JP2007184349A - Water-cooled heat sink - Google Patents

Water-cooled heat sink Download PDF

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JP2007184349A
JP2007184349A JP2006000505A JP2006000505A JP2007184349A JP 2007184349 A JP2007184349 A JP 2007184349A JP 2006000505 A JP2006000505 A JP 2006000505A JP 2006000505 A JP2006000505 A JP 2006000505A JP 2007184349 A JP2007184349 A JP 2007184349A
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cooling water
flow path
heat sink
tank
water flow
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JP4891617B2 (en
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Satoru Sakuma
哲 佐久間
Toshiyuki Horiuchi
俊行 堀内
Hiromi Ota
博巳 太田
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T Rad Co Ltd
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T Rad Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a water-cooled heat sink for equalizing surface temperature of a heat receiving plate. <P>SOLUTION: The water-cooled heat sink 11 is constituted to cool a heat generating material mounted to the heat receiving plate 13 of a tank 12 with cooling water that is circulating within the tank 12 of the flat shape. The heat sink is formed in a structure that a separating member 18 is provided along the heat receiving plate to which a heat generating material is closely attached. In addition, cooling water channels 19, 20 are formed in the shape of layers to assure that the cooling water may be circulated going forward and backward with the separating member 18. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ノート型パソコンのＣＰＵ等の発熱体を冷却水によって冷却するための水冷式ヒートシンクに関する。   The present invention relates to a water-cooled heat sink for cooling a heating element such as a CPU of a notebook computer with cooling water.

従来、ノート型パソコンのＣＰＵ（Central
Processing Unit）から発生した熱を放出させるため、ＣＰＵに空冷式ヒートシンクを取付けるのが一般的であったが、近年におけるパソコンの性能の向上に伴い、ＣＰＵからの発熱量が増大するに連れて、空冷式ヒートシンクではＣＰＵを十分に冷却することができなくなってきている。そこで、最近では、空冷式ヒートシンクより放熱量の大きい水冷式ヒートシンクを採用し、ＣＰＵを冷却することが行われるようになっている。 Conventional notebook computer CPU (Central
In order to release the heat generated from the Processing Unit), it was common to attach an air-cooled heat sink to the CPU. However, as the amount of heat generated from the CPU increases as the performance of personal computers has improved in recent years, An air-cooled heat sink cannot cool the CPU sufficiently. Therefore, recently, a water-cooled heat sink having a larger heat release than the air-cooled heat sink has been adopted to cool the CPU.

図６に示すように、この種の従来の水冷式ヒートシンク１には、扁平形状のタンク２が設けられている。このタンク２は、板状の受熱板３と、受熱板３に固着された盆状のタンク本体４とから構成され、受熱板３にはノート型パソコンのＣＰＵ５が密着して設置されるようになっている。また、タンク２の内部にはインナーフィン６が挿入され、タンク本体４の両端部には、タンク２の内部に連通するように、冷却水入口７及び冷却水出口８がそれぞれ接続されている。   As shown in FIG. 6, this type of conventional water-cooled heat sink 1 is provided with a flat tank 2. The tank 2 is composed of a plate-shaped heat receiving plate 3 and a tray-shaped tank body 4 fixed to the heat receiving plate 3, and a CPU 5 of a notebook personal computer is installed in close contact with the heat receiving plate 3. It has become. Inner fins 6 are inserted inside the tank 2, and a cooling water inlet 7 and a cooling water outlet 8 are connected to both ends of the tank body 4 so as to communicate with the inside of the tank 2.

そして、冷却水入口７からタンク２の内部に流入した冷却水は、受熱板３を介してＣＰＵ５から発生した熱を吸収してＣＰＵ５を冷却した後、冷却水出口８から外部に流出する（例えば、特許文献１参照）。
特開２００５−１２３２６０号公報 The cooling water flowing into the tank 2 from the cooling water inlet 7 absorbs heat generated from the CPU 5 via the heat receiving plate 3 to cool the CPU 5 and then flows out from the cooling water outlet 8 to the outside (for example, , See Patent Document 1).
JP-A-2005-123260

