CN213482806U

CN213482806U - Liquid cooling radiator for server

Info

Publication number: CN213482806U
Application number: CN202023230464.1U
Authority: CN
Inventors: 徐君博
Original assignee: Dongguan Tongyu Electronics Co ltd
Current assignee: Dongguan Tongyu Electronics Co ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-06-18
Anticipated expiration: 2030-12-28

Abstract

The utility model discloses a server liquid cooling radiator relates to server heat dissipation field, including the heat dissipation case, the liquid outlet has been seted up to one side of heat dissipation case, the inner wall of liquid outlet is provided with the drain pipe, and the one end of drain pipe is provided with the cooler bin, the one end that the liquid outlet was kept away from to heat dissipation case one side has been seted up the inlet, the inner wall of inlet is provided with the feed liquor pipe. The utility model discloses change traditional forced air cooling air convection heat dissipation mode of server into coolant liquid submergence formula heat dissipation, install the server mainboard to the fixing base on, start electromagnet device on the mount pad, electromagnet device adsorbs with the metal block, be fixed in the inside of heat dissipation case with the server mainboard, it is simple convenient, open the water pump, take out the coolant liquid through the filter from the cooler tank, carry out submergence formula heat dissipation to the server mainboard in getting into the heat dissipation case from the inlet, because the coolant liquid is insulating conduction oil, so insulating conduction oil can further increase the radiating effect of server mainboard.

Description

Liquid cooling radiator for server

Technical Field

The utility model relates to a server heat dissipation field specifically is a server liquid cooling radiator.

Background

At present, a large number of integrated circuits are used in server components, and high temperature is a big enemy of the integrated circuits, which not only causes unstable system operation, shortened service life, and even possibly causes some components to be burnt, but the existing heat dissipation mode of the integrated chips mainly comprises arranging a radiator on the upper part of the integrated chip, the radiator is contacted with the surface of a heating component to absorb heat, then forced air convection is carried out through a fan, and the heat is transferred to a remote place through air, so that the heat dissipation of the server is completed.

Traditional air convection heat dissipation mode is higher to the requirement of all ring edge borders, need guarantee that ambient temperature is invariable, this rate of utilization that has just increased the computer lab air conditioner, and energy-concerving and environment-protective effect is relatively poor, simultaneously because the heat conduction effect of air is not very good, and is relatively poor to electronic component's radiating effect, and long-time the use can lead to electronic component's working effect variation, and this just needs to carry out the work of dispelling the heat with a liquid cooling radiator to the server.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problem that the heat dissipation effect of a common radiator is not good, a liquid cooling radiator of a server is provided.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a server liquid cooling radiator, includes the heat dissipation case, the liquid outlet has been seted up to one side of heat dissipation case, the inner wall of liquid outlet is provided with the drain pipe, and the one end of drain pipe is provided with the cooler bin, the one end that the liquid outlet was kept away from to heat dissipation case one side has seted up the inlet, the inner wall of inlet is provided with the feed liquor pipe, and is provided with filter and water pump respectively in the centre of feed liquor pipe, the interior diapire of heat dissipation case is provided with a plurality of fixing bases, the fixing base top is provided with the metal block, the top of fixing base is provided with the server mainboard, the top of server mainboard is provided with a plurality of mount.

Preferably, the top of the heat dissipation box is provided with a box cover, and a sealing ring is arranged at a gap between the box cover and the heat dissipation box.

Preferably, the side wall of the heat dissipation box is provided with a fixing plate, and one side of the fixing plate is provided with a plurality of groups of turbulence columns.

Preferably, the outer wall of the electromagnet device is provided with a fixed ring.

Preferably, the top of fixing base is provided with the blotter, and the blotter is the rubber blotter.

