc. Electronic display assembly with combined conductive and convective cooling
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US8540411B2 (en) 2010-01-07 2013-09-24 Lg Innotek Co., Ltd. Backlight unit and display device
US8314901B2 (en) 2010-06-03 2012-11-20 Lg Innotek Co., Ltd. Backlight unit and display device
US9274269B2 (en) 2011-05-31 2016-03-01 Lg Innotek Co., Ltd. Backlight unit and display device
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US10088702B2 (en) 2013-07-08 2018-10-02 Manufacturing Resources International, Inc. Figure eight closed loop cooling system for electronic display
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US10212845B2 (en) 2014-03-11 2019-02-19 Manufacturing Resources International, Inc. Hybrid rear cover and mounting bracket for electronic display
US10194564B2 (en) 2014-04-30 2019-01-29 Manufacturing Resources International, Inc. Back to back electronic display assembly
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US10278311B2 (en) 2015-02-17 2019-04-30 Manufacturing Resources International, Inc. Perimeter ventilation system
US9964690B2 (en) 2015-12-10 2018-05-08 Sti Co., Ltd. Heat dissipating case for liquid crystal display panel
US10820445B2 (en) 2016-03-04 2020-10-27 Manufacturing Resources International, Inc. Cooling system for double sided display assembly
US10624218B2 (en) 2017-04-27 2020-04-14 Manufacturing Resources International, Inc. Field serviceable and replaceable display assembly
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US10398066B2 (en) 2017-04-27 2019-08-27 Manufacturing Resources International, Inc. System and method for preventing display bowing
US10485113B2 (en) 2017-04-27 2019-11-19 Manufacturing Resources International, Inc. Field serviceable and replaceable display
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US10757844B2 (en) 2017-04-27 2020-08-25 Manufacturing Resources International, Inc. System and method for reducing or combating display bowing
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