JP2011124609A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel electronic apparatus configured such that heat generated by a module is not easily conducted to a housing. <P>SOLUTION: The electronic apparatus includes the housing, the module, and a support portion. The housing has a first wall portion including an operation surface and a second wall portion positioned on the opposite side from the first wall portion. The module is isolated from both the first wall portion and second wall portion. The support portion is interposed between the housing and module to support the module apart from the first wall portion and second wall portion, has lower thermal conductivity than the housing, and is flexible. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  Embodiments described herein relate generally to an electronic apparatus.

  In place of conventional screwing, a fixed part that holds a substrate housed in a housing such as a PC (Personal Computer) between the upper cover and the substrate and between the lower cover and the substrate constituting the housing A technique for fixing to a housing is known. According to this technique, it is possible to prevent the housing and the substrate from coming into direct contact with each other, so that dust generation due to contact between the housing and the substrate due to vibration during manufacturing can be suppressed.

Japanese Patent Laid-Open No. 06-64678

  In this type of electronic device, countermeasures against heat transmitted from a module such as a substrate on which a CPU (Central Processing Unit), a memory, and the like are mounted to the housing are desired.

  Therefore, an embodiment of the present invention has an object of obtaining an electronic device having a novel configuration in which heat generated in a module is not easily transmitted to a housing.

  An electronic device according to an embodiment of the present invention includes a housing, a module, and a support unit. The housing had a first wall portion including the operation surface and a second wall portion located on the opposite side of the first wall portion. The module was spaced from both the first wall and the second wall. The support portion is interposed between the housing and the module, supports the module while being spaced apart from the first wall portion and the second wall portion, has lower thermal conductivity than the housing, and has flexibility. .

FIG. 1 is a perspective view showing a state in which the portable computer according to the present embodiment is viewed from the front. FIG. 2 is a diagram showing a mounted state of various components mounted on the main body cover of the portable computer according to the present embodiment. FIG. 3 is an AA cross-sectional view of the main body of the portable computer according to the present embodiment. FIG. 4 is a diagram showing the structure of the corners of the board mounted on the portable computer according to the present embodiment. FIG. 5 is a perspective view showing the mounting structure of the substrate in the housing. FIG. 6 is a four-side view of the heat insulating member disposed on the substrate. FIG. 7 is a diagram illustrating an example of the arrangement of the heat insulating member with respect to the substrate. FIG. 8 is a plan view showing the structure of the main body cover on the side where the board is mounted. FIG. 9 is a perspective view showing the structure of the palm rest portion on the side where the board is mounted. FIG. 10 is a perspective view showing another structure of the palm rest portion on the side where the board is mounted. FIG. 11 is a plan view showing the structure of the main body base on the side where the board is mounted. FIG. 12 is a perspective view showing the structure of the main body base on the side where the board is mounted. FIG. 13 is a perspective view showing another mounting structure of the substrate in the housing.

  Embodiments will be described below in detail with reference to the accompanying drawings. In the present embodiment, an example in which the electronic apparatus according to the present invention is applied to a notebook personal computer (hereinafter referred to as a portable computer) will be described. However, a thin casing such as a mobile phone is required. If it is an electronic device, it is not limited to this.

  First, the configuration of the portable computer 1 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing a state in which the portable computer according to the present embodiment is viewed from the front. FIG. 2 is a diagram showing a mounted state of various components mounted on the main body cover of the portable computer according to the present embodiment. FIG. 3 is an AA cross-sectional view of the main body of the portable computer according to the present embodiment.

  A portable computer 1 according to the present embodiment includes a main body 2 and a display unit 3.

  The display unit 3 includes a display housing 8 (first housing) and a liquid crystal display panel 9 accommodated in the display housing 8. The liquid crystal display panel 9 has a display screen 9a. The display screen 9 a is exposed to the outside of the display housing 8 through the opening 8 a on the front surface of the display housing 8.

  The display unit 3 is supported via a hinge portion 13 attached to the main body 2. Thereby, the display unit 3 has a closed position where the main body cover 5 is tilted so as to cover from above, that is, a position where the display screen 9a is covered, and an open position where the main body cover 5 is exposed, ie, the display screen 9a. It can be rotated between the exposed position.

