JPH11202978A - Notebook-sized computer - Google Patents

Notebook-sized computer

Info

Publication number
JPH11202978A
JPH11202978A JP10008295A JP829598A JPH11202978A JP H11202978 A JPH11202978 A JP H11202978A JP 10008295 A JP10008295 A JP 10008295A JP 829598 A JP829598 A JP 829598A JP H11202978 A JPH11202978 A JP H11202978A
Authority
JP
Japan
Prior art keywords
heat
case
main body
board
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10008295A
Other languages
Japanese (ja)
Other versions
JP3601282B2 (en
Inventor
Kazuaki Kurita
和哲 栗田
Shigeharu Munei
繁春 棟居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP00829598A priority Critical patent/JP3601282B2/en
Publication of JPH11202978A publication Critical patent/JPH11202978A/en
Application granted granted Critical
Publication of JP3601282B2 publication Critical patent/JP3601282B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To suppress the elevation of temperature on the surface of a main body case by intercepting a heating part inside a device and a device case with a heat insulator, conducting generated heat through a heat pipe to a radiation board on the rear side of a display part and radiating the heat through the chimney effect of ventilation holes on the upper and lower sides of a display part case. SOLUTION: A printed circuit board 5 and an HDD 7 are housed inside a main body part 1, and an aluminum board 9 for ground is laid on a gap with the base part of the case. Besides, a heat pipe 11 is connected to a radiation block 8 tightly adhered to the printed circuit board 5 and a CPU 6. Then, the gap between the printed circuit board 5, and keyboard 3, HDD 7, aluminum board 9 for ground and the case of a main body part 1 is surrounded with a heat insulator 10. The heat collected to the block 8 for radiation is conducted through the heat pipe 11 to the radiation board and radiated into the air. The radiation board is arranged inside the display part, the natural circulation of air is let occur by the chimney effect of upper exhaust port and lower inhalation port, and a cooling effect is improved.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はノート形コンピュー
タに代表される携帯を目的とした装置に関し、特に、装
置内部で発生した熱が装置ケースの表面に伝達され、装
置ケース表面の温度が上昇したとき、装置利用者の身体
と前記装置ケース表面とが長時間接触する部分の熱が装
置利用者に不快感を与える事を防ぐのに好適なノート形
コンピュータに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable device typified by a notebook computer, and more particularly, heat generated inside the device is transferred to the surface of the device case, and the temperature of the surface of the device case rises. The present invention relates to a notebook computer suitable for preventing heat generated in a portion where the body of the device user comes into contact with the surface of the device case for a long time from giving discomfort to the user.

【0002】[0002]

【従来の技術】図6に示すノート形コンピュータ断面図
で従来の放熱方法を説明する。コンピュータの内部での
発熱源は、主にCPU6、電源からの発熱であり、特に
CPU6の表面温度は約100℃を超える温度に達す
る。携帯を目的とした小形のノート形コンピュータで
は、本体部1にはキーボード3、CPU6を搭載したプ
リント基板5、外部記憶装置であるHDD7、装置駆動
用の充電式バッテリー等が詰め込まれ、表示部2には表
示用のLCDパネル4を搭載するのが一般的な構造であ
る。
2. Description of the Related Art A conventional heat dissipation method will be described with reference to a sectional view of a notebook computer shown in FIG. The heat source inside the computer is mainly heat generated from the CPU 6 and the power supply. In particular, the surface temperature of the CPU 6 reaches a temperature exceeding about 100 ° C. In a small notebook computer intended for portable use, a main body 1 is packed with a keyboard 3, a printed circuit board 5 on which a CPU 6 is mounted, an HDD 7 serving as an external storage device, a rechargeable battery for driving the device, and the like. Is generally equipped with an LCD panel 4 for display.

【0003】本体部1の内部のCPU6で発生した熱
は、CPU6の表面に取付けられた放熱用ブロック8を
通してキーボード3の裏面とグランド用アルミ板9へ伝
達される。さらに、その熱は接触している本体部1のケ
ース及びキーボード3の表面に伝達されそれぞれの表面
から空気中へ放散される。
The heat generated by the CPU 6 inside the main body 1 is transmitted to the back surface of the keyboard 3 and the ground aluminum plate 9 through a heat radiation block 8 attached to the surface of the CPU 6. Further, the heat is transmitted to the case of the main body 1 and the surface of the keyboard 3 which are in contact therewith and dissipated from the respective surfaces into the air.