しかしながら、上記した従来の水冷式ヒートシンク１では、タンク２内の冷却水温度が冷却水入口７付近から冷却水出口８付近に向かって次第に高くなるため、受熱板３の表面温度は、冷却水出口８側（図６のＨ点）で最も高くなり、全体的に不均一となる。一方、ヒートシンクでは、通常、受熱板３の表面温度が最も高くなる部分の温度が所定温度以下となるように、冷却水の流量や温度を設定する必要がある。したがって、上記した従来のヒートシンク１のように、受熱板３の表面温度が不均一となる場合には、冷却水の流量や温度を効率良く設定することできないため、ヒートシンクの経済性を高めることが難しいといった問題があった。   However, in the conventional water-cooled heat sink 1 described above, the cooling water temperature in the tank 2 gradually increases from the vicinity of the cooling water inlet 7 to the vicinity of the cooling water outlet 8, so that the surface temperature of the heat receiving plate 3 is reduced to the cooling water outlet. It becomes the highest on the 8 side (point H in FIG. 6), and becomes uneven as a whole. On the other hand, in the heat sink, it is usually necessary to set the flow rate and temperature of the cooling water so that the temperature of the portion where the surface temperature of the heat receiving plate 3 is the highest is not more than a predetermined temperature. Therefore, when the surface temperature of the heat receiving plate 3 is not uniform as in the conventional heat sink 1 described above, the flow rate and temperature of the cooling water cannot be set efficiently, so that the economical efficiency of the heat sink can be improved. There was a problem that was difficult.

本発明は、上記した課題を解決すべくなされたものであり、受熱板の表面温度の均一化を図り、効率的で経済性の高い水冷式ヒートシンクを提供することを目的とするものである。   The present invention has been made to solve the above-described problems, and has an object to provide a water-cooled heat sink that is efficient and highly economical by making the surface temperature of the heat receiving plate uniform.

上記目的を達成するため、本発明は、扁平形状を成すタンクの内部を流通する冷却水により、該タンクの外面に取り付けられた発熱体を冷却するように構成された水冷式ヒートシンクであって、前記タンクの内部には、前記発熱体が密着された外面に沿うように仕切り部材が設けられ、該仕切り部材により冷却水が折り返しながら流通可能な冷却水流路が層状に形成されていることを特徴とする。   In order to achieve the above object, the present invention is a water-cooled heat sink configured to cool a heating element attached to the outer surface of a tank with cooling water flowing through the inside of a flat tank. A partition member is provided inside the tank so as to extend along an outer surface to which the heating element is closely attached, and a cooling water flow path through which the cooling water can flow while being folded is formed in a layered manner by the partition member. And

そして、前記仕切り部材は板状部材により形成されており、前記冷却水流路は前記発熱体側から順に第１冷却水流路と第２冷却水流路が２層に形成されており、前記第１冷却水流路に連通するように冷却水入口が設けられていると共に、前記第２冷却水流路に連通するように冷却水出口が設けられていてもよい。   The partition member is formed by a plate-like member, and the cooling water flow path is formed in two layers in order from the heating element side, the first cooling water flow path and the second cooling water flow path, and the first cooling water flow A cooling water inlet may be provided so as to communicate with the path, and a cooling water outlet may be provided so as to communicate with the second cooling water flow path.

また、前記仕切り部材はコルゲートフィンにより形成されており、前記冷却水流路は前記発熱体側から順に第１冷却水流路と第２冷却水流路が２層に形成されており、前記第１冷却水流路に連通するように冷却水入口が設けられていると共に、前記第２冷却水流路に連通するように冷却水出口が設けられていてもよい。   The partition member is formed of a corrugated fin, and the cooling water flow path is formed in two layers, a first cooling water flow path and a second cooling water flow path, in order from the heating element side, and the first cooling water flow path A cooling water inlet may be provided to communicate with the second cooling water flow path, and a cooling water outlet may be provided to communicate with the second cooling water flow path.