  The main body 2 includes a main body base 4 (structure) and a main body cover 5 (structure) combined from above the main body base 4, and is formed in a box shape by combining the main body cover 5 from above the main body base 4. A housing 6 is provided. The casing 6 is made of a metal casing such as a magnesium alloy in order to prevent a decrease in strength due to the thinning of the portable computer 1 (main body 2). In the present embodiment, the housing 6 is constituted by a structure divided into two, ie, the main body base 4 and the main body cover 5, but is not limited thereto, and is constituted by one structure. Alternatively, it may be constituted by a structure divided into two or more.

  The housing 6 (second housing) includes an upper wall 6a (wall portion), a lower wall 6c (opposing wall portion) facing the upper wall 6a, and the outer edges of the upper wall 6a and the lower wall 6c. And a peripheral wall 6b provided. The peripheral wall 6b has a front peripheral wall 6ba, a rear peripheral wall 6bb, a left peripheral wall 6bc, and a right peripheral wall 6bd. Further, the housing 6 has a first end 15 and a second end 14 located on the opposite side of the first end 15.

  The upper wall 6a can be roughly divided into a keyboard housing portion 6aa for housing the keyboard 7, a palm rest portion 6ab provided with a touch pad 11, a click button 12, etc., and a hinge portion 13 for supporting the display unit 3. It is divided into the unit support part 6ac. The keyboard housing portion 6aa includes a keyboard placement portion 10 on which the keyboard 7 is placed. Here, the keyboard placing portion 10 is an opening provided on the upper wall 6 a and accommodating the keyboard 7. In other words, the keyboard housing portion 6aa has a recessed portion (keyboard placing portion 10) that is recessed by one step from the surrounding portion on the outer wall, and the keyboard 7 is fitted into the recessed portion. The palm rest portion 6ab is provided between the keyboard placing portion 10 and the second end portion 14 of the housing 6. The display unit support portion 6ac is located on the first end 15 side of the housing 6 and a hinge portion 13 that supports the display unit 3 is attached to the display unit support portion 6ac. The hinge portion 13 is provided in the vicinity of the first end 15 of the housing 6 and connects the display housing 8 (display unit 3) and the housing 6 (main body 2) in a rotatable manner.

  2 and 3, the housing 6 includes a substrate 201, a hard disk drive (HDD) 202, a blower 203, a heat radiating member 204, and a heat pipe 205. It is mounted opposite to. That is, the board 201 (circuit board) is located between the keyboard placing part 10 and the second end part 14. More specifically, the substrate 201 has a side portion 201 ca along the keyboard placement portion 10. The side portion 201ca is supported by the side wall portion 10a of the keyboard placement portion 10 that protrudes toward the lower wall 6c. Thereby, since the keyboard 7 and the board | substrate 201 are mounted in the housing | casing 6 without overlapping, thickness reduction of the portable computer 1 can be achieved.

  Conventionally, since the demand for thinning a notebook personal computer has been low, in general, a substrate or the like is mounted facing the keyboard mounting portion 10 on which the keyboard 7 is mounted. That is, the conventional notebook personal computer is mounted such that the board and the keyboard overlap each other. Therefore, it is difficult to reduce the thickness of the casing of the notebook personal computer due to the thickness of the keyboard and the substrate. However, in the present embodiment, as shown in FIG. 3, by mounting the substrate 201, the HDD 202, the blower 203, the heat radiating member 204, and the heat pipe 205 so as to face the palm rest portion 6 ab, the substrate 201, the HDD 202, and the blower are mounted. Since the device 203, the heat radiating member 204, the heat pipe 205, and the keyboard 7 overlap each other and are not mounted, the casing 6 can be thinned.

  The substrate 201 has a first surface 201b and a second surface 201c opposite to the first surface 201b, which is a surface provided with a printed wiring drawn with a conductor such as silver foil on an insulating plate. An electronic component 201a that generates heat, such as a CPU (Central Processing Unit) or a memory, is mounted on at least one of the first surface 201b and the second surface 201c. And the board | substrate 201 functions as a printed circuit board (Printed Circuit Board) by the electronic component 201a being soldered and connected. Note that the electronic component 201a is a surface-mounted electronic component that does not use leads or pins for electrical connection with the substrate 201.

