JP3839426B2 - Cooling module for display-integrated computer - Google Patents

Description

  The present invention relates to a desktop computer integrated with a liquid crystal display device, and more particularly to a liquid cooling technique for a heating element in the desktop computer.

  The prior art about the cooling device for an electronic device is to thermally connect the heat generating member to the metal housing wall by interposing a metal plate or a heat pipe between the heat generating member in the electronic device and the metal housing wall. The heat generated by the heat generating member is radiated by the metal housing wall.

  Further, as a conventional technique, a technique for liquid-cooling a heat generating member of an electronic device is disclosed (see, for example, Patent Document 1). According to this, a heat receiving head receives heat generated by a semiconductor element heat generating member in the electronic device. The refrigerant liquid in the heat receiving head is transported through the flexible tube to the heat radiating head provided in the metal casing of the display device, and the heat generated in the semiconductor element heating member is transferred to the heat radiating head via the refrigerant liquid. It has a structure that efficiently dissipates heat from a through metal casing. Furthermore, the above publication discloses an example in which a heat pipe is used as a heat transport device, and heat generated in the semiconductor element is transmitted to the heat pipe via a metal heat receiving plate, and further, a metal made as a heat radiating surface. A structure is disclosed in which heat is connected to the other end of the heat pipe directly attached to the wall surface of the housing to dissipate heat.

As another conventional technique, a heat dissipation technique of a desktop computer having a liquid crystal display device is described (for example, see Patent Document 1). According to this publication, the air that has entered the casing through the air intake hole provided in the lower casing portion of the casing portion surrounding the liquid crystal display device, the motherboard, etc. is warmed by the heat generated by the motherboard and the power supply portion, and the upper surface of the upper casing portion. In addition, it is described that the heat is released to the outside from the heat dissipation holes provided on the back surface and the upper surface of the lower casing part, and further, it is described that a cooling fan is attached to the lower part of the motherboard to improve the cooling efficiency.
JP-A-7-142886 JP-A-11-154036

  A desktop computer including a main body having a liquid crystal display device and a stand that rotatably supports the main body includes a CPU, MPU, etc. (hereinafter referred to as a CPU) incorporated in the main body. Although heat is generated, the generated heat may cause the circuit operation to become unstable or cause thermal deformation of the mechanisms. In particular, recently, as the operating frequency of the CPU becomes higher, the amount of heat generation has increased, and it has been desired to efficiently dissipate the increased heat generation to the outside.

  In the prior art, cooling with a refrigerant liquid related to electronic equipment in general, cooling using a heat pipe, and the like are disclosed. However, as for the cooling technology for a desktop computer having a liquid crystal display device, air cooling or the like as in Patent Document 2 is provided. It has only been proposed, and the actual situation is that the cooling structure peculiar to the structure of a desktop computer having a liquid crystal display device has not been publicly disclosed.

  Increasing the amount of heat generated by desktop computers can be dealt with by increasing the fan's ventilation capacity. However, if this is done, the wind noise generated by the fans may become noise or vibration may occur. It may be possible to increase the heat dissipation capacity by increasing the size of the air cooling heat sink (heat dissipation plate) for heat dissipation in the heat generating element such as CPU. This is incompatible with the request.

  An object of the present invention is to provide a cooling technology useful when applied to a desktop computer having a liquid crystal display device, and to propose a configuration capable of obtaining a specific heat dissipation effect not found in the prior art.

In order to solve the above problems, the present invention mainly adopts the following configuration.
A cooling module for a display device-integrated computer having a CPU and a flat display,
The cooling module includes a refrigerant liquid circulation means including a tubular flow path filled with the refrigerant liquid, and a heat receiving head fixed to at least one heat generating unit including the CPU,
A part of the refrigerant liquid circulation means is attached to a chassis facing the flat display of the display device-integrated computer, and a plane direction of a gap space formed from the flat display and the chassis of the display device-integrated computer Is arranged vertically,
Using the refrigerant liquid circulating through the refrigerant liquid circulation means as a heat transfer medium, the heat absorbed by the heat receiving head is thermally diffused to the chassis, and the gap space formed from the flat display and the chassis is used as a convection space for air. The heat absorbed by the heat receiving head is radiated by convection through the coolant circulation means and the chassis.

