JP3113683U - Heat dissipation device for computer motherboard - Google Patents

Abstract

Disclosed is a heat dissipation device for a motherboard of a computer, which can conduct heat energy generated by a heat generating device to a computer case via a heat sink to achieve noise reduction and a large area heat dissipation effect.
A support plate is fixed to the inner surface of at least one side plate of a computer case including a frame, a front plate, a back plate, two side plates and an upper plate, and a bottom plate. A heat sink installed between the plates, and a plurality of connectors, electronic devices, and heat generating devices such as a CPU and IC chip on each of the two surfaces are fixed to another surface of the support plate, and these heat generating devices are mounted on one surface of the heat sink described above. Includes a flat abutting motherboard.
[Selection] Figure 1

Description

  The present invention relates to a heat dissipating device for a motherboard of a computer, and more particularly to a heat dissipating device for a motherboard of a computer that reduces noise and achieves a large area heat dissipation effect.

  With the constant advancement of computer information technology, computer-related equipment and devices, such as hard disks, motherboards, and CPUs, are evolving day by day, and multimedia editing processing data is becoming larger and faster. Speeding up, resulting in excessive operating temperatures of personal computer internal equipment and integrated circuit devices, the chip on the motherboard also generates high heat at run time, and if the hot air is not removed in a timely manner, it will affect its normal operation This reduces the execution speed and also affects the service life. Therefore, installing a heat sink and a fan in the heat source is a common solution.

  In general, according to a heat dissipation structure disposed in a CPU, a heat sink is disposed on the CPU disposed on the motherboard, the heat sink is disposed so as to cover the CPU, and a fan is separately attached above the heat sink. The heat dissipation method absorbs the heat generated by the CPU by the heat sink and expands the heat source area. Further, the heat generated by the fan mounted above the heat sink causes the heat of the heat sink to flow in all directions, thereby reducing the heat dissipation. Achieve effect.

  However, the inside of the computer case belongs to a closed space, and there is a device on the motherboard that generates heat during operation other than the CPU, and heat is completely removed from the computer case directly in the closed space inside the computer case. However, the method in which hot air circulates inside the computer case and the fan blows air toward the heat sink is merely a repeated flow of the hot air flow inside the computer in a closed space. The generated heat dissipation effect is poor, a complete heat dissipation function cannot be achieved, and the operating efficiency decreases or freezes due to excessive CPU temperature, which may cause damage. For this reason, the well-known heat dissipation structure of the CPU does not match the actual use requirement.

  The main object of the present invention is to solve the above-mentioned drawbacks and eliminate the existence of the disadvantages, that is, by using a heat sink installed on one side of the computer case and bringing the heat generating device into contact with the heat sink, The heat energy generated by the heat generating device is conducted to the computer case via the heat sink, thereby reducing noise and achieving a large area heat radiation effect.

  To achieve the above object, the present invention provides a support plate on the inner surface of at least one side plate of a computer case composed of a frame, a front plate, a back plate, two side plates and an upper plate, and a bottom plate, and one surface of the support plate. Heat sink fixed between the support plate and the side plate, and a plurality of connectors, electronic devices and heat generating devices such as CPU and IC chip on each of the two surfaces, and fixed to another surface of the support plate. A motherboard includes a device that abuts flatly on one side of the heat sink described above.

The invention of claim 1 is a heat dissipation device for a motherboard of a computer.
A computer case comprising a frame and a front plate, a back plate, two side plates, an upper plate, and a bottom plate installed on each side of the frame, and a support plate provided on the inner surface of at least one side plate; A heat sink fixed between one side of the support plate and installed between the support plate and the side plate;
A plurality of connectors and an electronic device are installed on one surface of the above-described support plate, and a heat generating device such as a CPU and an IC chip is installed on the other surface. And a motherboard that abuts flatly,
A heat radiating device for a motherboard of a computer, characterized in that
According to a second aspect of the present invention, there is provided a heat dissipation device for a motherboard of a computer according to the first aspect of the present invention, wherein the support plate includes a perforated portion installed corresponding to the bottom of the heat sink. Yes.
According to a third aspect of the present invention, there is provided a heat dissipation device for a motherboard of a computer according to the first aspect, wherein the heat sink includes a bottom seat and a plurality of fins extending from the bottom seat. Yes.

