JP2005056951A - Heat sink device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink device capable of radiating heat of a high-power LD array without making the size of the device larger. <P>SOLUTION: The heat sink device 50 is provided with heat-receiving bodies 10, 20, 30 contacting the LD array 40 and passages formed on the heat-receiving bodies 10, 20, 30, and dissipates the heat of the LD array 40 by allowing a cooling medium to flow through the passages. The passages are formed so that all the portions of each passage may not cross the other portion of the passage. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device suitable for heat dissipation of a high-power laser diode array.

The heat output density of a high-power laser diode array (hereinafter referred to as “LD array”) is as high as several tens to several hundreds W / cm ² . When the temperature of the LD array rises due to heat generation, various problems such as instability of laser output and transmission wavelength, reduction of output efficiency, and shortening of element lifetime occur. Therefore, how to remove the heat generated in the LD array is a very important issue.

  Since the size of the bottom surface of the LD array is as small as about 10 mm in length and about 1 to 1.5 mm in width, an air-cooling heat dissipation device cannot suppress the temperature rise of the LD array. For this reason, as a heat dissipation device for radiating the heat of the LD array, a water-cooling type is applied (for example, see Patent Documents 1 and 2). 5 and 6 show an example of a conventional water-cooling heat dissipation device 100. FIG. In the heat dissipation device 100, an upper heat receiving body 70, an intermediate heat receiving body 80, and a lower heat receiving body 90 are sequentially laminated and joined. Each of the heat receiving bodies 70, 80, 90 is a flat plate member made of a metal having a large thermal conductivity such as copper. The joining surfaces of the heat receiving bodies 70, 80, 90 are joined in a state of confidentiality and good heat conduction with solder or the like. In addition, the dotted pattern in FIG. 6 (a) and (c) represents that the recessed part is provided in the part.

  Here, FIG. 5 is a sectional view of the heat dissipation device 100, FIG. 6A is a view taken along the line AA in FIG. 5 (a bottom view of the upper heat receiving body 70), and FIG. B line arrow figure (plan view of middle heat receiving body 80), the figure (c) is the CC line arrow figure in Figure 5 (plan view of lower heat receiving body 90). As shown in FIG. 5, the upper heat receiving body 70 is joined to the intermediate heat receiving body 80 and the lower heat receiving body 90 is joined to the intermediate heat receiving body 80 by an upper surface through which a coolant such as cooling water passes. A water channel 72 and a lower surface water channel 93 are formed. In addition, a circular communication port 82 that connects the upper surface water channel 72 and the lower surface water channel 93 is formed at one end edge of the intermediate heat receiving body 80.

In addition, an installation location of the LD array 40 is provided at one end edge of the upper surface of the upper heat receiving body 70.
The heat generated in the LD array 40 is conducted to the upper heat receiving body 70. In the upper heat receiving body 70, heat is conducted in the plate thickness direction, and is guided to the radiation fins 73 designed to be several times longer than the LD array 40. The radiating fins 73 dissipate the heat conducted from the LD array 40 to the refrigerant passing around the radiating fins 73. Further, since the heat radiation amount of the radiation fins 73 is not sufficient, the heat generated in the LD array 40 is conducted to the partition wall 82a of the intermediate heat receiving body 80 shown in FIG. The heat radiation fin 92 is conducted to increase the heat radiation amount.

  For example, when cooling water is supplied as a coolant from the cooling water circulation device to the water supply port 91 of the heat radiating device 100 configured as described above, the cooling water passes through the circular communication port 81 of the intermediate heat receiving body 80 and passes through the upper heat receiving body 70. It reaches the cooling water introduction part 71. Here, the cross-sectional area of the flow path changes in a direction perpendicular to the flow direction of the cooling water along the shape of the cooling water introduction part 71 and the upper surface water path 72. The cooling water flows through this flow path and reaches the radiation fins 73. As described above, the LD array 40 is installed on the upper surface of the upper heat receiving body 70 located above the heat dissipating fins 73.