【0004】なお、前記ノート形コンピュータの内部発
熱を装置ケースへ伝達させる放熱方法は、日刊工業新聞
社が1996年12月1日付けで発行された「電子技術
1月号1997Vol.39No.1」の中に「ノー
トパソコンにおける熱対策」(P46〜P49)として
記載されている。
A method for dissipating heat generated inside the notebook computer to the device case is described in “Electronic Technology January, 1997 Vol. 39 No. 1” published by Nikkan Kogyo Shimbun on December 1, 1996. Of the notebook PCs (P46-P49).

【0005】[0005]

【発明が解決しようとする課題】携帯を目的としたノー
ト形コンピュータは、装置を利用者の膝の上に置いて作
業することもある。この場合、装置内部の発熱によっ
て、装置利用者の身体と装置ケース表面が長時間接触し
ている部分、例えば装置底面やキーボード部分の温度が
上がると装置利用者へ不快感をあたえてしまうことにな
る。
A notebook computer intended for portable use sometimes has its device placed on a user's lap. In this case, heat generated inside the device may cause discomfort to the user of the device when the body of the device user is in contact with the surface of the device case for a long time, for example, when the temperature of the bottom of the device or the keyboard increases. Become.

【0006】本発明の目的は、装置内部で発生した熱を
装置利用者が使用時に触れない部分へ伝達して放熱する
ことにより、本体部ケース表面の温度上昇を抑えること
が可能なノート形コンピュータを提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a notebook computer capable of suppressing a rise in temperature on the surface of a main body case by transmitting heat generated inside the device to a portion that the user of the device does not touch when using the device to radiate heat. Is to provide.

【0007】[0007]

【課題を解決するための手段】装置内部の発熱部と装置
ケースとの間を断熱材で遮断するとともに、発生した熱
をヒートパイプを使用して表示部の裏面に設けられた放
熱板へ熱を伝達させ、表示部ケースの上下に設けた通気
孔の煙突効果を利用して放熱させる。
Means for Solving the Problems Insulating between the heat generating portion inside the device and the device case with a heat insulating material and transferring the generated heat to a heat radiating plate provided on the back surface of the display portion using a heat pipe. And dissipates heat using the chimney effect of ventilation holes provided above and below the display unit case.

【0008】[0008]

【発明の実施の形態】以下、本発明によるノート形コン
ピュータの一実施形態を図面を参照して詳細に説明す
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a notebook computer according to the present invention will be described below in detail with reference to the drawings.

【0009】本実施形態による放熱方法を適用したノー
ト形コンピュータを図1の断面図より説明する。図1に
おいて、本体部1の内部には、CPU6やその他部品が
搭載されたプリント基板5とHDD7が納められ、ケー
ス底面部との間には、グランド用アルミ板9が敷かれ
る。また、プリント基板5とCPU6には、放熱用ブロ
ック8を密着させ、さらに放熱ブロックにヒートパイプ
11を接続する、プリント基板5とキーボード3、HD
D7、グランド用アルミ板9、および本体部1のケース
との間は、断熱材10で囲まれた構造とする。次に本体
部内部での熱の伝達方法について説明すると、プリント
基板5上面のCPU6の熱は、CPU6に接続された放
熱用ブロック8に伝達し、また、プリント基板5下面の
放熱用ブロック8は、プリント基板5に搭載された他の
発熱部品の熱を集める。放熱用ブロック8に集められた
熱は、ヒートパイプ11を通って放熱場所まで伝達され
る。また、前記プリント基板5以外の電源部およびHD
D7等から発生する熱についても、グランド用アルミ板
9にヒートパイプ11を接続することにより、集めるこ
とが可能である。
A notebook computer to which the heat dissipation method according to the present embodiment is applied will be described with reference to the cross-sectional view of FIG. In FIG. 1, a printed circuit board 5 on which a CPU 6 and other components are mounted and an HDD 7 are housed inside a main body 1, and a ground aluminum plate 9 is laid between the printed circuit board 5 and a case bottom. Further, a heat radiating block 8 is brought into close contact with the printed board 5 and the CPU 6, and a heat pipe 11 is further connected to the heat radiating block.
The space between the D7, the ground aluminum plate 9, and the case of the main body 1 is surrounded by a heat insulating material 10. Next, a method of transmitting heat inside the main body will be described. The heat of the CPU 6 on the upper surface of the printed circuit board 5 is transmitted to the heat radiating block 8 connected to the CPU 6, and the heat radiating block 8 on the lower surface of the printed circuit board 5 is And heat of other heat-generating components mounted on the printed circuit board 5. The heat collected in the heat radiating block 8 is transmitted to the heat radiating place through the heat pipe 11. Also, a power supply unit other than the printed circuit board 5 and the HD
The heat generated from D7 and the like can be collected by connecting the heat pipe 11 to the ground aluminum plate 9.

