CN220913610U - Integrated water-cooling display card radiator - Google Patents

Integrated water-cooling display card radiator Download PDF

Info

Publication number
CN220913610U
CN220913610U CN202322493297.7U CN202322493297U CN220913610U CN 220913610 U CN220913610 U CN 220913610U CN 202322493297 U CN202322493297 U CN 202322493297U CN 220913610 U CN220913610 U CN 220913610U
Authority
CN
China
Prior art keywords
water
box
cooling
liquid inlet
bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202322493297.7U
Other languages
Chinese (zh)
Inventor
肖波
李顺辉
袁小祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Gaoyu Electronic Technology Co ltd
Original Assignee
Shenzhen Gaoyu Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Gaoyu Electronic Technology Co ltd filed Critical Shenzhen Gaoyu Electronic Technology Co ltd
Priority to CN202322493297.7U priority Critical patent/CN220913610U/en
Application granted granted Critical
Publication of CN220913610U publication Critical patent/CN220913610U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to the technical field of display card radiators, and provides an integrated water-cooling display card radiator, which comprises: the device comprises a bottom plate and a cover plate arranged above the bottom plate, wherein the upper surface of the bottom plate is fixedly provided with a main plate through screws, a CPU chip is fixedly arranged on the main plate, a water cooling assembly is arranged on the CPU chip, and an air cooling assembly is arranged above the water cooling assembly; the water cooling assembly comprises a water cooling calandria, a fixed table, a liquid inlet box, a circulating pump, a circulating box, a heat dissipation box and a copper bottom, wherein the copper bottom is fixedly arranged on the upper surface of a main board through screws, and a CPU chip is arranged between the copper bottom and the main board.

