JP2005039128A - Heat dissipation structure of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the heat dissipation structure of an electronic apparatus which carries out heat dissipation of a heat generating member housed in the cabinet of the electronic apparatus and at the same time restrains temperature rise of an outer surface of the cabinet which is in contact with a human body. <P>SOLUTION: A first thermally conductive member 4 is disposed in a space between an HDD1 which is a heat generating member and a cabinet 3 without coming into contact with the HDD1. The first thermally conductive member 4 and the low temperature part (an end part 3a of the cabinet) of the electronic apparatus are connected via a second thermally conductive member 5 arranged in the end 4a of the first thermally conductive member 4 which is not placed opposite to the HDD1. Furthermore, it is preferable to form a high reflectance surface in the surface of the first thermally conductive member 4 in opposition to the HDD1. It is also preferable to form a low reflectance surface in the surface of the first thermally conductive member 4 in opposition to the housing 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat dissipation structure for an electronic device in which a heat generating member that requires heat dissipation is housed in a casing.

  When an electronic device such as a personal computer in which an HDD (hard disk drive), CPU (central processing unit), etc. are housed in a casing is continuously operated, the HDD and CPU reach a considerably high temperature. For example, when a notebook personal computer is continuously operated without forced cooling, the HDD in the housing may reach about 50 ° C. As a general forced cooling method, a method of dissipating heat by bringing a heat radiating member into contact with a heat generating member such as an HDD or a CPU can be considered.

  However, the HDD, in particular, is made up of components that are vulnerable to external vibrations and shocks, such as a magnetic head, a magnetic disk rotating spindle motor, and the like, and it is difficult to abut the heat dissipation member on the HDD. Furthermore, the components that generate the most heat among the components of the HDD are the spindle motor portion and the driver portion, but the heat radiating member cannot be brought into contact with these portions.

  Therefore, the portion where the heat radiating member can be contacted is limited to the peripheral portion of the HDD case. However, since the HDD case is made of a highly rigid metal such as stainless steel, its thermal conductivity is low, and even if a thermal conductive member is brought into contact only with the peripheral part of the case, a sufficient amount of heat is not transferred and sufficient heat dissipation cannot be performed. There is a problem.

  For the above reasons, the heat generated by the HDD moves to the opposite housing surface by radiant heat transfer by heat rays and convection heat transfer by air, and contacts the human body such as the palm rest or the bottom of the housing facing the HDD. As a result, the temperature of the outer surface of the casing that rises has risen, causing the user to burn at low temperatures.

As a method for solving such a problem, a technique for dissipating heat by installing a heat insulating material inside an electronic device has been disclosed (see, for example, Patent Documents 1 and 2). Patent Document 1 proposes a heat dissipation structure in which a heat insulating material is attached to the inner surface of the housing above the heat generating component so that the radiant heat from the heat generating member does not directly heat the inner surface of the housing above the heat generating component. . Patent Document 2 proposes a notebook computer in which a high-performance vacuum heat insulating material capable of interrupting heat transfer between a heat generating member inside the apparatus and the apparatus housing is arranged.
Japanese Patent Laid-Open No. 10-117078 JP 2001-350546 A

  However, as shown in Patent Documents 1 and 2, when a heat insulating material is used for heat dissipation of the heat generating member, the local temperature rise on the surface of the housing can be reduced by the heat insulating material, but the radiant heat generated by the heat generating member is the heat insulating material. Therefore, there is a problem that the temperature of the heat generating member rises again.

  Therefore, the temperature of the heat generating member cannot be sufficiently reduced, and the problem that the temperature of the outer surface of the housing that comes into contact with the human body such as the housing palm rest or the housing bottom facing the heat generating member is sufficiently solved. It was not in a state.

  The present invention has been made in order to solve the above-described problems, and at the same time, the heat generation member housed in the housing of the electronic device is radiated, and at the same time, the temperature rise on the outer surface of the housing that contacts the human body is suppressed. An object is to provide a heat dissipation structure for an electronic device.