The cooling water passes through the flow path between the radiating fins 73 while exchanging heat, passes through the circular communication port 82 of the intermediate heat receiving body 80, and further flows between the radiating fins 92 provided in the lower heat receiving body 90. And reach the lower surface waterway 93. Here, the flow path is divided into two at the throttle portion 95 shown in FIG. 6C and merges again in the vicinity of the drain port 94. For this reason, the cross-sectional area of the flow path changes in a direction perpendicular to the flow direction of the cooling water. The cooling water flows through this flow path and is discharged out of the heat radiating device 100 from the drainage port 94.
International Application Publication No. 00/11922 Pamphlet Japanese Patent Laid-Open No. 8-139479

In the heat dissipation device 100 configured as described above, when the laser output of the LD array 40 is increased, it is necessary to increase the cooling performance of the heat dissipation device 100 and to dissipate the LD array 40. In order to improve the cooling performance, it is effective to increase the pumping capacity of the cooling water circulation device. If the pumping capacity is increased, the flow rate of the cooling water flowing through the flow path of the heat radiating device 100 is increased, the flow velocity near the heat radiating fins 73 and 92 is increased, and the heat exchange amount between the cooling water and the heat radiating fins 73 and 92 is increased. Increase. However, when the pumping capacity of the cooling water circulation device is increased, there is a problem that power consumption increases. In order to increase the pumping capacity, it is necessary to enlarge the cooling water circulation device. Further, it is necessary to increase the thickness of the heat radiating device 100 by increasing the thickness of the heat receiving bodies 70, 80, 90 so as to withstand the high water pressure of the cooling water. As described above, in order to dissipate heat from the high-power LD array, it is necessary to increase the scale of the apparatus.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat radiating device capable of radiating heat from a high-power LD array without increasing the scale of the device.

In order to solve the above-mentioned problem, the invention described in claim 1 includes a heat receiving body in contact with a heating element and a flow path formed in the heat receiving body, and flowing the refrigerant through the flow path to A heat radiating device for radiating heat from a heating element, wherein the flow path is formed so that all portions of the flow path do not intersect with other portions of the flow path. provide.
According to the first aspect of the present invention, since the heat dissipation device is configured so that all parts of the flow path do not intersect with other parts of the flow path, it is necessary to provide a throttle part at all in the flow path. Absent. Thereby, a flow path is simplified, the flow of cooling water becomes smooth, and pressure loss can be reduced.

  The invention according to claim 2 is the heat dissipating device according to claim 1, wherein the flow path discharges the refrigerant, a refrigerant introduction part joined to a refrigerant introduction port for introducing the refrigerant. A refrigerant discharge part joined to the refrigerant discharge port, a flow rate increase part for increasing the flow rate of the refrigerant, a first water channel part provided between the refrigerant introduction part and the flow rate increase part, It has the 2nd channel part provided between the said refrigerant | coolant discharge part and the said flow-velocity raising part, It is characterized by the above-mentioned.

According to invention of Claim 2, the said flow path has a refrigerant | coolant introduction part, a refrigerant | coolant discharge part, a flow velocity raising part, a 1st water channel part, and a 2nd water channel part which do not cross | intersect mutually. Therefore, the refrigerant is supplied from the refrigerant introduction part with a small fluid resistance and pressure loss, passes through the first water channel part, takes the heat of the heating element in the flow rate increasing part, and passes through the second water channel part. Is discharged from the refrigerant discharge section.
The invention according to claim 3 is the heat radiating device according to claim 2, wherein the cross-sectional area of the refrigerant inlet and the cross-sectional area of the refrigerant inlet are substantially equal, and the cross-sectional area of the refrigerant outlet. And a cross-sectional area of the refrigerant discharge portion are substantially equal.

According to invention of Claim 3, the cross-sectional area of the said refrigerant | coolant inlet port and the cross-sectional area of the said refrigerant | coolant inlet part are substantially equal, The cross-sectional area of the said refrigerant | coolant discharge port, and the cross-sectional area of the said refrigerant | coolant discharge part Are substantially equal to each other, it is possible to significantly reduce the pressure loss due to a sudden change in the cross-sectional area at the inflow and outflow of the refrigerant into the flow path.
According to a fourth aspect of the present invention, in the heat dissipation device according to any one of the first to third aspects, the heat receiving body includes a first heat receiving body, a second heat receiving body, and a third heat receiving body in order. Laminated and joined, the first flow path portion is formed between the first heat receiving body and the second heat receiving body, and between the second heat receiving body and the third heat receiving body. The second flow path portion is formed.

