US9986661B2 - Water cooling heat radiation device and module thereof - Google Patents

Water cooling heat radiation device and module thereof Download PDF

Info

Publication number
US9986661B2
US9986661B2 US15/275,495 US201615275495A US9986661B2 US 9986661 B2 US9986661 B2 US 9986661B2 US 201615275495 A US201615275495 A US 201615275495A US 9986661 B2 US9986661 B2 US 9986661B2
Authority
US
United States
Prior art keywords
water
body structure
water cooling
heat radiation
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US15/275,495
Other versions
US20180092245A1 (en
Inventor
Jung-Yi CHIU
Fu-Kuei Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US15/275,495 priority Critical patent/US9986661B2/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, FU-KUEI, CHIU, JUNG-YI
Publication of US20180092245A1 publication Critical patent/US20180092245A1/en
Application granted granted Critical
Publication of US9986661B2 publication Critical patent/US9986661B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/10—Particular pattern of flow of the heat exchange media
    • F28F2250/102—Particular pattern of flow of the heat exchange media with change of flow direction

Definitions

  • the present invention relates to a water cooling heat radiation device and module thereof, and more specifically, to a water cooling heat radiation device and module thereof that is composed of a plurality of stacked laminations to form a flow passage to provide improved heat dissipation efficiency.
  • the functions of the currently available electronic devices have been improved. To perform these functions well, the computation performance of electronic devices has been largely upgraded, so is the temperature in the electronic elements.
  • the currently available heat dissipation module can remove heat generated by the electronic elements by a heat spreader, a vapor chamber, a heat pipe, or any combinations thereof, also a cooling fan is applied. However, the heat can be removed from the electronic elements by the heat dissipation module in the electronic devices, but it cannot be dissipated out of the electronic devices. Therefore, water cooling heat radiation module is used to dissipate the heat in the electronic devices.
  • the water cooling heat radiation module includes a water cooling head and a water cooling heat dissipation structure.
  • a circulation passage is provided between the water cooling head and the water cooling heat dissipation structure to connect the water cooling head and the water cooling heat dissipation structure via pipes, such that a cooling water can be circulated.
  • the water cooling head has a heat exchange surface, which is in contact with the electronic elements to transfer the heat. The heat is transferred to the cooling water by the heat exchange surface and taken away, and then the cooling water carries the heat out of the water cooling head and flows into the water cooling heat radiation structure. The heated cooling water is flowed back and forth by an operation of the water pump of the water cooling head to cool down the electronic elements. Still, the water cooling head must have compact volume to meet the restricted space in the electronic devices. It is therefore tried by the inventor to develop an improved water cooling heat radiation device and module thereof to overcome the drawbacks and problems in the conventional water cooling heat radiation device.
  • the conventional water cooling heat radiation structure has a plurality of hollow flat pipes, each of which has two ends, respectively, connected to water reservoirs.
  • a plurality of heat radiation fins is disposed among the hollow flat pipes, which are flexible and correspondingly connected to outer side of the flat tubes at junctions therebetween by welding.
  • the two water reservoirs are also connected to the connected flexible heat radiation fins and the flat tubes by welding to form the water cooling heat radiation structure.
  • a primary object of the present invention is to provide a water cooling heat radiation device that has a cooling fluid which provides improved heat dissipation efficiency.
  • Another object of the present invention is to provide a water cooling radiation module that has largely reduced volume.
  • the water cooling heat radiation device includes a body structure, a top and a bottom sheet body, and a water pump.
  • the body structure is composed of a stacked plurality of laminations, and each the lamination has a plurality of radial spaced extended portions and at least one spiral raised portion.
  • the radial extended portions are radially connected to the spiral raised portion.
  • the laminations are stacked to one another to form the body structure, such that the stacked radial extended portions the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage.
  • the spiral flow passage has a water inlet and a water outlet, respectively, provided on two ends thereof.
  • the top sheet body is correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and has a water inlet part, in which a water inlet is located, whereas the bottom sheet body is correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure.
  • the water pump is located in the water inlet part and has a plurality of fan blades.
  • the water cooling heat radiation module includes a water cooling heat radiation device, a water cooling head, and a first and a second pipe.
  • the water cooling heat radiation device includes a body structure, a top and a bottom sheet body, and a water pump.