  In order to solve the above problems, the heat dissipation structure of an electronic device according to the present invention is a heat dissipation structure of an electronic device in which a heat generating member that requires heat dissipation is housed in a housing, and generates heat in a gap between the heat generating member and the housing. The first heat conductive member is disposed without contacting the member, the second heat conductive member is disposed between the first heat conductive member and the housing and not facing the heat generating member, The first heat conductive member is attached to the housing via the second heat conductive member.

  According to this configuration, the radiant heat and convection heat generated by the heat generating member of the electronic device are once absorbed by the first heat conductive member, and spread in the surface of the first heat conductive member by heat conduction. Heat is efficiently released through the second heat conductive member connected to the casing at a low temperature portion which is a portion not facing the heat generating member of the heat conductive member. Therefore, the temperature of the first heat conductive member is considerably lowered, and the temperature distribution is flattened. Heat transfer due to radiant heat or convection heat occurs between the first heat conductive member whose temperature distribution is flattened at such a low temperature and the housing of the electronic device, and is transferred to the housing of the electronic device. Therefore, the temperature rise on the outer surface of the housing is suppressed, and the temperature distribution is flattened, so that a local temperature rise is also avoided.

  In the heat dissipation structure for an electronic device of the present invention, the first heat conductive member is characterized in that a surface having a high emissivity is formed on at least a part of the surface facing the heat generating member.

  As a result, in the first heat conductive member, the absorption rate of the radiant heat from the heat generating member is improved, the amount of heat transferred from the electronic device to the first heat conductive member is increased, and heat dissipation of the electronic device is promoted. The

  In the heat dissipation structure for an electronic device according to the present invention, the first heat conductive member is characterized in that a surface having a low emissivity is formed on at least a part of the surface facing the housing.

  As a result, the amount of radiant heat re-radiated from the heat conductive member is reduced, so that the temperature rise on the outer surface of the housing is further reduced.

  In the heat dissipation structure having the above configuration, since the heat dissipation member and the heat generating member are not in contact with each other, it is more suitable for the case where it is difficult for the heat generating member to contact the heat dissipation member like a member including a hard disk drive.

  The heat dissipation structure of the electronic device according to the present invention sufficiently dissipates the heat generating member housed in the housing of the electronic device, lowers the average temperature of the outer surface of the housing of the electronic device, and flattens the temperature distribution. In addition, a local temperature rise on the outer surface of the housing is also avoided.

  In addition, the formation of the high emissivity surface on the surface where the first heat conductive member faces the heat generating member increases the movement of the amount of heat from the heat generating member to the first heat conductive member, thereby radiating heat from the heat generating member. Promote.

  Further, the formation of the low emissivity surface on the surface where the first heat conductive member faces the housing reduces the amount of radiant heat re-radiated by the first heat conductive member, so that the temperature of the housing is further lowered. An effect is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In the embodiment described below, for the sake of simplicity, an embodiment of a heat dissipation structure of a storage device on which an HDD is mounted will be described. However, this technique is not limited to a storage device on which an HDD is mounted, and a CPU is used. The present invention can be applied to electronic devices of any form on which a member (heat generating member) that requires heat dissipation is mounted.

<Embodiment 1>
FIG. 1 shows a heat dissipation structure of a memory device according to the first embodiment. FIG. 1A shows a cross-sectional structure viewed from the front, and FIG. 1B shows a structure viewed from the plane.