  FIG. 4 is a diagram showing the structure of the corners of the board mounted on the portable computer according to the present embodiment. In the present embodiment, as shown in FIG. 4, the substrate 201 has a cutout portion 1101 having a shape in which a portion of the corner portion 1100 is cut out at the corner portion 1100 of the substrate 201. Thereby, weight reduction of the board | substrate 201 can be achieved.

  The HDD 202 is mounted adjacent to the substrate 201 and connected to the substrate 201 via a flexible wiring board (not shown) connected to a connector on the substrate 201. In the present embodiment, the main body base 4 and the main body cover 5 (left peripheral wall 6bc) face the position where the HDD 202 is mounted and exhaust the air in the housing 6 to the outside of the housing 6. Have

  The heat pipe 205 is provided so as to extend from the heat radiating member 204, and transfers heat generated from the electronic component 201 a mounted on the substrate 201 to the heat radiating member 204.

  The heat radiating member 204 radiates heat transferred from the heat pipe 205 using a gas blown from a blower 203 described later. The air blower 203 blows gas into the heat dissipation member 204 and the housing 6.

  Specifically, the heat radiating member 204 is formed by arranging a plurality of rectangular plate-shaped members such that the plate surface of the plate-shaped member follows the gas flow from the blower 203. In the present embodiment, the main body base 4 and the main body cover 5 (front peripheral wall 6ba) face the position where the heat dissipation member 204 is mounted, and exhaust the gas blown from the blower 203 to the outside of the housing 6. An exhaust port 207 is provided. The blower 203 has a centrifugal fan that sucks gas from the axial direction of the rotation shaft and blows gas in a direction substantially orthogonal to the axial direction of the rotation shaft.

  Next, the mounting structure of the substrate 201 in the housing 6 will be described in detail with reference to FIGS. FIG. 5 is a perspective view showing the mounting structure of the substrate in the housing. FIG. 6 is a four-side view of the heat insulating member disposed on the substrate. FIG. 7 is a diagram illustrating an example of the arrangement of the heat insulating member with respect to the substrate. FIG. 8 is a plan view showing the structure of the main body cover on the side where the board is mounted. FIG. 9 is a perspective view showing the structure of the palm rest portion on the side where the board is mounted. FIG. 10 is a perspective view showing another structure of the palm rest portion on the side where the board is mounted. FIG. 11 is a plan view showing the structure of the main body base on the side where the board is mounted. FIG. 12 is a perspective view showing the structure of the main body base on the side where the board is mounted. FIG. 13 is a perspective view showing another mounting structure of the substrate in the housing.

  As shown in FIGS. 5 and 7, the casing 6 of the portable computer 1 has a heat insulating member 801 provided continuously from the first surface 201 b to the second surface 201 c at the four corners of the substrate 201. In other words, as shown in FIGS. 6 and 7, the housing 6 of the portable computer 1 has a U-shaped heat insulating member 801 having grooves 801 a into which the four corners of the substrate 201 are fitted.

  In this embodiment mode, as described above, the substrate 201 has the notch portion 1101 (shown in FIG. 4) in the corner portion 1100 of the substrate 201, but the corner portion 1100 is formed in the groove 801 a of the heat insulating member 801. By fitting, the weight of the substrate 201 can be reduced without changing the appearance when the substrate 201 is mounted on the housing 6.

  As shown in FIG. 5, the housing 6 (the main body cover 5 and the main body base 4) of the portable computer 1 is connected to the substrate from both sides of the first surface 201 b and the second surface 201 c of the substrate 201 via the heat insulating member 801. 201 is sandwiched.

  In the present embodiment, an integrated heat insulating member 801 provided continuously from the first surface 201b to the second surface 201c is used. However, as shown in FIG. 13, the first surface 201b and the second surface You may provide the 1st heat insulation member 1301 and the 2nd heat insulation member 1302 separately in 201c. In other words, the second heat insulating member 1302 is a first support portion that supports the substrate 201 and separates the substrate 201 from the upper wall 6a. Thereby, since it can prevent that the board | substrate 201 and the upper wall 6a contact directly, the heat conduction from the electronic component 201a mounted in the board | substrate 201 to the upper wall 6a can be reduced.