  • the body structure is composed of a plurality of stacked laminations, and each the lamination has a plurality of radial spaced extended portions and at least one spiral raised portion.
  • the radial extended portions are radially connected to the spiral raised portion.
  • the laminations are stacked to one another to form the body structure, such that the stacked radial extended portions the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage.
  • the spiral flow passage has a water inlet and a water outlet, respectively, provided on two ends thereof.
  • the top sheet body is correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and has a water inlet part, in which a water inlet is located, whereas the bottom sheet body is correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure.
  • the water pump is located in the water inlet part and has a plurality of fan blades.
  • the water cooling head has a housing, which has at least one water reservoir, a heat exchange surface, a water inlet, and a water outlet.
  • the water inlet and the water outlet is connected to the water reservoir, and the heat exchange surface is located on one side of the housing and connected to the water reservoir.
  • a first pipe has a first and a second end, which is connected to the water inlet of the water cooling head and the water outlet of the body structure of the water cooling heat radiation device, respectively
  • a second pipe has a third and a fourth end, which is connected to the water outlet of the water cooling head and the water inlet of the body structure of the water cooling heat radiation device, respectively.
  • the water cooling heat radiation device not only can provide improved cooling effect, but also can have complicated flow passage via the stacked laminations, so as to have cooling fluid that can have enhanced cooling efficiency.
  • the water cooling heat radiation device after the water cooling heat radiation device is combined with the water pump, the water cooling heat radiation device can have largely reduced volume, and the water cooling head further can be detachably assembled to one another in use.
  • FIG. 1 is an exploded perspective view of a water cooling heat radiation device according to a first embodiment of the present invention
  • FIG. 1 a is a partially enlarged view of the circled area in FIG. 1 ;
  • FIG. 2 is an assembled perspective view of FIG. 1 ;
  • FIG. 3 is a top view of the water cooling heat radiation device according to a second embodiment of the present invention.
  • FIG. 4 is a top view of the water cooling heat radiation device according to a third embodiment of the present invention.
  • FIG. 5 shows the working manner of the water cooling heat radiation device according to the preferred embodiment of the present invention.
  • FIG. 6 is an exploded perspective view of a water cooling heat radiation module included in the water cooling heat radiation device.
  • FIG. 7 is an assembled perspective view of FIG. 6 .
  • FIGS. 1 and 2 are exploded and assembled perspective views, respectively, of a water cooling heat radiation device 1 according to a first embodiment of the present invention
  • FIG. 1 a which is a partially enlarged view of the circled area in FIG. 1
  • the present invention is also briefly referred to as the water cooling device and generally denoted by reference numeral 1 .
  • the water cooling heat radiation device 1 includes a body structure 11 , a top and a bottom sheet body 12 , 13 , and a water pump 14 .
  • the body structure 11 is composed of a plurality of stacked laminations 111 , and each the lamination 111 has a plurality of radial spaced extended portions 1111 and at least one spiral raised portion 1112 .
  • the radial extended portions 1111 are radially connected to the spiral raised portion 1112 .
  • the laminations 111 are stacked to one another to form the body structure 11 , such that the stacked radial extended portions 1111 the stacked spiral raised portion 1112 respectively form a plurality of radiation fins 11 a and a spiral flow passage 11 b .
  • the spiral flow passage 11 b has a water inlet 11 e and a water outlet 11 d , respectively, provided on two ends thereof.
  • the top sheet body 12 is correspondingly located above the body structure 11 to secure a top side of the spiral flow passage 11 b of the body structure 11 and has a water inlet part 11 c , in which the water inlet 11 e is located, whereas the bottom sheet body 13 is correspondingly located below the body structure 11 to secure a bottom side of the spiral flow passage 11 b of the body structure 11 .
  • the water pump is located in the water inlet 11 of the water inlet part 11 c and has a plurality of fan blades 141 .
  • the top sheet body 12 has a first spiral secured portion 121 located correspondingly to secure the top side of the spiral flow passage 11 b of the body structure 11 , and the first spiral secured portion 121 is connected to a plurality of top radial extended portions 122 .
  • the top radial extended portions 122 of the top sheet body 12 are correspondingly stacked and connected to the radial extended portions 1111 of the body structure 11 .
  • the bottom sheet body 13 has a second spiral secured portion 131 located correspondingly to secure the bottom side of the spiral flow passage 11 b of the body structure 11 , and the second spiral secured portion 131 is connected to a plurality of bottom radial extended portions 132 .
  • the bottom radial extended portions 132 of the bottom sheet body 13 are correspondingly stacked and connected to the radial extended portions 1111 of the body structure 11 .
