CN100410841C - Heat sink of computer system - Google Patents
Heat sink of computer system Download PDFInfo
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- CN100410841C CN100410841C CNB011349786A CN01134978A CN100410841C CN 100410841 C CN100410841 C CN 100410841C CN B011349786 A CNB011349786 A CN B011349786A CN 01134978 A CN01134978 A CN 01134978A CN 100410841 C CN100410841 C CN 100410841C
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- heat
- power supply
- computer
- fan
- cpu
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- 239000000758 substrate Substances 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000030279 gene silencing Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a heat radiating device (1) of a computer system, which comprises a heat radiating device (2) for a power supply, and a heat radiating device (3) for a CPU. The present invention is characterized in that 1, the heat radiating device (2) for the power supply comprises a fan (4) which is arranged at the top of a casing of the power supply, and an air outlet (5) is arranged on one side wall of the casing of the power supply; 2, the heat radiating device (3) for the CPU is a low-noise integrated heat pipe radiating device comprising a base plate (6) which is fixed on a main plate and is in contact with the CPU, a plurality of heat pipes (7) with one end fixedly connected to the base plate (6), a heat radiating fin (8) fixedly connected to the other end of each heat pipe (7), a fixed support frame (9) fixed on a host machine box of a computer, and a fan (10), wherein the heat radiating fin (8) and the fan (10) are fixed on the fixed support frame (9).
Description
Technical field
The invention belongs to field of computer technology, and relate to a kind of heat sink of computer system particularly.
Background technology
At present, the radiating mode of desktop computing device is based on air-cooled, and total heat dissipation capacity of system is directly proportional with the temperature rise of the air of ventilation and turnover system.Along with the growth of computer CPU power, heat dissipation technology to be had higher requirement, common system radiating placement scheme makes the noise of system maintain a lower level again when being difficult in the demand that satisfies system radiating.
The power supply of present desktop PC system uses 8025 fans usually, it is installed in a side on the outer casing of power supply but not the outside at top, because the restriction of outer casing of power supply side wall dimensions, the diameter of fan only is 80mm, opposite side on outer casing of power supply is provided with air inlet, a side that is provided with the power supply of this fan be positioned at computer cabinet air outlet near, thereby by the air-flow that the fan rotation produces computer cabinet inside is comprised that the heat that power supply produces blows out through ventilating opening.In design in the past, if make ventilation can reach 15cfm, the power supply single noise less than 40db about, then the minimum needs of the rotating speed of this fan reach about 2500rpm.To improve the way of system ventilation amount infeasible because the user, further improves the rotating speed of power supply fan to the raising of the quiet requirement of system.
Although the thermal resistance value of the heating radiator monomer of common overhead on heat generating components such as CPU can be lower; usually at 0.4～0.8k/w; but because the power supply ventilation is lower; the rising of internal system environment temperature and the influence of local eddy currents; CPU package surface temperature usually can be very high, especially under system power supply ventilation condition of limited.The thermal resistance value that further reduces heating radiator generally is to realize by the rotating speed that improves fan, and this just causes the noise of system to raise, and the comfortableness of use descends.
The key that solves present problem is to reduce the intrasystem air themperature of cabinet, improves the ventilation of system, and the wind path of unobstructed system reduces or eliminates intrasystem local eddy currents.
Summary of the invention
Deficiency at prior art exists the object of the present invention is to provide a kind of heat sink of computer system, and it has not only improved the power supply ventilation, has reduced system noise, and can produce in enormous quantities, and parts are easy to change.
For realizing purpose of the present invention, a kind of heat sink of computer system is provided, it comprises a computer power supply heat abstractor and a computer CPU heat abstractor, it is characterized in that: (1) this computer power supply comprises the fan of a diameter greater than 80mm with heat abstractor, this fan is set at the side towards CPU of computer power supply enclosure, and an air outlet is set on the sidewall of computer power supply shell; (2) this computer CPU heat abstractor is a low noise integrated heat pipe radiator, and this low noise integrated heat pipe radiator comprises a substrate, and this substrate is fixed on the mainboard and with CPU and contacts, and is used to absorb the heat that CPU sends; Some heat pipes, an end of these some heat pipes is fixedly attached to this substrate, is used to conduct the heat that this substrate absorbs; One radiated rib is fixedlyed connected with the other end of heat pipe, is used to conduct the heat that heat pipe carries; One is fixed to the fixed support on the computer mainframe box, and radiated rib is fixed on this fixed support; And a fan, be fixed on this fixed support, be used to produce air-flow, the heat of radiated rib conduction is directly discharged by the system fan hole on the cabinet.
