JP2007103633A - Cooling device and electronic apparatus including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably improve a gas-liquid separating and cooling function together with miniaturization concerning a cooling device used for cooling, etc., by using the circulation of a liquid refrigerant. <P>SOLUTION: The cooling device includes a heat-receiving integrated pump 2 incorporating a pump for driving liquid circulation, which contacts with a heat generating electronic component so as to exchange heat with the liquid refrigerant flowing inside; two liquid transport routes 3, 4 for connecting the heat-receiving integrated pump 2 to a radiator 6; and a hermetically sealed reservation tank 5 for gas-liquid separation. One end of the core tube of the radiator 6 is arranged at one side of the reservation tank 5 and connected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cooling device used when cooling a heat-generating electronic component such as a central processing unit (hereinafter referred to as a CPU) disposed inside a casing of an electronic device by utilizing circulation of a liquid refrigerant, and The present invention relates to an electronic device provided with the same.

  Recently, the speed of data processing in computers has been very rapid, and the clock frequency of the CPU has become much larger than before. As a result, the amount of heat generated by the CPU increases, so that not only the conventional method of dissipating heat by bringing a heat sink or heat radiating fins into contact with the heat generator, but also a method of directly cooling the heat sink with a fan, In a heat sink module thermally connected to a radiator using a pipe, the radiator is cooled by a fan. Further, liquid refrigerant with high thermal conductivity is forced to circulate using a pump, and heat is generated between the receiver and the radiator. A liquid cooling system for replacement is indispensable, and further improvement in cooling capacity and miniaturization are required in the future.

  Therefore, as a configuration in which the cooling device as described above is attached to a substrate on which a heat generating electronic component such as a CPU is mounted, for example, a heat generating electronic component disclosed in (Patent Document 1) and a radiator for heat dissipation have a flexible structure. A cooling device that is thermally connected by a heat transport device having a liquid transport path is known.

  FIG. 10 shows an embodiment shown in (Patent Document 1), in which a keyboard 102 is mounted on an upper surface of a first casing 101 of an electronic device, and a heat generating electronic component such as a CPU is provided in the first casing 101. 103 is mounted on a substrate 104 of an electronic circuit, and a display device 106 for displaying a processing result by the CPU is disposed in a second casing 105 of the electronic device, and a heat receiver 107 is in close contact with the heat generating electronic component 103 and the heat generating electron. The heat of the component 103 is received, heat is exchanged with the liquid refrigerant flowing inside the component 103 to cool the heat generating electronic component 103, and the pump 108 is a pump for circulating the liquid refrigerant in the cooling device.

  The heat receiver 107 is made of a metal material having good thermal conductivity such as a metal such as aluminum or copper, or an alloy thereof, and the pump 108 is a Wesco-type pump (not shown). A ring-shaped impeller provided with a rotor magnet on the inner periphery, and a motor stator provided on the inner periphery side of the rotor magnet, driven by energizing the motor stator, and having a suction port and a discharge port The ring-shaped impeller is accommodated in the pump casing.

  In the pump casing, a cylindrical portion is disposed between the motor stator and the rotor magnet, and a ring-shaped impeller is rotatably supported on the cylindrical portion.

  Since the pump 108 is small and flat and thin, the cooling device can be made smaller and thinner.

  As shown in FIG. 10, the heat receiver 107 and the pump 108 are separated and connected by the connection pipe 112c. However, the bottom surface of the pump casing of the above-mentioned Wesco type pump is flattened to provide a heat receiving function. It is also possible to use a heat receiving integrated pump having a configuration that has both a function and a heat receiving function, and this heat receiving integrated pump can be directly mounted on a heat generating electronic component 103 such as a CPU.

  In this case, the pump casing needs to be made of a metal having a high thermal conductivity such as aluminum or copper. However, since the pump bottom is flat, it can be placed on a CPU or the like. Thereby, sufficient heat transfer can be performed.

  The radiator 109 is disposed on the back surface of the display device 106 and exchanges heat with the liquid refrigerant to dissipate the heat into the air. The blower fan 110 blows air to the radiator 109, and the blower fan 110 has three directions. A rectangular exhaust port is provided on one side, and an air passage wall (not shown) is provided on one side surface to smoothly flow the air inside the blower fan 110.

  The reserve tank 111 is disposed adjacent to the blower fan 110, and connection pipes 112a to 112d connect these elements. Since the radiator 109 needs to remove the heat from the liquid refrigerant in a relatively narrow space on the back surface of the display device 106, the U-shaped radiating pipe 113 is provided with a wider surface area as shown in FIG. In addition, a large number of heat dissipating fins made of aluminum or copper are installed.

  Further, the connection between the heat radiating pipe 113 and the heat radiating fin is tightly adhered because it is necessary to maintain good heat conduction from the heat radiating pipe 113 to the heat radiating fin.

  With the above configuration, since the blower fan 110 can also be made small and flat, the entire cooling device can be made small and thin.

  On the other hand, the use of the present invention is greatly different from that of the present invention, but as a configuration of a radiator device attached to an engine of a hydraulic pump that drives a construction machine such as a hydraulic shovel, for example, a radiator as disclosed in (Patent Document 2) In addition, there is also known a radiator device in which the number of parts is reduced as a simple configuration by integrally configuring the reserve tank.

  FIG. 11 shows an embodiment shown in (Patent Document 2). A radiator device 200 includes an upper tank 201, a lower tank 202, and a radiator core section 203. The radiator core section 203 is a fin (not shown). And a core tube (not shown) made up of a large number of thin tubes arranged so as to penetrate through the fins.

  However, the reserve tank 204 is provided integrally with the upper tank 201, and the upper tank 205 is formed by the upper tank 201 and the reserve tank 204.

  The upper tank 205 has an upper tank 201 on the lower side and a reserve tank 204 on the upper side, and a partition wall 206 is provided for partitioning the upper tank 201 and the reserve tank 204.

  The partition 206 has a low height at both ends in the longitudinal direction, but a high middle portion. An inflow pipe 207 is connected to an intermediate portion of the upper tank 201. An overflow cylinder (not shown) is provided above the connection position of the inflow pipe 207, and a pressure cap 208 is provided at the upper end of the cylinder.

  The pressure cap 208 is for applying a predetermined set pressure to the entire liquid circulation path including a liquid refrigerant such as a mixed liquid of water and ethylene glycol including the upper tank 201. In addition, a thin communication pipe 209 is provided between the position immediately below the pressure cap 208 in the cylindrical portion and the lower portion of the reserve tank 204.

  Further, an air communication pipe 210 is provided on the upper surface of the reserve tank 204 to prevent the internal pressure from fluctuating when the liquid level in the reserve tank 204 moves up and down, and to substantially keep the inside at atmospheric pressure. Further, an outflow pipe 211 is connected to the lower tank 202.

  By providing the reserve tank 204, when the liquid refrigerant expands thermally, the expanded liquid refrigerant flows into the reserve tank 204 via the communication pipe 209, and conversely, when the temperature of the liquid refrigerant decreases, the reserve tank The liquid refrigerant circulates from 204 to the upper tank 201 through the communication pipe 209.

  In addition, the lower tank 201 and the upper reserve tank 204 constitute an upper tank 205 formed of an integral casing, and the number of parts can be reduced.

  In order to more efficiently perform heat exchange by the radiator device 200, the cooling air is surely passed through the radiator core portion 203 by surrounding the blower fan 212 with the shroud 213.