本発明によれば、タンクの内部に冷却水が折り返しながら流通可能な冷却水流路が層状に形成されているため、タンクの内部の仕切り部材や冷却水の温度が平均化され、発熱体が密着されるタンクの外面の表面温度が均一化される。したがって、タンクに供給する冷却水の流量や温度を効率良く経済的に設定することできるため、ヒートシンクの効率や経済性の向上を図ることができる。   According to the present invention, since the cooling water flow path through which the cooling water can circulate is formed in a layered manner inside the tank, the temperature of the partition member and the cooling water inside the tank is averaged, and the heating element adheres closely The surface temperature of the outer surface of the tank to be made is made uniform. Accordingly, since the flow rate and temperature of the cooling water supplied to the tank can be set efficiently and economically, the efficiency and economic efficiency of the heat sink can be improved.

以下、図面を参照しつつ、本発明の実施の形態について説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

先ず、図１及び図２を参照しつつ、本発明の第１の実施の形態に係る水冷式ヒートシンクについて説明する。ここで、図１は本実施の形態に係る水冷式ヒートシンクを示す断面図、図２はＡ−Ａ矢視図である。   First, a water-cooled heat sink according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a cross-sectional view showing a water-cooled heat sink according to the present embodiment, and FIG.

本実施の形態に係る水冷式ヒートシンク１１には、アルミニウム製で扁平形状を成すタンク１２が設けられており、このタンク１２は、ノート型パソコンのＣＰＵ等の発熱体（図示省略）が密着可能なように矩形板状に形成された受熱板１３に、プレス加工により盆状に形成されたタンク本体１４を固着することにより形成されている。そして、タンク本体１４の受熱板１３に対向する面１５の一端部側には、冷却水入口１６、冷却水出口１７がそれぞれ接続されており、冷却水入口１６は冷却水出口１７より外側に配置されている。   The water-cooled heat sink 11 according to the present embodiment is provided with a tank 12 made of aluminum and having a flat shape. The tank 12 can be in close contact with a heating element (not shown) such as a CPU of a notebook computer. In this way, the tank body 14 formed in a tray shape is fixed to the heat receiving plate 13 formed in a rectangular plate shape by pressing. A cooling water inlet 16 and a cooling water outlet 17 are connected to one end side of the surface 15 of the tank body 14 facing the heat receiving plate 13, and the cooling water inlet 16 is disposed outside the cooling water outlet 17. Has been.

タンク１２の内部には、受熱板１３と受熱板１３に対向する面１５との間において、受熱板１３と受熱板１３に対向する面１５にそれぞれ平行を成すように、アルミニウム製の仕切り板１８が取り付けられている。この仕切り板１８により、前記タンク１２の内部には、前記発熱体側から順に第１冷却水流路１９と第２冷却水流路２０が２層に形成されている。また、仕切り板１８の一端部には、受熱板１３に対向する面１５の冷却水入口１６と冷却水出口１７との間に掛けて、閉塞板２１が取り付けられており、この閉塞板２１により、仕切り板１８と受熱板１３に対向する面１５との間の隙間が閉塞されるようになっている。これに対して、仕切り板１８の他端部は、タンク本体１４から離間して設けられている。   Inside the tank 12, an aluminum partition plate 18 is formed between the heat receiving plate 13 and the surface 15 facing the heat receiving plate 13 so as to be parallel to the heat receiving plate 13 and the surface 15 facing the heat receiving plate 13, respectively. Is attached. Due to the partition plate 18, a first cooling water channel 19 and a second cooling water channel 20 are formed in two layers in the tank 12 in order from the heating element side. In addition, a closing plate 21 is attached to one end of the partition plate 18 between the cooling water inlet 16 and the cooling water outlet 17 of the surface 15 facing the heat receiving plate 13. The gap between the partition plate 18 and the surface 15 facing the heat receiving plate 13 is closed. In contrast, the other end of the partition plate 18 is provided away from the tank body 14.

このようにタンク１２の内部に仕切り板１８及び閉塞板２１が設置されることにより、冷却水入口１６が第１冷却水流路１９に連通すると共に、冷却水出口１７が第２冷却水流路２０に連通し、タンク１２の内部には、第１冷却水流路１９から第２冷却水流路２０に折り返す冷却水流通路が形成されるようになっている。   Thus, by installing the partition plate 18 and the blocking plate 21 inside the tank 12, the cooling water inlet 16 communicates with the first cooling water channel 19, and the cooling water outlet 17 communicates with the second cooling water channel 20. In communication, a cooling water flow passage is formed in the tank 12 so as to be folded back from the first cooling water passage 19 to the second cooling water passage 20.