【0010】図2は、本実施形態の本体部1と表示部2
の接続部の構造を示した透視図である。接続部は、本体
部1の凹部に表示部2の凸部がはまる構造である。表示
部2の凸部一方の面には、本体部1と表示部2の固定用
の接続金具17があり、ヒンジ金具14を支点として両
者は開閉できる構造である。表示部2の凸部の反対の面
には、ヒンジ金具14の中心軸線上に穴があき、本体部
1からヒートパイプ11が通される。ヒートパイプ11
の一部は、可撓性を持つヒートパイプ連結体12が接続
される。
FIG. 2 shows a main unit 1 and a display unit 2 according to this embodiment.
FIG. 2 is a perspective view showing the structure of the connection part of FIG. The connecting portion has a structure in which the convex portion of the display portion 2 fits into the concave portion of the main body portion 1. On one surface of the protruding portion of the display unit 2, there is a connection fitting 17 for fixing the main body 1 and the display unit 2, and the two can be opened and closed with the hinge fitting 14 as a fulcrum. A hole is formed on the surface of the display unit 2 opposite to the convex portion on the center axis of the hinge fitting 14, and the heat pipe 11 is passed from the main unit 1. Heat pipe 11
Is connected to a heat pipe connector 12 having flexibility.

【0011】図3は、ヒートパイプ連結体12の構造を
示す図である。内層にゴム層18、外層に金属メッシュ
層19を持ち、金属製のヒートパイプ11が接続され
る。ゴム層18は可撓性をもたせるために使用する。金
属メッシュ層19は、ヒートパイプ11が動作する際に
発生する圧力によりゴム層18が変形するのを防ぐ。前
記ヒートパイプ連結体12を使用することにより、本体
部1と表示部2の開閉に対してもヒートパイプ11が追
随できる構造となる。
FIG. 3 is a diagram showing the structure of the connected heat pipe assembly 12. A metal heat pipe 11 is connected with a rubber layer 18 as an inner layer and a metal mesh layer 19 as an outer layer. The rubber layer 18 is used for providing flexibility. The metal mesh layer 19 prevents the rubber layer 18 from being deformed by the pressure generated when the heat pipe 11 operates. By using the heat pipe connector 12, the heat pipe 11 can follow the opening and closing of the main body 1 and the display unit 2.

【0012】図4は、本実施形態の放熱部分を示す内部
構造図である。表示部2よりLCDユニット4を外し正
面から見た状態を示し、放熱板13には本体部1からの
ヒートパイプ11が接続される。
FIG. 4 is an internal structural view showing a heat radiating portion of the present embodiment. This shows a state in which the LCD unit 4 is detached from the display unit 2 and viewed from the front, and a heat pipe 11 from the main unit 1 is connected to the heat sink 13.

