WO2005001674A1

WO2005001674A1 - Cooler for electronic equipment

Info

Publication number: WO2005001674A1
Application number: PCT/JP2004/008980
Authority: WO
Inventors: Kazuyuki Mikubo; Sakae Kitajo; Atsushi Ochi; Mituru Yamamoto
Original assignee: Nec Corporation
Priority date: 2003-06-27
Filing date: 2004-06-25
Publication date: 2005-01-06
Also published as: US20070006996A1; JPWO2005001674A1; CN100418037C; TWI239229B; TW200507736A; CN1813230A

Abstract

[PROBLEMS] A thin cooler for electronic equipment, having a large heat radiation area and preventing leakage of a refrigerant. [MEANS FOR SOLVING PROBLEMS] A cooler has a first and a second cooling panel (1, 2) respectively having flow paths (11, 21) formed by joining a lower heat radiation plate and an upper heat radiation plate, the plates having groove portions formed in them, and a circulation pump (3) for circulating a refrigerant in the flow paths (11, 21). In the upper heat radiation plate of the second cooling panel (2) are formed an outflow opening from which the refrigerant flows out from the flow path (21) toward the circulation pump (3) and an inflow opening from which the refrigerant flows in from the circulation pump (3) toward the flow path (21). The circulation pump (3) is fixed to the upper heat radiation plate of the cooling panel (2) such that a suction port and a discharge port are aligned with the outflow opening and the inflow opening, respectively.

Description

Specification

Electronic equipment cooling device

Technical field

The present invention relates to a cooling device for an electronic device, and more particularly to a cooling device for an electronic device suitable for cooling a heat-generating component such as a CPU mounted on a notebook computer or the like.

Background art

[0002] In recent years, electronic devices such as personal computers are equipped with heat-generating components such as CPUs that consume a large amount of power due to an increase in the amount of arithmetic processing and the speed thereof, and the amount of heat generated by the heat-generating components is large. It is steadily increasing. In these electronic devices, the operating temperature range of the various electronic components used is usually limited due to the heat resistance reliability and the temperature dependence of the operating characteristics. There is an urgent need to establish a technology for efficiently discharging wastewater to the outside.

[0003] Generally, in electronic devices such as personal computers, a metal heat sink or a so-called heat pipe or the like is attached to a CPU or the like as a heat-absorbing component to spread heat to the entire electronic device due to heat conduction or to provide electromagnetic cooling. A fan is attached to the housing to release heat from inside the electronic device to the outside.

[0004] For example, in an electronic device such as a notebook computer on which electronic components are mounted at a high density, a conventional cooling fan having a small heat radiation space inside the electronic device alone or a conventional cooling fan combined with a heat pipe is used. With the cooling system, it was possible to cool a CPU with a power consumption of about 30W. However, it is difficult for CPUs that consume more power to sufficiently release internal heat.

[0005] Even when heat can be dissipated, it is necessary to install a cooling fan having a large blowing capacity. Particularly, when an electromagnetic cooling fan is used, noise such as wind noise from the rotating blades is required. The silence was greatly impaired. Furthermore, as for personal computers for servers, the demand for miniaturization and quietness has increased with the increase in the penetration rate, and as a result, the same problem of heat emission as notebook-type personal computers has arisen.

[0006] In order to efficiently radiate the increased heat to the outside, a liquid cooling method in which a refrigerant is circulated is used. A cooling device of the type is being considered. For example, Japanese Patent Application Laid-Open No. 2003-67087 discloses that heat from a heat-generating component is transferred to the bottom of a personal computer body having a heat-receiving head for receiving heat generated from the heat-generating component of the personal computer via the heat-receiving head. A liquid-cooling type cooling device in which a housing provided with a connection head to be connected, a tube connected to the connection head and filled with a refrigerant, and a pump for circulating the refrigerant is arranged is described.

Disclosure of the invention

Problems to be solved by the invention

[0007] In the prior art described in the above publication, the refrigerant is circulated in the tube arranged at the bottom of the personal computer main body, so that a sufficient heat radiation area cannot be secured and the cooling efficiency is low. In addition, there is a problem that the cooling device cannot be made thin.

[0008] The present invention has been made in view of the above-described problems, and it is possible to improve the cooling efficiency by securing a sufficient heat radiation area, and to reduce the thickness of the electronic device cooling device. The purpose is to provide.

Means for solving the problem

[0009] In order to achieve the above object, the present invention provides a first cooling panel in which a first flow path in which a refrigerant circulates is formed, and a second flow path in which a refrigerant circulates is formed. A second cooling panel disposed to face, connecting means for connecting the first flow path and the second flow path, and circulating a refrigerant through the first flow path and the second flow path to form the second cooling panel. A cooling device for an electronic device, comprising: a cooling panel that diffuses heat transmitted to a first cooling panel and a second cooling panel.

[0010] Further, the present invention provides an electronic device characterized by mounting the cooling device for the electronic device.

The invention's effect

[0011] In the electronic device cooling device of the present invention, the first cooling panel and the second cooling panel are arranged so as to face each other, and the refrigerant is circulated in the channels of the cooling panels by a common circulation pump. By doing so, a cooling device having a sufficient heat radiation area and high cooling efficiency can be obtained. [0012] Preferably, the cooling device for an electronic device of the present invention includes a connecting means for pivotally supporting the first cooling panel and the second cooling panel so as to be freely opened and closed. A cooling device with a shape outside the compartment is obtained.

[0013] At least one of the first cooling panel and the second cooling panel may have a microchannel structure including a plurality of narrow channels having a smaller width than the channel in the channel. preferable. In this case, at least one of the first cooling panel and the second cooling panel has an area on the surface where air-cooling fins are formed, and the area is located downstream of the microchannel structure. Preferably. It is also preferable that the flow path in the area is meandering. Further, it is preferable that a cooling fan is provided corresponding to the air-cooling fin.

[0014] It is preferable that the circulation pump is fixed to a surface of the second cooling panel.

In addition, a liquid storage tank communicating with the second flow path is provided on a surface of the second cooling panel, or a liquid storage tank communicating with the second flow path inside the second cooling panel. It is also preferable to dispose. Further, it is also preferable that one or both of the first flow path and the second flow path are formed by joining a lower radiator plate and an upper radiator plate each having at least one groove formed therein. Furthermore, it is preferable that the area of the first cooling panel is smaller than the area of the second cooling panel. It is also preferable that the width of the first flow path is smaller than the width of the second flow path, and that the depth of the first flow path is deeper than the depth of the second flow path. Configuration.

Brief Description of Drawings

FIG. 1 (a) is a top view of a first embodiment of a cooling device for electronic equipment according to the present invention,

(b) and (c) are a side view and a front view, respectively.