  The present invention conducts heat energy generated by the heat generating device to a computer case through a heat sink, thereby achieving noise reduction and a large area heat radiation effect.

  1, 2 and 3 are a three-dimensional external view, a three-dimensional exploded view and a cross-sectional view of the present invention. As shown in the figure, the heat dissipating device for a computer motherboard of the present invention comprises a computer case 1, a heat sink 2, and a mother board 3, and achieves noise reduction and a large area heat dissipating effect.

  The computer case 1 of the above-described computer includes at least one frame 11 and a front plate 12, a back plate 13, two side plates 14 and 15, an upper plate 16, and a bottom plate 17 installed on each surface of the frame 11. A support plate 18 is provided on the inner surface of the side plate 14, and the support plate 18 includes a perforated portion 181.

  The heat sink 2 includes a bottom seat 21 and a plurality of fins 22 extending from the bottom seat 21, and the heat sink 2 is fixed to the perforated portion 181 of the support plate 18 by the bottom seat 21, and The heat sink 2 is installed between the support plate 18 and the side plate 14.

  The motherboard 3 is fixed to another surface of the above-described support plate 18, and a plurality of connectors 31 and an electronic device 32 are provided on one surface of the motherboard 3, and the CPU 33 and the IC chip 34 generate heat on the other surface of the motherboard 3. An apparatus is installed, and these heat generating devices abut against one surface of the heat sink 2 described above. As described above, a novel heat dissipating device for a motherboard of a computer is configured.

  4 and 5 are a display diagram of a usage state of the present invention and a display diagram of another example of use of the present invention. As shown in the figure, when the heat generating devices such as the CPU 33 and the IC chip 34 generate heat during operation, the bottom seat 21 of the heat sink 2 directly absorbs the heat of these heat generating devices and conducts them to the fins 22 to generate heat. Achieve dissipation.

  The volume of the heat sink 2 is substantially equal to the support plate 18, so that when the heat of the heat generating device is conducted to each fin 22, a relatively large amount of heat is absorbed and when each fin 22 dissipates heat. Each fin 22 is in direct contact with the side plate 14 (FIG. 5), or is not in contact with the side plate 14 and a gap is formed between each fin 22 and the side plate 14 (FIG. 4). Each fin 22 conducts heat to the computer case 1 when it contacts 14 and forms a heat dissipation, and when each fin 22 is not in contact with the side plate 14, the gap between each fin 22 and the side plate 14 is airflow. A channel is formed and the heat of each fin 22 is dissipated.

  In summary, the heat dissipating device for the motherboard of the computer according to the present invention improves a number of drawbacks of the well-known technology, transfers the heat generated by the heat generating device to the computer case via the heat sink, and achieves a large heat dissipating function. This saves the mounting space of the motherboard and achieves an effective mounting operation on the motherboard, so that the present invention has an inventive step and practicality and meets the needs of the user.

  The embodiments described above do not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the claims of the present invention.

It is a three-dimensional external view of the present invention. It is a three-dimensional exploded view of the present invention. It is sectional drawing of this invention. It is a use condition display figure of the present invention. It is another use condition display figure of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Computer case 11 Frame 12 Front board 13 Back board 14, 15 Side board 16 Top board 17 Bottom board 18 Support board 181 Perforation part 2 Heat sink 21 Bottom seat 22 Fin 3 Motherboard 31 Connector 32 Electronic device 33 CPU
34 IC chip

Claims (3)

In a computer motherboard heatsink,
A computer case comprising a frame and a front plate, a back plate, two side plates, an upper plate, and a bottom plate installed on each side of the frame, and a support plate provided on the inner surface of at least one side plate; A heat sink fixed between one side of the support plate and installed between the support plate and the side plate;
A plurality of connectors and an electronic device are installed on one surface of the above-described support plate, and a heat generating device such as a CPU and an IC chip is installed on the other surface. And a motherboard that abuts flatly,
A heat radiating device for a motherboard of a computer, comprising:   2. The heat dissipating device for a mother board of a computer according to claim 1, wherein the support plate includes a perforated portion in which a bottom portion of the heat sink corresponds and is installed. 2. A heat dissipation device for a computer motherboard according to claim 1, wherein the heat sink comprises a bottom seat and a plurality of fins extending from the bottom seat.

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