JPH08286783A - Heat radiating structure for electronic parts in information unit - Google Patents

Abstract

PURPOSE: To efficiently radiate the heat of CPU by radiating heat that CPU fitted to a CPU substrate generates through the use of a first metallic board, a second metallic board and a heat transmission means. CONSTITUTION: The tip of a boss for heat transmission 12 is screwed into a boss 13 which is integrally formed in a bottom cabinet 1 from above, and the first metallic board 5 and a main substrate 6 are fixed to the bottom cabinet 1. Brass interface metallic parts 11 are fitted to the main substrate 6 for heat- radiating the bottom cabinet 1. Heat radiated by CPU 8 is transmitted to the CPU substrate 7 at first and is transmitted to the first metallic board 5 through the boss for heat transmission 12 so as to be radiated. Heat is radiated by an aluminum board 14 provided at the upper part of the CPU substrate 7 and heat is radiated by the metallic board 16 through a silicon sheet for heat transmission 15. Furthermore, heat transmitted to the second metallic board 10 by a heat pipe 9 connected to the aluminum board 14 is radiated by the metallic board 10 and the metallic parts 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component which is a highly heat-generating component of information equipment, and particularly C which affects other components.
The present invention relates to a heat dissipation structure for electronic components in information equipment that dissipates heat generated by PU.

[0002]

2. Description of the Related Art Heretofore, in various portable electronic devices, a heat radiating plate has often been used to generate heat from electronic components, and various measures have been taken to dissipate the heat.

In particular, personal computers (hereinafter referred to as PCs) as information devices have been made particularly thin, notebook PCs have become mainstream, and CPUs, which are semiconductor components housed therein, have high-speed performance. From that,
The amount of heat generated is extremely large, and it has come to affect peripheral parts.

Then, as a concrete solution, Japanese Patent Laid-Open No.
As disclosed in Japanese Patent Publication No. 1-294528, a structure is provided in which ventilation holes are provided in the PC main body so that heat can be efficiently discharged, or a cooling fan is forcibly used as disclosed in Japanese Utility Model Laid-Open No. 2-119728. A structure that dissipates heat can be considered.

[0005]

Among the conventional techniques disclosed in the above-mentioned publication, the former, if the air passage is simply provided, heat generated from the CPU of the CPU board provided directly below the keyboard is not generated. It is conceivable that the heat resistance limit of the keyboard will be exceeded considerably.

In the latter case, while the office automation equipment in offices is increasing rapidly as in recent years, the power consumption by the cooling fan and the generation of the noise thereof have a great influence on the work environment and remain a problem.

Therefore, the present invention is particularly applicable to the CPU in the PC body.
We propose a new technology to efficiently and dissipate the heat generated by.

[0008]

According to the present invention, there is provided an information device in which a keyboard is provided above a bottom cabinet constituting a PC main body, and a main board and a CPU board are provided below the keyboard inside the bottom cabinet. The heat generated by the CPU attached to the CPU is effectively dissipated by using the first and second metal plates and the heat conducting means.

[0009]

According to the present invention, a large amount of heat generated from the CPU during operation can be effectively dissipated by the elements constituting the present invention, so that the influence on the surroundings of the keyboard and the like can be minimized.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.
Shows a completed partial sectional view of the embodiment of the present invention, and FIG. 2 shows an exploded perspective view of the embodiment.

In FIGS. 1 and 2, 1 is a bottom cabinet which constitutes the computer main body, 2 is a keyboard having a key top 3 and a cover 4, 5 is a first metal plate made of an aluminum plate, and 6 is a main electron. A main board called a main board on which components are attached, 7 is a CPU board on which a CPU 8 is attached, 9 is a heat pipe made of a copper pipe, and 10 is mechanically and thermally coupled to the heat pipe at one end. Second metal plate made of aluminum, 1
1 is an interface fitting.

Reference numeral 12 is a boss for heat transfer, which is made of brass, and has a tip end that is screwed into a mounting boss 13 integrally provided in the bottom cabinet. 14 is an aluminum plate arranged on the back surface of the keyboard 2;
Reference numeral 5 is a silicon sheet for heat conduction, and 16 is a mounting screw.

The structure of the present invention will be described below according to the order of attachment in the present invention. As shown in FIG. 1, a bottom cabinet 1 made of a synthetic resin is provided with a first metal plate 5 inside thereof. Store the main board 6,
Boss 13 formed integrally with the bottom cabinet 1
The tip of the boss 12 for heat transfer is screwed in from above to fix the first metal plate 5 and the main substrate 6 to the bottom cabinet 1.

An interface metal fitting 11 is mounted on the main board 6 as a radiating plate made of casting for radiating heat from the back surface of the bottom cabinet 1. Next, the components shown in FIG. 2 are sequentially stored in the bottom cabinet 1,
It is incorporated in the state shown in FIG. In that case, each component is fixed with a screw 16 as required.

With the above-described structure, the heat generated by the CPU 8 is first transferred to the CPU board 7 and then transferred to the first metal plate via the heat conduction boss 12, and is radiated by the first metal plate. .

Further, the heat is dissipated by the aluminum plate 14 provided above the CPU substrate 7 and the heat is dissipated by the brass metal plate 16 through the silicone sheet 15 for heat conduction.

The heat transferred to the second metal plate 10 by the heat pipe 9 connected to the aluminum plate 14 is radiated by the second metal plate 10. In addition,
1 and 2, a display element such as an LCD is omitted, and the display element is attached above the bottom cabinet 1,
Complete as C.

With the above-mentioned structure, the temperature of the area immediately below the CPU can be lowered by 5 degrees on the surface of the bottom cabinet 1, and the temperature of the area immediately below the CPU can be reduced by 13 degrees on the inner surface of the bottom cabinet 1. Was able to be protected.

[0019]

According to the present invention, the heat can be dissipated to the keyboard, and the rear panel is made of a material having good thermal conductivity.
It is possible to efficiently dissipate the heat generated by the CPU.

Further, the radiant heat from the CPU can be made uniform by the first metal plate placed inside the bottom cabinet. Further, if the rear panel and the first metal plate in the bottom cabinet are in close contact with each other, heat can be more efficiently dissipated from the rear panel.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an essential part showing a heat dissipation structure of an electronic component in an information device of the present invention.

FIG. 2 shows the same exploded perspective view of the present invention.

[Explanation of symbols]

 1 Bottom Cabinet 2 Keyboard 5 First Metal Plate 6 Main Board 7 CPU Board 9 Heat Pipe 10 Second Metal Field 11 Interface Metal Fitting 12 Heat Transfer Boss 16 Mounting Screw

Claims (3)

[Claims] 1. A main board and a CPU provided below a keyboard
In an information device including a bottom cabinet having a substrate inside, a first heat-dissipating metal plate thermally coupled to a CPU mounted on the CPU substrate through a metal tube is provided on an inner wall of the bottom cabinet. A second metal plate is provided with a third metal plate on the back surface of the bottom cabinet via a heat conducting means to dissipate the heat generated by the CPU. Construction. 2. A heat dissipation structure for electronic parts in an information device according to claim 1, wherein a copper pipe is used as the metal pipe. 3. The electronic component of the information device according to claim 1, wherein a heat pipe is used as the heat conducting means, and aluminum plates are used as the first metal plate and the second metal plate. Heat dissipation structure.