According to invention of Claim 4, the said heat receiving body is a three-layer structure which laminated | stacked and joined the 1st heat receiving body, the 2nd heat receiving body, and the 3rd heat receiving body one by one, A flow path is provided between each heat receiving body. Therefore, the heat radiating device itself can be easily manufactured.
The invention according to claim 5 is the heat radiating device according to claim 4, wherein the second heat receiving body forms the first flow path portion and the refrigerant introducing portion with the first heat receiving body. A concave portion is formed in at least one of the portion and the portion forming the second flow path portion and the refrigerant discharge portion between the third heat receiving body and the third heat receiving body.

  According to the invention of claim 5, by forming the recess, the cross-sectional area of the refrigerant introduction port and the cross-sectional area of the refrigerant introduction portion are substantially equal, and the cross-sectional area of the refrigerant discharge port, Since the cross-sectional areas of the refrigerant inlet and the refrigerant outlet are enlarged so that the cross-sectional areas of the refrigerant outlet are substantially equal, the pressure due to the change of the cross-sectional area in the vicinity of the refrigerant inlet and the refrigerant outlet Loss can be reduced.

As described above, since all the portions of the flow path of the heat radiating device are formed so as not to intersect with other portions of the flow path, it is not necessary to provide any throttle portion in the flow path. Thereby, a flow path is simplified, the flow of cooling water becomes smooth, and pressure loss can be reduced.
Further, the cross-sectional areas of the refrigerant introduction portion and the refrigerant discharge portion are enlarged, the cross-sectional area of the refrigerant introduction port and the cross-sectional area of the refrigerant introduction portion are substantially equal, and the cross-sectional area of the refrigerant discharge port and the cross-sectional area of the refrigerant discharge portion are By making these substantially equal, it is possible to reduce the pressure loss due to the change in the cross-sectional area during the inflow and outflow of the refrigerant into the flow path.
For this reason, it is possible to radiate heat from the high-power LD array without increasing the scale of the heat radiating device or the device supplying the refrigerant.

A preferred embodiment of a heat dissipation device according to the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a cross-sectional view of a heat dissipation device 50 according to Embodiment 1 of the present invention. The heat dissipation device 50 is for radiating heat using the high-power LD array 40 as a heating element. As shown in the figure, the heat dissipation device 50 includes an upper heat receiving body (first heat receiving body) 10, an intermediate heat receiving body (second heat receiving body) 20, and a lower heat receiving body (third heat receiving body) 30 that are sequentially laminated and bonded. It is prepared for.

As a specific example, when a rectangular LD array 40 having a length of 10 mm, a width of 1 to 1.5 mm, and a height of 0.1 to 0.2 mm is used as a heat-dissipating object, a length of 11 mm × The heat receiving bodies 10, 20, and 30 having a size of width 20 mm × height 1 mm are applied (total height is 3 mm with three layers).
Each of these heat receiving bodies 10, 20, and 30 is formed in a rectangular flat plate shape by a metal having a good thermal conductivity such as copper, copper-tungsten, or aluminum. Further, the heat receiving bodies 10, 20, and 30 are joined in a watertight manner by soldering or the like.

In addition, a flow path for flowing the refrigerant from the water supply port 31 to the drain port 32 is formed inside the heat receiving bodies 10, 20, 30.
An installation location of the LD array 40 is provided at one end edge in the length direction on one surface (upper surface in FIG. 1) of the upper heat receiver 10.
2A is a view taken along the line AA in FIG. 1 (a bottom view of the upper heat receiving body 10), and FIG. 2B is a view taken along the line BB in FIG. 20 (plan view) and FIG. 10 (c) are views taken along line CC in FIG. 1 (plan view of the lower heat receiving body 30). Note that the dotted pattern in FIGS. 2A and 2C indicates that a concave portion is provided in that portion.