Description

Integrated water-cooling display card radiator
Technical Field
The application relates to the technical field of display card radiators, in particular to an integrated water-cooling display card radiator.
Background
The computer is a modern electronic computing machine for high-speed computing, can perform numerical computation and logic computation, has a memory function, can operate according to a program, and is a modern intelligent electronic device for automatically processing massive data at high speed, and generally consists of a hardware system and a software system, wherein the hardware system is a CPU and a display card, the temperature of the CPU and the display card can be linearly increased in the process of operating large-scale software, and if the CPU or the display card cannot timely dissipate heat, the CPU or the display card can be reduced in frequency and even a dead halt phenomenon occurs. Therefore, the display card in the computer is provided with the radiator, so that the radiator can be used for assisting in radiating, and the temperature of the radiator can be maintained within a reasonable operation range.
Most of the traditional display card radiators adopt an air cooling technology, so that the radiating efficiency is low, the noise is large, dust is easy to accumulate in the radiator, and the normal use of the display card is influenced; some high-end display cards also adopt water-cooling radiator at present, but this kind of water-cooling radiator needs external water-cooling system and water row of increasing, occupation space is great, uses water piping connection in the outside, leads to installation and removal inconvenient.
Therefore, the above-mentioned existing technical drawbacks need to be changed.
Disclosure of utility model
In view of the above-mentioned shortcomings of the prior art, the present application aims to provide an integrated water-cooled display card radiator, which aims to radiate heat of a display card in the process of running large software of a computer, and prevent the phenomenon of frequency reduction and even crash of a CPU or the display card caused by untimely heat radiation.
The application solves the technical problems by adopting a technical scheme as follows:
An integrated water cooled graphics card heat sink comprising: the device comprises a bottom plate and a cover plate arranged above the bottom plate, wherein the upper surface of the bottom plate is fixedly provided with a main plate through screws, a CPU chip is fixedly arranged on the main plate, a water cooling assembly is arranged on the CPU chip, and an air cooling assembly is arranged above the water cooling assembly;
The water cooling assembly comprises a water cooling calandria, a fixed table, a liquid inlet box, a circulating pump, a circulating box, a heat dissipation box and a copper bottom, wherein the copper bottom is fixedly arranged on the upper surface of the main board through screws, a CPU chip is arranged between the copper bottom and the main board, the side wall of the liquid inlet box is communicated with a plurality of water cooling calandria, the other ends of the plurality of water cooling calandria are communicated with the inside of the circulating box, and the circulating pump is fixedly arranged in the circulating box;
The middle parts of the water-cooling calandria are communicated with a heat dissipation box, a fixed table is fixedly arranged on the upper surface of the copper bottom through screws, and a reserved groove for installing the heat dissipation box is formed in the upper surface of the fixed table.
In one possible implementation manner, the air cooling assembly comprises a cooling fan, a mounting frame and cooling fins, wherein two mounting grooves for the cooling fan to move are formed in the upper surface of the cover plate, the mounting frames are fixedly connected to the lower ends of the two mounting grooves, the two cooling fans are respectively and fixedly mounted on the upper surfaces of the two mounting frames, and the cooling fins are respectively fixed between the water cooling calandria.
In one possible implementation, the inside of the heat dissipation box is divided into a liquid inlet cavity and a liquid outlet cavity by a partition plate, and a liquid inlet groove and a liquid outlet groove which are communicated with the liquid inlet cavity and the liquid outlet cavity are separately arranged in the fixed table.
In one possible implementation mode, the upper surface of the main board is fixedly provided with a first bracket, a second bracket and a third bracket through screws, the front end and the rear end of the liquid inlet box are fixedly connected with fixing frames, the liquid inlet box is fixedly connected with the circulating box through two fixing frames, and the two fixing frames are fixedly connected with the first bracket, the second bracket and the third bracket through screws.
In one possible implementation manner, the first cooling fins are fixedly connected to the upper surfaces of the first support and the second support, the second cooling fins are symmetrically and fixedly connected to the upper surface of the copper bottom, and the mounting grooves for mounting the water cooling fins are formed in the upper surface of the copper bottom.
In one possible implementation manner, the lower surface of the fixing table is provided with a sealing groove for installing a sealing ring, the lower end of the sealing ring is abutted against the upper surface of the copper bottom, the lower surface of the fixing table is clamped with a protection pad, and the lower surface of the protection pad is abutted against the upper surface of the water cooling fin.
In one possible implementation manner, a liquid inlet pipe is communicated with the inside of the liquid inlet box, and a sealing cover is connected with the inner thread of the liquid inlet pipe.
In one possible implementation, the upper surface of the bottom plate is fixedly connected with a metal back plate, and the cover plate is fixedly connected with the bottom plate through the metal back plate.