Preferably, the electromagnet devices are electrically connected with the server mainboard through wires, and the electromagnet devices correspond to the metal blocks one to one.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model changes the traditional air-cooled air convection heat dissipation mode of the server into the cooling liquid immersion heat dissipation mode, the server mainboard is arranged on the fixed seat, the electromagnet device on the mounting seat is started, the electromagnet device is adsorbed with the metal block, the server mainboard is fixed in the heat dissipation box, when the server mainboard needs to be disassembled, the electromagnet device is powered off, the server mainboard can be disassembled without other tools, the operation is simple and convenient, after the server mainboard is completely assembled, the water pump is opened, the cooling liquid passing through the filter is taken out from the cooling box and enters the heat dissipation box from the liquid inlet to carry out the immersion heat dissipation on the server mainboard, the heated cooling liquid flows out from the liquid outlet and enters the cooling box through the liquid outlet pipe to circulate, because the cooling liquid is the insulation heat conduction oil, the specific heat capacity of the liquid is larger than that of the air, the immersion heat dissipation can lead the electronic element, the influence of thermal resistance is reduced, so that the heat dissipation effect of the server mainboard can be further improved by the insulating heat conduction oil, the periphery ring is not required to keep constant temperature, the utilization rate of the air conditioner of the machine room is effectively reduced, and the energy-saving and environment-friendly effects of the machine room are improved.

Drawings

FIG. 1 is a sectional top view of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

fig. 3 is an enlarged view of a structure in fig. 1 according to the present invention.

In the figure: 1. a heat dissipation box; 2. a liquid outlet; 3. a liquid outlet pipe; 4. a cooling tank; 5. a liquid inlet; 6. a liquid inlet pipe; 7. a filter; 8. a water pump; 9. a fixed seat; 10. a cushion pad; 11. a metal block; 12. a server motherboard; 13. a mounting seat; 14. an electromagnet device; 15. a stationary ring; 16. a fixing plate; 17. a turbulence column; 18. a box cover; 19. and (5) sealing rings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention according to its overall structure.

Referring to fig. 1-3, a liquid cooling radiator for a server comprises a heat dissipation box 1, a liquid outlet 2 is disposed at one side of the heat dissipation box 1, a liquid outlet pipe 3 is disposed on the inner wall of the liquid outlet 2, a cooling box 4 is disposed at one end of the liquid outlet pipe 3, a liquid inlet 5 is disposed at one side of the heat dissipation box 1 away from the liquid outlet 2, a liquid inlet pipe 6 is disposed on the inner wall of the liquid inlet 5, a filter 7 and a water pump 8 are respectively disposed in the middle of the liquid inlet pipe 6, a plurality of fixing bases 9 are disposed on the inner bottom wall of the heat dissipation box 1, a metal block 11 is disposed on the tops of the fixing bases 9, a server motherboard 12 is disposed on the tops of the fixing bases 9, a plurality of mounting bases 13 are disposed on the tops of the mounting bases 13, an electromagnet device 14 is mounted on the tops of the mounting bases 13, the, the electromagnet device 14 on the mounting seat 13 is started, the electromagnet device 14 and the metal block 11 are adsorbed, the server mainboard 12 is fixed inside the heat dissipation box 1, when the server mainboard 12 needs to be disassembled, the electromagnet device 14 is powered off, the server mainboard 12 can be disassembled without other tools, the operation is simple and convenient, after the server mainboard 12 is completely assembled, the water pump 8 is started, the cooling liquid passing through the filter 7 is pumped out from the cooling box 4 and enters the heat dissipation box 1 from the liquid inlet 5 to perform immersion type heat dissipation on the server mainboard 12, the heated cooling liquid flows out from the liquid outlet 2 and enters the cooling box 4 through the liquid outlet pipe 3 to circulate, as the cooling liquid is insulating heat conduction oil, the specific heat capacity of the liquid is larger than that of air, the immersion type heat dissipation can enable electronic elements to be in direct contact with the insulating heat conduction oil, the influence of heat conduction oil heat resistance is reduced, and the heat dissipation effect of the server mainboard, the periphery ring is not needed to keep constant temperature, the utilization rate of the air conditioner in the machine room is effectively reduced, and the energy-saving and environment-friendly effects of the machine room are improved.

Please refer to fig. 2, a cover 18 is disposed on the top of the heat dissipating box 1, and a sealing ring 19 is disposed at a gap between the cover 18 and the heat dissipating box 1, so that the cover 18 and the sealing ring 19 are disposed to effectively seal the cooling fluid.