In one embodiment, this computer power supply is housed is installed in the inside of computer cabinet with the computer power supply of heat abstractor, make its air outlet be positioned at chassis intake near, and this computer power supply that its top is provided with the fan of heat abstractor away from chassis intake and be positioned at the top of the CPU of cabinet.
In one embodiment, this computer power supply is 120mm with the diameter of the fan of heat abstractor.
In one embodiment, this computer power supply is set at the inboard of computer power supply shell with the fan of heat abstractor.
In one embodiment, described air outlet is made up of the little air vent of a plurality of spaces, and spreads all over the whole sidewall of the computer power supply shell at its place.
In one embodiment of this invention, this heat pipe can be one, two, three or more heat pipe.
In one embodiment of this invention, this substrate, heat pipe and radiated rib can use copper, aluminium or other heat conductivility good metal or nonmetallic materials.
In one embodiment of this invention, this radiated rib can use the common aluminium extruded type heating radiator that has substrate.
According to low noise integrated heat pipe radiator of the present invention, have the following advantages: (1) is by being arranged on fan at the top of computer power supply shell, make and to adopt the fan of diameter greater than 80mm, thereby improved ventilation, reduced rotation speed of the fan, reduce the power supply fan noise, thereby reduced the noise of complete machine; (2) fan is arranged on the inside of outer casing of power supply, has further reduced the noise of power supply fan; (3) raising of ventilation makes the temperature control circuit part to be set in the computer power supply, has prolonged the life-span of power supply fan, has reduced the cost of power supply.(4) use the low noise integrated heat pipe radiator, can effectively avoid the appearance of local eddy currents in the cabinet, the wind path of unobstructed system, radiated rib is in the very low surrounding air of temperature, increased heat transfer temperature difference, fin efficiency increases. because heat dissipation capacity is directly proportional with the temperature difference, be inversely proportional to thermal resistance, therefore under the constant situation of heat radiator thermal resistance, thereby can increase the heat of heating radiator unit area. satisfy under the requirement of system radiating, and the reduction rotation speed of the fan, system noise is dropped to below 30 decibels.And can produce in enormous quantities, parts are easy to change.
Description of drawings
Fig. 1 is for being installed in the constitutional diagram in the computer cabinet according to the heat sink of computer system of one embodiment of the invention;
Fig. 2 is the structural representation of computer power supply heat abstractor shown in Figure 1;
Fig. 3 is the structural representation of low noise integrated heat pipe radiator shown in Figure 1;
Fig. 4 is the side view of computer power supply heat abstractor shown in Figure 1;
Fig. 5 is the side view of low noise integrated heat pipe radiator shown in Figure 1; And
Embodiment
Below in conjunction with accompanying drawing, one embodiment of the invention are elaborated.
Referring to Fig. 1,2 and 4, show a kind of heat sink of computer system 1 according to one embodiment of the invention, it comprises a computer power supply heat abstractor 2 and computer CPU heat abstractor 3.
Wherein this computer power supply comprises that with heat abstractor 2 diameter is the fan 4 of 120mm, and this fan 4 is set at the top of computer power supply shell, and an air outlet 5 is set on the sidewall of computer power supply shell.Described fan 4 is set at the inboard of computer power supply shell.Described air outlet 5 is made up of the little air vent of a plurality of spaces, and spreads all over the whole sidewall of the computer power supply shell at its place.When computer power supply is installed in the inside of computer mainframe box, make its air outlet 5 be positioned at chassis intake 11 near, and its top fan 4 is away from chassis intake 11 and be positioned at the top of the CPU of cabinet, make by the blowing of fan 4, cabinet inside is comprised that the heat that power supply and CPU produce blows out outside the cabinet through air outlet 5 and chassis intake 11.
Through test, by using the fan 1 of 120mm, satisfying under the condition that ventilation reaches 20cfm, the rotating speed of fan 4 is designed in 1200 right sides of turning left, and noise is reduced to below the 30db.Fan 4 is arranged on the inside of outer casing of power supply, has further reduced the noise of fan 4.In order to increase radiating effect, carry out exhausting by fan 4, increased the size of air outlet 5 simultaneously, the components and parts height on the circuit board in the outer casing of power supply is accomplished minimum, can make the ventilation of power supply increase 5cfm, noise reduces 10db.The raising of ventilation makes the temperature control circuit part to be set in the computer power supply, has prolonged the life-span of fan 4, has reduced the cost of power supply.