Compared with the prior art, the application provides the integrated water-cooling display card radiator;
According to the utility model, heat conduction silicone grease (not shown) can be filled between the CPU chip and the copper bottom, so that heat on the CPU chip is rapidly transferred to the copper bottom, meanwhile, under the action of the circulating pump, cooling liquid in the liquid inlet box can circularly flow through the circulating box, the water cooling drain pipe and the heat dissipation box, and heat at the copper bottom is taken away when the cooling liquid passes through the heat dissipation box, so that heat dissipation of the display card radiator is completed, the set air cooling assembly can air-cool the cooling drain pipe and cooling liquid in the cooling drain pipe, so that the cooling liquid can repeatedly absorb the heat on the copper bottom to complete heat dissipation of the CPU chip, an external water cooling system and a water drain are not needed for the display card radiator, the occupied area of the display card radiator is not influenced, the installation and the use of the display card radiator are facilitated, the air cooling assembly and the water cooling assembly are matched, the rotating speed of a heat dissipation fan in the air cooling assembly is not needed to be too high, and the problem of reducing the overlarge noise in use can be achieved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the overall structure of an integrated water-cooled graphics card radiator according to the present embodiment;
Fig. 2 is a split schematic diagram of an integrated water-cooled graphics card radiator according to the present embodiment;
Fig. 3 is a schematic structural diagram of a water cooling assembly of an integrated water-cooled graphics card radiator according to the present embodiment;
Fig. 4 is a schematic diagram of a split structure of a water cooling assembly of an integrated water-cooled graphics card radiator according to the present embodiment;
fig. 5 is a schematic installation diagram of a copper bottom of an integrated water-cooled graphics card radiator according to the present embodiment;
fig. 6 is a schematic diagram of a split structure of a radiator tank of an integrated water-cooled graphics card radiator according to the present embodiment.
In the figure:
1. A bottom plate; 2. a cover plate; 3. a main board; 4. a CPU chip; 5. water-cooling calandria; 6. a fixed table; 7. a liquid inlet box; 8. a circulation pump; 9. a circulation box; 10. a heat radiation box; 11. a copper bottom; 12. a heat radiation fan; 13. a mounting frame; 14. a heat radiation fin; 15. a partition plate; 16. a liquid inlet cavity; 17. a liquid outlet cavity; 18. a liquid inlet tank; 19. a liquid outlet groove; 20. a first bracket; 21. a second bracket; 22. a third bracket; 23. a fixing frame; 24. a first heat sink; 25. a second heat sink; 26. water cooling fins; 27. a seal ring; 28. a protective pad; 29. a liquid inlet pipe; 30. sealing cover; 31. a metal back plate.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features described above in the different embodiments of the present utility model may be combined with each other as long as they do not collide with each other.
The utility model provides an integrated water-cooled display card radiator as shown in fig. 1, 2, 3, 4, 5 and 6, which is used for radiating a display card in the process of running large software of a computer and preventing the phenomenon of frequency reduction and even dead halt of a CPU (Central processing Unit) or the display card caused by untimely radiating. The main structure comprises a bottom plate 1 and a cover plate 2 arranged above the bottom plate 1, wherein a main plate 3 is fixedly arranged on the upper surface of the bottom plate 1 through screws, a CPU chip 4 is fixedly arranged on the main plate 3, a water cooling component is arranged on the CPU chip 4, and an air cooling component is arranged above the water cooling component; the heat generated by the CPU chip 4 is conducted through the arranged water cooling assembly, and cooling liquid in the water cooling assembly is cooled and radiated through the air cooling assembly, so that the whole radiating process of the display card is completed.
The water cooling assembly comprises a water cooling calandria 5, a fixed table 6, a liquid inlet box 7, a circulating pump 8, a circulating box 9, a heat dissipation box 10 and a copper bottom 11, wherein the copper bottom 11 is fixedly arranged on the upper surface of the main board 3 through screws, a CPU chip 4 is arranged between the copper bottom 11 and the main board 3, the side wall of the liquid inlet box 7 is communicated with a plurality of water cooling calandria 5, the other ends of the water cooling calandria 5 are communicated with the inside of the circulating box 9, and the circulating pump 8 is fixedly arranged in the circulating box 9; during the use, can pack heat conduction silicone grease (not marked) between CPU chip 4 and copper end 11 to increase copper end 11 and to CPU chip 4 heat's conduction effect, and circulating pump 8 can make the coolant liquid in feed liquor case 7, circulation case 9, cooling box 10 and a plurality of water-cooling calandria 5 circulate, when the coolant liquid passes through cooling box 10, can take away the heat on the copper end 11, guarantees copper end 11 and to CPU chip 4's heat conduction effect.
The middle parts of the water-cooling calandria 5 are communicated with a heat dissipation box 10, a fixed table 6 is fixedly arranged on the upper surface of a copper bottom 11 through screws, and a reserved groove for installing the heat dissipation box 10 is formed in the upper surface of the fixed table 6.