  • FIG. 3 is a top view of the water cooling device 1 according to a second embodiment of the present invention.
  • the second embodiment of the water cooling device 1 is generally structurally similar to the first embodiment except that, in this second embodiment, the radiation fins 11 a can have different or the same lengths.
  • FIG. 4 is a top view of the water cooling device 1 according to a third embodiment of the present invention.
  • the third embodiment of the water cooling device 1 is generally structurally similar to the first embodiment except that, in this third embodiment, the radiation fins 11 a can have, for example but not limited to, different or the same thicknesses.
  • FIG. 5 shows the working manner of the water cooling device 1 according to the preferred embodiment of the present invention.
  • the water inlet part 11 c is ranged eccentrically, such that the cooling fluid 2 is directed into the water inlet part 11 c via the water inlet 11 e , and then the cooling fluid 2 is outwardly flowed from a center of the spiral flow passage 11 b by an operation of the water pump 14 . After that, the cooling fluid 2 is flowed out of the body structure 11 from the water outlet 11 d , located on the outmost portion of the spiral flow passage 11 b , of the body structure 11 .
  • FIGS. band 7 are exploded and assembled perspective views, respectively, of a water cooling heat radiation module 3 included in the water cooling device 1 .
  • the water cooling heat radiation module 3 according to the present invention includes a water cooling heat radiation device 1 , a water cooling head 31 , and a first and a second pipe 32 , 33 .
  • the water cooling device 1 included in the water cooling heat radiation module 3 is generally structurally similar to the water cooling device 1 in the first, the second, and the third embodiments.
  • the body structure 11 is connected to the water cooling head 31 via the first and the second pipe 32 , 33 .
  • the water cooling head 31 has a housing 311 , which has at least one water reservoir 312 , a heat exchange surface 313 , a water inlet 314 , and a water outlet 315 .
  • the water inlet and the water outlet 314 , 315 are connected to the water reservoir 312 .
  • the heat exchange surface 313 is located on one side of the housing 311 and connected to the water reservoir 312 .
  • the first pipe 32 has a first and a second end 321 , 322 , which is connected to the water inlet 314 of the water cooling head 31 and the water outlet 11 d of the body structure 11 of the water cooling device 1 , respectively.
  • the second pipe 33 n has a third and a fourth end 331 , 332 , which is connected to the water outlet 315 of the water cooling head 31 and the water inlet 11 e of the body structure 11 of the water cooling device 1 , respectively.
  • the water cooling device 1 further includes a cooling fan 4 located on one side thereof.
  • the cooling fan 4 is located corresponding to the water cooling device 1 to forcedly cool down the heat generated by the heat source, so as to have greatly improved heat dissipation efficiency.
  • the water cooling head 31 When the water cooling heat radiation module 3 is in operation, the water cooling head 31 is in contact with at least one heat source (not shown) and absorbs heat generated by the heat source. The heat is transferred to the cooling fluid 2 by the heat exchange surface 313 and taken away, then the cooling fluid 2 carries the heat out of the water cooling head 31 via the water outlet 31 and flows into the water cooling device 1 via the second pipe 33 . The heated cooling fluid 2 is then flowed into the water inlet part 11 c from the water inlet 11 c of the water cooling device 1 . Then the heated cooling fluid 2 is flowed in a direction of the spiral flow passage 11 b by the operation of the water pump 14 from the water inlet part 11 c , and further flowed outwardly from the center of the spiral flow passage 11 .
  • the heat then is transferred to the water cooling device 1 when the heated cooling fluid 2 stays in the spiral flow passage 11 b , and the cooling device 1 and the heated cooling fluid 2 is, respectively, forcedly cooled down by the cooling fan 4 , such that the cooling fluid 2 is flowed out of the water cooling device 1 via the water outlet 11 d and further into the water cooling head 31 via the water inlet 31 of the water cooling head 31 to complete the whole heat dissipation circulation.
  • the water cooling device 1 not only can provide improved cooling effect, but also can have complicated flow passage via the stacked laminations 111 , so as to have cooling fluid that can have enhanced cooling efficiency, as well as have radiation fins that is hard to be break down by an external force.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A water cooling heat radiation device and module thereof includes a body structure, composed of a plurality of laminations, a top and a bottom sheet body, and a water pump. Each the lamination has a plurality of radial extended portions and a spiral raised portion. The laminations are stacked to form the body structure, such that the radial extended portions and the spiral raised portions form a plurality of radiation fins and a spiral flow passage, respectively. The spiral flow passage has a water inlet in a water inlet part, and a water outlet, respectively, provided on two ends thereof. The top and the bottom sheet body correspondingly secure a top and a bottom side of the spiral flow passage of the body structure. The water pump is located in the water inlet part, and forms a water cooling heat radiation module with a first and a second pipe.