  Furthermore, as disclosed in (Patent Document 3), a configuration of a reserve tank corresponding to a cooling device mounted on a portable electronic device such as a notebook PC is also known.

  FIG. 12A is a perspective view for explaining the outline of a reserve tank connected by a tube in the liquid circulation path of the cooling device. Inside the reserve tank 300, there are a liquid refrigerant region 301, a gas region 302, and its There is a liquid surface 303 that is a boundary, and a cap 304 is attached to close the inlet when the liquid refrigerant is replenished.

  Further, a liquid inlet 307 to which a radiator tube (not shown) is connected is provided on the right side 306 when viewed from the front 305, and a liquid outlet pipe 310 having a liquid outlet 309 is provided on the left side 308. . Here, the flow direction of the liquid refrigerant is the direction from the liquid inlet 307 to the liquid outlet 309 as indicated by an arrow 311, and the liquid outlet pipe 310 having the liquid outlet 309 is the center of the reserve tank 300. It extends to.

  With the above configuration, even when the electronic device on which the reserve tank 300 is mounted is moved in any direction, the liquid outlet 309 becomes the liquid level 303 or less and air is sucked into the liquid outlet 309. I try not to.

  And in (patent document 4), in addition to the content mentioned above, as an improvement not to suck | inhale air at the liquid outlet 309 of the reserve tank 300, an uneven | corrugated | grooved part is provided in the inner wall surface near the liquid outlet 309. The structure which provided is disclosed.

  FIG. 12B is a perspective view for explaining the outline of the reserve tank 300. An uneven surface 312 is provided on the inner wall surface near the liquid outlet 309 extending to the center of the reserve tank 300. The liquid refrigerant region 301 raises the liquid surface 303 by the action of the surface tension of the part 312, further increases the flow velocity near the liquid outlet 309, raises the pressure, keeps the air away, and permeates the wall surface. The amount of evaporation of the liquid refrigerant is also suppressed.

With the above-described configuration, a highly reliable cooling device is provided without air being sucked from the liquid outlet 309.
Japanese Patent Laying-Open No. 2005-26498 (page 11, FIG. 1) JP 2001-153490 A (page 5, FIG. 3) Japanese Unexamined Patent Publication No. 2003-78271 (page 7, FIG. 2) Japanese Patent Laying-Open No. 2003-304086 (5th page, FIG. 2)

  However, in the conventional cooling device described in (Patent Document 1), the heat receiver 107 is installed on the surface of the heat generating electronic component 103 such as a CPU, and other elements constituting the cooling device, such as the radiator 109, the reserve, etc. Since the tank 111 and the pump 108 are connected in series by the connection pipes 112a to 112d and are separately disposed in the electronic device casing, it is easy to reduce the thickness of the electronic device casing, but the electronic device of the cooling device The mounting work to the housing is complicated, and the volume occupied by the cooling device itself is very large.

  In addition, since the length of the liquid transport path that interconnects each component is inevitably increased, the amount of water evaporation, which is a liquid refrigerant due to long-term use, also increases, and a larger reserve tank must be provided to supplement this. As a result, the overall size of the cooling device and the length of the liquid transport path are increased, leading to an increase in the resistance of the liquid circulation path to the pump and a decrease in the flow rate, leading to a decrease in cooling performance. It was.

  Furthermore, in order to enhance the heat dissipation, even when the metal fins constituting the radiator 109 are forcibly cooled by the blower fan 110, a space for securing the blower fan 110 in the electronic device casing is required. Therefore, when the cooling device is mounted in the electronic device casing, further complication of components and a decrease in cooling performance associated therewith are also problems.

  On the other hand, in (Patent Document 2), the upper tank 201 constituting a part of the liquid circulation path and the mere storage reserve tank 204 are partitioned by a partition wall 206, so that the structure of the upper side tank 205 is complicated. It has a structure.

  Furthermore, since the atmosphere communication pipe 210 opened to the atmosphere is connected so as to maintain an atmospheric pressure state inside the reserve tank 204 and obtain an effective storage function, the reserve tank 204 is provided on the upper part of the upper tank 201, In addition, the installation direction of the radiator device 200 needs to be fixed in one direction with respect to the direction of gravity so that the liquid refrigerant does not leak to the outside.

  That is, not only the structure of the upper tank 205 is a complicated double structure, but also the installation direction of the radiator device 200 is restricted with respect to the direction of gravity. In addition, there is a problem that it is difficult to apply to an electronic device used in any installation direction of horizontal installation.

  Further, in (Patent Document 3) and (Patent Document 4), similarly to (Patent Document 1), the reserve tank 300 includes other elements constituting the cooling device such as a radiator, a heat receiver, and a pump in series by a tube. Are connected to each other and are separately arranged in the electronic device casing, so it is easy to reduce the thickness of the electronic device casing, but the mounting work of the cooling device on the electronic device casing is complicated, and the cooling device itself The volume occupied by was very large.

  In addition, since the length of the liquid transport path that interconnects each component is inevitably increased, the amount of water evaporation, which is a liquid refrigerant due to long-term use, also increases, and a larger reserve tank must be provided to supplement this. As a result, the overall size of the cooling device and the length of the liquid transport path are increased, which increases the flow resistance of the liquid circulation path to the pump and decreases the flow rate. It was connected.

  The present invention solves such a conventional problem, and the sealed reserve tank for gas-liquid separation has a simple structure integrated with the radiator and constitutes a part of the liquid circulation path. It is no longer necessary to provide a separate reserve tank, which was required for conventional cooling devices, and it is easy to reduce the size, and the radiator is moved to one side of the reserve tank, so that an air passage to the radiator can be secured. Heat dissipation performance can be improved.

  Furthermore, since the reserve tank is hermetically sealed, it can be easily applied to highly portable electronic devices, or electronic devices that are used in either the vertical or horizontal installation direction.

  Moreover, when a liquid outflow pipe is provided at a predetermined position using a large reserve tank having an internal volume sufficient to accommodate the air mixed in the liquid circulation path, a stable gas-liquid separation function can also be obtained. Good liquid circulation operation can be secured.

  In order to achieve the above object, the present invention provides a radiator having a plurality of core tubes that circulates liquid refrigerant and removes heat from heat-generating electronic components mounted on a substrate by heat exchange with the liquid refrigerant. A cooling device that dissipates heat, a heat receiver for exchanging heat with the liquid refrigerant flowing in contact with the heat-generating electronic components, a liquid transport path that is connected to the heat receiver and connects between the heat receiver and the radiator, A pump that circulates and drives liquid refrigerant from the heat receiver through the liquid transport path toward the radiator, and a sealed reserve tank for gas-liquid separation in which one end of the core tube of the radiator is connected to one side, The liquid outlet of the liquid outflow pipe of the reserve tank was arranged at the approximate center in the reserve tank.

  According to the cooling device of the present invention, it is not necessary to provide a separate reserve storage tank that is required in the conventional cooling device, and the size can be easily reduced, and the radiator is brought close to one side of the reserve tank and connected. Therefore, the air path to the radiator can be secured and the heat radiation performance can be improved.