It should be noted that, before using, can add sufficient coolant liquid to feed liquor box 7, at mainboard 3 during operation, can shift the heat on the CPU chip 4 to copper end 11 rapidly under the effect of heat conduction silicone grease (not marked), simultaneously, circulating pump 8 can carry the coolant liquid in the feed liquor box 7 to circulation box 9 through partial cooling calandria, rethread partial cooling calandria carries back into feed liquor box 7, accomplish the circulation flow to the coolant liquid, simultaneously, when the coolant liquid flows in cooling calandria, can be through radiator box 10, make the coolant liquid can take away the heat on the copper end 11, guarantee the cooling effect to CPU chip 4, and when the coolant liquid that absorbs the heat flows in cooling calandria, the forced air cooling subassembly of setting can carry out the forced air cooling to cooling calandria and inside coolant liquid, make the coolant liquid can repeatedly absorb the heat on the copper end 11, accomplish the heat dissipation to CPU chip 4, forced air cooling subassembly cooperates with the forced air cooling subassembly, thereby can reduce the rotational speed of fan 12 in the subassembly, and then can reduce the noise of cooling down, and the heat dissipation card is compact structure, the heat dissipation card can not be compact, the heat dissipation card can be installed to the heat dissipation device is compact, the heat dissipation card is convenient, and the heat dissipation device is convenient for use has no occupied by the heat dissipation card.
Further, as shown in fig. 1, 2 and 3, the air cooling assembly comprises a cooling fan 12, a mounting frame 13 and cooling fins 14, two mounting grooves for the cooling fan 12 to move are formed in the upper surface of the cover plate 2, the mounting frames 13 are fixedly connected to the lower ends of the two mounting grooves, the two cooling fans 12 are respectively and fixedly mounted on the upper surfaces of the two mounting frames 13, and the plurality of cooling fins 14 are respectively and fixedly arranged among the plurality of water-cooling calandria 5.
Specifically, when the cooling fan is used, the two cooling fans 12 are started to take away heat on the cooling fins 14, so that the cooling effect of the water cooling calandria 5 and the internal cooling liquid is achieved, and the cooling effect of the water cooling assembly on the CPU chip 4 is guaranteed.
Further, as shown in fig. 6, the inside of the heat dissipation box 10 is divided into a liquid inlet cavity 16 and a liquid outlet cavity 17 by a partition plate 15, and a liquid inlet groove 18 and a liquid outlet groove 19 which are communicated with the liquid inlet cavity 16 and the liquid outlet cavity 17 are separately arranged in the fixed table 6.
It should be noted that, the cooling liquid can enter the liquid inlet groove 18 through the liquid inlet cavity 16 to contact with the copper bottom 11, take away the heat of the copper bottom 11, then pass through the liquid outlet groove 19 to enter the liquid outlet cavity 17, and finally circulate through the plurality of water-cooling calandria 5, thereby ensuring the cooling and heat dissipation effects on the copper bottom 11.
Further, as shown in fig. 3, 4 and 5, the upper surface of the main board 3 is fixedly provided with a first bracket 20, a second bracket 21 and a third bracket 22 through screws, both front and rear ends of the liquid inlet tank 7 are fixedly connected with fixing frames 23, the liquid inlet tank 7 is fixedly connected with the circulation tank 9 through two fixing frames 23, and the two fixing frames 23 are fixedly connected with the first bracket 20, the second bracket 21 and the third bracket 22 through screws.
Specifically, when the water cooling assembly is installed, the first bracket 20, the second bracket 21 and the third bracket 22 can be installed on the main board 3 through screws, then the two fixing frames 23 are lapped on the upper surfaces of the first bracket 20, the second bracket 21 and the third bracket 22 and fixed through screws, so that the stability of the installation of the water cooling assembly can be ensured, and the tight fit between the fixing table 6 and the copper bottom 11 can be ensured.
Further, as shown in fig. 3, 4 and 5, the first cooling fins 24 are fixedly connected to the upper surfaces of the first bracket 20 and the second bracket 21, the second cooling fins 25 are symmetrically and fixedly connected to the upper surface of the copper bottom 11, and the mounting grooves for mounting the water cooling fins 26 are formed in the upper surface of the copper bottom 11.
It should be noted that, through the cooperation of the first cooling fin 24 and the second cooling fin 25, the heat dissipation can be performed to other positions of the motherboard 3 except for the CPU chip 4, the overall heat dissipation effect of the motherboard 3 is increased, and the service life of the motherboard 3 is ensured.
Further, as shown in fig. 4 and 6, a sealing groove for installing a sealing ring 27 is formed on the lower surface of the fixing table 6, the lower end of the sealing ring 27 is abutted against the upper surface of the copper bottom 11, a protection pad 28 is clamped on the lower surface of the fixing table 6, and the lower surface of the protection pad 28 is abutted against the upper surface of the water cooling fin 26.
Specifically, through the sealing ring 27 that sets up, can prevent that the coolant liquid from leaking through the contact site of fixed station 6 and copper bottom 11, promoted the life of display card, and the protection pad 28 that sets up can protect the contact site of fixed station 6 and water-cooling fin 26.
Further, as shown in fig. 3 and 4, the liquid inlet pipe 29 is connected to the inside of the liquid inlet tank 7, and a sealing cover 30 is screwed to the inside of the liquid inlet pipe 29.
In use, the seal cap 30 may be rotated to remove the seal cap from the inlet pipe 29, so that the coolant may be added to the inlet tank 7 through the inlet pipe 29.
Further, as shown in fig. 1, 2, 3 and 5, the metal backboard 31 is fixedly connected to the upper surface of the base plate 1, and the cover plate 2 is fixedly connected to the base plate 1 through the metal backboard 31.
It should be noted that, the bottom plate 1 and the cover plate 2 are conveniently connected through the metal back plate 31, and meanwhile, the radiator is conveniently installed in the computer case through the metal back plate 31.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present utility model.