Referring to Fig. 4 and 6, this computer CPU is a low noise integrated heat pipe radiator with heat abstractor 3, and it comprises a substrate 6, and it is fixed on the mainboard and with CPU and contacts, and is used to absorb the heat that CPU sends; Some heat pipes 7, one end are fixedly attached to this substrate 6, are used to conduct the heat that this substrate 6 is absorbed; One radiated rib 8 is fixedlyed connected with the other end of heat pipe 7, is used to conduct the heat that heat pipe 7 carries; One is fixed to the fixed support 9 on the computer mainframe box, and radiated rib 8 is fixed on this fixed support 9; And a fan 10, be fixed on this fixed support 9, be used to produce air-flow, the heat of radiated rib 8 conduction is directly discharged by the system fan hole on the cabinet.
Wherein this substrate 6 is copper coin or aluminium sheet, and it contacts on mainboard and with CPU by screw retention.This heat pipe 7 is two copper pipes or aluminum pipe, its can be as required in scope allowable by bending.This radiated rib 8 is for having the common aluminium extruded type heating radiator of substrate.This fan 10 is a design speed per hour at the 1200 right slow-speed of revolution fans that turn left, and it can be regulated as required, blowing or air draught outside cabinet in cabinet.
The inventor adopts basis in the MICRO-ATX P42GHz of association silencing computer
Heat sink of computer system 1 of the present invention is tested, and test result please be seen following table 1 and table 2:
The report of table 1. computer environment temperature test
By table 1 as seen, adopt according to behind the heat sink of computer system 1 of the present invention, the environment temperature of computer system reduces significantly, generally than only high 3 degree of system's external environment temperature.
Table 2: the computing machine total noise of centrifuge test report according to heat abstractor of the present invention is housed
The?Report?of?Fan?Noise?Test
By table 2 as seen, adopt noise according to the computer system of heat sink of computer system 1 of the present invention below 27 decibels.
Though only an embodiment is here illustrated and is described, should be appreciated that according to above-mentioned teaching, do not breaking away under the prerequisite of the spirit and scope of the present invention that limit by accompanying Claim, a lot of change of the present invention and variation are possible, for example the diameter of fan 4 can be 100mm or 110mm, the passive heat radiation device that is used for computer power supply and diversion trench also can be housed to obtain better radiating effect etc.
Claims (8)
1. a heat sink of computer system (1), it comprises that a computer power supply with heat abstractor (2) and computer CPU usefulness heat abstractor (3), is characterized in that:
This computer power supply comprises the fan (4) of a diameter greater than 80mm with heat abstractor (2), and this fan (4) is set at the side towards CPU of computer power supply enclosure, and an air outlet (5) is set on the sidewall of computer power supply shell;
This computer CPU is a low noise integrated heat pipe radiator with heat abstractor (3), and this low noise integrated heat pipe radiator comprises: a substrate (6), and this substrate (6) is fixed on the mainboard and with CPU and contacts, and is used to absorb the heat that CPU sends; Some heat pipes (7), an end of these some heat pipes is fixedly attached to this substrate (6), is used to conduct the heat that this substrate (6) is absorbed; One radiated rib (8) is fixedlyed connected with the other end of heat pipe (7), is used to conduct the heat that heat pipe (7) carries; One is fixed to the fixed support (9) on the computer mainframe box, and radiated rib (8) is fixed on this fixed support (9); And a fan (10), be fixed on this fixed support (9), be used to produce air-flow, the heat of radiated rib (8) conduction is directly discharged by the system fan hole on the cabinet.
2. heat sink of computer system according to claim 1, it is characterized in that: this computer power supply is installed in computer cabinet with the computer power supply of heat abstractor (2) inside is housed, make its air outlet (5) be positioned at chassis intake (11) near, and this computer power supply that its top is provided with the fan (4) of heat abstractor (2) away from chassis intake (11) and be positioned at the side of facing CPU of cabinet.
3. heat sink of computer system according to claim 1 is characterized in that: this computer power supply is 120mm with the diameter of the fan (4) of heat abstractor (2).