  According to the first aspect of the present invention, a radiator having a plurality of core tubes that circulates a liquid refrigerant and removes heat from the heat-generating electronic component mounted on the substrate by heat exchange with the liquid refrigerant. A cooling device that dissipates heat at a heat receiving device for exchanging heat with a liquid refrigerant that is in contact with heat-generating electronic components and flowing inside, and a liquid transport path that is connected to the heat receiving device and connects between the heat receiving device and the radiator And a pump that circulates and drives the liquid refrigerant from the heat receiver through the liquid transport path toward the radiator, and a sealed reserve tank for gas-liquid separation in which one end of the core tube of the radiator is connected to one side. Since the liquid outlet of the liquid outlet pipe of the reserve tank is arranged at the approximate center in the reserve tank, the sealed reserve tank for gas-liquid separation has a simple structure integrated with the radiator and the liquid circulation path It is possible to reduce the size by eliminating the need for a separate reserve storage tank, which is part of the conventional cooling system, and the radiator can be moved to one side of the reserve tank to secure the air path to the radiator. Heat dissipation performance can be improved.

  In addition, since the liquid outlet of the liquid outflow pipe of the reserve tank is arranged in the approximate center of the reserve tank, the cooling device is mounted on a relatively portable electronic device such as a desktop personal computer or PC server. Even when a part of the housing is temporarily tilted due to relocation, maintenance, repair, etc. in the office and the liquid level of the liquid refrigerant in the reserve tank is tilted, the liquid outlet of the liquid outflow pipe of the reserve tank is liquid. Therefore, it is possible to prevent the air on the liquid surface from entering the liquid circulation path such as a pump and a liquid transport path from the liquid outlet and lowering the cooling capacity.

  Furthermore, since the reserve tank is hermetically sealed, there is an effect that it can be easily applied to highly portable electronic devices or electronic devices that are used in either the vertical or horizontal installation direction.

  Moreover, when a liquid outflow pipe is provided at a predetermined position using a large reserve tank having an internal volume sufficient to accommodate the air mixed in the liquid circulation path, a stable gas-liquid separation function can also be obtained. Good liquid circulation operation can be secured.

  According to the invention described in claim 2 of the present invention, the heat receiver is a heat receiving integrated pump with a built-in pump, so there is no need to separately provide the pump separately in the liquid circulation path. In addition to facilitating mounting work on heat-generating electronic components, the liquid circulation path length is further shortened, which reduces the flow resistance of the liquid circulation path to the pump and improves the cooling performance by increasing the flow rate. be able to.

  Further, since the liquid circulation path length of the entire liquid is shortened, moisture evaporation of the liquid refrigerant can be suppressed, and accordingly, the internal capacity of the reserve tank can be reduced and the entire cooling device can be downsized.

  According to the invention described in claim 3 of the present invention, since there are only two liquid transport paths, at least 3 to 4 liquid transport paths are required in the conventional cooling device, and the liquid circulation path becomes two. Since the length is shortened, the flow resistance of the liquid circulation path with respect to the pump is reduced, and the cooling performance can be improved by increasing the flow rate.

  Further, since the liquid circulation path length of the entire liquid is shortened, moisture evaporation of the liquid refrigerant can be suppressed, and accordingly, the internal capacity of the reserve tank can be reduced and the entire cooling device can be downsized.

  According to the invention described in claim 4 of the present invention, the reserve tank is arranged on the upper side in the direction of gravity with respect to the radiator, so even if there is a minute amount of air in the liquid circulation path, the buoyancy is utilized. It becomes easy to collect in the reserve tank, a more stable gas-liquid separation function is obtained, and good liquid circulation operation can be secured.

  According to the invention of claim 5 of the present invention, the notch is formed on the liquid bottom side of the liquid outlet of the liquid outlet pipe of the reserve tank, so that the liquid outlet of the liquid outlet pipe of the reserve tank is the starting point. Suppresses the generation of vortex flow in the liquid surface direction, and air on the liquid level in the reserve tank is entrained in the vortex flow, and enters the liquid circulation path such as the pump and liquid transport path from the liquid flow outlet to reduce the cooling capacity. It can be prevented from lowering.

  According to the sixth aspect of the present invention, since the protruding wall is formed from the inner wall of the reserve tank in the liquid surface direction of the liquid outlet of the liquid outflow pipe, the shielding action against the air on the liquid surface works and the reserve tank The vortex flow starting from the liquid outlet of the liquid outflow pipe is suppressed from occurring in the liquid surface direction, and the air on the liquid level in the reserve tank is entrained in the vortex flow, and the pump and liquid transport from the liquid outlet It is possible to prevent the cooling capacity from being reduced due to mixing in a liquid circulation path such as a path.

  According to the seventh aspect of the present invention, a communication tank that connects the core tube and the liquid transport path is connected to the other end of the core tube of the radiator, and the reserve tank and the communication tank are connected by the tank connecting member. Since it is connected, the reserve tank and the communication tank are firmly held by the tank connecting member, and when connecting to the heat receiver via the tank connecting member, or when being placed and fixed at a predetermined position of the electronic device casing, etc. Not only the assembling work is facilitated, but also the connection with other related members is facilitated.

  According to the invention of claim 8 of the present invention, the reserve tank and the communication tank are arranged to face each other so as to have a U shape with the radiator interposed therebetween, and an air passage is formed in the space between the reserve tank and the communication tank. As a result, the air path to the radiator can be secured and the heat dissipation performance can be improved. Further, if a blower fan for forced cooling is incorporated in the air passage, a more compact cooling device can be configured.

  According to the ninth aspect of the present invention, since the air blowing surface of the blower fan is disposed opposite to the ventilation surface of the radiator, the cooling device of the present invention is located close to other peripheral devices and the housing wall in the electronic device housing. Even if installed, a sufficient amount of air can be blown to the radiator, so that the heat dissipation performance of the radiator can be improved.

  According to the tenth aspect of the present invention, since the heat receiver and the tank connection member are connected via the heat receiver connection member, the entire cooling device becomes more compact and integrated, and the heat generating electronic component is mounted. By simply fixing the heat receiver on the printed circuit board, it becomes possible to simultaneously install related members such as a reserve tank connected to the tank connecting member via the heat receiver connecting member, a communication tank, and a reserve tank connected to the tank. For example, it is possible to easily replace a heat generating electronic component to be cooled.

  According to the eleventh aspect of the present invention, since the corrugated fins are provided between the plurality of core tubes constituting a part of the radiator, the heat of the liquid refrigerant flowing through the core tubes is heated to the corrugated fins. Conduction and the heat radiation area are greatly increased, and efficient heat radiation becomes possible.

  According to the twelfth aspect of the present invention, since the core tube of the radiator and the reserve tank are thermally connected, the heat of the liquid refrigerant stored in the reserve tank is conducted to the core tube and radiated, and the reserve tank is also It has a heat dissipation function and can improve the cooling performance of the entire cooling device.

  According to the thirteenth aspect of the present invention, the liquid transport path has a curved portion or a bent portion, and the curved portion or the bent portion is formed of a metal tube. Therefore, the liquid transport path is mounted in an electronic device. If there is only one place where the stress that locally bends the path works, the liquid transport path can be prevented from being blocked by configuring the portion with a metal tube, and a good liquid circulation operation can be secured.

  In addition, if there are a plurality of places where the stress that locally bends the liquid transport path is applied in a state of being mounted on an electronic device, any one of the curved portions or the bent portions has an arc shape having a relatively large curvature. By forming the metal tube with a sharp bend, the other curved or bent portion becomes a gentle bend when the arc shape with a smaller curvature becomes smaller. However, it is possible to prevent the liquid transport path from being blocked and to ensure a good liquid circulation operation.