Claims (8)

1. An integrated water-cooled graphics card radiator, comprising: the device comprises a bottom plate (1) and a cover plate (2) arranged above the bottom plate (1), wherein a main plate (3) is fixedly arranged on the upper surface of the bottom plate (1) through screws, a CPU chip (4) is fixedly arranged on the main plate (3), a water cooling component is arranged on the CPU chip (4), and an air cooling component is arranged above the water cooling component;
The water cooling assembly comprises a water cooling calandria (5), a fixing table (6), a liquid inlet box (7), a circulating pump (8), a circulating box (9), a heat dissipation box (10) and a copper bottom (11), wherein the copper bottom (11) is fixedly arranged on the upper surface of a main board (3) through screws, a CPU chip (4) is arranged between the copper bottom (11) and the main board (3), a plurality of water cooling calandria (5) are communicated with the side wall of the liquid inlet box (7), the other ends of the water cooling calandria (5) are communicated with the inside of the circulating box (9), and the circulating pump (8) is fixedly arranged in the circulating box (9);
The middle parts of the water-cooling calandria (5) are communicated with a heat dissipation box (10), a fixed table (6) is fixedly arranged on the upper surface of the copper bottom (11) through screws, and a reserved groove for installing the heat dissipation box (10) is formed in the upper surface of the fixed table (6).
2. The integrated water-cooled display card radiator according to claim 1, wherein the air cooling assembly comprises a radiator fan (12), a mounting frame (13) and radiating fins (14), two mounting grooves for the radiator fan (12) to move are formed in the upper surface of the cover plate (2), the mounting frames (13) are fixedly connected to the lower ends of the two mounting grooves, the radiator fan (12) is fixedly mounted on the upper surfaces of the two mounting frames (13), and a plurality of the radiating fins (14) are fixed between a plurality of water-cooled calandria (5) respectively.
3. The integrated water-cooled graphics card radiator according to claim 1, wherein the interior of the radiator box (10) is divided into a liquid inlet cavity (16) and a liquid outlet cavity (17) by a partition plate (15), and a liquid inlet groove (18) and a liquid outlet groove (19) which are communicated with the liquid inlet cavity (16) and the liquid outlet cavity (17) are separately arranged in the fixed table (6).
4. The integrated water-cooling display card radiator according to claim 1, wherein a first bracket (20), a second bracket (21) and a third bracket (22) are fixedly arranged on the upper surface of the main board (3) through screws, fixing frames (23) are fixedly connected to the front end and the rear end of the liquid inlet box (7), the liquid inlet box (7) is fixedly connected with the circulation box (9) through two fixing frames (23), and the two fixing frames (23) are fixedly connected with the first bracket (20), the second bracket (21) and the third bracket (22) through screws.
5. The integrated water-cooled graphics card radiator according to claim 4, wherein the first cooling fins (24) are fixedly connected to the upper surfaces of the first bracket (20) and the second bracket (21), the second cooling fins (25) are symmetrically and fixedly connected to the upper surface of the copper bottom (11), and the mounting groove for mounting the water-cooled fins (26) is formed in the upper surface of the copper bottom (11).
6. The integrated water-cooled display card radiator according to claim 5, wherein a sealing groove for installing a sealing ring (27) is formed in the lower surface of the fixed table (6), the lower end of the sealing ring (27) is abutted against the upper surface of the copper bottom (11), a protection pad (28) is clamped on the lower surface of the fixed table (6), and the lower surface of the protection pad (28) is abutted against the upper surface of the water-cooled fin (26).
7. The integrated water-cooled graphics card radiator according to claim 1, wherein a liquid inlet pipe (29) is communicated with the inside of the liquid inlet box (7), and a sealing cover (30) is connected with the inside of the liquid inlet pipe (29) in a threaded manner.
8. The integrated water-cooled display card radiator according to claim 1, wherein the upper surface of the bottom plate (1) is fixedly connected with a metal back plate (31), and the cover plate (2) is fixedly connected with the bottom plate (1) through the metal back plate (31).
CN202322493297.7U 2023-09-13 2023-09-13 Integrated water-cooling display card radiator Active CN220913610U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322493297.7U CN220913610U (en) 2023-09-13 2023-09-13 Integrated water-cooling display card radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322493297.7U CN220913610U (en) 2023-09-13 2023-09-13 Integrated water-cooling display card radiator