Description

FIELD OF THE INVENTION
The present invention relates to a water cooling heat radiation device and module thereof, and more specifically, to a water cooling heat radiation device and module thereof that is composed of a plurality of stacked laminations to form a flow passage to provide improved heat dissipation efficiency.
BACKGROUND OF THE INVENTION
The functions of the currently available electronic devices have been improved. To perform these functions well, the computation performance of electronic devices has been largely upgraded, so is the temperature in the electronic elements. The currently available heat dissipation module can remove heat generated by the electronic elements by a heat spreader, a vapor chamber, a heat pipe, or any combinations thereof, also a cooling fan is applied. However, the heat can be removed from the electronic elements by the heat dissipation module in the electronic devices, but it cannot be dissipated out of the electronic devices. Therefore, water cooling heat radiation module is used to dissipate the heat in the electronic devices. The water cooling heat radiation module includes a water cooling head and a water cooling heat dissipation structure. Also, a circulation passage is provided between the water cooling head and the water cooling heat dissipation structure to connect the water cooling head and the water cooling heat dissipation structure via pipes, such that a cooling water can be circulated. The water cooling head has a heat exchange surface, which is in contact with the electronic elements to transfer the heat. The heat is transferred to the cooling water by the heat exchange surface and taken away, and then the cooling water carries the heat out of the water cooling head and flows into the water cooling heat radiation structure. The heated cooling water is flowed back and forth by an operation of the water pump of the water cooling head to cool down the electronic elements. Still, the water cooling head must have compact volume to meet the restricted space in the electronic devices. It is therefore tried by the inventor to develop an improved water cooling heat radiation device and module thereof to overcome the drawbacks and problems in the conventional water cooling heat radiation device.
Furthermore, there are multiple-complicated passages must be arranged in the water cooling heat radiation structure to enhance heat dissipation efficiency. However, the conventional water cooling heat radiation structure has a plurality of hollow flat pipes, each of which has two ends, respectively, connected to water reservoirs. A plurality of heat radiation fins is disposed among the hollow flat pipes, which are flexible and correspondingly connected to outer side of the flat tubes at junctions therebetween by welding. The two water reservoirs are also connected to the connected flexible heat radiation fins and the flat tubes by welding to form the water cooling heat radiation structure. It is clear that the conventional water cooling heat radiation structure has no complicated passage to effectively dissipate the heat generated by the electronic elements and the heat radiation fins can be easily damaged to cause a malfunction of the water cooling heat radiation structure.
SUMMARY OF THE INVENTION
To solve the above and other problems, a primary object of the present invention is to provide a water cooling heat radiation device that has a cooling fluid which provides improved heat dissipation efficiency.
Another object of the present invention is to provide a water cooling radiation module that has largely reduced volume.
To achieve the above and other objects, the water cooling heat radiation device according to the present invention includes a body structure, a top and a bottom sheet body, and a water pump.
The body structure is composed of a stacked plurality of laminations, and each the lamination has a plurality of radial spaced extended portions and at least one spiral raised portion. The radial extended portions are radially connected to the spiral raised portion. The laminations are stacked to one another to form the body structure, such that the stacked radial extended portions the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage. The spiral flow passage has a water inlet and a water outlet, respectively, provided on two ends thereof. The top sheet body is correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and has a water inlet part, in which a water inlet is located, whereas the bottom sheet body is correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure. The water pump is located in the water inlet part and has a plurality of fan blades.
The water cooling heat radiation module according to the present invention includes a water cooling heat radiation device, a water cooling head, and a first and a second pipe.
The water cooling heat radiation device includes a body structure, a top and a bottom sheet body, and a water pump.
The body structure is composed of a plurality of stacked laminations, and each the lamination has a plurality of radial spaced extended portions and at least one spiral raised portion. The radial extended portions are radially connected to the spiral raised portion. The laminations are stacked to one another to form the body structure, such that the stacked radial extended portions the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage. The spiral flow passage has a water inlet and a water outlet, respectively, provided on two ends thereof. The top sheet body is correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and has a water inlet part, in which a water inlet is located, whereas the bottom sheet body is correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure. The water pump is located in the water inlet part and has a plurality of fan blades.
The water cooling head has a housing, which has at least one water reservoir, a heat exchange surface, a water inlet, and a water outlet. The water inlet and the water outlet is connected to the water reservoir, and the heat exchange surface is located on one side of the housing and connected to the water reservoir. a first pipe has a first and a second end, which is connected to the water inlet of the water cooling head and the water outlet of the body structure of the water cooling heat radiation device, respectively, whereas a second pipe has a third and a fourth end, which is connected to the water outlet of the water cooling head and the water inlet of the body structure of the water cooling heat radiation device, respectively.
With these arrangements, the water cooling heat radiation device not only can provide improved cooling effect, but also can have complicated flow passage via the stacked laminations, so as to have cooling fluid that can have enhanced cooling efficiency.
Moreover, after the water cooling heat radiation device is combined with the water pump, the water cooling heat radiation device can have largely reduced volume, and the water cooling head further can be detachably assembled to one another in use.
BRIEF DESCRIPTION OF THE DRAWINGS
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
FIG. 1 is an exploded perspective view of a water cooling heat radiation device according to a first embodiment of the present invention;
FIG. 1a is a partially enlarged view of the circled area in FIG. 1;
FIG. 2 is an assembled perspective view of FIG. 1;
FIG. 3 is a top view of the water cooling heat radiation device according to a second embodiment of the present invention;
FIG. 4 is a top view of the water cooling heat radiation device according to a third embodiment of the present invention;
FIG. 5 shows the working manner of the water cooling heat radiation device according to the preferred embodiment of the present invention.