  Furthermore, if the positional relationship between the heat receiver and the radiator is constant, a plurality of cooling devices are mounted in the electronic device even if all the curved parts or bent parts are composed of flexible tubes and there is no risk of blockage. As a result, if the mutual positional relationship between the heat receiver and the radiator is non-uniform in each case, there is a possibility that a larger bending stress will act on the curved part or the bent part, so that either part thereof may be blocked. By using a metal tube having a relatively large curvature, the bending of other curved portions or bent portions can be reduced and the liquid transport path can be prevented from being blocked, and a good liquid circulation operation can be ensured.

  According to the fourteenth aspect of the present invention, the cooling device according to any one of the first to thirteenth aspects is provided, and the heat receiver of the cooling device is an electronic device thermally connected to the heat generating electronic component. The cooling performance can be improved, the arithmetic processing capability of the CPU or the like mounted on the electronic device can be improved, and the stability of the operation state can be ensured. In addition, the electronic device can be easily reduced in size, thickness, and weight.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing, description will be given below with the reserve tank side as the upper side and the communication tank side as the lower side.

(Embodiment 1)
1 to 8, FIG. 1 is an overall perspective view of the cooling device according to the first embodiment of the present invention, and FIG. 2 is a front view and a rear view of the cooling device according to the first embodiment of the present invention. 3 is a partially cutaway view for explaining the structure of the reserve tank of the cooling device according to the first embodiment of the present invention and a cross-sectional view taken along the line BB, and FIG. 4 is a first modified example of the reserve tank. FIG. 5 is a perspective view for explaining a second modification of the reserve tank and its DD arrow sectional view, and FIG. 6 is a sectional view of the reserve tank. FIG. 7 is a partially cutaway view illustrating a third modification and a cross-sectional view taken along the line EE of FIG. 7, FIG. 7 is a cross-sectional view taken along the line AA of FIG. It is the perspective view and front view which show the assembly state of the cooling device in the.

  First, as shown in the overall perspective view of the cooling device 1 according to the first embodiment of the present invention shown in FIG. 1, a heat circulation electronic component (not shown) such as a CPU and a heat pump including a liquid circulation pump described later are incorporated. Two liquid transport paths 3 and 4 are connected to each of the liquid discharge side and the liquid suction side of the heat receiving integrated pump 2 to be connected.

  The liquid transport path 3 includes a flexible tube 3a using a flexible and low gas permeability polymer material such as butyl rubber or fluoro rubber, and a metal tube 3b made of copper, aluminum, stainless steel or the like at one bent portion. The hose band 3c is connected, and the liquid transport path 4 is similarly configured by connecting the flexible tube 4a and the metal pipe 4b with the hose band 4c, both of which constitute part of the liquid circulation path. Yes.

  Further, the gas-liquid separation type reserve tank 5 is disposed adjacent to the upper end of the radiator 6 in the direction of gravity, and the upper end of the core tube 6a (see FIG. 2) of the radiator 6 is connected to the reserve tank 5 thereof. The reserve tank 5 constitutes a part of the liquid circulation path, and one liquid transport path 4 is connected to the liquid outflow pipe 5a of the reserve tank 5. The flexible tube 4a which comprises is connected by the hose band 4c.

  A communication tank 7 is connected to the lower end of the radiator 6, and the reserve tank 5 and the communication tank 7 are connected by a tank connecting member 8 with the radiator 6 sandwiched so as to have a U shape when viewed from the side. Since they face each other, an air passage is formed between them.

  Furthermore, the flexible tube 3a which comprises the other liquid transport path 3 is connected to the liquid inflow pipe 7a of the communication tank 7 by the hose band 3c.

  In other words, the heat receiving integrated pump 2 takes heat while exchanging heat with the liquid refrigerant flowing in contact with the heat generating electronic component, while the liquid refrigerant heated to high temperature by the heat exchange is discharged in the direction indicated by the arrow. Thereafter, the liquid passes through the liquid transport path 3 in the direction of the arrow and flows into the communication tank 7 to perform heat transport.

  Since the communication tank 7 is connected to and communicates with each of a plurality of core tubes 6a (see FIG. 2) constituting a part of the radiator 6, the liquid refrigerant flows through the core tubes 6a of the radiator 6. After exchanging heat and radiating heat, it flows through the reserve tank 5 constituting a part of the liquid circulation path, passes through the liquid transport path 4, and returns to the heat receiving integrated pump 2.

  By repeating such a liquid circulation operation, heat is removed from the heat generating electronic component, and an effective cooling effect is obtained.

  The sealed reservoir tank 5 for gas-liquid separation is provided with a liquid replenishing pipe 5b separately from the liquid outflow pipe 5a, and is normally sealed with the cap 5c closed. The cap 5c is removed to replenish the exhausted liquid refrigerant.

  As described above, the upper end of the core tube 6a of the radiator 6 is connected to one side in a direction away from the liquid outflow pipe 5a of the closed type reserve tank 5.

  In other words, the gas-liquid separation type closed reserve tank 5 is connected to the radiator 6 to form an integrated simple structure. The reservoir tank 5 and the communication tank 7 are connected by the tank connecting member 8 with the radiator 6 interposed therebetween. As a result, an air passage is formed between them, and an air passage to the radiator 6 can be secured, so that the heat radiation performance can be improved.

  Moreover, it is not necessary to provide a separate reserve tank that is required in the conventional cooling device, and the size can be further reduced.

  In addition, since the gas-liquid separation reserve tank 5 is a hermetically sealed type, it can be easily applied to highly portable electronic devices or electronic devices used in different installation directions of vertical installation or horizontal installation.

  Furthermore, since the heat receiving integrated pump 2 has a built-in pump function, a separate pump for driving the circulation of the liquid refrigerant is separately provided in the liquid circulation paths such as the two liquid transport paths 3 and 4 and the radiator 6. Since there is no need for this and the cooling device 1 has only two liquid transport paths, at least three to four liquid transport paths are required in the conventional cooling device, and the liquid circulation path length is increased. Since it becomes short, the flow resistance of the liquid circulation path with respect to the pump decreases, and the cooling performance can be improved by increasing the flow rate.

  Moreover, not only the mounting operation to the heat generating electronic components in the electronic device casing is facilitated, but also the evaporation of the moisture of the liquid refrigerant can be suppressed by shortening the entire liquid circulation path length. A capacity | capacitance can be made small and the cooling device 1 whole can also be reduced in size.

  Here, the reserve tank 5 is an airtight tank for gas-liquid separation that is disposed above the radiator 6 in the gravitational direction and has a large internal volume enough to accommodate air mixed in the liquid circulation path. Therefore, for example, even if a small amount of air that has passed through the flexible tubes 3a and 4a is mixed in the liquid circulation path, it is easy to collect air in the reserve tank 5, and a stable gas-liquid separation function can be obtained. Circulating operation can be secured.

  Further, a communication tank 7 that connects the core tube 6 a and the liquid transport path 3 is connected to the lower end of the core tube 6 a of the radiator 6, and the reserve tank 5 and the communication tank 7 are connected by the tank connecting member 8. The reserve tank 5 and the communication tank 7 can be firmly held by the tank connecting member 8 at two upper and lower connecting portions 8a, and connected to the heat receiving integrated pump 2 via the tank connecting member 8 or an electronic device casing Assembling work becomes easier when it is arranged and fixed at a predetermined position.

  In this case, the fixing hole 8b is provided to fasten and fix other members using a fixing screw or the like (not shown).

  In addition, the reserve tank 5 and the communication tank 7 are arranged so as to be U-shaped with the radiator 6 interposed therebetween, and an air passage is formed in the space between them, so that an air passage to the radiator 6 can be secured and heat radiation performance can be ensured. It can be improved. As will be described later, a more compact cooling device 1 can be configured by incorporating a blower fan for forced cooling into the air passage.