FIG. 2 is a plan view showing a configuration of a flow path below the air-cooled fin shown in FIG. 1.

[FIG. 3] (a) is a top view of a lower heat sink of the first cooling panel constituting the first cooling panel material shown in FIG. 1, and (b) is a line X—X ′ of (a). FIG.

FIG. 4 (a) is a top view of an upper heat sink of the first cooling panel constituting the first cooling panel material shown in FIG. 1, and FIG. 4 (b) is a side view thereof.

FIG. 5 is a plan view showing a configuration of an introduction portion into the microchannel structure shown in FIG. 1. FIG. 6 (a) is a top view of the second cooling panel shown in FIG. 1, and (b) and (c) are a side view and a front view, respectively.

Garden 7] (a) is a top view of the lower heat sink of the second cooling panel constituting the second cooling member shown in FIG. 6, and (b) is a cross section taken along the line YY ′ shown in (a). FIG.

Garden 8] FIG. 7 is a plan view showing a configuration of an upper heat sink of a second cooling panel constituting the second cooling member shown in FIG.

9 is a graph showing the relationship between the width and depth of the flow channel shown in FIG. 6 and the cooling performance.

Garden 10] is a graph showing the relationship between the width and plate thickness of the flow channel shown in FIG. 6 and the pressure resistance performance.

FIG. 11 (a) is an exploded perspective view of a first example of the circulating pump shown in FIG. 1, and (b) is a side sectional view thereof.

12 (a) and (b) are side sectional views showing a mounting method of the circulation pump shown in FIG.

FIG. 13 (a) is an exploded perspective view of a second example of the circulating pump shown in FIG. 1, and (b) is a side sectional view thereof.

14] (a)-(d) are side sectional views each showing a mounting method of the circulating pump shown in FIG. 13. [FIG.

[FIG. 15] (a) and (b) are side sectional views each showing a mounting method of the circulation pump shown in FIG.

FIG. 16 (a) is an exploded perspective view of a third example of the circulating pump shown in FIG. 1, and (b) is a side sectional view.

17] (a)-(c) are side sectional views each showing a mounting method of the circulating pump shown in FIG. 16. [FIG.

FIG. 18 is a perspective view showing a configuration of the liquid storage tank shown in FIG.

[FIG. 19] (a) and (b) are cross-sectional views taken along line ZZ 'of FIG. 18 respectively.

20] (a)-(d) are explanatory diagrams for explaining the air reservoir function of the liquid storage tank shown in FIG. 18. [FIG.

FIG. 21 (a) is a perspective view showing a first example of assembling a cooling device for an electronic device according to the present invention into an electronic device of the first embodiment, and (b) is a perspective view of (a). It is sectional drawing in the Z-Z 'line.

FIG. 22 (a) shows a second example of the electronic apparatus cooling device according to the embodiment of the present invention. It is a perspective view which shows the example of incorporation, (b) is sectional drawing in the ZZ 'line of (a).

FIG. 23 (a) is a perspective view showing a third example of assembling the electronic device cooling device according to the embodiment of the present invention into the electronic device, and FIG. 23 (b) is a perspective view of FIG. FIG.

FIG. 24 is a plan view showing an experimental example of a cooling effect due to a change in air volume on the lower surface of the second cooling panel shown in FIG. 1.

FIG. 25 is a graph showing a relationship between a change in air volume on a lower surface of a second cooling panel shown in FIG. 1 and a cooling effect.

FIG. 26 is a plan view of a second cooling panel in a cooling device for electronic equipment according to a second embodiment of the present invention.

[FIG. 27] (a)-(c) are plan views each showing the structure of a vertical type liquid storage tank used in the second embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in more detail with reference to the drawings based on embodiments of the present invention. Throughout the drawings, the same components are denoted by the same reference numerals.

Referring to FIG. 1, the cooling device for an electronic device according to the first embodiment includes a first cooling panel 1, a second cooling panel 2, and a connection between the first cooling panel 1 and the second cooling panel 2. The first cooling panel 1 has connecting portions 61 and 62 that pivotally support the second cooling panel 2 so that the first cooling panel 1 can be opened and closed in a direction indicated by an arrow in FIG. 1C.

[0018] The cooling device circulates a coolant such as water or antifreeze through a flow path formed in the first cooling panel 1 and the second cooling panel 2, thereby generating heat from the CPU and other heating elements that generate heat. It has a function of cooling the component 7. Reference numeral 84 shown in FIG. 1 indicates a battery located when the cooling device is mounted on the electronic device, and the second cooling panel 2 has a shape avoiding the area of the battery 84.

The shapes of the first cooling panel 1 and the second cooling panel 2 shown in FIG. 1 are appropriately determined by various restrictions when mounted on an electronic device.

[0019] The first cooling panel 1 is made of a metal material having good thermal conductivity such as copper (Cu) or aluminum (A1). As shown in FIG. Structures 12 and are formed. Air cooling fins 13 are provided on the upper and lower surfaces of the first cooling panel 1, respectively. As shown in FIG. 2, the flow path 11 in the area 13A in which the air-cooling fins 13 are provided is a meandering flow path 111 in order to enhance the heat radiation effect. Note that reference numeral 5 shown in FIG. 1A is a cooling fan, and the cooling fan 5 forms an air flow in the air cooling fins 13 provided on the first cooling panel 1 to enhance the air cooling effect.

[0020] The first cooling panel 1 is formed by joining the lower heat radiating plate 17 and the upper heat radiating plate 18 shown in Fig. 3 and Fig. 4 by joining techniques such as diffusion joining, brazing joining, and laser welding. You. By covering the groove 171 formed in the lower heat sink 17 of the first cooling panel and the narrow groove 172 of the microchannel structure 12 with the upper heat sink 18 of the first cooling panel, the flow path 11 and the microchannel structure 12 are formed. Is formed. The grooves 171 and the narrow grooves 172 of the microchannel structure are formed on the lower heat dissipation plate 17 of the first cooling panel by a method of forming these grooves by pressing or by molding with these grooves formed. The method and the method of forming by grinding are considered.

As shown in FIG. 3, the lower heat radiating plate 17 of the first cooling panel has an opening B as an inlet through which the refrigerant flows into the flow channel 11, and an outlet through which the refrigerant flows out from the flow channel 11. An opening C is formed. A metal tube 14 is connected to the opening B, and a metal tube 15 is connected to the opening C. Flexible metal tubes are used for the metal tubes 14 and 15 so that the first cooling panel 1 does not hinder opening and closing of the second cooling panel 2 with respect to the second cooling panel 2.