  It is assumed that the side wall 10a of the keyboard mounting portion 10 supports the side portion 201ca of the substrate 201 and protrudes to the lower wall 6c side from the second heat insulating member 1302. Thereby, since the length which the key of the keyboard 7 mounted in the keyboard mounting part 10 protrudes from the upper wall 6a can be shortened, the portable computer 1 can be made thinner.

  The first heat insulating member 1301 is a second support portion that supports the substrate 201 and separates the substrate 201 from the lower wall 6c. That is, the substrate 201 is supported by the first heat insulating member 1301 and the second heat insulating member 1302 and is separated from the upper wall 6a and the lower wall 6c. Thereby, since it can prevent that the board | substrate 201 and the lower wall 6c contact directly, the heat conduction from the electronic component 201a mounted in the board | substrate 201 to the lower wall 6c can also be reduced.

  In addition, the heat insulating member 801 is provided at the four corners of the substrate 201, but is not limited thereto. For example, in addition to the four corners of the substrate 201, the heat insulating member 801 is provided in the vicinity of the middle of the length of the rectangular substrate 201. May be provided.

  Further, as the heat insulating member 801, a member having a lower thermal conductivity than that of the housing 6 is used. Thereby, since heat from the electronic component 201a can be prevented from being transmitted to the housing 6 that touches the heat insulating member 801, it is possible to prevent the user from feeling hot even when touching the housing 6.

  For the heat insulating member 801, a flexible member such as rubber may be used. Note that when the heat insulating member 801 is a flexible member, the heat insulating member 801 is crushed in the thickness direction when the substrate 201 is sandwiched by the housing 6 from both sides of the first surface 201b and the second surface 201c. To be. Thereby, rattling of the substrate 201 in the housing 6 can be suppressed.

  For the heat insulating member 801, a conductive member such as a material mixed with a conductive material such as metal powder or a gasket is preferably used. Accordingly, since the heat insulating member 801 can also serve as the GND of the substrate 201, it is not necessary to newly provide a wiring or the like for connecting the substrate 201 to the GND.

  Furthermore, it is assumed that the thickness l1 of the heat insulating member 801 provided on the second surface 201c of the substrate 201 is thicker than the thickness l2 of the heat insulating member 801 provided on the first surface 201b of the substrate 201. Thereby, since the distance L1 between the main body cover 5 and the board | substrate 201 can be made longer than the distance L2 between the main body base 4 and the board | substrate 201, the heat | fever emitted from the electronic component 201a touches a user's hand. In many cases, it is possible to more effectively prevent the main body cover 5 from being transmitted.

  As shown in FIGS. 8 and 9, the palm rest 6ab on the side where the substrate 201 is mounted is provided with ribs 310, screwing portions 303, and the like.

  The rib 310 prevents the main body cover 5 from being deformed, and includes a linear protrusion 309 provided from the side portion along the keyboard housing portion 6aa of the palm rest portion 6ab toward the second end portion 14. The palm rest portion 6ab is provided over the entire surface.

  Further, the rib 310 has projections 301 and 302 that protrude higher toward the substrate 201 than the linear projection 309 so as to face the heat insulating member 801 provided at the four corners of the substrate 201. Here, the protrusions 301 and 302 are provided so as to face the heat insulating member 801 provided at the four corners of the substrate 201 to suppress the rattling of the substrate 201 and to flow in the housing 6 (reference numeral 308). This is to secure a flow path for the gas flowing in (shown). In the present embodiment, the protrusions 301 and 302 are provided on a part of the rib 310. However, if the main body cover 5 has sufficient strength without the rib 310, only the protrusions 301 and 302 are provided. You may provide in the palm rest part 6ab.

  In the present embodiment, since the keyboard housing portion 6aa protrudes toward the substrate 201 due to the recessed portion 10, it is difficult to lay a wiring (not shown) extending from the substrate 201 on the keyboard housing portion 6aa side. Therefore, in the present embodiment, the cross section of the protrusion 302 provided on the keyboard housing portion 6aa side has a rectangular shape with a short side toward the protrusion 301. Accordingly, since the interval between the protrusion 302 and the protrusion 301 can be increased, a space for laying a wiring (not shown) extending from the substrate 201 is provided between the protrusion 301 and the protrusion 302. Can do.