  According to the present invention, heat generated from a high heat generation source such as a CPU of a desktop computer having a liquid crystal display device can be efficiently dissipated to the outside.

  Further, if the configuration of the present invention is adopted, the heat dissipation effect can be improved without changing the size of the outer shape of the computer main body.

Furthermore, the improvement of the heat radiation efficiency by the chimney effect of air can be expected by making a hole in the existing main body cover.
Further, it is possible to prevent damage caused by liquid leakage and bubble generation that occurs when the present invention adopts heat radiation using a refrigerant liquid.

  A liquid cooling technique for a desktop computer according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an overall configuration related to liquid cooling of a desktop computer according to an embodiment of the present invention, and FIG. 2 is a front view of a tube and a liquid receiver fixed to a main chassis in the overall configuration of FIG. FIG. 3 is a rear view in which (CPU + heat receiving head) and a pump are arranged on the mother board in the overall configuration of FIG.

  1 to 3, the desktop computer includes a computer main body 1 and a stand 2 that rotatably supports the main body 1, and the computer main body 1 is equipped with a liquid crystal panel 5 on the front side of the main chassis 3. A mother board (control circuit board) 4 is disposed on the back side.

  The motherboard 4 is equipped with various electric / electronic elements, integrated circuits, electronic circuit groups, and the like necessary for operating the computer, and a CPU 9 and a power supply circuit that are heat sources during the operation of the computer are also arranged on the motherboard. Yes. Further, a large number of connectors are arranged on the back side of the liquid crystal panel 5, that is, the side facing the main chassis 3, and electrical wiring via the connectors is connected to the terminals of the mother board 4 through the openings of the main chassis 3. Therefore, a space in which electric wirings are arranged is formed between the main chassis 3 and the liquid crystal panel 5.

  Referring to FIG. 3, on the back side of motherboard 4 (the side opposite to the main chassis side) are a heat source such as CPU 9, power supply circuit, HDD (Hard Disk Drive) 10 and the like. A heat receiving head 8 (see FIG. 1) for transmitting the heat generation amount to the refrigerant liquid is provided. Here, as a heat source in the desktop computer, specifically, in addition to the CPU, a chip set, a display controller, a power supply unit, an HDD, an FDD, a CD-ROM unit, a CD-R / W unit, a DVD-ROM unit There is. The heat receiving head 8 is made of a metallic material having a high heat transfer coefficient, and the inside of the heat receiving head is filled with a refrigerant liquid for heat transport to a heat radiating portion located at a distance from the heat receiving head. As the refrigerant liquid, water or ethylene glycol is used, but is not limited thereto. The refrigerant liquid is pressurized by a pump 7 shown in the figure, recovers heat by a heat receiving head 8, and is circulated by a tube 6.

  As the tube 6 for transporting the refrigerant liquid, a Cu tube having a good heat transfer rate and corrosion resistance is generally used. However, the tube 6 is not limited to copper as long as it has the attributes described above. A flexible tube such as a silicon-based tube can also be employed because it has the above-mentioned attribute. As will be described later, in particular, the tube as shown in FIGS. 13 and 14 is routed in the same manner as the cable. Therefore, a portion other than the portion fixed to the cover or chassis is made a flexible tube (for example, a portion requiring flexibility). It is also possible to use a flexible tube such as a silicon-based tube in place of the Cu tube.

  The refrigerant liquid transporting tube 6 is brought to the front side of the main chassis through the heat receiving head 8, the pump 7 and the main chassis opening (see FIG. 2), that is, a space between the main chassis 3 and the liquid crystal panel 5. And is fixed by an appropriate fixing method such as screwing or embedding on the front side of the main chassis to form a heat radiating portion. Here, the tube placement space on the front side of the main chassis is a space originally reserved for the electrical wiring of the liquid crystal panel as described above, and a new tube pipe is provided on the front side of the main chassis 3. Since the space that has already been secured, not the space, is used, this is not contrary to the reduction in thickness and size of the entire apparatus.

  As shown in FIG. 2, the tube 6 is fixed on the front side of the main chassis in a spiral shape, zigzag structure, or meandering, so that the heat generated by the CPU or the like transferred to the refrigerant liquid is efficiently passed through the Cu tube. It is transmitted to the main chassis 3. Since the main chassis originally constitutes the entire frame of the computer connected to the stand 2, its entire area is naturally large, and it is made of a metal material. Using the surface area, heat can be radiated externally, and highly efficient heat radiating can be achieved.

  In addition, referring to FIG. 2, the tube 6 fixed on the surface side of the main chassis 3 in a spiral shape, for example, may have a situation in which the refrigerant liquid leaks due to thermal contraction at the joint of the turning portion. A liquid receiver 11 for collecting the refrigerant liquid is provided on the lower front side of the main chassis so as not to spill over the chassis through the chassis. Since the main chassis is usually kept in an upright state or in a slightly inclined state from the upright state, the leaked liquid flows down the main chassis surface and can be collected in the liquid receiver 11. FIG. 2 shows an example in which the liquid receiver 11 is provided on the front side of the main chassis 3, but a liquid receiver is also installed on the back side of the main chassis to collect the leaked liquid that has descended through the tube. You may do it.

  Further, the computer main body 1 is entirely covered with a cover 12, and a cover portion corresponding to a lower portion of a space between the liquid crystal panel 5 and the main chassis 3 is composed of a heat transport tube and a main chassis. In order to air-cool the heat radiating portion, an air intake port 13 for taking in air is provided. Similarly, an exhaust port 14 for exhausting air is also provided in the upper part of the cover 12. The air circulation path from the inlet port 13 to the exhaust port 14 generates an air chimney effect, further cooling the air in the heat radiating portion, and improving the cooling efficiency.

  Next, as another configuration example of the first embodiment of the present invention described above, a fan for air blowing is provided in the lower part in the cover, and air is forcibly taken in to exchange heat in the heat radiating part. As a result, the air can be discharged to further increase the cooling efficiency.

  As described above, according to the first embodiment of the present invention, the case (cover) of a desktop computer that is currently used can be used as it is without changing its size. The large surface area can be used for heat dissipation, and heat can be dissipated from both the front and back surfaces to achieve a further heat dissipation effect. Moreover, it can be expected that the heat dissipation efficiency is further increased by the chimney effect of air in the heat dissipation portion of the tube.

  Next, FIG. 4 shows a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention. According to FIG. 4, the present embodiment has a structure in which a heat radiation portion is formed by fixing and arranging a tube passing through a pump, a heat receiving head, and a main chassis opening on the back surface of the liquid crystal panel. Since the back surface of the liquid crystal panel is made of a metal material, heat from the refrigerant liquid in a spiral, zigzag structure, or meandering tube can be efficiently transmitted to the back surface of the liquid crystal panel to dissipate heat.

  The space between the liquid crystal panel and the main chassis is an arrangement space for electrical wiring connected to the connector of the liquid crystal panel, as described in the present embodiment shown in FIG. It does not require a special space for arranging the tube to form the heat radiating portion. Therefore, in the embodiment shown in FIG. 4 as well, the heat radiating section can be installed without changing the external dimensions of the current case of the desktop computer, which can contribute to thinning and miniaturization of the computer.

  Furthermore, since the rear surface of the liquid crystal panel has a large metal surface area, heat can be efficiently radiated using this large surface area. Also, by opening an air intake inlet in the lower part of the cover that covers the space between the liquid crystal panel and the main chassis and providing an air outlet in the upper part of the air intake, the upper part exhausts from the lower part. An air flow path to the outlet is formed, and an improvement in the heat dissipation effect can be expected due to the so-called chimney effect.

  In addition, as a structural example of air flow to the heat radiating unit in the embodiment shown in FIG. 1, a structure in which a fan for air blowing is provided in a lower part and / or an upper part of a cover that covers between the liquid crystal panel and the main chassis is illustrated. 10 shows. By adopting the fan shown in FIG. 10, air conveyance can be further promoted. Furthermore, since a large amount of cooling air can be conveyed by providing a fan, the lower and upper openings for inlet and exhaust can be narrowed, and the device can be made thinner. As well as being able to reduce the inflow of dust.

  Next, FIG. 5 shows a configuration related to prevention of liquid cooling leakage of the desktop computer according to the embodiment of the present invention. The present embodiment is a countermeasure method in the case where a refrigerant liquid leaks in the heat radiating portion of the configuration in which heat from the heat receiving head is radiated on the main chassis front side as shown in the embodiment shown in FIG. . A desktop computer with a liquid crystal display consisting of a computer main unit and a stand is held on the stand in an upright state or slightly inclined from the upright state, both when used and when not used. The liquid leaking from the heat radiating portion where the liquid leakage is likely to occur in the cooling device leaks to the lowermost part of the main chassis from the tilted state of the computer main body. Therefore, a feature of this embodiment is that a liquid receiver is provided at the lowermost part of the main chassis.

  According to FIG. 5, the liquid leaking from the heat radiating portion descends along the front surface of the main chassis and is collected by the liquid receiver at the bottom of the main chassis. In FIG. 5, the liquid receiver is attached to the lowermost part of the main chassis. However, the liquid receiver may have a structure integrated with the main chassis. Further, as another configuration example, a liquid receiver integrated with the cover (configuration example shown in FIG. 5) may be used to collect the liquid falling along the main chassis surface.

  Furthermore, since the connection portion or the coupling portion of the refrigerant liquid tube can be considered as a location where liquid leakage is likely to occur, a liquid receiver may be provided on the back side of the main chassis against liquid leakage from the heat receiving head and the pump (see above). (Since the liquid leaking from the tube connection part travels down the outer surface of the tube and descends along the back of the main chassis). Further, in order to cope with the leaked liquid falling from the lowermost part of the mother board to which the pump or the heat receiving head is attached, a liquid receiver having a structure integrated with the cover may be provided at a position corresponding to the lowermost part of the mother board. Furthermore, a liquid receiver may be provided in the vicinity of the computer headquarters in the stand.

  As described above, according to the embodiment shown in FIGS. 1 and 5, the leaked refrigerant liquid can be recovered and damage to the equipment in the stand due to the leakage of the refrigerant liquid can be prevented.

  Next, FIG. 6 shows a configuration relating to liquid cooling and air cooling of the desktop computer according to the embodiment of the present invention. In the embodiment shown in FIG. 6, the heat receiving head is fixed on the CPU arranged on the mother board and the heat generated by the CPU is transmitted to the heat receiving head, and the heat receiving head passes through the refrigerant liquid (water or ethylene glycol) in the tube. The heat generated is transmitted to the heat radiating portion on the main chassis front side or the back surface of the liquid crystal panel (similar to the embodiment shown in FIGS. 1 and 4), and radiating fins are installed on the heat receiving head.

  In other words, the embodiment shown in FIG. 6 intends to radiate the heat that cannot be radiated from the radiating fins provided on the heat receiving head by liquid cooling. In a desktop computer, there is a sufficient space between the back of the motherboard and the back cover, so installing the heat dissipating fins as in this embodiment does not change the extra size. FIG. 6B shows a structure in which a fan is further provided on the heat radiation fin on the heat receiving head. By providing the blower fan, the heat radiation from the heat radiation fin can be carried out efficiently and quickly.

  As described above, the embodiment shown in FIG. 6 applies a combination of liquid cooling and air cooling to a heat source such as a CPU, so that the maximum heat radiation amount can be increased and the heat radiation efficiency can be increased. it can. In addition, even when an abnormality occurs in the liquid cooling device such that the refrigerant liquid such as water freezes, the computer operation can be continued due to the air cooling effect by the radiating fins fixed to the heat receiving head. There is an effect.

  Next, FIG. 7, FIG. 8 and FIG. 9 are diagrams showing configuration examples relating to the shape and structure of the heat radiating portion in the tube. (1) in FIG. 7 is a cross-sectional view showing that a spiral tube is disposed between the liquid crystal panel and the main chassis to dissipate heat, and (2) in FIG. 7 shows (1) in FIG. FIG. 7 (3) is a cross-sectional view showing that a spiral tube is disposed between the liquid crystal panel and the main chassis, and that a cylinder such as aluminum is disposed at the center of the tube to dissipate heat. It is. According to the configuration example shown in FIG. 7, the tube that has passed through the main chassis opening from the heat receiving head is guided to the back surface of the liquid crystal panel and disposed along the back surface, and is then guided to the main chassis side to be placed on the main chassis surface. A structure in which the heat dissipating part is formed is employed along the arrangement (the arrangement order may be reversed). With this structure, since both the liquid crystal panel and the main chassis can be used as heat radiation surfaces, further heat radiation effects can be expected. (3) in FIG. 7 is intended to further improve the heat dissipation efficiency by disposing (clamping) heat dissipation metal such as aluminum in the central space of the spiral tube disposed on the liquid crystal panel and the main chassis. To do.

  In FIG. 8, a spiral tube is disposed between a motherboard provided with a heating element and a back cover, and a cylindrical heat radiation metal such as aluminum is disposed in a central space surrounded by the spiral tube to dissipate heat. It is an example of a structure which shows doing. In FIG. 8, an opening for air circulation is provided in a cover corresponding to an upper part and a lower part of the cylindrical metal to provide an inlet and an outlet. And by making the cylindrical metal into a hollow body structure, an air path is formed from the inlet to the exhaust through the hollow body, and the heat transferred from the tube to the cylindrical metal is efficiently cooled by the chimney effect. Is done.

  (1) in FIG. 9 is a view showing that a tube is disposed between the liquid crystal panel and the main chassis without contacting and fixing, and heat is dissipated, and (2) in FIG. 9 is a diagram showing the liquid crystal panel and the main chassis. FIG. 5 is a diagram showing that the distance between the contact point is substantially equal to the tube diameter, and the liquid crystal panel and the main chassis are in contact with each other and dissipate heat throughout the tube.

  Next, FIG. 11 shows a refrigerant liquid supply pump, a heat receiving head (water jacket W / J), a tube, a heat radiating system comprising a spiral, zigzag structure or meandering tube heat radiating portion, and a flow of the refrigerant liquid. Shows relationship with direction. Since (1) in FIG. 11 is the direction of liquid flow as shown in the figure, the flow path from the pump to the top of the head through the heat radiating section becomes long, so that the pump capacity increases accordingly, but the heat radiating section is included. The bubbles generated in the refrigerant liquid in the tube escape upward along the flow, and the bubble removal effect is great (the bubble removal port is provided at the top of the head). Moreover, since (2) of FIG. 11 is a liquid flow direction as shown in the figure, the flow path from the pump to the top of the head is shorter than that of (1) of FIG. Further, (3) in FIG. 11 has a plurality of heat generating elements outside the CPU as a heat source in the desktop computer as described above. Therefore, a plurality of heat receiving heads are provided corresponding to the plurality of heat generating elements. Indicates that the heat receiving heads are connected in series by a tube.

  Next, FIG. 12 is a schematic diagram showing the function of the reserve tank that replenishes the refrigerant liquid and the function of removing bubbles in the tube heat radiating section. According to FIG. 12, a reserve tank for storing a liquid is provided at the uppermost part of the circulation path of the refrigerant liquid, that is, the upper part of the tube spiral structure (heat dissipating part), and in the case of liquid leakage from the tube or liquid evaporation, The liquid functions as a replenisher. Also, by installing the reserve tank at the uppermost part of the liquid circulation path, bubbles generated in the circulation path will escape to the tank.

  Furthermore, the shape of the tube heat radiation part shown in FIG. 12 is such that the tube is not reciprocated horizontally, but an inclined path with an angle α is formed from the turning point to proceed to the next turning point. Yes. In this way, by making the liquid circulation path in the inclined shape in the heat radiating portion, bubbles in the refrigerant liquid generated in the heat radiating portion can easily escape to the reserve tank. In other words, bubbles generated in the refrigerant liquid due to slight liquid leakage can be quickly eliminated through the reserve tank.

  Next, FIG. 13 shows a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention. In the present embodiment, the heat dissipating part of the refrigerant liquid tube is formed on the back cover (back cover) provided on the back side of the main body part, and the back cover is usually made of metal or plastic. Heat can be dissipated to the outside air through the back cover. The plastic of the back cover has the same heat dissipation characteristics as metal. Further, FIG. 13 shows a structure in which a liquid receiver for collecting the leaked refrigerant liquid is provided below the tube heat dissipating part provided in the back cover.

  In the configuration shown in FIG. 13, the back cover is removed and various devices inside the main body are inspected during the maintenance and inspection of the computer. In this embodiment, the back cover is not configured to be removed in consideration of the maintenance and inspection. It can be opened and closed with a hinge structure. Also, install the heat dissipation part on the back cover fixed to the main unit, and perform maintenance and inspection by tilting the liquid crystal panel to the front side with the bottom side as the pivot point and opening the liquid crystal panel with the side side as the pivot point. It may be possible to inspect internal equipment.

  Next, FIG. 14 shows a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention. In this embodiment, as viewed from the front of the computer, the liquid crystal panel, the motherboard, the main chassis, the heat radiating portion, and the back cover are arranged in this order. The back cover can be removed from the main body, a main chassis is provided opposite the back cover, and a heat radiating portion is attached to the main chassis, and the heat radiating portion has an elastic function. In this configuration, heat is transferred to the back cover through the body. That is, since the heat radiating portion is in contact with the back cover with no gap through the elastic heat transfer body, the heat radiating effect is good.

  According to this embodiment, heat can be radiated through the back cover having a large heat radiating area, and an attachment error of the back cover can be absorbed by the elastic heat transfer body.

It is sectional drawing which shows the whole structure regarding the liquid cooling of the desktop computer which concerns on embodiment of this invention. It is the front view which fixed the tube and the liquid receiver to the main chassis in the whole structure shown in FIG. It is the rear view which has arrange | positioned (CPU + heat receiving head) and a pump in the motherboard in the whole structure shown in FIG. It is a structural example regarding liquid cooling of the desktop computer according to the embodiment of the present invention, and is a cross-sectional view in which a tube is fixed to a liquid crystal panel to dissipate heat. It is sectional drawing which shows the structural example regarding the liquid leak prevention of the liquid cooling of the desktop computer which concerns on embodiment of this invention. It is a figure which shows the structural example regarding liquid cooling and air cooling of the desktop computer which concerns on embodiment of this invention. It is sectional drawing which shows the structural example regarding arrangement | positioning of the tube in the liquid cooling of the desktop computer which concerns on this embodiment. It is sectional drawing which shows the other structural example regarding arrangement | positioning of the tube in the liquid cooling of the desktop computer which concerns on this embodiment. It is sectional drawing which shows the structural example regarding arrangement | positioning related with the tube in the liquid cooling of the desktop computer which concerns on this embodiment, a main chassis, and a liquid crystal panel. It is sectional drawing which shows the exhaust heat by a fan with the structure regarding the liquid cooling of the desktop computer which concerns on this embodiment. It is a schematic diagram which shows the arrangement | positioning and liquid flow direction of the pump in the liquid cooling of the desktop computer which concerns on this embodiment, a heat receiving head, and a tube. It is a schematic diagram which shows the function of the reserve tank which performs the liquid replenishment of the refrigerant | coolant liquid in the liquid cooling of the desktop computer which concerns on this embodiment, and the bubble removal function in a tube thermal radiation part. It is a structural example regarding liquid cooling of the desktop computer according to the embodiment of the present invention, and is a cross-sectional view in which a tube and a liquid receiver are arranged on a back cover. FIG. 3 is a cross-sectional view of a configuration example related to liquid cooling of a desktop computer according to an embodiment of the present invention, in which a tube is disposed on a main chassis facing a back cover.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Computer main body 2 Stand 3 Main chassis 4 Motherboard 5 Liquid crystal panel 6 Tube 7 Pump 8 Heat receiving head 9 CPU
10 HDD
11 Liquid receiver 12 Cover 13 Inlet 14 Exhaust

Claims (3)

A cooling module for a display device-integrated computer having a CPU and a flat display,
The cooling module includes a refrigerant liquid circulation means including a tubular flow path filled with the refrigerant liquid, and a heat receiving head fixed to at least one heat generating unit including the CPU,
A part of the refrigerant liquid circulation means is attached to a chassis facing the flat display of the display device-integrated computer, and a plane direction of a gap space formed from the flat display and the chassis of the display device-integrated computer Is arranged vertically,
Using the refrigerant liquid circulating through the refrigerant liquid circulation means as a heat transfer medium, the heat absorbed by the heat receiving head is thermally diffused to the chassis, and the gap space formed from the flat display and the chassis is used as a convection space for air. The cooling module, wherein the heat absorbed by the heat receiving head radiates convection through the coolant circulation means and the chassis. 2. The cooling module according to claim 1, wherein the heat receiving head is provided for each heat generating portion, and the refrigerant liquid circulating through the refrigerant liquid circulation means sequentially absorbs heat to a heat transfer medium. 2. The cooling module according to claim 1, wherein a part of the refrigerant liquid circulation means arranged in a gap space on the back surface of the flat display has a meandering shape or a zigzag shape.

Images