The area where the micro-channel structure 12 on the lower surface of the lower heat sink 17 of the first cooling panel is formed has a large power consumption, a small area, a small area, and a locally generated CPU or other heating element. Contact the upper surface of the heat generating component 7. The heat generated by the heat generating component 7 is transmitted to the refrigerant flowing through the micro channel structure 12 via the lower heat radiating plate 17 of the first cooling panel. The microchannel structure 12 is formed in the first cooling panel 1 and is composed of a plurality of narrow passages having a width smaller than that of the flow passage 11 and having a width of lmm or less. The heat radiating plate 17 is formed in an area in contact with the heat generating component 7 with an area larger than the area. In the first embodiment, the flow channel 11 formed in the first cooling panel 1 has a width of 6 mm and a depth of 1.5 mm, and the microchannel structure 12 has a width of 0.5 mm and a depth of 1. 38 5 mm channels were formed.

As shown in FIG. 5, the inflow part where the refrigerant flows into the microchannel structure 12 The width gradually widens toward the macro channel 12 side, and becomes the same as the width of the micro channel structure 12 at its end. A guide plate 16 for diffusing the refrigerant flowing from the flow channel 11 to the width of the microchannel structure 12 is formed in the inflow portion of the microchannel structure. The guide plate 16 includes a pair of left and right first guide plates 161, second guide plates 162, and third guide plates 163 sequentially arranged from the upstream side of the flow of the refrigerant. The length of each guide plate is such that the length of the first guide plate 161 is longer than that of the guide plate located upstream, and the length of the second guide number 62 is longer than the length of the second guide plate 162. The relationship is larger than the length of the three guide plates 163. The angle Θ of each guide plate with respect to the flow direction of the refrigerant indicated by the arrow in FIG. 5 is larger at the angle of the guide plate located upstream, and the angle of the first guide plate 161 is equal to the angle of the second guide plate 162. The angle of the second guide plate larger than the angle of the third guide plate 163 is larger than the angle of the third guide plate 163.

The second cooling panel 2 is made of a highly conductive metal material such as copper (Cu) or aluminum (A1), and has a flow path 21 formed therein as shown in FIG. A circulation pump 3 and a liquid storage tank 4 are attached to the pump.

The second cooling panel 2 is formed by joining the lower heat sink 23 and the upper heat sink 24 shown in FIGS. 7 and 8, respectively, by a diffusion technique, a brazing technique, a laser welding technique, or the like. You. The channel 21 is formed by covering the groove 231 formed in the lower heat sink 23 of the second cooling panel with the upper heat sink 24. The groove 231 is formed in the lower heat sink 23 of the second cooling panel by forming the groove 231 by pressing, molding the groove 231 in a state where the groove 231 is formed, or forming the groove 231 by grinding. There is a method. The grooves may be formed in the upper heat sink 24 or in both the upper heat sink 23 and the lower heat sink 24.

[0026] A plurality of columns 22 are formed at predetermined intervals in the central portion of the flow path 21 of the second cooling panel 2, that is, in the central portion of the groove 231 formed in the lower heat sink 23 of the second cooling panel. It has been. The struts 22 are for ensuring the strength at the time of joining the lower heat sink 23 and the upper heat sink 24 of the second cooling panel. Regarding the relationship between the width and depth of the flow path 21 and the cooling performance, as shown in FIG. 9, the cooling performance is improved as the flow path width is increased and as the depth is reduced, but the pressure resistance performance is shown in FIG. As shown, the wider the channel width, the thinner the plate thickness It decreases indeed. Therefore, from the viewpoint of cooling performance, it is required to make the width of the flow path 21 as wide as possible and to make the depth shallow, but the pressure resistance performance is reduced. For this reason, in the first embodiment, the column 22 improves the pressure resistance. Further, in the first embodiment, the place where the force strut 22 is formed so that the strut 22 is formed in the central part of the flow path 21 is not limited to the central part. They may be arranged. In the first embodiment, the flow path 21 formed in the second cooling panel 2 has a width of 20 mm and a depth of 0.8 mm, and has a width of 0.5 mm and a length of 2 mm at the center of the flow path 21. Struts were formed at intervals of 20 mm.

As shown in FIG. 8, the upper heat sink 24 of the second cooling panel has an opening communicating with the liquid storage tank 4.

(Branch hole) 25, a refrigerant outlet 26 through which the refrigerant flows out from the flow path 21 toward the circulation pump 3, a refrigerant inlet 27 through which the refrigerant flows from the circulation pump 3 toward the flow path, An opening A as an outlet through which the refrigerant flows out and an opening D as an inlet through which the refrigerant flows into the flow path 21 are formed. A metal tube 14 is connected to the opening A, and a metal tube 15 is connected to the opening D. Note that a microchannel structure may be formed in the second cooling panel 2.

Next, the flow of the refrigerant in the first embodiment will be described in detail.

[0029] The refrigerant discharged from the circulation pump 3 provided on the upper surface of the second cooling panel 2 passes through the flow path 21 formed in the second cooling panel 2 through the refrigerant inlet 27, and the opening A Flows into the first cooling panel 1 through the metal tube 14 and the opening B. The refrigerant that has flowed into the first cooling panel 1 flows into the microchannel structure 12 through the flow path 11 formed in the first cooling panel 1.

The refrigerant that has flowed into the microchannel structure 12 absorbs the heat generated by the heat-generating component 7 and passes through the meandering flow path 111 formed in the area where the air-cooling fins 13 are provided. It flows into the second cooling panel 2 through the opening C, the metal tube 15 and the opening D. The refrigerant flowing into the second cooling panel 2 passes through a flow path 21 formed in the second cooling panel 2, passes below an opening 25 communicating with the liquid storage tank 4, and reaches a refrigerant outlet 26. It flows into the circulation pump 3 again.

[0031] By circulating the refrigerant by the circulation pump 3 in this manner, the heat generated by the heat-generating component 7 is thermally diffused to the entire first cooling panel 1 and the second cooling panel 2 by heat transfer, and discharged. Increases heat effect.

Next, a first configuration example of the circulation pump 3 mounted on the upper heat sink 24 of the second cooling panel on the upper surface side of the second cooling panel 2 will be described in detail with reference to FIGS. 11 and 12. .

11 is a diagram showing a first configuration example of the circulation pump shown in FIG. 1, (a) is an exploded perspective view, and (b) is a side sectional view. FIG. 12 is a side sectional view showing a mounting method of the circulation pump shown in FIG.

Referring to FIG. 11, a first configuration example of circulating pump 3 includes pump housing 311, rubber resin ring 312, piezoelectric vibration plate 313, and top plate 314 for holding piezoelectric vibration plate 313. It consists of In the pump housing 311, a suction port 315 and a discharge port 316 are formed so as to face the refrigerant outlet 26 and the refrigerant inlet 27 formed in the upper heat sink 24 of the second cooling panel, respectively. A space for the pump chamber 319 is formed. The suction port 315 has an inflow check valve 317 for preventing backflow from the pump chamber 319 to the flow path 21, and the discharge port 316 has an outflow check valve for preventing backflow from the flow path 21 to the pump chamber 319. 318 are provided respectively. The inflow check valve 317 and the outflow check valve 318 are formed of a metal thin plate reed valve, and are connected to the bottom surface of the pump housing 311 by spot welding and screwing.