このような構成を備えた水冷式ヒートシンク１１において、冷却水入口１６からタンク１２の内部に流入した冷却水は、先ず、第１冷却水流路１９を流通し、受熱板１３を介して前記ＣＰＵから発生した熱を吸収しながら、第２冷却水流路２０に折り返す。その後、冷却水は第２冷却水流路２０を流通し、さらに、受熱板１３からタンク本体１４に伝熱した熱等を吸収した後、冷却水出口１７を通って外部に流出する。この間、冷却水温度は、第１冷却水流路１９では冷却水入口１６から離れるに従って次第に高くなるが、冷却水が第１冷却水流路１９から第２冷却水流路２０に折り返すようになっているため、第２冷却水流路ではその反対に冷却水出口１７に向かうに連れて高くなる。したがって、タンク１２の内部の仕切り板１８及び冷却水の温度は平均化され、受熱板１３の表面温度は均一化される。   In the water-cooled heat sink 11 having such a configuration, the cooling water that has flowed into the tank 12 from the cooling water inlet 16 first circulates through the first cooling water flow path 19 and from the CPU via the heat receiving plate 13. While absorbing the generated heat, the second cooling water flow path 20 is folded back. Thereafter, the cooling water flows through the second cooling water channel 20 and further absorbs heat transferred from the heat receiving plate 13 to the tank body 14 and then flows out through the cooling water outlet 17. During this time, the cooling water temperature gradually increases as the distance from the cooling water inlet 16 increases in the first cooling water flow path 19, but the cooling water is turned from the first cooling water flow path 19 to the second cooling water flow path 20. On the other hand, in the second cooling water flow path, it becomes higher toward the cooling water outlet 17. Accordingly, the temperatures of the partition plate 18 and the cooling water inside the tank 12 are averaged, and the surface temperature of the heat receiving plate 13 is made uniform.

次に、図３〜図５を参照しつつ、本発明の第２の実施の形態に係る水冷式ヒートシンクについて説明する。ここで、図３は本実施の形態に係る水冷式ヒートシンクを示す断面図、図４はＡ−Ａ矢視図、図５はＢ−Ｂ矢視図である。なお、以下の説明では、説明の簡略化のため、上記した第１の実施の形態と同様の構成については、図３〜図５中、図１及び図２と同一の符号を付し、それらの構成に関する詳細な説明は省略する。   Next, a water-cooled heat sink according to a second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 3 is a cross-sectional view showing the water-cooled heat sink according to the present embodiment, FIG. 4 is an AA arrow view, and FIG. 5 is a BB arrow view. In the following description, for simplification of description, the same reference numerals as those in FIGS. 1 and 2 are given to the same configurations as those in the first embodiment described above, in FIGS. A detailed description of the configuration will be omitted.

本実施の形態に係る水冷式ヒートシンク３１では、上記した第１の実施の形態における仕切り板１８の代わりに、タンク１２の内部に挿入されたインナーフィン３２を利用している。また、冷却水出口１７は、タンク本体１４に突設されたチャンバ３８を介して接続されている。   In the water-cooled heat sink 31 according to the present embodiment, inner fins 32 inserted into the tank 12 are used instead of the partition plate 18 in the first embodiment described above. The cooling water outlet 17 is connected via a chamber 38 protruding from the tank body 14.

このインナーフィン３２は、アルミニウム製のコルゲートフィンであり、タンク１２の内部の高さに整合した高さに形成されていると共に、その両端部とタンク本体１４との間にそれぞれ空間３３，３４が形成されるように配置されており、その一端部は冷却水入口１６と冷却水出口１７との間に位置している。そして、このインナーフィン３２により、前記タンク１２の内部には、前記発熱体側から順に第１冷却水流路３５と第２冷却水流路３６が２層に形成されている。また、インナーフィン３２の一端部から、受熱板１３に対向する面１５の冷却水入口１６と冷却水出口１７との間に掛けて、櫛歯状の閉塞板３７が取り付けられており、この閉塞板３７により、インナーフィン３２と受熱板１３に対向する面１５との間の隙間が閉塞されるようになっている。   The inner fins 32 are aluminum corrugated fins, and are formed at a height matching the internal height of the tank 12, and spaces 33 and 34 are provided between both ends of the tank 12 and the tank body 14, respectively. The one end part is located between the cooling water inlet 16 and the cooling water outlet 17. The inner fin 32 forms a first cooling water passage 35 and a second cooling water passage 36 in two layers in the tank 12 in order from the heating element side. Further, a comb-like blocking plate 37 is attached from one end of the inner fin 32 between the cooling water inlet 16 and the cooling water outlet 17 of the surface 15 facing the heat receiving plate 13. The plate 37 closes the gap between the inner fin 32 and the surface 15 facing the heat receiving plate 13.