Hereinafter, the components of the heat dissipation device 50 will be described with reference to the drawings.
As shown in FIG. 2 (a), on the other surface (the lower surface in FIG. 1) of the upper heat receiving body 10, a cooling water introduction portion (refrigerant introduction portion) 11, an upper surface water passage (first water passage portion) 12, A flow path (flow velocity increasing portion) 13 and a heat radiating fin 14 are formed.
The cooling water introduction portion 11, the upper surface water passage 12, and the flow passage 13 are recessed portions that are opened on the lower surface of the upper heat receiving body 10. The concave portion is provided in a portion extending from one end edge corresponding to the installation location of the LD array 40 to the other end edge facing the installation location of the LD array 40. As shown in FIG. 1, the depth of the concave portion is uniform over the entire area. The concave portion has the same height and is surrounded by a continuous wall portion of the upper heat receiving body 10. When the other surface of the upper heat receiving body 10 is laminated and joined to one surface of the middle heat receiving body 20, the recess is closed, and a coolant such as cooling water flows between the upper heat receiving body 10 and the middle heat receiving body 20. A space for this is formed.

As shown in FIG. 2A, the cooling water introducing portion 11 is provided at the other end edge portion of the upper heat receiving body 10 that faces the installation location of the LD array 40. The cooling water introducing portion 11 is formed so as to gradually increase in width from the other end edge toward the upper surface water channel 12, and to have the same width as that of the upper surface water channel 12 at a portion intersecting with the upper surface water channel 12.
Further, the upper surface water channel 12 is located between the cooling water introduction part 11 and the flow channel 13. Since the upper surface water channel 12 has a uniform width and depth throughout, the cross-sectional area and the cross-sectional shape in the direction perpendicular to the direction in which the refrigerant flows are constant.

In the following, “cross-sectional shape” and “cross-sectional area” refer to a cross section perpendicular to the direction in which the refrigerant flows.
A flow path 13 for taking heat away from the heat radiating fins 14 is formed at one end edge corresponding to the installation location of the LD array 40. The flow path 13 is connected to a plurality of circular communication holes 22 formed in the intermediate heat receiving body 20.

  The flow path 13 is provided with a plurality of heat radiation fins 14. These radiating fins 14 are arranged at the same pitch from the one end edge side corresponding to the installation location of the LD array 40 of the upper heat receiver 10 toward the other end edge side (length direction, refrigerant flow direction), They extend parallel to each other. Each radiating fin 14 has the same height as the wall portion of the upper heat receiving body 10 surrounding the flow path 13. For this reason, when the other surface of the upper heat receiving body 10 is laminated on one surface of the middle heat receiving body 20, the heat radiation fin 14 can be joined to the upper heat receiving body 10 and the middle heat receiving body 20.

As shown in FIG. 2B, the middle heat receiving body 20 is formed with a circular communication hole (refrigerant inlet) 21 and a circular communication hole (flow velocity increasing portion) 22.
The circular communication hole 21 is a circular hole penetrating along the thickness direction at the other end edge of the intermediate heat receiving body 20 facing the installation location of the LD array 40. The circular communication hole 21 communicates the water supply port 31 of the lower heat receiving body 30 and the cooling water introducing portion 11 of the upper heat receiving body 10.

The circular communication hole 22 is a small-diameter circular hole penetrating along the thickness direction of the intermediate heat receiving body 20, and in the width direction of the intermediate heat receiving body 20 at one end edge corresponding to the installation location of the LD array 40. Are arranged side by side. Each circular communication hole 22 has the same inner diameter.
One surface (upper surface in FIG. 1) of the lower heat receiving body 30 is laminated and joined to the other surface (lower surface in FIG. 1) of the intermediate heat receiving body 20. On the upper surface of the lower heat receiving body 30, as shown in FIG. 2C, a flow path (flow velocity increasing portion) 34, a lower surface water channel (second water channel portion) 33, a cooling water discharge portion (refrigerant discharge portion) 36. A drain port (refrigerant discharge port) 32, a water supply port (refrigerant water inlet port) 31, and a radiation fin 35 are formed.

  The flow path 34, the lower surface water channel 33, and the cooling water discharge portion 36 are recessed portions that are opened on the upper surface of the lower heat receiving body 30. The recess is formed across the drain port 32 and the heat radiating fin 35. The depth of the concave portion is uniform over the entire area in the same manner as the concave portion formed in the upper heat receiving body 10. The periphery of the recess is surrounded by a wall portion of the lower heat receiving body 30 that is continuous at the same height. When one surface of the lower heat receiving body 30 is laminated and joined to the other surface of the middle heat receiving body 20, the concave portion of the lower heat receiving body 30 is closed, and a refrigerant flows between the lower heat receiving body 30 and the middle heat receiving body 20. A space for this is formed.