[0034] The piezoelectric vibration plate 313 is a piezoelectric bending vibration plate that is a driving source of the circulation pump 3, is configured by bonding a piezoelectric element and an elastic plate, and prevents the piezoelectric element from directly contacting the coolant liquid. Watertight mold is applied. As the piezoelectric element, a piezoelectric ceramic or a piezoelectric single crystal can be used. As the elastic plate, a copper alloy such as phosphor bronze, a metal thin plate such as a stainless steel alloy, a carbon fiber thin plate, or a resin thin plate such as a PET plate can be used. The detailed structure of the piezoelectric vibration plate 313 may be a multilayer structure in which piezoelectric elements are stacked in addition to a unimorph, a bimorph, and the like.

Referring to FIG. 12A, the mounting method of the circulation pump 3 shown in FIG. 11 is as follows. First, the pump housing 311 is connected to the upper heat sink 24 of the second cooling panel by metal diffusion bonding and brazing. And integrated by laser welding and other joining techniques. At this time, the pump housing 311 has a suction port 315, a discharge port 316, a space serving as a pump chamber 319, an inflow check valve 317, and an outflow port. The check valve 318 is processed and joined.

Next, as shown in FIG. 12B, the O-ring 312 is fitted, and the piezoelectric vibrating plate 313 is placed on the O-ring 312 to form the pump chamber 319. Next, the tension force and the o-ring 312 are compressed and adhered to each other with the top plate 314 to ensure watertightness, and the piezoelectric vibrating plate 313 is fixed in a peripheral state. At this time, the top plate 314 may be screwed from above, or a screw may be formed around the top plate 314 and tightened.

As described above, in the first configuration example of the circulating pump 3, the circulating pump 3 and the second cooling panel 2 are completely connected to each other by a metal joining technique, so that pressure loss and liquid Leakage and the like are prevented. Further, since the circulation pump 3 and the second cooling panel 2 are integrally formed, the thickness can be reduced and the cost can be reduced. Further, by using the circulation pump 3 of the present structure, the cooling device can be made thinner, and its height can be made 7 mm or less at the maximum portion where the circulation pump 3 is arranged.

Next, a second configuration example of the circulation pump 3 mounted on the upper heat sink 24 of the second cooling panel on the upper surface side of the second cooling panel 2 will be described in detail with reference to FIGS. 13 to 15. You.

13 is a diagram showing a second configuration example of the circulation pump shown in FIG. 1, (a) is an exploded perspective view, and (b) is a side sectional view. 14 and 15 are side sectional views showing a method of mounting the circulation pump shown in FIG.

Referring to FIG. 13, a second configuration example of circulation pump 3 includes pump housing 321, disk 322 with check valve, rubber resin ring 312, and piezoelectric vibrating plate 313. And the top plate 314 that holds down the piezoelectric vibration plate 313. The suction port 315 and the discharge port 316 are formed in the disk 322 with the check valve so as to face the refrigerant outlet 26 and the refrigerant inlet 27 formed in the upper heat sink 24 of the second cooling panel, respectively. I have. The suction port 315 has an inflow check valve 317 for preventing backflow from the pump chamber 319 to the flow path 21, and the discharge port 316 has an outflow check valve 318 for preventing backflow from the flow path 21 to the pump chamber 319. Each is provided. The inflow check valve 317 and the outflow check valve 318 are composed of metal thin plate reed valves, and are connected to the disk 322 with a check valve by spot welding and screwing. Referring to FIGS. 14 (a)-(c), the mounting method of the circulation pump 3 shown in FIG. 13 is as follows. First, the pump housing 321 is connected to the upper heat sink 24 of the second cooling panel by metal diffusion bonding. It is integrated by joining techniques such as brazing and laser welding. At this time, the pump housing section 603 may process the portion to be the pump chamber 319 first, or may process the rear force.

Next, as shown in FIG. 14 (d), the suction port 315, the discharge port 316, the inflow check valve 317 and the outflow check valve 318 are processed. Fit into the housing 321.

Next, as shown in FIG. 15 (a), the O-ring 312 is fitted, and as shown in FIG. 15 (b), the piezoelectric vibrating plate 313 is placed on the O-ring 312 to form the pump chamber 319. . Next, the watertightness is secured by compressing and tightly attaching the beam and the ring 312 with the top plate 314, and the piezoelectric vibrating plate 313 is fixed in a peripheral state. At this time, the top plate 314 may be screwed from above, or a screw may be formed around the top plate 314 and tightened.

[0043] As described above, in the second configuration example of the circulation pump 3, the suction port 315, the discharge port 316, the inflow check valve 317, and the outflow check valve 318 are machined on the disc 322 with a check valve. In addition, the check valve-equipped disk 322 is configured to be replaceable. As a result, when the pump performance is deteriorated due to clogging of the suction port 315 and the discharge port 316 and plastic deformation of the inflow check valve 317 and the outflow check valve 318 during long-term use, a check is made. Pump performance can be restored simply by replacing the disk with valve 322, and maintenance can be performed easily.

Next, a third configuration of the circulation pump 3 attached to the upper heat sink 24 of the second cooling panel on the upper surface side of the second cooling panel 2 will be described in detail with reference to FIGS. 16 and 17. . 16 is a diagram showing a third configuration example of the circulating pump shown in FIG. 1, (a) is an exploded perspective view, and (b) is a side sectional view. FIG. 17 is a side sectional view showing a mounting method of the circulation pump shown in FIG.

Referring to FIG. 16, a third configuration example of circulating pump 3 includes a pump housing 331, a disk 322 with a check valve, a ring 312 made of rubber resin, and a piezoelectric vibrating plate 313. And a top plate 314 pressing the piezoelectric vibrating plate. The bottom surface of the pump housing 331 is opposed to the refrigerant outlet 26 and the refrigerant inlet 27 formed in the upper heat sink 24 of the second cooling panel, respectively. A pump bottom face inlet 333 and a pump bottom face outlet 334 are formed at the bottom.

The pump bottom face inlet 333 and the pump bottom face outlet 334 are connected to the suction port 315 and the discharge port 316 of the disk 322 with a check valve, respectively. The suction port 315 has an inflow check valve 317 for preventing backflow from the pump chamber 319 to the flow path 21, and the discharge port 316 has an outflow check valve 318 for preventing backflow from the flow path 21 to the pump chamber 319. Each is provided. The inflow check valve 317 and the outflow check valve 318 are formed of a thin metal plate lead valve, and are connected to the disk 322 with a check valve by spot welding and screwing.