  In addition, the liquid transport path 3 has two curved portions, and the flexible tube 3a and one of the curved portions are configured by the arc-shaped metal tube 3b having a large curvature. Accordingly, the curvature becomes small, so that the bending is reduced and the blockage is prevented, and a good liquid circulation operation can be secured.

  Similarly, the liquid transport path 4 also has two curved portions, and the flexible tube 4a and one curved portion thereof are configured by the arc-shaped metal tube 4b having a relatively large curvature. Since the curved portion has a smaller curvature, the bending is reduced and the blockage is prevented, and a good liquid circulation operation can be secured.

  Even if the curved portion or the bent portion of the heat receiving integrated pump 2 and the radiator 6 are constituted by the flexible tubes 3a and 4a, a plurality of the cooling devices 1 are mounted in the electronic device even if the curvature is small and there is no fear of closing. As a result, if the mutual positional relationship between the heat receiving integrated pump 2 and the radiator 6 becomes non-uniform in each cooling device 1, there is a possibility that a larger bending stress acts on the curved portion or the bent portion and the block is blocked. By configuring any of the portions with the metal tubes 3b and 4b having a relatively large curvature, the bending of other curved portions or bent portions is reduced, and the liquid transport paths 3 and 4 are prevented from being clogged. A safe liquid circulation operation.

  Furthermore, since the metal tubes 3b and 4b also have an action of suppressing air permeation and moisture evaporation of the liquid refrigerant, they may be used for straight portions that are not curved portions or bent portions.

  In the case of the present embodiment, only one curved portion of each of the liquid transport paths 3 and 4 is configured by the metal tubes 3b and 4b. However, blocking is prevented depending on the type and size of the flexible tube used. When the effect is insufficient, all the curved portions or bent portions may be constituted by the metal tubes 3b and 4b.

  The heat receiving integrated pump 2 is fixed by using fixing screws 2b in a state of being mounted on a base plate 2a for attachment to the substrate. In this state, the heat receiving integrated pump 2 is mounted on a substrate on which a heat generating electronic component such as a CPU is mounted. It is attached using a mounting screw 2c.

  With such a configuration, attachment is facilitated by appropriately changing the shape and size of the base plate 2a and the mounting screw 2c in accordance with the size of the CPU and the positional relationship with the substrate.

  Next, as shown in the front view of the cooling device 1 according to the first embodiment of the present invention shown in FIG. 2 (a), the corrugated fin 6b having a waveform between the plurality of core tubes 6a constituting a part of the radiator 6. Since the heat of the liquid refrigerant flowing through the core tube 6a is conducted to the corrugated fins 6b, the heat radiation area is greatly increased, and efficient heat radiation becomes possible.

  Here, in order to ensure good thermal conductivity up to the corrugated fins 6b, as the flat core tube 6a, a metal material having good thermal conductivity such as aluminum, aluminum alloy, copper, and copper alloy is extruded. On the other hand, the corrugated fins 6b having corrugated corrugated fins 6b, which are made of a metal material having a good thermal conductivity and formed into a roll shape, are molded between the core tubes 6a arranged in parallel. It is tightly inserted and brazed using a brazing material such as silver, copper or zinc.

  Note that the corrugated fin 6b may have a rectangular shape or a trapezoidal shape in addition to the corrugated shape as long as desired heat radiation cooling can be obtained.

  The tank connecting member 8 connects the reserve tank 5 and the communication tank 7 in a positional relationship substantially parallel to the core tube 6 a on both the left and right sides of the radiator 6.

  Then, as shown in the rear view of the cooling device 1 according to the first embodiment of the present invention in FIG. 2B, the heat receiving integrated pump 2 is mounted on the base plate 2a for mounting and is a fixing screw. It is fixed using 2b, and in this state, it is attached to a substrate on which a heat generating electronic component such as a CPU is mounted using an attaching screw 2c.

  Next, the liquid transport paths 3 and 4 and the heat receiving integrated pump 2 described above in the partially cutaway view for explaining the structure of the reserve tank 5 of the cooling device 1 according to the first embodiment of the present invention shown in FIG. It is omitted. As shown in this figure, since the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 is arranged at the approximate center in the reserve tank 5, the cooling device 1 is a relatively portable desktop PC or PC server. When the electronic device or a part of its casing is temporarily tilted due to rearrangement or maintenance in the office and the liquid refrigerant liquid level in the reserve tank 5 is tilted, or vertically Even when applied to an electronic device that is used in either a horizontal or horizontal orientation, the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 is below the liquid level, and the air above the liquid level is the liquid outlet. It is possible to prevent the cooling capacity from being deteriorated by mixing in the liquid circulation paths such as the heat receiving integrated pump 2 and the liquid transport paths 3 and 4 from 5d.

  That is, as shown in the cross-sectional view taken along the line BB in FIG. 3B, the cooling device 1 is slightly inclined in the direction indicated by the dashed arrow, and the liquid refrigerant 9 in the reserve tank 5 is indicated by the broken line. Even if the state changes to the state of the surface 9a, the liquid outlet 5d of the liquid outflow pipe 5a is arranged at the approximate center in the reserve tank 5 so as to be below the liquid surface 9a.

  The same effect can be obtained when the cooling device 1 is slightly tilted in the direction opposite to the direction indicated by the dashed arrow. In either case, the air flows out in the direction of the solid arrow in the liquid outlet pipe 5a. Is prevented.

  In other words, the reserve tank 5 is arranged above the radiator 6 in the direction of gravity, and is a gas-liquid separation sealed tank having a large internal volume enough to accommodate the air mixed in the liquid circulation path. As described above, the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 is disposed at the approximate center in the reserve tank 5, so that, for example, a small amount of air that has passed through the flexible tubes 3a and 4a is mixed into the liquid circulation path. Even so, air can be easily collected in the reserve tank 5, a stable gas-liquid separation function can be obtained, and a good liquid circulation operation can be secured.

  As in the present embodiment, it is preferable to arrange the liquid outlet 5d of the liquid outlet pipe 5a so as to be substantially in the center with respect to all three directions X, Y, and Z in FIG. However, in the case where it is unlikely that the vertical direction is reversed after the electronic device is installed, the liquid bottom surface 5e may be arranged so as to be approximately in the center in only the two directions X and Y. It may be arranged closer to.

  On the other hand, as shown in the cross-sectional view along the line BB in FIG. 3B, the reserve tank 5 is also formed into a box shape with a metal material having good thermal conductivity such as aluminum, aluminum alloy, copper, copper alloy, The upper end of the core tube 6a of the radiator 6 is brought to one side in the direction away from the liquid outflow pipe 5a of the reserve tank 5 and is introduced to the inside of the reserve tank 5 so that the boundary portion is made of silver, copper, By being connected by brazing using a brazing material such as zinc, thermal conductivity and hermeticity are secured.

  Accordingly, since the core tube 6a of the radiator 6 and the reserve tank 5 are thermally connected, the heat of the liquid refrigerant 9 stored in the reserve tank 5 is also conducted to the core tube 6a to be dissipated, and the reserve tank 5 also has a heat dissipating function. The cooling performance of the entire cooling device 1 can be improved.