The water supply port 31 is a circular hole penetrating along the plate thickness direction at a portion of the lower surface water channel 33 opposite to the flow channel 34 in the length direction. The water supply port 31 is connected to the circular communication hole 21 of the middle heat receiving body 20.
Further, the drainage port 32 is a circular hole that is provided in a substantially central portion of the lower heat receiving body 30 along the thickness direction. The drain port 32 has substantially the same inner diameter as the water supply port 31. The water supply port 31 and the water discharge port 32 are arranged so that their diameters do not overlap each other. Further, the drain port 32 is disposed closer to the length direction than the water supply port 31 from the installation location of the LD array 40.

The cooling water discharge part 36 is formed at a portion of the drain port 32 of the lower heat receiving body 30. As shown in FIG. 2 (c), the cooling water discharge portion 36 gradually increases in width from the drain port 32 toward the lower surface water channel 33, and has the same width as the lower surface water channel 33 at a portion intersecting with the lower surface water channel 33. Become.
Since the lower surface water channel 33 is located between the cooling water discharge part 36 and the flow channel 34 and is formed to have a uniform width and depth throughout, the cross-sectional shape and the cross-sectional area are substantially constant. is there.

The flow path 34 is provided in a portion of the lower heat receiving body 30 corresponding to the circular communication hole 22 of the middle heat receiving body 20, and allows the refrigerant flowing from the circular communication hole 22 to flow toward the lower surface water channel 33. .
The flow path 34 is provided with a plurality of heat radiating fins 35. These radiating fins 35 are provided at portions corresponding to the respective radiating fins 14 provided in the upper heat receiving body 10. Since each radiation fin 35 has the same height as the wall portion surrounding the lower surface water channel 33, when one surface of the lower heat receiving body 30 is stacked on the other surface of the middle heat receiving body 20, It is possible to join the fin 35 to the other surface (partition wall 22a) of the intermediate heat receiving body 20.

Note that the flow passages 13 and 34 (flow velocity increasing portions) are smaller in the cross-sectional area by the thickness of the radiation fins 14 and 35 than the upper flow passage 12 and the lower flow passage 33, so that the flow velocity is high. Become.
In addition, the upper heat receiving body 10, the intermediate heat receiving body 20, and the lower heat receiving body 30 described above are formed by performing chemical processing such as etching or machining such as cutting and grinding, for example.
Next, an operation when the heat dissipation device 50 is applied to perform heat dissipation of the LD array 40 will be described. Here, cooling water is used as the refrigerant. In order to radiate heat from the LD array 40, first, the LD array 40 is joined to an installation location provided in the upper heat receiving body 10. From this state, the pressurized cooling water is sequentially supplied from the cooling water circulation device to the water supply port 31 formed in the lower heat receiving body 30.

  The cooling water guided to the water supply port 31 passes through the circular communication hole 21 of the middle heat receiving body 20 and reaches the cooling water introducing portion 11 of the upper heat receiving body 10. The cooling water flows in the direction of the upper surface water channel 12 along the shape of the cooling water introduction portion 11 whose cross-sectional area gradually increases. In the upper surface water channel 12, the cooling water flows according to the shape of the upper surface water channel 12 having a constant cross-sectional area. The cooling water that has reached the flow path 13 exchanges heat with the heat radiating fins 14 by taking heat conducted from the LD array 40 from the plurality of heat radiating fins 14 provided in the flow paths 13. Then, the heat-exchanged cooling water passes through the circular communication hole 22 of the middle heat receiving body 20 and is guided to the flow path 34 of the lower heat receiving body 30. At this time, the cooling water takes heat of the LD array 40 conducted from the upper heat receiving body 10 and the middle heat receiving body 20 from the heat radiating fins 35. Then, the cooling water is led to the lower surface water channel 33 having a constant cross-sectional area and reaches the cooling water discharge portion 36. The cooling water flows along the shape of the cooling water discharge portion 36 whose cross-sectional area gradually decreases in the direction of the drain port 32. Then, the cooling water is discharged from the drain port 32.