Referring to FIGS. 17A and 17B, the mounting method of the circulation pump 3 shown in FIG. 16 is as follows. First, the second cooling panel upper radiator plate 24 and the second cooling panel lower radiator plate 23 are made of metal. It is integrated by joining techniques such as diffusion joining, brazing joining, and laser welding.

Next, a disk 322 with a check valve to which a suction port 315, a discharge port 316, an inflow check valve 317, and an outflow check valve 318 are processed and joined is fitted into the inside of the pump housing 331. Further, the O-ring 312 is mounted on the O-ring 312, and the O-ring 312 is compressed and adhered to the top plate 314 from above to secure watertightness, and the P-vibration plate 313 is fixed around the O-ring 312. Install the circulation pump 3 in advance. At this time, the top plate 314 may be screwed from above, or a screw may be formed around the top plate 314 and tightened.

Next, as shown in FIG. 17 (c), two O-ring grooves 335 provided on the pump bottom side so as to separate the pump bottom inlet 333 and the pump bottom outlet 334, respectively. Is mounted, and the previously configured circulating pump 3 and second cooling panel 2 are mounted with screws.

As described above, in the third configuration example of the circulating pump 3, maintenance such as replacement of the circulating pump 3 can be easily performed as a measure against performance degradation of the circulating pump 3, and cost can be reduced. There is an advantage that it can be inexpensively. The joining of the circulating pump 3 and the second cooling panel 2 is not so close to metal joining as in the first and second configuration examples of the circulating pump 3 described above, but is sufficient to maintain sufficient watertightness. Connected.

Next, the upper cooling plate 24 is attached to the upper heat sink 24 of the second cooling panel on the upper surface side of the second cooling panel 2. The configuration of the liquid storage tank 4 will be described in detail with reference to FIGS.

FIG. 18 is a perspective view showing the configuration of the liquid storage tank shown in FIG. 1, FIG. 19 is a cross-sectional view taken along the line Z-Z 'shown in FIG. 18, and FIG. It is an explanatory view for explaining a storage function.

As shown in FIG. 6, the liquid storage tank 4 is a hollow disk-shaped flat-type liquid storage tank, and is located on the front side of the circulation pump 3 (on the front side where the refrigerant flows into the circulation pump 3). It is fixed on the upper heat sink 24 on the flow path 21. Referring to FIG. 18 and FIG. 19, the branch hole 43 provided on the bottom surface of the liquid storage tank 4 and the opening 25 formed in the upper heat sink 24 of the second cooling panel are arranged so as to coincide with each other. The branch hole 43 leading to the liquid storage tank 4 has a smaller cross-sectional area than the flow path 21 and increases the acoustic impedance, thereby minimizing the flow rate of the refrigerant flowing into the liquid storage tank 4. The flow of the refrigerant in the flow path 21 is not hindered.

[0053] Since the liquid storage tank 4 is connected by providing a branch hole 43 on the upper side of the flow path 21, air bubbles that enter into the flow path 21 due to a temperature change or the like are generated above the second cooling panel. The liquid is trapped in the upper liquid storage tank 4 through the opening 25 formed in the heat sink 24. The trapped air 45 passes through the branch hole 43 and enters the liquid storage tank 4. At this time, if it stops near the outlet of the branch hole 43, the air 45 continuously trapped will not enter the liquid storage tank 4. For this reason, a protrusion 42 is formed on the upper lid of the liquid storage tank 4 above the outlet of the branch hole 43 so that air does not stop near the outlet of the branch hole 43. The outgoing air 45 is dispersed around. Note that, as shown in FIGS. 18 and 19, if the protrusion 42 has a conical shape, the retention of air can be effectively prevented. By making the protrusion 42 downwardly convex and having a shape of the convex portion smaller than the area of the branch hole, it is possible to prevent the air 45 from stagnating.

The air 45 trapped in the liquid storage tank 4 works to alleviate the pressure fluctuation in the flow path 21 due to the expansion and contraction of the liquid due to the temperature change, and contributes to the improvement of the durability of the cooling device. On the other hand, if the trapped air 45 enters the liquid passage 21 and the air 45 flows into the circulation pump, the discharge pressure of the circulation pump 3 decreases, and the performance of the circulation pump 3, that is, the flow rate of the refrigerant significantly decreases. There is a risk of doing it. Therefore, as shown in FIGS. 18 and 19, a trapezoidal cone-shaped tapered portion 41 having the exit of the branch hole 43 as an apex is formed on the bottom surface of the liquid storage tank 4. ing. The tapered portion 41 makes it possible to keep the air 45 trapped in the liquid storage tank 4 as long as possible even when the cooling device is turned upside down. In order to prevent the air trapped in the liquid storage tank 4 from returning to the liquid path, the outlet of the branch hole 43 needs to be always immersed in the refrigerant 44. In the first embodiment, as shown in FIG. 19, at the A—A ′ interface where the outlet of the branch hole 43 is located, the volume force A—A ′ of the liquid storage tank 4 below the A—A ′ interface is shown. It is configured to be larger than the volume of the upper liquid storage tank 4 at the boundary, and the refrigerant 44 liquid level comes above the A-A 'boundary in the liquid storage tank 4, as shown in Fig. 19 (b). In this way, the refrigerant 44 was filled.

In a normal use state of the cooling device of the first embodiment, the liquid storage tank 4 is in a state shown in FIG. 20 (a), and the air 45 has a lower specific gravity than the refrigerant 44. Is stagnating. At this time, the liquid storage tank 4 is filled with the refrigerant 44 so that the outlet of the branch hole 43 (the tapered portion of the tapered portion 41) is always in the liquid. Further, the volume of the liquid storage tank 4 is designed to be sufficiently large to withstand the thermal expansion of the refrigerant 44, the thermal expansion of the cooling device housing, the pressure resistance, and the like.

Next, when the cooling device is tilted obliquely, the liquid storage tank 4 is in a state shown in FIG. 20 (b), and the air 45 in the liquid storage tank 4 stays in one direction. I do. Also at this time, the outlet of the branch hole 43 does not come out of the liquid, and the air 45 in the liquid storage tank 4 cannot enter the branch hole 43.

Next, when the cooling device is further tilted and turned upside down, the liquid storage tank 4 is in a state shown in FIG. 20 (c). Even in this state, a tapered portion 41 is formed on the bottom surface of the liquid storage tank 4, and the refrigerant 44 whose volume is larger than that of the liquid storage tank 4 below the A-A ′ boundary surface shown in FIG. -Filled up above the 'A' interface. Therefore, the outlet of the branch hole 43 is always immersed in the refrigerant 44, and the air 45 stays in the liquid storage tank 4 and does not enter the branch hole 43.