  In FIG. 1, an HDD 1 that is one of storage devices is housed between a palm rest 31 and a housing bottom 32 in a housing 3 (31, 32) on a keyboard (not shown) side of a notebook computer. Specifically, a notch 2a having a substantially U-shaped cross section formed at a side corner of the prismatic shock absorber 2 is inserted and held in each corner of the rectangular parallelepiped HDD 1. Each shock absorber 2 is sandwiched and fixed between the palm rest 31 and the housing bottom 32, so that the HDD 1 is stably housed and held between the palm rest 31 and the housing bottom 32. That is, the HDD 1 is disposed with the gaps P1 and P2 having a predetermined width between the HDD 1 and the palm rest portion 31 by the shock absorber 2. As a material of the shock absorber 2, for example, soft elastomer resin, sponge-like urethane rubber, or the like can be used.

  Further, the first heat conductive member 4 is disposed between the HDD 1 and the palm rest portion 31 and between the HDD 1 and the housing bottom portion 32. The first heat conductive member 4 is a rectangular plate-like body, and both side end portions 4a in the longitudinal direction (both side end portions 4a in the left-right direction in FIG. 1) are extended outward from the HDD 1. The extended side end portions 4a are attached and fixed to the palm rest portion 31 and the housing bottom portion 32 via the second heat conducting member 5, respectively.

  That is, the first thermal conductive member 4 is arranged at a predetermined interval without contacting the HDD 1, and the palm rest portion 31 and the housing bottom portion 32 are not in direct contact with each other and have a slight gap. Are arranged. Further, as can be seen from FIG. 1B, the first heat conducting member 4 is not in contact with the shock absorbing material 2.

  Next, how the heat generated by the HDD 1 is radiated by the first heat conductive member 4 and the second heat conductive member 5 will be described.

  In FIG. 1A, the movement of heat generated from the HDD 1 is indicated by arrows. The radiant heat and convective heat generated by the HDD 1 are received and absorbed by the first heat conductive member 4 that is provided facing the HDD 1.

  The amount of heat absorbed is directed toward the end portion 4a of the first thermal conductive member 4 that is a low temperature portion outside the shock absorber 2 that does not face the HDD 1 through the surface of the first thermal conductive member 4. Move.

  Further, the amount of heat transferred to the end portion 4 a of the heat conductive member 4 moves to the end portion 3 a of the housing 3, which is a low temperature portion, via the second heat conductive member 5. Therefore, the in-plane temperature of the first heat conductive member 4 is kept low, and the temperature distribution of the first heat conductive member 4 is also flattened over the entire surface.

  In this way, in the first thermal conductive member 4, heat transfer by radiant heat or convection heat occurs between the casings 3 in which the temperature is kept low and the temperature distribution is flattened. The temperature distribution of 3b is also flattened, and a local temperature rise is avoided.

  In this Embodiment 1, it is preferable that the 1st heat conductive member 4 is as thin and lightweight as possible besides having high heat conductivity. Examples of metal-based materials include copper films and aluminum films. Moreover, as a resin-type thing, the silicon sheet which added the high heat conductive material by using silicon-type resin as a matrix can be mentioned. Moreover, as a ceramic type thing, the graphite sheet obtained by graphitizing a polyimide resin, the graphite sheet of the expanded graphite which expanded natural graphite etc. into the sheet form can be mentioned. Moreover, as a structure of the 1st heat conductive member 4, there exist a planar structure, a mesh-like structure, or an armor door structure. Moreover, it is preferable that the 1st heat conductive member 4 has a structure with especially high thermal conductivity of a surface direction.

  Moreover, the 2nd heat conductive member 5 is formed with the block-shaped spacer which consists of copper or aluminum material with high heat conductivity. However, the present invention is not limited to these materials, and other high heat conductive materials may be used. In addition, since the heat transfer between the first heat conductive member 4 and the housing 3 is important for the second heat conductive member 5, the heat conductivity in the direction of the thickness 5a of the second heat conductive member is particularly important. It is preferable to have a high structure.

<Embodiment 2>
FIG. 2 is a cross-sectional view of the storage device according to the second embodiment as viewed from the front, and shows a heat dissipation structure of the storage device. In the second embodiment, the same parts as those in the first embodiment will be denoted by the same reference numerals, detailed description thereof will be omitted, and differences from the first embodiment will be mainly described.