  The protrusions 301 and 302 have square holes 301a and 302a on the surfaces 301b and 302b facing the heat insulating member 801, respectively. Thereby, weight reduction of the portable computer 1 can be achieved.

  Here, another shape of the protrusion will be described with reference to FIG. In the example illustrated in FIG. 9, the holes 301 a and 302 a are provided in the surfaces 301 b and 302 b of the protrusions 301 and 302 that face the heat insulating member 801, but the surfaces 501 b and 302 a of the protrusions 501 and 502 that face the heat insulating member 801. 502b may be provided with grooves 501a and 502a along the flow direction (indicated by reference numeral 308) of the gas flowing in the housing 6. Thus, the weight of the portable computer 1 can be reduced, and the gas flowing in the housing 6 can be guided into the protrusions 501 and 502, so that the heat transmitted from the substrate 201 can be radiated more effectively.

  Further, as shown in FIGS. 5, 8, and 9, the rib 310 is located near the protrusions 301 and 302 (outer edge of the corner of the substrate 201) closer to the substrate 201 than the linear protrusion 309. Guide ribs 304 and 305 projecting high are provided. The substrate 201 is fitted inside guide ribs 304 and 305 provided in the vicinity of the protrusions 301 and 302. Thereby, it is possible to prevent the substrate 201 from being displaced in the housing 6 or the substrate 201 being mounted at an incorrect position. The heat insulating members 801 provided at the four corners of the substrate 201 are provided continuously from the first surface 201b to the second surface 201c, and the side surfaces of the substrate 201 do not directly contact the guide ribs 304 and 305. Therefore, heat from the electronic component 201a mounted on the substrate 201 can be prevented from being transferred to the housing 6 via the guide ribs 304 and 305.

  Further, when the board 201 and the HDD 202 are mounted adjacent to each other as in the present embodiment, the guide rib 305 disposed between the board 201 and the HDD 202 may be used as the guide rib of the HDD 202. . In the present embodiment, the guide ribs 304 and 305 are provided on the main body cover 5, but it is only necessary to be provided on at least one of the main body base 4 and the main body cover 5.

  The screwing portion 303 (fixing portion) is disposed in the vicinity of the guide ribs 304 and 305 (near the heat insulating member 801), and screwed in the screw inserted from the screwing portion 602 (see FIGS. 11 and 12) of the main body base 4. Thus, the main body cover 5 and the main body base 4 are fixed. In the portable computer 1 according to the present embodiment, since the substrate 201 is not directly screwed to the housing 6, rattling of the substrate 201, how the heat insulating member 801 is interposed between the substrate 201 and the housing 6, and the like. As a result, the main body cover 5 may be in a state of being lifted from the main body base 4. Therefore, the screw cover 303 is disposed in the vicinity of the guide ribs 304 and 305 (near the position where the heat insulating member 801 is provided) to prevent the main body cover 5 from being lifted from the main body base 4.

  As shown in FIGS. 11 and 12, the main body base 4 on the side where the substrate 201 is mounted is provided with ribs 604, screwing portions 602, and the like.

  The rib 604 prevents deformation of the main body base 4, and has a linear protrusion 605 provided from one end on the side where the display unit 3 is supported toward the other end opposite to the one end. The main body base 4 is provided over the entire surface. Further, the rib 604 has a protruding portion 601 that protrudes toward the substrate 201 higher than the linear protruding portion 605 so as to face the heat insulating member 801 provided at the four corners of the substrate 201. Here, the provision of the protrusions 601 facing the heat insulating members 801 provided at the four corners of the substrate 201 suppresses the rattling of the substrate 201 and flows in the flow direction (reference numeral 603) in the housing 6. This is to ensure a gas flow path. As shown in FIG. 5, the height h2 of the rib 604 toward the substrate 201 is higher than the height h1 of the protrusions 301 and 302 of the main body cover 5 toward the substrate 201. This is because the height from the first surface 201b of the electronic component 201a mounted on the 201b is higher than the height of the electronic component 201a mounted on the second surface 201c.