Next, when the cooling device is further tilted, the liquid storage tank 4 changes from the state shown in FIG. 20C to the state shown in FIG. 45 runs up the tapered surface of the tapered portion 41 and, when reaching near the exit of the branch hole 43, stays on the opposite side. At this time, since the cross-sectional area of the branch hole 43 is very small, the air 45 jumps over the branch hole 43. It is a mechanism that is retained on the other side.

In order to verify the effectiveness of the liquid storage tank 4 of the first embodiment, a part of the flow path 21 was actually provided with a φ2 mm branch hole 43 and a liquid storage tank having a diameter of 50 mm and a height of 7 mm. A cooling device provided with a tank 4 (the height difference of the tapered portion 41 was 4 mm) was manufactured. A commercially available high-pressure pump was connected to this cooling device, and a pressure endurance test was performed with a pressure amplitude of 0 to 1 MPa and a frequency of 10 Hz, assuming a steep temperature change of the electronic equipment.

As a result, when the liquid storage tank 4 was not provided, liquid leakage due to peeling of the lower wall and the liquid path plate was instantaneously confirmed at 200 kPa (2 atm), but when the liquid storage tank 4 was provided, No liquid leak was confirmed up to 150,000 cycles at 1 MPa (10 atm), and it was confirmed that the durability of the liquid storage tank 4 of the first embodiment against pressure fluctuations was improved.

As described above, the liquid storage tank 4 of the first embodiment can be arranged in a two-dimensional plane with respect to a part or the whole of the flow path 21 extending in the two-dimensional plane. It has features and can be made thin. It should be noted that a great effect is exhibited by providing such a liquid storage tank 4 in addition to a single liquid storage tank. Further, if the liquid storage tank 4 is configured to be detachable, the refrigerant can be replenished in the event that the amount of the refrigerant in the cooling device is reduced, which is very effective.

Next, an example of incorporating the cooling device of the first embodiment into an electronic device will be described in detail with reference to FIGS. 21 to 25.

21A and 21B are diagrams showing a first example of assembling into an electronic device, wherein FIG. 21A is a perspective view, and FIG. 21B is a cross-sectional view taken along the line Z-Z 'shown in FIG. FIGS. 22A and 22B are diagrams showing a second example of assembling the electronic device cooling device according to the embodiment of the present invention into the electronic device, wherein FIG. 22A is a perspective view, and FIG. FIG. 2 is a sectional view taken along the line Z-Z 'of FIG. FIGS. 23A and 23B are diagrams illustrating a third example of assembling the electronic device cooling device according to the embodiment of the present invention into the electronic device. FIG. 23A is a perspective view, and FIG. FIG. 3 is a sectional view taken along the line Z-Z 'shown in FIG. FIG. 24 is a diagram showing an experimental example of a cooling effect by a change in the air volume on the lower surface of the second cooling panel shown in FIG. FIG. 25 is a graph showing a relationship between a change in air volume on the lower surface of the second cooling panel shown in FIG. 1 and a cooling effect.

[0062] Referring to Fig. 21, the first installation example generally includes a DVD_RAM81, an FD_RAM82, an HDD83, a battery 84 in a notebook computer housing 80 having a thickness of about 34 cm. In addition, a relatively large main electronic component such as a memory card 85 having a different thickness and a mother board 86 on which a heat generating component 7 such as a CPU is mounted are mounted. The second cooling panel 2 is mounted below the motherboard 86. In the first installation example, it is assumed that the microchannel structure 12 is formed on the second cooling panel 2, and the heat generating component 7 and the microchannel structure 12 mounted on the upper surface of the motherboard 86 are formed. And the upper surface of the second cooling panel 2 in the area where the second cooling panel 2 is in contact.

[0063] The second installation example is an installation example having a higher cooling effect than the first installation example.

Referring to FIG. 22, the first cooling panel 1 is mounted above the mother board 86 on which the heat-generating components 7 such as the CPU are mounted, and the second cooling panel 2 is mounted below the mother board 86. Is done. The heat generating component 7 mounted on the upper surface of the mother board 86 is in contact with the lower surface of the first cooling panel 1 in the area where the microchannel structure 12 is formed. In the second installation example, since the first cooling panel 1 opens and closes as described above, the first cooling panel 1 is opened to replace the heat-generating component 7 mounted on the upper surface of the motherboard 86. Can be easily maintained.

[0064] The third installation example is an installation example having a higher cooling effect than the second installation example.

Referring to FIG. 23, the first cooling panel 1 is mounted above the motherboard 86 on which the heat-generating components 7 such as the CPU are mounted, and the second cooling panel 2 is mounted below the motherboard 86. Is done. The heat-generating component 7 mounted on the upper surface of the motherboard 86 and the lower surface of the first cooling panel 1 in the area where the micro-channel structure 12 is formed are in contact with each other, and the first cooling panel 1 is air-cooled. Fins 13 are formed. Further, a fan 5 for forming an air flow in the air cooling fins 13 formed in the first cooling panel 1 and a fan 51 for forming an air flow on the lower surface of the second cooling panel 2 are provided.

In the third installation example, in order to verify the relationship between the amount of air supplied to the lower surface of the second cooling panel 2 and the cooling effect, as shown in FIG. The heat resistance was measured by disposing a fan 51-55 forming a flow and changing the number of fans 51-55. In addition, the fan 5 which forms an air flow in the air-cooled fins 13 formed in the first cooling panel 1 was measured while being constantly driven. As a result, as shown in FIG. 25, as the number of driven fans 51 55 increases, the thermal resistance decreases and the cooling effect improves. Verified.

[0066] Also, for the example in which the air-cooling fins were formed on the lower surface of the second cooling panel 2, the heat resistance was measured by changing the number of fans 51 to 55 in the same manner. As a result, as shown in FIG. 25, there was almost no difference in the cooling effect between the case where the air-cooling fin was formed at the lower portion of the second cooling panel 2 and the case where no air-cooling fin was provided.

As described above, in the first embodiment, the second cooling panel 2 in which the flow path 21 is formed by covering the groove 231 formed in the lower heat radiating plate 23 with the upper heat radiating plate 24 is used for the electronic device. It is configured to be mounted on the bottom of the device. Thus, the cooling efficiency can be improved by securing a sufficient heat radiation area, and the cooling device can be made thinner. Even if the cooling device is made thinner, refrigerant leakage can be prevented as much as possible.