  On the other hand, the communication tank 7 that communicates the core tube 6a of the radiator 6 and the liquid transport path 3 needs to send the liquid refrigerant flowing from the liquid transport path 3 to the plurality of core tubes 6a that communicate with the communication tank 7 as soon as possible. Therefore, it is preferable to reduce the internal volume so that the liquid refrigerant stays in the interior. Like the closed type reserve tank 5, the thermal conductivity of aluminum, aluminum alloy, copper, copper alloy, etc. is good. Formed into a box shape with a metal material, with the core tube 6a of the radiator 6 being introduced to the inside, the boundary portion is brazed using a brazing material such as silver, copper, zinc, etc. Ensuring airtightness.

  In addition, although joining of each member was performed by brazing, if desired characteristics such as thermal conductivity, hermeticity, heat resistance, and mechanical strength can be ensured, other joining, for example, welding, adhesion, and resin material Other joining methods such as insert molding may be used.

  4A is a partially cutaway view for explaining a first modified example of the reserve tank 5. A cutout portion 5f on the liquid bottom surface 5e side of the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 is shown. Therefore, the vortex flow starting from the liquid outlet 5d of the liquid outflow pipe 5a of the reserve tank 5 is restrained from being generated in the direction of the liquid level 9a, and the vortex flows above the liquid level 9a in the reserve tank 5 It is possible to prevent the cooling capacity from being deteriorated by being entrained in the liquid circulation path such as the heat receiving integrated pump 2 and the liquid transport paths 3 and 4 from the liquid outlet 5d.

  That is, as shown in the cross-sectional view taken along the line CC in FIG. 4B, when the liquid level 9a of the liquid refrigerant 9 gradually decreases in the direction indicated by the arrow, the liquid outlet 5d starts. However, since the cutout portion 5f is formed on the liquid bottom surface 5e side of the liquid outlet 5d, the vortex flow is suppressed.

  FIG. 5A is a perspective view for explaining a second modification of the reserve tank 5, and is a plan view from the inner wall of the reserve tank 5 toward the liquid level 9 a of the liquid outlet 5 d of the liquid outlet pipe 5 a of the reserve tank 5. Since the protruding wall 5g is formed, the shielding action against the air on the liquid surface 9a is activated, and a vortex flow starting from the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 is generated in the direction of the liquid surface 9a. The air above the liquid surface 9a in the reserve tank 5 is entrained in the vortex and mixed into the liquid circulation path such as the heat receiving integrated pump 2 and the liquid transport paths 3 and 4 from the liquid outlet 5d, and the cooling capacity is increased. It can be prevented from lowering.

  That is, as shown in the cross-sectional view taken along the line DD in FIG. 5B, when the liquid level 9a of the liquid refrigerant 9 gradually decreases as indicated by the arrow, the liquid outlet 5d is the starting point. However, the flat protruding wall 5g is formed from the inner wall of the reserve tank 5 toward the liquid surface 9a of the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5. The shielding action against the air on the liquid surface 9a works to suppress the generation of the vortex.

  Here, the protruding wall 5g protrudes downward from a part of the upper wall of the reserve tank 5 and is formed in the liquid surface 9a direction of the liquid outlet 5d.

  FIG. 6A is a partially cutaway view illustrating a third modified example of the reserve tank 5. The liquid level 9 a from the inner wall of the reserve tank 5 to the liquid outlet 5 d of the liquid outlet pipe 5 a of the reserve tank 5 is shown. Since the flat protruding wall 5h is formed in the direction, the shielding action against the air on the liquid surface 9a works, and the vortex flow starting from the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5 moves in the direction of the liquid surface 9a. The generation of air is suppressed, and air on the liquid surface 9a in the reserve tank 5 is entrained in the vortex, and enters the liquid circulation path such as the heat receiving integrated pump 2 and the liquid transport paths 3 and 4 from the liquid outlet 5d. And it can prevent that cooling capacity falls.

  That is, as shown in the cross-sectional view taken along the line E-E in FIG. 6B, when the liquid level 9a of the liquid refrigerant 9 gradually decreases in the direction indicated by the arrow, the liquid outlet 5d starts. However, the flat protruding wall 5h is formed from the inner wall of the reserve tank 5 toward the liquid surface 9a of the liquid outlet 5d of the liquid outlet pipe 5a of the reserve tank 5. The shielding action against the air on the liquid surface 9a works to suppress the generation of the vortex.

  Here, the protruding wall 5h is formed by joining a U-shaped metal member to the upper wall of the reserve tank 5 by a method such as resistance welding, adhesion, or caulking.

 In the above description, any of the protruding walls 5g and 5h protrudes from the upper wall of the reserve tank 5 toward the liquid outlet 5d of the liquid outlet pipe 5a. You may form so that it may protrude in the liquid surface 9a direction of the liquid outflow port 5d of the liquid outflow tube 5a from a lower wall.

  Further, the shape of the protruding walls 5g and 5h is not required to be flat as in this embodiment, and other shapes such as a curved surface and an uneven surface can be used as long as the shape acts to shield air on the liquid surface 9a. The shape may be any.

  Further, a solid body such as a cube, a rectangular parallelepiped, or a cylinder may be attached to the inner wall of the reserve tank 5 and one surface thereof may be close as a protruding wall.

  Next, FIG. 7 is a cross-sectional view taken along the line AA of FIG. 1, and the internal structure of the heat receiving integrated pump 2 will be described based on this drawing. The impeller 10 is pivotally supported at a substantially central portion of the heat receiving integrated pump 2, and a plurality of open-type blades 10a are provided substantially radially on the surface of the impeller 10, and a small hole 10b is provided in the vicinity of the central portion of the impeller 10. And the magnet rotor 10 c is provided on the inner peripheral side of the impeller 10.

  Here, the impeller 10 may be configured separately from the magnet rotor 10c, but it is preferable that the impeller 10 be magnetized in a portion that becomes the magnet rotor 10c.

  When the impeller 10 rotates in the liquid refrigerant, the pressure of the liquid refrigerant on the outer peripheral side of the vane 10a becomes higher at the peripheral edge of the vane 10a than at the inlet of the impeller 10 (the central portion indicated by K in FIG. 7). Further, since the pressure at the inlet of the impeller 10 is substantially the same as the back side pressure of the impeller 10 communicated by the small hole 10b described above, the liquid refrigerant passes through the back surface of the impeller 10 and passes through the small hole 10b to the inlet. Reflux for a small amount. Thereby, compared with the case where there is no small hole 10b, thrust force is reduced to the impeller 10, and rotation of the impeller 10 becomes smoother.

  In addition, the heat receiving integrated pump 2 of the present embodiment is small and has a size that is several tenths or one hundredth of that of a general centrifugal pump. This is a centrifugal pump having a length of 3 mm to 50 mm, a representative dimension in the radial direction of 10 mm to 100 mm, a rotation speed of 1000 rpm to 8000 rpm, and a head of about 0.5 m to 10 m.

  Next, a stator 11 is provided on the inner peripheral side of the magnet rotor 10 c, a coil 12 that generates a magnetic field is wound around the stator 11, and an electric circuit that allows current to flow through the coil 12 is mounted on the circuit board 13.

  Here, the stator 11 is preferably formed by laminating a plurality of silicon steel plates in order to reduce eddy current loss, and a copper wire with an insulating film is suitable as the coil 12. The number of turns is optimized in view of the power supply voltage used and the line factor.

  Although not shown, a Hall element that detects the rotational position of the magnet rotor 10c, a current direction switching transistor, and a diode are mounted on the circuit board 13.

  In addition, the second casing 14 accommodates the impeller 10 and at the same time guides the liquid refrigerant given the driving force by the impeller 10 in the direction of the discharge path 14a connected to the side surface thereof, and the suction port 14b also serves as the second casing 14. Are connected in the same direction on the sides.