FIG. 6 is an exploded perspective view of a water cooling heat radiation module included in the water cooling heat radiation device; and
FIG. 7 is an assembled perspective view of FIG. 6.
 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will now be described with some preferred embodiments thereof and by referring to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to FIGS. 1 and 2, which are exploded and assembled perspective views, respectively, of a water cooling heat radiation device 1 according to a first embodiment of the present invention, and FIG. 1a , which is a partially enlarged view of the circled area in FIG. 1. For the purpose of conciseness, the present invention is also briefly referred to as the water cooling device and generally denoted by reference numeral 1. As shown, the water cooling heat radiation device 1 includes a body structure 11, a top and a bottom sheet body 12, 13, and a water pump 14.
The body structure 11 is composed of a plurality of stacked laminations 111, and each the lamination 111 has a plurality of radial spaced extended portions 1111 and at least one spiral raised portion 1112. The radial extended portions 1111 are radially connected to the spiral raised portion 1112. The laminations 111 are stacked to one another to form the body structure 11, such that the stacked radial extended portions 1111 the stacked spiral raised portion 1112 respectively form a plurality of radiation fins 11 a and a spiral flow passage 11 b. The spiral flow passage 11 b has a water inlet 11 e and a water outlet 11 d, respectively, provided on two ends thereof.
The top sheet body 12 is correspondingly located above the body structure 11 to secure a top side of the spiral flow passage 11 b of the body structure 11 and has a water inlet part 11 c, in which the water inlet 11 e is located, whereas the bottom sheet body 13 is correspondingly located below the body structure 11 to secure a bottom side of the spiral flow passage 11 b of the body structure 11. The water pump is located in the water inlet 11 of the water inlet part 11 c and has a plurality of fan blades 141.
The top sheet body 12 has a first spiral secured portion 121 located correspondingly to secure the top side of the spiral flow passage 11 b of the body structure 11, and the first spiral secured portion 121 is connected to a plurality of top radial extended portions 122. The top radial extended portions 122 of the top sheet body 12 are correspondingly stacked and connected to the radial extended portions 1111 of the body structure 11.
The bottom sheet body 13 has a second spiral secured portion 131 located correspondingly to secure the bottom side of the spiral flow passage 11 b of the body structure 11, and the second spiral secured portion 131 is connected to a plurality of bottom radial extended portions 132. The bottom radial extended portions 132 of the bottom sheet body 13 are correspondingly stacked and connected to the radial extended portions 1111 of the body structure 11.
Please refer to FIG. 3, which is a top view of the water cooling device 1 according to a second embodiment of the present invention. The second embodiment of the water cooling device 1 is generally structurally similar to the first embodiment except that, in this second embodiment, the radiation fins 11 a can have different or the same lengths.
Please refer to FIG. 4, which is a top view of the water cooling device 1 according to a third embodiment of the present invention. The third embodiment of the water cooling device 1 is generally structurally similar to the first embodiment except that, in this third embodiment, the radiation fins 11 a can have, for example but not limited to, different or the same thicknesses.
Please refer to FIG. 5, which shows the working manner of the water cooling device 1 according to the preferred embodiment of the present invention. As shown, the water inlet part 11 c is ranged eccentrically, such that the cooling fluid 2 is directed into the water inlet part 11 c via the water inlet 11 e, and then the cooling fluid 2 is outwardly flowed from a center of the spiral flow passage 11 b by an operation of the water pump 14. After that, the cooling fluid 2 is flowed out of the body structure 11 from the water outlet 11 d, located on the outmost portion of the spiral flow passage 11 b, of the body structure 11.
Please refer to FIGS. band 7, which are exploded and assembled perspective views, respectively, of a water cooling heat radiation module 3 included in the water cooling device 1. The water cooling heat radiation module 3 according to the present invention includes a water cooling heat radiation device 1, a water cooling head 31, and a first and a second pipe 32, 33.
Please refer to FIGS. 1 to 5 again. The water cooling device 1 included in the water cooling heat radiation module 3 is generally structurally similar to the water cooling device 1 in the first, the second, and the third embodiments. The body structure 11 is connected to the water cooling head 31 via the first and the second pipe 32, 33. The water cooling head 31 has a housing 311, which has at least one water reservoir 312, a heat exchange surface 313, a water inlet 314, and a water outlet 315. The water inlet and the water outlet 314, 315 are connected to the water reservoir 312. The heat exchange surface 313 is located on one side of the housing 311 and connected to the water reservoir 312.
The first pipe 32 has a first and a second end 321, 322, which is connected to the water inlet 314 of the water cooling head 31 and the water outlet 11 d of the body structure 11 of the water cooling device 1, respectively.
The second pipe 33 n has a third and a fourth end 331, 332, which is connected to the water outlet 315 of the water cooling head 31 and the water inlet 11 e of the body structure 11 of the water cooling device 1, respectively.
The water cooling device 1 further includes a cooling fan 4 located on one side thereof. The cooling fan 4 is located corresponding to the water cooling device 1 to forcedly cool down the heat generated by the heat source, so as to have greatly improved heat dissipation efficiency.
When the water cooling heat radiation module 3 is in operation, the water cooling head 31 is in contact with at least one heat source (not shown) and absorbs heat generated by the heat source. The heat is transferred to the cooling fluid 2 by the heat exchange surface 313 and taken away, then the cooling fluid 2 carries the heat out of the water cooling head 31 via the water outlet 31 and flows into the water cooling device 1 via the second pipe 33. The heated cooling fluid 2 is then flowed into the water inlet part 11 c from the water inlet 11 c of the water cooling device 1. Then the heated cooling fluid 2 is flowed in a direction of the spiral flow passage 11 b by the operation of the water pump 14 from the water inlet part 11 c, and further flowed outwardly from the center of the spiral flow passage 11. The heat then is transferred to the water cooling device 1 when the heated cooling fluid 2 stays in the spiral flow passage 11 b, and the cooling device 1 and the heated cooling fluid 2 is, respectively, forcedly cooled down by the cooling fan 4, such that the cooling fluid 2 is flowed out of the water cooling device 1 via the water outlet 11 d and further into the water cooling head 31 via the water inlet 31 of the water cooling head 31 to complete the whole heat dissipation circulation.
With these arrangements, the water cooling device 1 not only can provide improved cooling effect, but also can have complicated flow passage via the stacked laminations 111, so as to have cooling fluid that can have enhanced cooling efficiency, as well as have radiation fins that is hard to be break down by an external force.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (7)