Further, according to the first embodiment, the column for reinforcing the joint between the lower heat radiating plate 23 and the upper heat radiating plate 24 in the flow path 21 of the second cooling panel 2 mounted on the bottom of the electronic device. To form As a result, the width of the flow path 21 of the second cooling panel 2 can be increased, and the thicknesses of the lower heat radiating plate 23 and the upper heat radiating plate 24 can be reduced. Thus, the cooling efficiency can be improved, and the thickness of the cooling device can be reduced.

Further, according to the first embodiment, the circulation pump 3 is fixedly provided on the upper surface of the second cooling panel 2 mounted on the bottom of the electronic device, so that leakage of the refrigerant can be prevented as much as possible. Can be.

Further, according to the first embodiment, a branch hole is provided above the flow path 21 of the second cooling panel 2 mounted on the bottom of the electronic device, and a branch is provided above the branch hole. By installing the tank 4, air bubbles generated by a change in the temperature inside the electronic device or a change in the pressure in the liquid path can be trapped in the liquid storage tank 4. For this reason, it is possible to prevent a decrease in the outflow amount of the circulating pump 3 due to the inclusion of bubbles.

Further, according to the first embodiment, a branch hole that branches off above the flow path 21 of the second cooling panel 2 mounted on the bottom of the electronic device is provided, and a liquid reservoir is provided above the branch hole. By installing the tank 4, pressure fluctuations in the flow path due to temperature changes in the electronic equipment can be mitigated by the air 45 in the liquid storage tank 4, and the pressure fluctuations in the flow path can be reduced. Damage due to locally generated stress can be prevented. Further, according to the first embodiment, the lower heat radiating plate 23 and the upper heat radiating plate 24 of the second cooling panel constituting the flow path 21 in which the refrigerant circulates are provided with good heat conductivity and metallic material. And the upper heat sink 24 of the second cooling panel and the circulation pump 3 are connected by metal bonding. Thus, since the circulation pump 3 is integrated with the flow path 11 and the entire flow path 11 is covered with the metal material, there is an effect that there is no evaporation or leakage of the refrigerant. In the structure in which the circulating pump 3 is connected to the upper heat sink 24 of the second cooling panel via the ring 332 (third configuration example), since the circulating pump 3 is different, the connection from the connection of the ring 332 A slight possibility of refrigerant evaporation and liquid leakage remains. However, in this case, maintenance can be easily performed.

As described above, in the first embodiment of the electronic device cooling device of the present invention, the groove formed in the lower heat sink of the second cooling panel is covered by the upper heat sink of the second cooling panel. Thus, the second cooling panel, in which the flow path is formed, is mounted on the bottom of the electronic device. With this configuration, cooling efficiency can be improved by securing a sufficient heat radiation area, and the cooling device can be made thinner. Even if the cooling device is made thinner, leakage of refrigerant can be prevented as much as possible. Power S can.

Further, in the first embodiment of the cooling device for an electronic device of the present invention, the lower radiator plate and the upper radiator plate are joined in the flow path of the second cooling panel mounted on the bottom of the electronic device. Form a reinforcing column. With this configuration, the width of the flow path of the second cooling panel 2 can be increased, and the plate thickness of the lower heat sink and the upper heat sink of the second cooling panel can be reduced. Therefore, the cooling efficiency can be improved by securing a sufficient heat radiation area, and the cooling device can be made thinner.

Further, in the first embodiment of the cooling device for electronic equipment of the present invention, the circulation pump is fixedly provided on the upper surface of the second cooling panel mounted on the bottom of the electronic equipment, thereby preventing the leakage of the refrigerant. It can be prevented as much as possible.

Further, in the first embodiment of the cooling device for an electronic device of the present invention, a branch hole that branches above the flow path of the second cooling panel mounted on the bottom of the electronic device is provided, and the branch hole is provided. A storage tank will be installed at the top. As a result, air bubbles generated due to a change in the temperature inside the electronic device or a change in the pressure in the liquid path can be trapped in the liquid storage tank. This can prevent a decrease in the amount of outflow from the circulating pump.

Further, in the first embodiment of the electronic device cooling device of the present invention, a branch hole is provided which is branched above the flow path of the second cooling panel mounted on the bottom of the electronic device. By installing a liquid storage tank at the top, pressure fluctuations in the flow path due to temperature changes in the electronic equipment can be mitigated by the air in the liquid storage tank, resulting in pressure fluctuations in the flow path. As a result, breakage due to locally generated stress can be prevented.

Further, in the first embodiment of the cooling device for electronic equipment of the present invention, the lower radiator plate and the upper radiator plate of the second cooling panel constituting the flow path in which the refrigerant circulates are provided with good heat conductivity. And a metal material, and the upper heat sink of the second cooling panel and the circulation pump are connected by metal bonding. Thus, the circulation pump is integrated with the flow path, and since the entire flow path is covered with the metal material, there is an effect that there is no evaporation or liquid leakage of the refrigerant. In the structure where the circulating pump is connected to the upper heat sink of the second cooling panel via an O-ring, the circulating pump is a separate product, so that maintenance can be performed easily. There is a problem that the refrigerant may evaporate or leak from the O-ring connection.

Next, a second embodiment of the cooling device for electronic equipment of the present invention will be described. First, a simple configuration of the vertical type liquid storage tank 411 will be described with reference to FIG. In the cooling device shown in the figure, a cooling panel (base) 20 has an integral structure and has a groove 231 forming a flow path 21 therein. Further, in the middle of the flow path 21 developed in a two-dimensional plane, a flat-type liquid storage tank 4 and a vertical-type liquid storage tank 411 are formed. It can be used in a state where the lower side in FIG. 26 stands upright as the upper part in the vertical direction. The vertical type liquid storage tank 411 plays a role of relaxing pressure fluctuation in the flow path and trapping bubbles in the flow path 11 in response to expansion and contraction of the refrigerant caused by temperature fluctuation.

On the other hand, in the case where the shape of FIG. 26 is viewed from directly above, that is, when the present cooling device is used horizontally on a desk, the flat-type liquid storage tank 4 is placed vertically. It plays the same role as the mold liquid storage tank 411. In view of the above, by providing both of these liquid storage tanks 4 and 411, even when the electronic device main body such as a notebook PC is used on a desk or hung on a wall, for example, Of refrigerant due to temperature fluctuation of refrigerant By acting to alleviate pressure fluctuations due to contraction and trapping bubbles in the flow path 21, it is possible to contribute to improving the durability of the present cooling device.

Next, with reference to FIG. 27, the configuration of the vertical type liquid storage tank 411 will be specifically described. FIGS. 27 (a) and 27 (c) are enlarged views of the vertical type liquid storage tank 411 shown in FIG. 1, and show a case where an electronic device body such as a notebook PC is used in a vertical state. In other words, it is represented as a diagram when the user sees it from the front.