Please refer to fig. 1 and fig. 2, the side wall of the heat dissipation box 1 is provided with a fixing plate 16, and one side of the fixing plate 16 is provided with a plurality of groups of turbulence columns 17, so that the turbulence of the cooling liquid in the heat dissipation box 1 is effectively increased through the arranged turbulence columns 17, and the heat exchange effect of the cooling liquid is increased.

Referring to fig. 1, the outer wall of the electromagnet device 14 is provided with a fixing ring 15, and the electromagnet device 14 is effectively fixed by the fixing ring 15.

Please refer to fig. 1, a cushion pad 10 is disposed on the top of the fixing base 9, and the cushion pad 10 is a rubber cushion pad, so that the server motherboard 12 is effectively protected from being damaged during installation by the cushion pad 10.

Please refer to fig. 1, the electromagnet devices 14 are electrically connected to the server motherboard 12 through wires, and the electromagnet devices 14 correspond to the metal blocks 11 one by one, and are electrically connected to the server motherboard 12 through the electromagnet devices 14, so as to effectively control the on/off of the electromagnet devices 14.

The working principle is as follows: firstly, a server mainboard 12 is installed on a fixed seat 9, an electromagnet device 14 on a mounting seat 13 is started, the electromagnet device 14 is adsorbed with a metal block 11, the server mainboard 12 is fixed inside a heat dissipation box 1, the electromagnet device 14 is of the existing structure, when the server mainboard 12 needs to be disassembled, the electromagnet device 14 is powered off, the server mainboard 12 can be disassembled without other tools, the operation is simple and convenient, after the server mainboard 12 is installed, a water pump 8 is turned on, cooling liquid passing through a filter 7 is pumped out of a cooling box 4 and enters the heat dissipation box 1 from a liquid inlet 5 for immersion type heat dissipation, the heated cooling liquid flows out of a liquid outlet 2 and enters the cooling box 4 through a liquid outlet pipe 3 for circulation, and as the cooling liquid is insulating heat conduction oil, the specific heat capacity of the liquid is larger than that of air, the immersion type heat dissipation can enable electronic elements to be in direct contact with the insulating heat conduction oil, the influence of thermal resistance is reduced, so that the heat dissipation effect of the server mainboard 12 can be further improved by the insulating heat conduction oil, the periphery ring is not required to keep constant temperature, the utilization rate of the air conditioner of the machine room is effectively reduced, and the energy-saving and environment-friendly effects of the machine room are improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a server liquid cooling radiator, includes heat dissipation case (1), its characterized in that: a liquid outlet (2) is formed in one side of the heat dissipation box (1), a liquid outlet pipe (3) is arranged on the inner wall of the liquid outlet (2), a cooling box (4) is arranged at one end of the liquid outlet pipe (3), a liquid inlet (5) is arranged at one end of one side of the heat dissipation box (1) far away from the liquid outlet (2), a liquid inlet pipe (6) is arranged on the inner wall of the liquid inlet (5), and the middle of the liquid inlet pipe (6) is respectively provided with a filter (7) and a water pump (8), a plurality of fixed seats (9) are arranged on the inner bottom wall of the heat dissipation box (1), a metal block (11) is arranged at the top of each fixed seat (9), the top of fixing base (9) is provided with server mainboard (12), the top of server mainboard (12) is provided with a plurality of mount pads (13), and electromagnet device (14) are all installed at the top of mount pad (13).

2. The server liquid-cooled heat sink of claim 1, wherein: a box cover (18) is arranged at the top of the heat dissipation box (1), and a sealing ring (19) is arranged at a gap between the box cover (18) and the heat dissipation box (1).

3. The server liquid-cooled heat sink of claim 1, wherein: the side wall of the heat dissipation box (1) is provided with a fixing plate (16), and one side of the fixing plate (16) is provided with a plurality of groups of turbulence columns (17).

4. The server liquid-cooled heat sink of claim 1, wherein: and a fixing ring (15) is arranged on the outer wall of the electromagnet device (14).

5. The server liquid-cooled heat sink of claim 1, wherein: the top of fixing base (9) is provided with blotter (10), and blotter (10) are rubber buffer.

6. The server liquid-cooled heat sink of claim 1, wherein: the electromagnet devices (14) are electrically connected with the server main board (12) through conducting wires, and the electromagnet devices (14) correspond to the metal blocks (11) one by one.