What is claimed is:
1. A water cooling heat radiation device, comprising:
a body structure, which is composed of a plurality of laminations; each the lamination having a plurality of radial spaced extended portions and at least one spiral raised portion; the radial extended portions radially connected to the spiral raised portion; the laminations being stacked to one another to form the body structure, such that the stacked radial extended portions and the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage, which having a water inlet and a water outlet, respectively, provided on two ends thereof;
a top sheet body being correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and having a water inlet part, in which a water inlet being located;
a bottom sheet body being correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure; and
a water pump being located in the water inlet part and having a plurality of fan blades.
2. The water cooling heat radiation device as claimed in claim 1, wherein the top sheet body has a first spiral secured portion located correspondingly to secure the top side of the spiral flow passage of the body structure; the first spiral secured portion being connected to a plurality of top radial extended portions;
and the top radial extended portions of the top sheet body being correspondingly connected to the radial extended portions of the body structure.
3. The water cooling heat radiation device as claimed in claim 1, wherein the bottom sheet body has a second spiral secured portion located correspondingly to secure the bottom side of the spiral flow passage of the body structure; the second spiral secured portion being connected to a plurality of bottom radial extended portions; and the bottom radial extended portions of the bottom sheet body being correspondingly connected to the radial extended portions of the body structure.
4. The water cooling heat radiation device as claimed in claim 1, wherein the radiation fins can have different or the same lengths.
5. The water cooling heat radiation device as claimed in claim 1, wherein the radiation fins can have different or the same thicknesses.
6. A water cooling heat radiation module, comprising:
a water cooling heat radiation device comprising:
a body structure, which is composed of a plurality of laminations; each the lamination having a plurality of radial spaced extended portions and at least one spiral raised portion; the radial extended portions radially connected to the spiral raised portion; the laminations being stacked to one another to form the body structure, such that the stacked radial extended portions and the stacked spiral raised portion respectively form a plurality of radiation fins and a spiral flow passage, which having a water inlet and a water outlet, respectively, provided on two ends thereof;
a top sheet body being correspondingly located above the body structure to secure a top side of the spiral flow passage of the body structure and having a water inlet part, in which a water inlet being located;
a bottom sheet body being correspondingly located below the body structure to secure a bottom side of the spiral flow passage of the body structure; and
a water pump being located in the water inlet part and having a plurality of fan blades;
a water cooling head having a housing, which having at least one water reservoir, a heat exchange surface, a water inlet, and a water outlet; the water inlet and the water outlet being connected to the water reservoir; and the heat exchange surface being located on one side of the housing and connected to the water reservoir;
a first pipe having a first and a second end, which being connected to the water inlet of the water cooling head and the water outlet of the body structure of the water cooling heat radiation device, respectively; and
a second pipe having a third and a fourth end, which being connected to the water outlet of the water cooling head and the water inlet of the body structure of the water cooling heat radiation device, respectively.
7. The water cooling heat radiation module as claimed in claim 6, further comprising a cooling fan, which being located on one side of the water cooling heat radiation device.
US15/275,495 2016-09-26 2016-09-26 Water cooling heat radiation device and module thereof Active 2036-12-09 US9986661B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/275,495 US9986661B2 (en) 2016-09-26 2016-09-26 Water cooling heat radiation device and module thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/275,495 US9986661B2 (en) 2016-09-26 2016-09-26 Water cooling heat radiation device and module thereof