[0082] Bubbles 413 generated in the refrigerant 415 circulating in the flow path 11 by the circulating pump 3 and generated due to temperature fluctuation and the like approach the vicinity of the vertical storage tank 411, and the bubbles 413 themselves are Since the specific gravity is lower than that of the liquid, the liquid is guided to the vertical storage tank 411 along the wall surface of the tapered portion 412. Then, after staying above the liquid storage tank, it is finally trapped in the air layer 414.

In order to prevent the bubbles 413 guided into the vertical storage tank 411 from returning to the flow path 11 again, the entrance portion of the vertical storage tank 411 has a trapezoidal taper. The inside of the vertical storage tank 411 should be at least equal to or larger than the internal volume of the flat storage tank 4 so that the inside of the vertical storage tank 411 can be widened horizontally or spread vertically. I have.

With the above configuration, as described above, by utilizing the fact that the specific gravity of the bubbles 413 itself is lower than that of the liquid, the bubbles 413 do not return from the vertical type storage tank 411 to the liquid in the flow path 11. ,. This fact was confirmed by the inventors' experiments. Further, according to the embodiment, the vertical type storage tank 411 has a volume equal to or larger than that of the flat type storage tank 4, It was confirmed that by optimizing the amount of the air layer 414, pressure fluctuation in the flow channel due to expansion and contraction caused by the temperature fluctuation of the refrigerant can be mitigated.

Next, the shape of the vertical type liquid storage tank 411 will be described. The liquid storage tanks 411 shown in FIG. 27 (a) and FIG. 27 (c) have a function of trapping bubbles 413 and a function of reducing pressure, respectively. However, when the mounting positions of the heat-generating components such as the CPU, the circulation pump 3 and the flat-type tank 4 are changed, various restrictions are imposed on the optimal design of the flow path 11. According to the embodiment, depending on the heat-generating components such as the CPU on the motherboard in the electronic device and the layout of large electronic components such as HDDs and DVDs, the vertical mounting type shown in FIGS. By selecting the shape of the liquid storage tank 411, the cooling performance of this cooling device can be improved, It is effective for realizing.

[0086] The vertical type liquid storage tank 411 shown in Fig. 27 (a) is a horizontally long type and has a shape which is wide in the horizontal direction and short in the vertical direction. The interval between the adjacent flow paths 11 can be minimized, and the function as a liquid storage tank can be secured. Also, the vertical type liquid storage tank 411 shown in FIG. 27 (b) is of a vertical type, and unlike FIG. 27 (a), the interval between the left and right adjacent flow paths 11 can be minimized, and the upper and lower flow paths 11 By using the space between the two to secure as large a volume as possible, pressure fluctuations can be further mitigated.

In the vertical type liquid storage tank 411 shown in FIG. 27 (c), a part of the vertical type liquid storage tank 411 is connected to the flow path 11. Thereby, when the flow rate of the refrigerant flowing in the flow path 11 increases, more bubbles 413 can be trapped more reliably than in the liquid storage tanks of FIGS. 27 (a) and 27 (b). In this case, it is possible to always secure a constant amount of the air layer 414 and reliably trap the bubbles 413 without filling the liquid storage tank with the liquid.

In any structure of the vertical type liquid storage tank of the second embodiment, trapping of bubbles 413 generated in the flow path is effectively performed. Therefore, the vertically disposed liquid storage tank 411 having such an air reservoir function can be expanded and configured in a two-dimensional plane with respect to the liquid circulation path of the present cooling device, and can be formed of a metal such as aluminum or copper having good heat conductivity. Since it can be embedded together with the flow path inside the upper heat sink and the lower heat sink of the first cooling panel made of the material, the overall thickness of the cooling part plate can be reduced to 2 mm or less. It should be noted that it is obvious that such a vertical type liquid storage tank 411 and a flat type liquid storage tank 4 can exert a tremendous effect by providing not only a single type but also a plurality of the same type or different types.

It is apparent that the present invention is not limited to the above embodiments, and that the embodiments can be appropriately changed within the scope of the technical idea of the present invention. For example, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, but can be set to a number, position, shape, and the like suitable for carrying out the present invention.

Claims

The scope of the claims

[1] a first cooling panel (1) in which a first flow path (11) through which a refrigerant circulates is formed;

A second cooling panel (2) in which a second flow path (21) through which a refrigerant circulates is formed, and which is disposed to face the first panel (1);

Connecting means (15) for connecting the first flow path (11) and the second flow path (21); and circulating a refrigerant through the first flow path (11) and the second flow path (21). A cooling device for an electronic device, comprising: a circulating pump (3) for diffusing heat transmitted to the first cooling panel (1) and the second cooling panel (2).

[2] A connecting means for pivotally supporting the first cooling panel (1) and the second cooling panel (2) in an openable and closable manner (

The cooling device for an electronic device according to claim 1, further comprising: 61, 62), wherein the connection means (15) has flexibility.

[3] At least one of the first cooling panel (1) and the second cooling panel (2) is connected to the flow path (1

2. The electronic device according to claim 1, further comprising: a microchannel structure including a plurality of narrow channels having a smaller width than the channels. 3. Cooling system.

[4] At least one of the first cooling panel (1) and the second cooling panel (2) has an area (13A) on the surface of which an air-cooling fin (13) is formed, and the area (13A) is The cooling device for an electronic device according to any one of claims 1 to 3, wherein the cooling device is arranged downstream of the micro channel structure (12).

5. The cooling device for an electronic device according to claim 4, wherein a flow path of the area (13A) is meandering.

6. The cooling device for an electronic device according to claim 4, wherein a cooling fan (5) is provided corresponding to the air-cooling fin (13).

7. The cooling device for an electronic device according to claim 1, wherein the circulating pump (3) is fixed to a surface of the second cooling panel (2).

[8] The electronic device according to claim 1, wherein a liquid storage tank (4) communicating with the second flow path (21) is provided on a surface of the second cooling panel (2). Cooling device.

[9] The electronic device according to claim 1, wherein a liquid storage tank (411) communicating with the second flow path (21) is formed inside the second cooling panel (2). Cooling system.

[10] At least one of the first flow path (11) and the second flow path (21) has a groove (23

2. The cooling device for electronic equipment according to claim 1, wherein the lower heat radiating plate (23) and the upper heat radiating plate (24) formed with (1) are joined to each other.

[11] The cooling device for an electronic device according to claim 1, wherein an area of the first cooling panel (1) is smaller than an area of the second cooling panel (2).

12. The cooling device for an electronic device according to claim 1, wherein a width of the first flow path (11) is smaller than a width of the second flow path (21).

13. The cooling device for an electronic device according to claim 1, wherein a depth (11) of the first flow path is deeper than a depth of the second flow path (21).

[14] An electronic device comprising the cooling device for an electronic device according to any one of claims 1 to 12.