  Further, the protrusion 601 has a rectangular hole 601 a on the surface 601 b facing the heat insulating member 801. Thereby, weight reduction of the portable computer 1 can be achieved. Note that the protruding portion 601 can have the same shape as the protruding portions 501 and 502 shown in FIG.

  The screwing portion 602 (fixing portion) is disposed in the vicinity of the protruding portion 601 (in the vicinity of the heat insulating member 801), and a screw is inserted from the side opposite to the side on which the board 201 of the main body base 4 is mounted. The main body base 4 is fixed to the main body cover 5 by being screwed into the screw fixing portion 303. In the portable computer 1 according to the present embodiment, since the substrate 201 is not directly screwed to the housing 6, rattling of the substrate 201, how the heat insulating member 801 is interposed between the substrate 201 and the housing 6, and the like. As a result, the main body cover 5 may be in a state of being lifted from the main body base 4. Therefore, the screw cover 303 is disposed in the vicinity of the protrusion 601 (in the vicinity of the heat insulating member 801) to prevent the main body cover 5 from being lifted from the main body base 4.

  As described above, according to the portable computer 1 according to the present embodiment, the substrate 201 on which the electronic component 201a generating heat is mounted on at least one of the first surface 201b and the second surface 201c opposite to the first surface 201b, A heat insulating member 801 provided continuously from the first surface 201b to the second surface 201c at the four corners of the substrate 201, and the substrate 201 is sandwiched from both sides of the first surface 201b and the second surface 201c via the heat insulating member 801. The substrate 201 can be fixed to the housing 6 without direct contact between the substrate 201 and the housing 6, and heat transfer from the electronic component 201a to the housing 6 can be performed. Since it can be delayed, an increase in the surface temperature of the housing 6 can be suppressed.

  DESCRIPTION OF SYMBOLS 1 ... Portable computer (electronic device), 6 ... Housing | casing, 6a ... Upper wall (1st wall part), 6c ... Lower wall (2nd wall part), 11 ... Touchpad, 14 ... 2nd edge part (End part), 201 ... substrate (module), 203 ... air blower, 301, 302, 309, 501, 502, 601, 605 ... projection (projection), 301a, 302a, 601a ... hole (concave), 303, 602... Screw fixing part (joint part), 304, 305... Guide rib (guide part), 801, 1301, 1302 .. heat insulation member (support part), 801 a.

Claims (10)

A housing having a first wall portion including an operation surface, and a second wall portion located on the opposite side of the first wall portion;
A module housed in the housing and spaced from both the first wall and the second wall;
The module is interposed between the casing and the module, supports the module separately from the first wall and the second wall, has lower thermal conductivity than the casing, and is flexible. A supporting portion having,
With electronic equipment.   The electronic device according to claim 1, wherein a touch pad is provided on the first wall portion so as to overlap the module with a gap.   The electronic device according to claim 1, wherein a protrusion that supports the support portion is provided on at least one of the first wall portion and the second wall portion.   The electronic device according to claim 3, wherein a concave portion is provided in a contact portion between the protruding portion and the support portion.   The support part supports the module between the first part contacting the first wall part, the second part contacting the second wall part, and the first part and the second part. The electronic device according to claim 1, comprising three parts.   The electronic device according to claim 5, wherein a guide portion that guides the opposite side of the third portion of the support portion is provided on one of the first wall portion and the second wall portion.   Along the end portion of the housing, the module, and a blower that is located in the housing and flows air into a gap between the module and the first wall portion or the second wall portion, The electronic device according to claim 1, wherein the electronic device is provided.   The electronic device according to claim 7, wherein the support portion is provided in a state where the air hits the support portion.   At least one of the first wall portion and the second wall portion is provided with a plurality of protrusions supporting the support portion in a state where the air flows between the plurality of protrusions. Item 9. The electronic device according to Item 7 or 8. The housing includes a first part having the first wall part and a second part having the second wall part,
The electronic device according to claim 1, wherein a coupling portion that couples the first component and the second component is provided in the vicinity of the support portion.

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