  Furthermore, since the shape of the second casing 14 is complicated and a certain degree of heat resistance is required, resin molding such as polyphenylene sulfide (PPS), polyphenylene ether (PPE), and polybutylene terephthalate (PBT) is used. Is more preferable.

  On the other hand, it is not preferable that the second casing 14 is made of metal because eddy current loss occurs due to magnetic flux fluctuations generated by the magnetic circuit such as the stator 11.

  The first casing 15 is fitted to the second casing 14, and the partition wall member 16 is sandwiched between the first casing 15, and the liquid refrigerant is driven between the second casing 14 and the partition wall member 16 for driving liquid circulation. A pump chamber 17 for providing a propulsive force is formed.

  In the pump chamber 17, the liquid refrigerant given the driving force by the open blade 10 a is guided to the discharge port 14 a.

  On the other hand, since the first casing 15 is in direct contact with the heat generating electronic component 18 indicated by a two-dot chain line through a heat conductive grease or the like (not shown), the surface thereof has as high a flatness as possible and has a high heat conductivity. It is manufactured by using a metal material such as copper, copper alloy, aluminum, aluminum alloy or the like with good heat dissipation, by die casting or the like, forging, machining, or a combination thereof.

  The first casing 15 preferably has a structure in which a plurality of radiating fins 15a are formed on the inside in order to exchange heat received from the heat generating electronic component 18 with the liquid refrigerant with high efficiency. The casing 15 will be described.

  A flange portion 15b that contacts the second casing 14 is formed on the outer peripheral portion of the first casing 15, and a heat receiving surface 15c that is a contact surface with the heat generating electronic component 18 indicated by a two-dot chain line is provided at a lower portion thereof, A plurality of heat dissipating fins 15a, which are heat dissipating projections, are arranged on the back side, increasing the contact area with the liquid refrigerant and promoting heat conduction, and efficiently receiving the heat received from the heat generating electronic component 18 in the liquid refrigerant. Do the work to tell.

  Then, the liquid refrigerant passes through a through hole (not shown) located substantially at the center of the partition wall member 16 provided so as to be sandwiched between the first casing 15 and the second casing 14 to be pumped. A suction force for driving liquid circulation is given by the open type blade 10a which is sucked into the central portion of the chamber 17.

  In addition, although antifreezing liquids, such as ethylene glycol aqueous solution and propylene glycol aqueous solution, are suitable as a liquid refrigerant, since copper, copper alloy, etc. are used as the material of the 1st casing 15, it is preferable to add an anticorrosive additive.

  As described above, the heat receiving integrated pump 2 includes a pump constituted by the pump chamber 17 formed between the partition wall member 16 and the second casing 14 and the impeller 10 rotating in the pump chamber 17. In addition, since it has both a heat receiving function and a pump function and it is not necessary to provide a separate pump for driving the liquid circulation in the liquid circulation path, the length of the liquid circulation path is shortened, and the size can be further reduced.

  Further, FIG. 8 is a perspective view and a front view showing a state in which the cooling device is assembled in the rack-type casing of the electronic device. Inside the rack-type casing 19, two heat-generating electronic components that require forced cooling (see FIG. (Not shown) is disposed, and two cooling devices 1 are mounted on the mounting surface side of the substrate 20 in correspondence with the respective heat generating electronic components.

  Further, in each cooling device 1, the reserve tank 5 and the communication tank 7 are disposed so as to be U-shaped with the radiator 6 interposed therebetween, and an air passage 21 is provided therebetween, and the ventilation surface 6 c of the radiator 6 is provided. Since the air blowing surface 22a that sends out the air of the air blowing fan 22 is disposed opposite to the air supply fan 22, even if the cooling device 1 is installed in the rack type housing 19 in the vicinity of other peripheral devices or the housing wall, the radiator 6 can be secured, and a sufficient amount of air can be blown to the radiator 6 in the direction indicated by the arrow in FIG. 8B, so that the heat dissipation performance of the radiator 6 can be improved.

  That is, the cooling performance in the electronic device can be improved, the arithmetic processing capability of a CPU or the like mounted on the electronic device can be improved, and the stability of the operation state can be ensured. In addition, the electronic device can be easily reduced in size, thickness, and weight.

(Embodiment 2)
FIG. 9 is a perspective view and a side view of a cooling device according to Embodiment 2 of the present invention. A reserve tank 5 constituting a part of a liquid circulation path for liquid refrigerant is adjacent to the upper end of the core tube 6a of the radiator 6. The upper end of the core tube 6a (not shown) of the radiator 6 is connected to one side in a direction away from the liquid outflow pipe 5a of the closed type reserve tank 5.

  On the other hand, the communication tank 7 is integrally connected to the lower end of the core tube 6 a of the radiator 6, and the reserve tank 5 and the communication tank 7 are connected by a tank connecting member 8.

  Further, the heat receiving integrated pump 2 is connected to the lower side thereof via the tank connecting member 8, and the two liquid transport paths 3 and 4 respectively constitute a part of the liquid circulation path.

  Here, the heat receiver connecting member 23 processed into a U-shape is disposed so as to overlap the outside of the tank communication member 8, and is fastened and fixed by a fixing screw 23 a, and further, the heat receiver connecting member 23. The bottom 23b is connected to a base plate 2a fixed so as to place the heat receiving integrated pump 2 thereon. In this state, the heat generating electronic component 18 such as a CPU is attached to the board on which the heat generating electronic component 18 is mounted using the mounting screw 2c. With such a configuration, the size of the CPU and the positional relationship with the board can be accommodated. Thus, the attachment is facilitated by appropriately changing the shape and size of the base plate 2a and the mounting screw 2c.

  Further, the reserve tank 5 and the communication tank 7 are arranged to face each other, an air passage is formed in a space between them, and the air passage is connected to a connecting portion (not shown) of the heat receiver connecting member 23 for forced cooling. Since the air blowing fan 22 is incorporated and the air blowing surface 22a of the air blowing fan 22 is disposed so as to be in close contact with the ventilation surface (not shown) of the radiator 6, not only the more compact cooling device 1 can be configured, but also this cooling device. Even if the electronic device 1 is installed in the vicinity of other peripheral devices or the housing wall in the electronic device housing, a sufficient amount of air can be blown to the radiator 6, so that the heat dissipation performance of the radiator 6 can be improved.

  As described above, since the heat receiving integrated pump 2 and the tank connecting member 8 are connected via the heat receiver connecting member 23, the entire cooling device 1 becomes more compact and integrated.

  Then, only by fixing the heat receiving integrated pump 2 on the substrate on which the heat generating electronic component 18 is mounted, it is also connected to the tank connecting member 8 through the heat receiver connecting member 23, and further, the reserve tank 5, the communication tank 7, and Related members such as the radiator 6 can also be installed at the same time, and the heat generating electronic component 18 to be cooled such as a CPU can be easily replaced.

  In the above description of the embodiment, in order to reduce the size, it is preferable to use the heat receiving integrated pump 2 having a pump function as the heat receiving device. However, if necessary, the heat receiving device and the pump are provided separately. May be configured to be connected by the liquid transport paths 3 and 4. Although the built-in pump drive system is a centrifugal pump, a pump of another drive system may be used as long as a desired flow rate is obtained and the cooling performance is not affected.