  In the heat dissipation structure of the storage device according to the second embodiment, the high emissivity surface 41 is further formed on the surface of the first thermal conductive member 4 facing the HDD 1. In FIG. 2, the high emissivity surface 41 is formed over the entire surface of the first thermal conductive member 4, but it may be formed on a part of the surface facing the HDD 1.

  As a specific method of forming the high emissivity surface 41, there is a method of making the surface rougher than the wavelength of infrared rays by embossing. Alternatively, it may be formed by applying and drying a ceramic-containing paint having an infrared emissivity (ε) of 0.9 or more.

  In addition, when an aluminum alloy having a thickness of 100 μm or more is used for the first heat conductive member 4, a high emissivity surface having an emissivity of 0.9 or more is obtained by subjecting the surface to alumite treatment. It is done.

  By forming the high emissivity surface 41, the absorption rate for the radiant heat generated by the HDD 1 is improved, the amount of heat transferred from the HDD 1 to the first thermal conductive member 4 is increased, and the heat dissipation of the HDD 1 is enhanced.

<Embodiment 3>
FIG. 3 is a cross-sectional view of the storage device according to the third embodiment viewed from the front, and shows a heat dissipation structure of the storage device. In the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and different points from the first embodiment will be mainly described.

  In the heat dissipation structure of the storage device according to the third embodiment, a low emissivity surface 42 is further formed on the surface of the first thermal conductive member 4 facing the housing 3. In FIG. 3, the low emissivity surface 42 is formed over the entire surface of the first thermal conductive member 4, but it may be formed on a part of the surface facing the housing 3.

  Specifically, the low emissivity surface 42 having an emissivity of 0.1 or less is formed by performing a surface treatment such as mirror polishing or metal plating.

  By forming the low emissivity surface 42, the amount of radiant heat re-radiated by the first heat conductive member 4 is reduced, and the temperature of the outer surface 3b of the housing 3 is further lowered.

1 shows a heat dissipation structure for a storage device according to Embodiment 1 of the present invention, where (a) is a cross-sectional view of the storage device viewed from the front, and (b) is a plan view of the storage device. FIG. 5 is a cross-sectional view of the storage device as viewed from the front, showing the heat dissipation structure of the storage device according to the second embodiment of the present invention. FIG. 7 is a cross-sectional view of the storage device as viewed from the front, showing the heat dissipation structure of the storage device according to Embodiment 3 of the present invention.

Explanation of symbols

1 Hard disk drive (HDD)
DESCRIPTION OF SYMBOLS 2 Shock absorbing member 2a Notch part of impact buffering member 3 Housing | casing 3a End part of housing | casing 3b Outer surface of a housing | casing 31 Palm rest part 32 Housing | casing bottom part 4 1st heat conductive member 4a 1st heat conductive member End portion 41 high emissivity surface 42 low emissivity surface 5 second heat conductive member 5a thickness of second heat conductive member

Claims (4)

A heat dissipation structure of an electronic device in which a heat generating member that requires heat dissipation is housed in a housing,
The first heat conductive member is disposed in the gap between the heat generating member and the housing without being in contact with the heat generating member,
A second heat conductive member is disposed between the first heat conductive member and the housing, and the second heat conductive member is disposed in a portion not facing the heat generating member;
The heat dissipation structure for an electronic device, wherein the first thermal conductive member is attached to the housing via the second thermal conductive member.   2. The heat dissipation structure for an electronic device according to claim 1, wherein the first heat conductive member has a high emissivity surface formed on at least a part of a surface facing the heat generating member.   3. The heat dissipation of the electronic device according to claim 1, wherein the first heat conductive member has a surface having a low emissivity formed on at least a part of a surface facing the housing. 4. Construction. 4. The heat dissipation structure for an electronic device according to claim 1, wherein the heat generating member is a hard disk drive.

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