このようにタンク１２の内部にインナーフィン３２及び閉塞板３７が設置されることにより、冷却水入口１６が第１冷却水流路３５に連通すると共に、冷却水出口１７が第２冷却水流路３６に連通し、タンク１２の内部には、第１冷却水流路３５から第２冷却水流路３６に折り返す冷却水流通路が形成されるようになっている。   Thus, by installing the inner fin 32 and the blocking plate 37 inside the tank 12, the cooling water inlet 16 communicates with the first cooling water channel 35, and the cooling water outlet 17 communicates with the second cooling water channel 36. In communication, a cooling water flow passage is formed in the tank 12 so as to be folded back from the first cooling water passage 35 to the second cooling water passage 36.

このような構成を備えた水冷式ヒートシンク３１において、冷却水入口１６からタンク１２の内部に流入した冷却水は、先ず、第１冷却水流路３５を流通し、受熱板１３を介して前記ＣＰＵから発生した熱を吸収しながら、第２冷却水流路３６に折り返す。その後、冷却水は第２冷却水流路３６を流通し、さらに、受熱板１３からタンク本体１４に伝熱した熱等を吸収した後、冷却水出口１７を通って外部に流出する。この間、冷却水温度は、第１冷却水流路３５では冷却水入口１６から離れるに従って次第に高くなるが、冷却水が第１冷却水流路３５から第２冷却水流路３６に折り返すようになっているため、第２冷却水流路ではその反対に冷却水出口１７に向かうに連れて高くなる。したがって、タンク１２の内部のインナーフィン３２及び冷却水の温度は平均化され、受熱板１３の表面温度は均一化される。   In the water-cooled heat sink 31 having such a configuration, the cooling water that has flowed into the tank 12 from the cooling water inlet 16 first circulates through the first cooling water flow path 35 and from the CPU via the heat receiving plate 13. While absorbing the generated heat, the second cooling water flow path 36 is folded back. Thereafter, the cooling water flows through the second cooling water flow path 36, further absorbs heat transferred from the heat receiving plate 13 to the tank body 14, and then flows out through the cooling water outlet 17. During this time, the cooling water temperature gradually increases as the distance from the cooling water inlet 16 increases in the first cooling water flow path 35, but the cooling water is turned back from the first cooling water flow path 35 to the second cooling water flow path 36. On the other hand, in the second cooling water flow path, it becomes higher toward the cooling water outlet 17. Therefore, the temperatures of the inner fins 32 and the cooling water inside the tank 12 are averaged, and the surface temperature of the heat receiving plate 13 is made uniform.

なお、上記各実施の形態においては、タンク１２の内部に層状に冷却水流路を形成させるための仕切り部材として、仕切り板１８やインナーフィン３２を設けたが、これらは単なる例示に過ぎず、他の部材を使用することも可能である。   In each of the above-described embodiments, the partition plate 18 and the inner fin 32 are provided as partition members for forming the cooling water flow path in layers inside the tank 12, but these are merely examples, and other It is also possible to use these members.

また、この仕切り部材を複数段に渡って設け、タンク１２の内部に３層以上の冷却水流路を形成させることもできる。   Further, the partition member may be provided in a plurality of stages, and three or more cooling water flow paths may be formed inside the tank 12.

さらに、本発明の水冷式ヒートシンク１１，３１により冷却される発熱体としては、上記したノート型パソコンのＣＰＵの他、サイリスタや電力用コンデンサ等であってもよい。   Further, the heating element cooled by the water-cooled heat sinks 11 and 31 of the present invention may be a thyristor, a power capacitor, or the like, in addition to the CPU of the notebook personal computer described above.