  Even if there is a small amount of air in the liquid circulation path, a sealed reserve tank for gas-liquid separation with a large internal volume that can sufficiently accommodate the air mixed in the liquid circulation path using its buoyancy In order to make it easy to collect the air in 5 and to obtain a more stable gas-liquid separation function and to ensure a good liquid circulation operation, the reserve tank 5 is arranged above the radiator 6 in the direction of gravity. Preferably, if the flow direction of the liquid refrigerant is limited from the communication tank 7 to the direction of the reserve tank 5 through the radiator 6, the reserve tank 5 is hermetically sealed, so that the vertical, horizontal, or reserve tank 5 is disposed in the radiator. 6, a stable gas-liquid separation function can be obtained regardless of the installation direction which is lower in the direction of gravity with respect to 6, and good liquid circulation operation can be ensured.

  Further, with respect to the direction in which the liquid refrigerant is circulated, the liquid medium heated to a high temperature passes through the radiator 6 from the communication tank 7 having a small internal volume so that heat can be radiated from the radiator 6 in as short a time as possible without staying in the middle. The liquid circulation path is formed so that the liquid refrigerant flows in the direction of the reserve tank 5, but if the gas-liquid separation function in the reserve tank 5 is obtained and the liquid refrigerant stays little and sufficient cooling performance can be obtained, the reserve is provided. A liquid circulation path may be formed so that the liquid refrigerant flows from the tank 5 through the radiator 6 toward the communication tank 7.

  In the above embodiment, the reserve tank 5 has a larger internal volume than the communication tank 7, but the total length of the gas permeable flexible tubes 3a and 4a is set short so that the inside of the liquid circulation path. When the amount of air mixed into the tank is very small, or when a separate gas-liquid separation mechanism is provided and a large internal volume is not required, the internal volume may be reduced and set smaller than the communication tank 7. .

  In addition, the radiator 6 does not form a liquid circulation path in only one direction, but separates the communication tank 7 and the reserve tank 5 by partition plates, and turns the liquid circulation path in one of the tanks to turn the radiator 6. The core tube 6a may be a turn type that forms a bidirectional liquid circulation path.

  Further, including the radiator 6, the reserve tank 5, the communication tank 7, and related members such as the liquid transport paths 3 and 4 that connect them, the form, material, size, quantity, manufacturing method, etc. The present invention is not limited to the embodiment, and may be appropriately selected in consideration of cooling performance, assembly workability, arrangement of electronic devices to be mounted in a casing, space, guaranteed life, and the like.

  Similarly, although the axial fan from which sufficient air volume is obtained was used also about the ventilation fan 22, you may use a thin centrifugal fan from the relationship on the space to mount, etc., and the cooling effect is also about the ventilation direction. It may be set as appropriate in consideration of noise and noise.

  The present invention can be applied to a cooling device that cools a heat-generating electronic component while circulating a liquid refrigerant and an electronic device including the same.

1 is an overall perspective view of a cooling device according to Embodiment 1 of the present invention. The front view and back view of the cooling device concerning Embodiment 1 of this invention The partial cutaway figure explaining the structure of the reserve tank of the cooling device concerning Embodiment 1 of this invention, and its BB arrow sectional drawing Partial cutaway view for explaining the first modified example of the reserve tank and its cross-sectional view taken along the line CC The perspective view explaining the 2nd modification of a reserve tank, and its DD arrow sectional drawing Partial cutaway view for explaining a third modified example of the reserve tank and its EE arrow cross-sectional view AA arrow sectional view of FIG. A perspective view and a front view showing an assembled state of the cooling device in the rack-type housing of the electronic device The perspective view and side view of the cooling device concerning Embodiment 2 of this invention The perspective view of embodiment described in (patent document 1) Side view of the embodiment described in (Patent Document 2) (A) The perspective view explaining the outline of the reserve tank as described in (patent document 3), The perspective view explaining the outline of the reserve tank as described in (b) (patent document 4)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat receiving integrated pump 2a Base plate 2b Fixing screw 2c Mounting screw 3 Liquid transport path 3a Flexible tube 3b Metal pipe 3c Hose band 4 Liquid transport path 4a Flexible tube 4b Metal pipe 4c Hose band 5 Reserve tank 5a Liquid outflow pipe 5b Liquid supply pipe 5c Cap 5d Liquid outlet 5e Liquid bottom 5f Notch 5g Projection wall 5h Projection wall 6 Radiator 6a Core tube 6b Corrugated fin 6c Ventilation surface 7 Communication tank 7a Liquid inflow pipe 8 Tank connection member 8a Connection part 8a Connection part 8a Hole portion 9 Liquid refrigerant 9a Liquid surface 10 Impeller 10a Blade 10b Small hole 10c Magnet rotor 11 Stator 12 Coil 13 Circuit board 14 Second casing 14a Discharge port 14b Suction port 15 First casing 15a Radiating fin 1 b flange portion 15c heat receiving surface 16 partition member 17 the inlet of the pump chamber 18 heat-generating electronic component 19 rack-shaped casing 20 substrate 21 air path 22 blower fan 22a blowing surface 23 heat absorber connecting member 23a fixing screw 23b bottom K impeller

Claims (14)

A cooling device that circulates a liquid refrigerant, removes heat from a heat generating electronic component mounted on a substrate by heat exchange with the liquid refrigerant, and dissipates the heat removed by a radiator having a plurality of core tubes, the heat generating electron A heat receiver for exchanging heat with the liquid refrigerant flowing in contact with the components, a liquid transport path connected to the heat receiver and connecting between the heat receiver and the radiator, and a liquid refrigerant for the heat receiver A pump that circulates in the direction of the radiator through the liquid transport path, and a sealed reserve tank for gas-liquid separation in which one end of a core tube of the radiator is connected to one side, and the reserve is provided. A cooling device, wherein a liquid outlet of a liquid outlet pipe of the tank is arranged at a substantially center in the reserve tank. The cooling device according to claim 1, wherein the heat receiver is a heat receiving integrated pump including the pump. The cooling apparatus according to claim 2, wherein only two liquid transport paths are provided. The cooling device according to claim 1 or 2, wherein the reserve tank is disposed above the radiator in the direction of gravity. The cooling device according to claim 1 or 2, wherein a notch is formed on the liquid bottom side of the liquid outlet of the liquid outlet pipe of the reserve tank. The cooling device according to claim 1 or 2, wherein a protruding wall is formed from an inner wall of the reserve tank in a liquid surface direction of a liquid outlet of the liquid outlet pipe. The communication tank connecting the core tube and the liquid transport path is connected to the other end of the core tube of the radiator, and the reserve tank and the communication tank are connected by a tank connecting member. 3. The cooling device according to 1 or 2. The reserve tank and the communication tank are disposed so as to face each other in a U shape with the radiator interposed therebetween, and an air passage is formed in a space between the reserve tank and the communication tank. 7. The cooling device according to 7. The cooling device according to claim 7, wherein a ventilation surface of the blower fan is disposed opposite to the ventilation surface of the radiator. The cooling device according to claim 7, wherein the heat receiver and the tank connecting member are connected via a heat receiver connecting member. The cooling device according to claim 1 or 2, wherein corrugated fins are provided between a plurality of core tubes constituting a part of the radiator. The cooling device according to claim 1 or 2, wherein the core tube of the radiator and the reserve tank are thermally connected. The cooling device according to claim 1 or 2, wherein the liquid transport path has a curved portion or a bent portion, and the bent portion or the bent portion is constituted by a metal tube. An electronic apparatus comprising the cooling device according to claim 1, wherein the heat receiver of the cooling device is thermally connected to a heat generating electronic component.

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