Publications (2)

Publication Number Publication Date
US20180092245A1 US20180092245A1 (en) 2018-03-29
US9986661B2 true US9986661B2 (en) 2018-05-29

Family

ID=61686000

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/275,495 Active 2036-12-09 US9986661B2 (en) 2016-09-26 2016-09-26 Water cooling heat radiation device and module thereof

Country Status (1)

Country Link
US (1) US9986661B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI748683B (en) * 2020-10-12 2021-12-01 技嘉科技股份有限公司 Heat dissipation module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114828467B (en) * 2021-01-29 2024-04-26 讯凯国际股份有限公司 Computer device, shell and water-cooling heat dissipation device

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1916768A (en) * 1932-09-09 1933-07-04 John G Carruthers Heat exchanger
US3631923A (en) * 1968-06-28 1972-01-04 Hisaka Works Ltd Plate-type condenser having condensed-liquid-collecting means
US5186238A (en) * 1991-04-25 1993-02-16 International Business Machines Corporation Liquid film interface cooling chuck for semiconductor wafer processing
US5343936A (en) * 1989-11-17 1994-09-06 Long Manufacturing Ltd. Spiral ripple circumferential flow heat exchanger
US20020144809A1 (en) * 2001-04-09 2002-10-10 Siu Wing Ming Laminated heat transfer device and method of producing thereof
US20020195231A1 (en) * 2001-04-09 2002-12-26 Siu Wing Ming Laminated heat transfer device and method of producing thereof
US6575231B1 (en) * 2002-08-27 2003-06-10 Chun-Chih Wu Spiral step-shaped heat dissipating module
US20030164231A1 (en) * 2001-09-28 2003-09-04 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US7073569B1 (en) * 2005-04-07 2006-07-11 Delphi Technologies, Inc. Cooling assembly with spirally wound fin
TWM446869U (en) * 2012-09-20 2013-02-11 Cooling House Co Ltd Laminated heat dissipating device
KR20140055418A (en) * 2012-10-31 2014-05-09 코웨이 주식회사 Cooling device and cold water storage of water treatment apparatus
JP3208823U (en) * 2016-11-07 2017-02-23 奇▲こう▼科技股▲ふん▼有限公司 Cooling water radiator and its water cooling module
CN206525066U (en) * 2016-09-08 2017-09-26 奇鋐科技股份有限公司 Cooling water drainage device and its water cooling module