【0013】図5は、図4のA−A’の断面図を示す。
内部には、LCDユニット4、断熱材10、ヒートパイ
プ11、放熱板13があり、ケースの上部と下部には、
それぞれ吸気口16と排気口15を持つ構造である。前
記本体部1で発生した熱は、ヒートパイプ11を伝達
し、放熱板13へ伝達する。前記LCDユニット4は、
熱に対して弱いため放熱板13とLCDユニット4との
間には、断熱材10を設け熱を遮断する。ヒートパイプ
11より放熱板13まで伝達した熱は、放熱板13に広
がり表示部2のケースに伝達し空気中に放熱されること
になる。また、表示部2は、使用時には立った状態で使
用されることから、上部に排気口15、下部に吸気口1
6を設けることにより煙突効果で空気の自然対流がおこ
るため、放熱板13の冷却効果を上げることができる。
さらに、表示部2のケースと放熱板13の間に断熱材1
0を加えれば、表示部ケース表面の温度上昇も抑えるこ
とが可能である。
FIG. 5 is a sectional view taken along the line AA 'of FIG.
Inside, there are an LCD unit 4, a heat insulating material 10, a heat pipe 11, and a radiator plate 13.
Each has an intake port 16 and an exhaust port 15. The heat generated in the main body 1 is transmitted through the heat pipe 11 and transmitted to the heat radiating plate 13. The LCD unit 4 includes:
Since it is weak against heat, a heat insulating material 10 is provided between the heat radiating plate 13 and the LCD unit 4 to block heat. The heat transmitted from the heat pipe 11 to the heat radiating plate 13 spreads to the heat radiating plate 13 and is transmitted to the case of the display unit 2 to be radiated into the air. In addition, the display unit 2 is used in a standing state at the time of use.
By providing 6, the natural convection of air occurs due to the chimney effect, so that the cooling effect of the radiator plate 13 can be improved.
Further, a heat insulating material 1 is provided between the case of the display unit 2 and the heat sink 13.
By adding 0, it is possible to suppress the temperature rise on the surface of the display unit case.

【0014】ここで、ヒートパイプ11は、図2に示す
本体部1と表示部2との連結部を通さず、本体部1の後
部からヒートパイプ連結部12を装置外に出し、表示部
2へ接続する方法も可能である。
Here, the heat pipe 11 does not pass through the connecting portion between the main body 1 and the display unit 2 shown in FIG. A method of connecting to is also possible.

【0015】この様に構成されたノート形コンピュータ
の構造は、本体部1の内部で発生した熱が、本体部1の
ケースのキーボード3に伝達されにくく、また、熱源を
断熱材で遮閉することにより装置内のHDD7等の熱に
弱い部品を保護することができ、本体部1のケース表面
の温度上昇を抑えることができるため、利用者に発熱に
よる不快感を与えない構造の装置を実現することが可能
である。
In the structure of the notebook computer thus configured, the heat generated inside the main body 1 is less likely to be transmitted to the keyboard 3 of the case of the main body 1, and the heat source is shielded by a heat insulating material. Thus, heat-sensitive components such as the HDD 7 in the device can be protected, and a rise in the temperature of the case surface of the main body 1 can be suppressed, thereby realizing a device that does not cause discomfort to the user due to heat generation. It is possible to

【0016】[0016]

【発明の効果】以上に述べたごとく、本発明によるノー
ト形コンピュータは、装置表面の温度の上昇を抑え利用
者に不快感を与えることを防ぐことができる。また、装
置ケースへの放熱は、近年の装置サイズ小形化に伴い放
熱量に限界があり、CPU等の性能アップ時に生じる発
熱量増加に対応できないことが考えられるが、本発明に
よれば、放熱を効率的に行うことができる効果がある。
As described above, the notebook computer according to the present invention can suppress an increase in the temperature of the surface of the apparatus and prevent the user from feeling uncomfortable. In addition, the amount of heat released to the device case is limited due to the recent downsizing of the device, and it may not be possible to cope with the increase in the amount of heat generated when the performance of the CPU or the like is increased. Has the effect of being able to perform efficiently.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態を示すノート形コンピュー
タの本体部断面図である。
FIG. 1 is a sectional view of a main body of a notebook computer according to an embodiment of the present invention.

【図2】本発明の一実施形態を示すノート形コンピュー
タの本体部と表示部の接続部分を示す透視図である。
FIG. 2 is a perspective view showing a connection portion between a main body portion and a display portion of the notebook computer according to the embodiment of the present invention.

【図3】本発明の一実施形態を示すヒートパイプ連結体
の内部構造図である。
FIG. 3 is an internal structural view of a heat pipe connection body showing one embodiment of the present invention.

【図4】本発明の一実施形態を示すノート形コンピュー
タの表示部内部構造図である。
FIG. 4 is an internal structure diagram of a display unit of the notebook computer according to the embodiment of the present invention.

【図5】本発明の一実施形態を示すノート形コンピュー
タの表示部断面図である。
FIG. 5 is a sectional view of a display unit of the notebook computer according to the embodiment of the present invention.