In this way, there is no portion where the flow path intersects in the conventional manner while the cooling water is supplied from the water supply port 31 and discharged from the drain port 32, so it is necessary to form a throttle part in the flow channel. Absent. For this reason, the cooling water can smoothly flow through the flow path with a small fluid resistance, and the pressure loss of the cooling water can be reduced.
Thus, the pressure loss of the cooling water can be reduced without increasing the size of the heat dissipation device 50.

  For this reason, when a cooling water circulation device having the same pumping capacity as that of the conventional one is used, a large flow rate can be flowed as much as the pressure loss is reduced, so that the cooling efficiency is improved. Further, when the same flow rate as in the past is passed through the flow path of the heat radiating device 50 (when the heat exchange amount is the same as in the past), the heat radiating device 50 can be reduced in low pressure, and thus supplied from the cooling water circulation device. The water pressure of the cooling water can be lowered. Accordingly, it is possible to reduce the size and cost of the cooling water circulation device.

  As described above, the pressure loss is reduced, and even in the case of the high-power LD array 40, the temperature rise of the LD array 40 can be suppressed without increasing the size and performance of the heat dissipation device 50 and the cooling water circulation device. Can do. As a result, even if the output is high, the laser output and transmission wavelength of the LD array 40 are stabilized, the output efficiency is improved, the element life is prolonged, and the like.

In addition, if the flow rate is the same as the conventional one, there is a margin in pressure loss, so that the amount of heat radiation can be improved by increasing the number of heat radiation fins 14 and 35, for example.
Moreover, in Embodiment 1 mentioned above, the cross-sectional area of the flow path through which cooling water passes is gradually expanded from the water supply port 31 to the upper surface water channel 12, and in the upper surface water channel 12, the cross-sectional area is made constant. The heat radiation fins 14 are guided while being held, the lower surface water passage 33 is allowed to pass through the lower surface water passage 33 while keeping the cross sectional area constant, and the cooling water discharge portion 36 gradually reduces the cross sectional area toward the drain port 32. The configuration. For this reason, as a whole, a flow path without a sudden change in the cross-sectional area can be formed, and the pressure loss can be reduced.

  Further, since the water supply port 31 connected to the flow path of the upper heat receiving body 10 is formed at a position farther from the installation position of the LD array 40 than the drain port 32, the flow path ( The concave portion can be made longer in the length direction. Thereby, the contact area between the cooling water and the upper heat receiving body 10 is increased, and the heat transmitted to the upper heat receiving body 10 is favorably removed by the cooling water passing through the upper surface water channel 12. As a result, heat can be efficiently radiated from the LD array 40.

(Embodiment 2)
Next, a second embodiment will be described. FIG. 3 is a cross-sectional view of the heat dissipation device 60 according to Embodiment 2 of the present invention. The heat radiating device 60 exemplified here is for radiating heat using the high-power LD array 40 as a heating element, similarly to the heat radiating device 50 shown in the first embodiment. The configuration of the heat dissipation device 60 is different from the heat dissipation device 50 according to Embodiment 1 only in the configuration of the intermediate heat receiving body (second heat receiving body).

Specifically, the first recess 23 is formed on one surface of the intermediate heat receiving body 25 of the heat dissipation device 60, and the second recess 24 is formed on the other surface.
4A is a view taken along the line AA in FIG. 3 (a bottom view of the upper heat receiving body 10), and FIG. 4B is a view taken along the line BB in FIG. 3 (a middle heat receiving body 25). (C) is a cross-sectional view of the intermediate heat receiving body 25, FIG. 4 (d) is a view taken along the line CC in FIG. 3 (a bottom view of the intermediate heat receiving body 25), and FIG. e) shows a DD arrow view (plan view of the lower heat receiving body 30) in FIG. In addition, the dotted pattern in FIG. 4 (a) and (c) represents that the recessed part is provided in the part.

  The configuration of the recesses 23 and 24 will be described in detail with reference to these drawings. As shown in FIGS. 4A and 4B, the first recess 23 is formed on one surface of the intermediate heat receiving body 25 corresponding to the cooling water introducing portion 11 and the upper surface water channel 12 of the upper heat receiving body 10. Yes. The first recess 23 is configured such that the cross-sectional area of the water supply port (refrigerant inlet) 31 and the circular communication hole (refrigerant inlet) 21 is substantially equal to the cross-sectional area of the cooling water inlet (refrigerant inlet) 11. Is formed.