4. heat sink of computer system according to claim 1 is characterized in that: this computer power supply is set at the inboard of computer power supply shell with the fan (4) of heat abstractor (2).
5. heat sink of computer system according to claim 1 is characterized in that: described air outlet (5) is made up of the little air vent of a plurality of spaces, and spreads all over the whole sidewall of the computer power supply shell at its place.
6. heat sink of computer system according to claim 1 is characterized in that: this heat pipe (7) can be one, two, three or more heat pipe.
7. heat sink of computer system according to claim 1 is characterized in that: this substrate (6), heat pipe (7) and radiated rib (8) can use copper, aluminium or other heat conductivility good metal or nonmetallic materials.
8. heat sink of computer system according to claim 1 is characterized in that: this radiated rib (8) can use the common aluminium extruded type heating radiator that has substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011349786A CN100410841C (en) | 2001-11-21 | 2001-11-21 | Heat sink of computer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011349786A CN100410841C (en) | 2001-11-21 | 2001-11-21 | Heat sink of computer system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1420412A CN1420412A (en) | 2003-05-28 |
| CN100410841C true CN100410841C (en) | 2008-08-13 |
Family
ID=4672871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011349786A Expired - Fee Related CN100410841C (en) | 2001-11-21 | 2001-11-21 | Heat sink of computer system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100410841C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10085360B2 (en) | 2016-07-11 | 2018-09-25 | Lintes Technology Co., Ltd | Heat sink assembly |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8837139B2 (en) * | 2007-09-29 | 2014-09-16 | Biao Qin | Flat heat pipe radiator and application thereof |
| CN101290531B (en) * | 2008-06-18 | 2013-04-10 | 秦彪 | Portable computer |
| CN101859170A (en) * | 2010-05-17 | 2010-10-13 | 方正科技集团苏州制造有限公司 | Radiating structure of micro-projection computer |
| CN102348363A (en) * | 2010-07-30 | 2012-02-08 | 上海微电子装备有限公司 | Electric cabinet |
| CN202533862U (en) * | 2012-02-23 | 2012-11-14 | 周哲明 | Low-noise computer radiating device |
| CN105652991B (en) * | 2015-12-29 | 2019-09-03 | 湖南长城银河科技有限公司 | Cooling device for notebook computer and notebook computer |
| CN108856154A (en) * | 2018-08-17 | 2018-11-23 | 上海至盛信息技术股份有限公司 | A kind of notebook, all-in-one machine dedusting method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2202942Y (en) * | 1994-10-22 | 1995-07-05 | 刘镇锋 | Cooling device for computer host |
| CN2302549Y (en) * | 1997-07-26 | 1998-12-30 | 叶明祥 | Source radiating device for computer |
| CN2383112Y (en) * | 1999-03-11 | 2000-06-14 | 富金精密工业(深圳)有限公司 | Computer configuration structure |
| JP2001203485A (en) * | 1999-08-06 | 2001-07-27 | Showa Alum Corp | Heatsink of CPU for personal computer |
| CN2453646Y (en) * | 2000-11-15 | 2001-10-10 | 唐徵 | Guiding tube type air cooling radiator |
| CN2456214Y (en) * | 2000-12-06 | 2001-10-24 | 林清彬 | central processing unit radiator |
-
2001
- 2001-11-21 CN CNB011349786A patent/CN100410841C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2202942Y (en) * | 1994-10-22 | 1995-07-05 | 刘镇锋 | Cooling device for computer host |
| CN2302549Y (en) * | 1997-07-26 | 1998-12-30 | 叶明祥 | Source radiating device for computer |
| CN2383112Y (en) * | 1999-03-11 | 2000-06-14 | 富金精密工业(深圳)有限公司 | Computer configuration structure |
| JP2001203485A (en) * | 1999-08-06 | 2001-07-27 | Showa Alum Corp | Heatsink of CPU for personal computer |
| CN2453646Y (en) * | 2000-11-15 | 2001-10-10 | 唐徵 | Guiding tube type air cooling radiator |
| CN2456214Y (en) * | 2000-12-06 | 2001-10-24 | 林清彬 | central processing unit radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10085360B2 (en) | 2016-07-11 | 2018-09-25 | Lintes Technology Co., Ltd | Heat sink assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1420412A (en) | 2003-05-28 |
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Granted publication date: 20080813 Termination date: 20201121 |
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