【図6】従来のノート形コンピュータの構造を示した断
面図である。
FIG. 6 is a cross-sectional view showing the structure of a conventional notebook computer.

【符号の説明】[Explanation of symbols]

1…ノート形コンピュータ本体部、2…表示部、3…キ
ーボード、4…LCDパネル、5…プリント基板、6…
CPU、7…HDD、8…放熱用ブロック、9…グラン
ド用アルミ板、10…断熱材、11…ヒートパイプ、1
2…ヒートパイプ連結体、13…放熱板、14…ヒンジ
金具、15…排気口、16…吸気口、17…接続金具、
18…ゴム層、19…金属メッシュ層。
DESCRIPTION OF SYMBOLS 1 ... Laptop type computer main body, 2 ... Display part, 3 ... Keyboard, 4 ... LCD panel, 5 ... Printed circuit board, 6 ...
CPU, 7 HDD, 8 heat dissipation block, 9 aluminum ground plate, 10 heat insulating material, 11 heat pipe, 1
2 ... Heat pipe connection body, 13 ... Heat radiation plate, 14 ... Hinge fitting, 15 ... Exhaust port, 16 ... Intake port, 17 ... Connection fitting,
18: rubber layer, 19: metal mesh layer.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】携帯を目的としたノート形コンピュータの
装置内部の発熱部と装置ケースとの間を遮断する断熱材
と、表示部の裏面に設けられた放熱板と、装置内部で発
生した熱を前記放熱板に伝達するヒートパイプと、表示
部ケースの上下に設けた通気孔とを有し、装置の内部で
発生した熱を前記ヒートパイプにより前記放熱板に伝達
し、前記通気孔から前記伝達された熱を放熱することを
特徴とするノート形コンピュータ。
1. A heat insulating material for shutting off a heat generating portion inside a device of a notebook type computer intended for carrying and an apparatus case, a heat radiating plate provided on a back surface of a display portion, and a heat generated inside the device. A heat pipe that transmits the heat to the heat sink, and ventilation holes provided above and below the display unit case, heat generated inside the device is transmitted to the heat radiation plate by the heat pipe, and the heat is transmitted from the ventilation hole to the heat radiation plate. A notebook computer characterized by dissipating the transmitted heat.
JP00829598A 1998-01-20 1998-01-20 Notebook computer Expired - Fee Related JP3601282B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP00829598A JP3601282B2 (en) 1998-01-20 1998-01-20 Notebook computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00829598A JP3601282B2 (en) 1998-01-20 1998-01-20 Notebook computer

Publications (2)

Publication Number Publication Date
JPH11202978A true JPH11202978A (en) 1999-07-30
JP3601282B2 JP3601282B2 (en) 2004-12-15

Family

ID=11689179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP00829598A Expired - Fee Related JP3601282B2 (en) 1998-01-20 1998-01-20 Notebook computer

Country Status (1)

Country Link
JP (1) JP3601282B2 (en)

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JP2003029878A (en) * 2001-07-12 2003-01-31 Matsushita Refrig Co Ltd Notebook-sized personal computer
EP1288770A1 (en) * 2000-06-06 2003-03-05 Matsushita Refrigeration Company Portable information appliance
WO2004082349A1 (en) * 2003-03-12 2004-09-23 Fujitsu Limited Cooling structure for electronic equipment
US6816371B2 (en) * 2002-12-16 2004-11-09 International Business Machines Corporation Method and arrangement for enhancing the cooling capacity of portable computers
WO2005001674A1 (en) * 2003-06-27 2005-01-06 Nec Corporation Cooler for electronic equipment
CN1304807C (en) * 2001-12-13 2007-03-14 索尼公司 Cooling device, electronic device and method of manufacturing cooling device
KR100718562B1 (en) * 2005-09-09 2007-05-16 후지쯔 가부시끼가이샤 Cooling structure for electronic equipment
JP2007122132A (en) * 2005-10-25 2007-05-17 Sony Corp Portable electronic apparatus
JP2008243201A (en) * 2008-03-17 2008-10-09 Fujitsu Ltd Cooling structure of electronic apparatus
WO2009003411A1 (en) * 2007-07-02 2009-01-08 Huawei Technologies Co., Ltd. A mobile terminal preventing temperature rising of user-sensitive surface
US7839630B2 (en) * 2008-09-24 2010-11-23 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation device and computer using same
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