Further, as shown in FIGS. 4D and 4E, the other surface of the intermediate heat receiving body 25 corresponding to the lower surface water passage 33, the cooling water discharge portion 36 and the drain port 32 of the lower heat receiving body 30 is A second recess 24 is formed. The second recess 24 is formed such that the cross-sectional area of the drain port (refrigerant discharge port) 32 and the cross-sectional area of the cooling water discharge part (refrigerant discharge part) 36 are substantially equal.
Since other configurations are the same as those in the first embodiment, the same reference numerals are given and detailed descriptions thereof are omitted.

  Next, an operation when the heat dissipation device 60 is applied to perform heat dissipation of the LD array 40 will be described. In order to radiate heat from the LD array 40, the LD array 40 is first joined to the installation location of the LD array 40 provided in the upper heat receiving member 10 as in the first embodiment. From this state, the pressurized cooling water is supplied to the water supply port 31 of the lower heat receiving body 30 from the cooling water circulation device. The cooling water guided to the water supply port 31 passes through the circular communication hole 21 of the middle heat receiving body 25 and reaches the cooling water introducing portion 11 of the upper heat receiving body 10. At this time, since the first concave portion 23 is formed on one surface of the intermediate heat receiving body 25, the cross-sectional area of the cooling water introducing portion 11 is greatly enlarged and becomes substantially equal to the circular communication hole 21. Yes. Therefore, the pressure loss when cooling water flows into the cooling water introduction part 11 from the water supply port 31 and the circular communication hole 21 is significantly reduced.

  The cooling water guided to the cooling water introduction part 11 passes through the upper surface water channel 12 and is guided to the flow path 13 where the heat radiation fins 14 are provided. Here, since the first recess 23 is not formed in the intermediate heat receiving body 25 around the flow path 13, the cross-sectional area of the flow path 28 is smaller than that of the upper surface water path 12. As described above, the reason why the cross-sectional area is reduced in the flow path 13 is that the heat radiation fin 14 requires a large heat exchange with the cooling water, so that the flow velocity in the flow path 13 is reduced by reducing the cross-sectional area of the flow path 13. This is to increase the heat transfer amount from the radiating fins 14 to the cooling water.

  The cooling water heat-exchanged with the heat radiating fins 14 in this way passes through the circular communication hole 22 of the middle heat receiving body 25 and is guided to the flow path 34 of the lower heat receiving body 30. At this time, the cooling water removes heat from the radiation fins 35 provided in the lower heat receiving body 30. And although cooling water is guide | induced to the lower surface water channel 33, here the 2nd recessed part 24 is formed in the other surface of the intermediate | middle heat receiving body 25 corresponding to the lower surface water channel 33 of the lower heat receiving body 30, Since the cross-sectional area of the lower surface water channel 33 is enlarged, pressure loss is reduced.

The cooling water is guided from the lower surface water channel 33 to the cooling water discharge part 36 and the drain port 32 and discharged to the outside of the heat radiating device 60. At this time, the second recess 33 is formed on the other surface of the intermediate heat receiving body 25, and the cross-sectional areas of the cooling water discharge part 36 and the drain port 32 are substantially equal. Loss is reduced.
As described above, in the second embodiment, the flow path cross-sectional area around the water supply port 31 and the drain port 32 of the heat radiating device 60 is enlarged, and the pressure loss due to the inflow and outflow of the cooling water is greatly reduced.

Thereby, in addition to the effects of the first embodiment, the pressure loss around the water supply port 31 and the drain port 32 can be further reduced, so that the pressure loss can be greatly reduced as the entire heat dissipation device 60.
Moreover, in Embodiment 2 mentioned above, although the 1st recessed part 23 and the 2nd recessed part 24 are formed in the middle heat receiving body 25, not only the middle heat receiving body 25 but the upper heat receiving body 10 or You may make it form a recessed part in the lower heat receiving body 30. FIG. However, if a large concave portion is formed in the upper heat receiving body 10, the thermal resistance along the surface direction of the upper heat receiving body 10 is increased. Therefore, when a recess is formed in the upper heat receiving body 10, it may be small. preferable.