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1916768A (en) * 1932-09-09 1933-07-04 John G Carruthers Heat exchanger
US3631923A (en) * 1968-06-28 1972-01-04 Hisaka Works Ltd Plate-type condenser having condensed-liquid-collecting means
US5343936A (en) * 1989-11-17 1994-09-06 Long Manufacturing Ltd. Spiral ripple circumferential flow heat exchanger
US5186238A (en) * 1991-04-25 1993-02-16 International Business Machines Corporation Liquid film interface cooling chuck for semiconductor wafer processing
US20020144809A1 (en) * 2001-04-09 2002-10-10 Siu Wing Ming Laminated heat transfer device and method of producing thereof
US20020195231A1 (en) * 2001-04-09 2002-12-26 Siu Wing Ming Laminated heat transfer device and method of producing thereof
US20030164231A1 (en) * 2001-09-28 2003-09-04 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6575231B1 (en) * 2002-08-27 2003-06-10 Chun-Chih Wu Spiral step-shaped heat dissipating module
US7073569B1 (en) * 2005-04-07 2006-07-11 Delphi Technologies, Inc. Cooling assembly with spirally wound fin
TWM446869U (en) * 2012-09-20 2013-02-11 Cooling House Co Ltd Laminated heat dissipating device
KR20140055418A (en) * 2012-10-31 2014-05-09 코웨이 주식회사 Cooling device and cold water storage of water treatment apparatus
CN206525066U (en) * 2016-09-08 2017-09-26 奇鋐科技股份有限公司 Cooling water drainage device and its water cooling module
JP3208823U (en) * 2016-11-07 2017-02-23 奇▲こう▼科技股▲ふん▼有限公司 Cooling water radiator and its water cooling module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI748683B (en) * 2020-10-12 2021-12-01 技嘉科技股份有限公司 Heat dissipation module

Also Published As

Publication number Publication date
US20180092245A1 (en) 2018-03-29

Similar Documents

Publication Publication Date Title
US9818671B2 (en) Liquid-cooled heat sink for electronic devices
US20140069614A1 (en) Heat dissipaion device and thermal module using same
JP4234722B2 (en) Cooling device and electronic equipment
JP4551261B2 (en) Cooling jacket
JP4532422B2 (en) Heat sink with centrifugal fan
US9151544B2 (en) Liquid-cooling heat exchange module
US20120152500A1 (en) Flow passage structure for water-cooling device
US10921067B2 (en) Water-cooling radiator structure with internal partition member
US10004159B2 (en) Water-cooling radiator unit and device thereof
US9689627B2 (en) Water-cooling device with waterproof stator and rotor pumping unit
US20070039716A1 (en) Heat dissipating unit
JP4891617B2 (en) Water-cooled heat sink
US10378836B2 (en) Water-cooling radiator assembly
US9986661B2 (en) Water cooling heat radiation device and module thereof
TWM493087U (en) Closed circulation heat dissipation module
US10907910B2 (en) Vapor-liquid phase fluid heat transfer module
US7669642B1 (en) Thermal module
US20200359529A1 (en) Water cooling heat dissipation structure
US20080078529A1 (en) Cooling of the power components of a frequency converter
US20110192572A1 (en) Heat exchanger
JP2009099995A (en) Refrigerator and electronic apparatus
JP2009295869A (en) Cooling device of electronic apparatus
TWI619918B (en) Cooling water drain device and water cooling module thereof
US20190215987A1 (en) Water-cooling radiator structure
KR200319226Y1 (en) Heat-radiate device for heat-pipe having fan-shape heat-pin

Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHIU, JUNG-YI;CHANG, FU-KUEI;REEL/FRAME:039850/0649

Effective date: 20160926

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4