本発明の第１の実施の形態に係る水冷式ヒートシンクを示す断面図である。It is sectional drawing which shows the water cooling type heat sink which concerns on the 1st Embodiment of this invention. 図１のＡ−Ａ矢視図である。It is an AA arrow line view of FIG. 本発明の第２の実施の形態に係る水冷式ヒートシンクを示す断面図である。It is sectional drawing which shows the water cooling type heat sink which concerns on the 2nd Embodiment of this invention. 図３のＡ−Ａ矢視図である。It is an AA arrow line view of FIG. 図３のＢ−Ｂ矢視図である。It is a BB arrow line view of FIG. 従来例を示す断面図である。It is sectional drawing which shows a prior art example.

符号の説明Explanation of symbols

１１ 水冷式ヒートシンク
１２ タンク
１６ 冷却水入口
１７ 冷却水出口
１８ 仕切り板
１９ 第１冷却水流路
２０ 第２冷却水流路
３１ 水冷式ヒートシンク
３２ インナーフィン
３５ 第１冷却水流路
３６ 第２冷却水流路 DESCRIPTION OF SYMBOLS 11 Water cooling type heat sink 12 Tank 16 Cooling water inlet 17 Cooling water outlet 18 Partition plate 19 1st cooling water flow path 20 2nd cooling water flow path 31 Water cooling type heat sink 32 Inner fin 35 1st cooling water flow path 36 2nd cooling water flow path

Claims (3)

扁平形状を成すタンクの内部を流通する冷却水により、該タンクの外面に取り付けられた発熱体を冷却するように構成された水冷式ヒートシンクであって、
前記タンクの内部には、前記発熱体が密着された外面に沿うように仕切り部材が設けられ、該仕切り部材により冷却水が折り返しながら流通可能な冷却水流路が層状に形成されていることを特徴とする水冷式ヒートシンク。 A water-cooled heat sink configured to cool a heating element attached to the outer surface of the tank with cooling water flowing through the inside of a flat tank,
A partition member is provided inside the tank so as to be along an outer surface to which the heating element is closely attached, and a cooling water flow path through which the cooling water can flow while being folded is formed in a layered manner by the partition member. A water-cooled heat sink. 前記仕切り部材は板状部材により形成されており、前記冷却水流路は前記発熱体側から順に第１冷却水流路と第２冷却水流路が２層に形成されており、前記第１冷却水流路に連通するように冷却水入口が設けられていると共に、前記第２冷却水流路に連通するように冷却水出口が設けられている請求項１に記載の水冷式ヒートシンク。 The partition member is formed of a plate-like member, and the cooling water flow path is formed in two layers in order from the heating element side, the first cooling water flow path and the second cooling water flow path, and the first cooling water flow path The cooling water heat sink according to claim 1, wherein a cooling water inlet is provided so as to communicate with each other, and a cooling water outlet is provided so as to communicate with the second cooling water flow path. 前記仕切り部材はコルゲートフィンにより形成されており、前記冷却水流路は前記発熱体側から順に第１冷却水流路と第２冷却水流路が２層に形成されており、前記第１冷却水流路に連通するように冷却水入口が設けられていると共に、前記第２冷却水流路に連通するように冷却水出口が設けられている請求項１に記載の水冷式ヒートシンク。
The partition member is formed by a corrugated fin, and the cooling water flow path is formed in two layers in order from the heating element side, the first cooling water flow path and the second cooling water flow path, and communicates with the first cooling water flow path. The water-cooled heat sink according to claim 1, wherein a cooling water inlet is provided so that a cooling water outlet is provided so as to communicate with the second cooling water flow path.
JP2006000505A 2006-01-05 2006-01-05 Water-cooled heat sink Expired - Fee Related JP4891617B2 (en)

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JP2012060040A (en) * 2010-09-13 2012-03-22 Showa Denko Kk Cooler
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KR102581027B1 (en) 2021-12-28 2023-09-21 숙명여자대학교산학협력단 Anti-freeze type cold water production apparatus

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