  Further, in the first and second embodiments, the drain port 32 is formed in the approximate center of the lower surface water channel 33, but the drain port 32 is more LD array 40 than the water port 31 so as not to overlap the water port 31. As long as it is provided on the side closer to the installation location, the center of the lower surface water channel 22 is not necessarily required. In short, it suffices if all the parts of the flow path are formed so as not to intersect with other parts of the flow path. In addition, although the drain port 32 has substantially the same inner diameter as the water supply port 31, it may have a different inner diameter.

Moreover, in Embodiment 1 and 2 mentioned above, although the heat radiating device was set as the three-layer structure of the upper heat receiving body 10, the middle heat receiving bodies 20, 25, and the lower heat receiving body 30, it is not limited to this, For example, A single-layer structure or a two-layer structure may be used.
The water supply port 31 and the drain port 32 may be reversed so that the cooling water is supplied from the drain port 32 and the cooling water is discharged from the water supply port 31. Even in this case, since the flow path configuration is the same, the pressure loss and the heat dissipation performance are not affected, so that the degree of freedom in device design is improved.
In the first and second embodiments described above, the device for radiating the heat from the LD array 40 is exemplified, but the present invention can also be applied to a device for radiating heat from other heating elements.
Moreover, in Embodiment 1 and 2 mentioned above, although cooling water was used as a refrigerant | coolant, you may use liquids and gas other than water as a refrigerant | coolant.

It is sectional drawing of the thermal radiation apparatus which concerns on Embodiment 1 of this invention. (A) is an AA arrow view in FIG. 1, (b) is a BB arrow view in FIG. 1, (c) is a CC arrow view in FIG. It is sectional drawing of the thermal radiation apparatus which concerns on Embodiment 2 of this invention. (A) is an AA arrow view in FIG. 3, (b) is a BB arrow view in FIG. 3, (c) is a cross-sectional view of the intermediate heat receiving body, (d) in FIG. CC line arrow figure, the figure (e) is DD line arrow figure in Figure 3 It is sectional drawing of the conventional heat radiator. (A) is an AA arrow view in FIG. 5, (b) is a BB arrow view in FIG. 5, (c) is a CC arrow view in FIG.

Explanation of symbols

10 Upper heat receiving body 20, 25 Middle heat receiving body 21 Circular communication hole 22 Circular communication hole 22a Partition wall 23 First recess 24 Second recess 30 Lower heat receiving body 31 Water supply port 32 Drain port 33 Lower surface water channel 34 Channel 35 Radiation fin 36 Cooling water discharge unit 40 LD array

Claims (5)

In a heat dissipation device that includes a heat receiving body that is in contact with the heat generating body and a flow path formed in the heat receiving body, and radiates heat of the heat generating body by flowing a refrigerant through the flow path.
The heat dissipation device, wherein the flow path is formed so that all portions of the flow path do not intersect with other portions of the flow path. The flow path is
A refrigerant introduction part joined to a refrigerant introduction port for introducing the refrigerant;
A refrigerant discharge part joined to a refrigerant outlet for discharging the refrigerant;
A flow rate increasing portion for increasing the flow rate of the refrigerant;
A first water channel portion provided between the refrigerant introduction portion and the flow velocity increase portion;
The heat radiating device according to claim 1, further comprising: a second water channel portion provided between the refrigerant discharge portion and the flow velocity increasing portion.   The cross-sectional area of the refrigerant inlet and the cross-sectional area of the refrigerant inlet are substantially equal, and the cross-sectional area of the refrigerant outlet and the cross-sectional area of the refrigerant outlet are substantially equal. The heat dissipation device described. The heat receiving body is configured by sequentially laminating and joining a first heat receiving body, a second heat receiving body, and a third heat receiving body,
The first flow path portion is formed between the first heat receiving body and the second heat receiving body, and
The heat radiating device according to any one of claims 1 to 3, wherein the second flow path portion is formed between the second heat receiving body and the third heat receiving body.   The second heat receiving body includes the second flow path portion and the refrigerant between the third heat receiving body and the portion forming the first flow path portion and the refrigerant introducing portion with the first heat receiving body. The heat radiating device according to claim 4, wherein a recess is formed in at least one of a portion forming the discharge portion.

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