Publications (1)

Publication Number Publication Date
CN220913610U true CN220913610U (en) 2024-05-07

Family

ID=90907847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322493297.7U Active CN220913610U (en) 2023-09-13 2023-09-13 Integrated water-cooling display card radiator

Country Status (1)

Country Link
CN (1) CN220913610U (en)

Similar Documents

Publication Publication Date Title
TWI238691B (en) Cooling module
CN213482806U (en) Liquid cooling radiator for server
CN1797276A (en) Liquid cooling type heat sink
CN209560478U (en) A kind of novel computer radiator
CN214954895U (en) Water-cooling heat dissipation device
CN220913610U (en) Integrated water-cooling display card radiator
CN108227883A (en) A kind of huge computer servers radiator
CN209946807U (en) Auxiliary heat dissipation device for computer case
CN204904175U (en) Liquid cooling computer
CN216291941U (en) Water-cooling heat dissipation device and electronic device
CN213029008U (en) Metal heat dissipation module
CN211831657U (en) Novel network security gateway
CN209946787U (en) Sheet-metal case with efficient heat dissipation function
CN213601176U (en) Computer radiator with dustproof function
CN216979714U (en) Heat dissipation cold head with pump
CN211293845U (en) Computer hardware heat dissipation case
CN219042318U (en) Integrated structure of rear cover cast aluminum radiator of vehicle-mounted host
CN219456824U (en) Water-cooling radiator
CN215895405U (en) Computer information storage chip protection device
CN210983313U (en) Heat radiator for reinforcement type computer
CN216532388U (en) Novel video processing chip
CN215450120U (en) Computer CPU radiator
CN217034687U (en) Split type high-efficient heat abstractor
CN216286541U (en) Be applied to integral type water-cooling radiator and computer of 1U server
CN212694358U (en) Computer water-cooling turbine radiator

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant