JP2004102295A - Cooling module in display device integrated computer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide useful cooling technology to be applied to a desk-top computer with a liquid crystal display, and to attain a peculiar heat radiation effect which has not been obtained by the conventional technology. <P>SOLUTION: This is a cooling module for a liquid crystal display integrated computer having a CPU 9 and a flat display 5, and the cooling module comprises a cooling liquid circulation means comprising a tubular flow passage filled with the cooling liquid, and a heat receiving head 8 to be fixed to at least one heat generation part including the CPU, and a part of the cooling liquid circulation means is vertically arranged in an air gap space on the rear surface of the flat display 5, and radiates the heat absorbed by the heat receiving head 8 through a part of the cooling liquid circulation means arranged in the air gap space on the rear surface of the flat display 5 using the cooling liquid circulating in the cooling liquid circulation means as a heat transmission medium. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a desktop computer integrated with a liquid crystal display device, and more particularly, to a liquid cooling technique for a heating element in the desktop computer.

The related art of a cooling device for an electronic device includes a metal plate or a heat pipe interposed between a heat generating member in the electronic device and a metal housing wall to thermally connect the heat generating member to the metal housing wall. The heat generated by the heat generating member is radiated by the metal housing wall.

Further, as a conventional technique, a technique of liquid cooling a heating member of an electronic device is disclosed (see, for example, Patent Document 1). According to this technology, heat generated by a semiconductor element heating member in the electronic device receives heat. The refrigerant liquid in the heat receiving head is transported to the heat radiating head provided in the metal casing of the display device through the flexible tube, and the heat generated by the semiconductor element heat generating member is transferred to the heat radiating head through the refrigerant liquid. The structure is such that heat is efficiently radiated from the through metal case. Further, the above-mentioned publication discloses an example in which a heat pipe is used as a heat transport device, and heat generated in a semiconductor element is transmitted to the heat pipe via a metal heat receiving plate, and further, a metal heat dissipation surface is formed. There is disclosed a structure in which heat is connected to the other end of a heat pipe directly attached to a wall surface of a housing to dissipate heat.

Further, as another conventional technique, a heat dissipation technique for a desktop computer having a liquid crystal display device is described (for example, see Patent Document 1). According to this publication, air entering the casing from an air intake hole provided in a lower casing portion of a casing portion surrounding a liquid crystal display device, a motherboard, and the like is heated by heat generated by the motherboard and the power supply portion, and the upper surface of the upper casing portion is heated. In addition, it describes that heat is released to the outside through heat radiation holes provided on the back surface and the upper surface of the lower casing portion, and further describes that a cooling fan is attached to a lower portion of the motherboard to improve cooling efficiency.
JP-A-7-142886 Japanese Patent Application Laid-Open No. H11-154036

A desktop computer including a main body having a liquid crystal display device and a stand for rotatably supporting the main body is provided by a CPU, an MPU, or the like (hereinafter, referred to as a CPU) built in the main body. Although heat is generated, the generated heat may cause unstable circuit operation or cause thermal deformation of mechanisms. In particular, recently, the amount of heat generated has increased as the operating frequency of the CPU has further increased, and it has been desired to efficiently radiate the increased heat to the outside.

In the related art, cooling with a refrigerant liquid for electronic devices in general, cooling using a heat pipe, and the like are disclosed. However, as for the cooling technology for a desktop computer having a liquid crystal display device, air cooling or the like as described in Patent Document 2 is used. It is only a proposal, and in fact, no technology has been disclosed for a cooling structure specific to the structure of a desktop computer having a liquid crystal display device.

To increase the amount of heat generated by a desktop computer, it is conceivable to increase the fan's airflow capacity, but this will cause noise or vibration from the wind noise generated by the fan, which may cause problems in computer use. It is conceivable that a problem arises, and that the size of an air-cooling heat sink (heat radiating plate) for radiating heat in a heating element such as a CPU is increased to increase the heat radiation capacity. Will be incompatible with the requirements of

An object of the present invention is to provide a useful cooling technique applied to a desktop computer having a liquid crystal display device, and to propose a configuration capable of obtaining a unique heat radiation effect not found in the related art.

In order to solve the above problems, the present invention mainly employs the following configuration.
A cooling module of a display device-integrated computer having a CPU and a flat display,
The cooling module, a refrigerant liquid circulation means comprising a tubular flow path filled with the refrigerant liquid,
A heat receiving head fixed to at least one heat generating portion including the CPU;
A part of the refrigerant liquid circulating means is vertically arranged in a clearance space on the back surface of the flat display, and the refrigerant liquid circulating through the refrigerant liquid circulating means is used as a heat transfer medium to absorb heat absorbed by the heat receiving head into the flat display. The heat is radiated through a part of the cooling liquid circulating means disposed in the gap space on the back surface of the cooling liquid.

A cooling jacket for a personal computer having at least one heat generating portion including a CPU and cooling the heat generating portion by circulating refrigerant liquid,
The cooling jacket is connected in the middle of a circulation path of the refrigerant liquid, and has a heat receiving head that transfers generated heat of the heat generating portion to the refrigerant liquid, and a radiation fin that radiates heat stored in the heat receiving head into the air. Configuration.

According to the present invention, heat generated from a high heat source such as a CPU of a desktop computer having a liquid crystal display device can be efficiently radiated to the outside.

According to the configuration of the present invention, the heat radiation effect can be improved without changing the size of the external shape of the computer main body.

Further, improvement of the heat radiation efficiency due to the air chimney effect can be expected by perforating the existing main body cover.
In addition, it is possible to prevent liquid leakage and air bubble generation that occur when the present invention employs heat radiation using a refrigerant liquid.

The liquid cooling technology of the desktop computer according to the embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an overall configuration of a desktop computer according to an embodiment of the present invention relating to liquid cooling, and FIG. 2 is a front view in which a tube and a liquid receiver are fixed to a main chassis in the overall configuration of FIG. FIG. 3 is a rear view in which (CPU + heat receiving head) and a pump are arranged on the motherboard in the entire configuration of FIG.

As shown in FIGS. 1 to 3, the desktop computer includes a computer main body 1 and a stand 2 for rotatably supporting the main body 1. The computer main body 1 is equipped with a liquid crystal panel 5 on the front side of a main chassis 3. A motherboard (control circuit board) 4 is disposed on the back side.

On the motherboard 4, various electric / electronic elements, integrated circuits, electronic circuits, and the like necessary for operating the computer are mounted, and a CPU 9 and a power supply circuit, etc., which generate heat when the computer operates, are also arranged on the motherboard. I have. On the back side of the liquid crystal panel 5, that is, on the side facing the main chassis 3, a number of connectors are arranged, and electric wiring via the connectors is connected to terminals of the motherboard 4 through openings in the main chassis 3. Therefore, a space in which electric wiring is arranged is formed between the main chassis 3 and the liquid crystal panel 5.

Referring to FIG. 3, CPU 9 as a heat source, a power supply circuit, an HDD (hard disk drive) 10 and the like are arranged on the back side of mother board 4 (the side opposite to the main chassis side). A heat receiving head 8 (see FIG. 1) for transmitting a heat value to the refrigerant liquid is provided. Here, as the heat source in the desktop computer, specifically, in addition to the CPU, a chipset, a display controller, a power supply unit, an HDD, an FDD, a CD-ROM unit, a CD-R / W unit, a DVD-ROM unit There is. The heat receiving head 8 is made of a metal material having a high heat transfer coefficient, and the inside of the heat receiving head is filled with a refrigerant liquid for transporting heat to a heat radiating portion that is separated from the heat receiving head. Water or ethylene glycol is used as the refrigerant liquid, but is not limited thereto. The refrigerant liquid is applied with pressure by a pump 7 shown, recovers heat with a heat receiving head 8, and is circulated through a tube 6.

(4) As the tube 6 for transporting the refrigerant liquid, a Cu tube having a good heat transfer coefficient and corrosion resistance is generally used, but is not limited to copper as long as it has the above-described attributes. A flexible tube such as a silicon-based tube also has the above-described attribute, and can be used. As will be described later, in particular, in a tube such as that shown in FIGS. 13 and 14, the cable is routed in the same manner as a cable. A flexible tube such as a silicon-based tube may be used instead of the Cu tube for the flow path.

The refrigerant liquid transport tube 6 is brought to the front side of the main chassis through the heat receiving head 8, the pump 7, and the main chassis opening (see FIG. 2), that is, the space between the main chassis 3 and the liquid crystal panel 5. And is fixed to the front side of the main chassis by an appropriate fixing method such as screwing or embedding to form a heat radiating portion. Here, the tube arrangement space on the front side of the main chassis is a space originally reserved for electrical wiring of the liquid crystal panel as described above, and is a new space for implementing tube piping on the front side of the main chassis 3. Since the space already reserved is used instead of the space, it does not violate the reduction in thickness and size of the entire apparatus.

As shown in FIG. 2, since the tube 6 is fixed in a spiral or zigzag structure or in a meandering manner on the front side of the main chassis, the heat generated by the CPU and the like transmitted to the refrigerant liquid is efficiently transmitted through the Cu tube. It is transmitted to the main chassis 3. Since the main chassis originally constitutes the entire computer frame connected to the stand 2, its entire area is naturally large, and it is made of a metal material. External heat can be radiated using the surface area, and highly efficient heat radiation can be achieved.

Referring to FIG. 2, the tube 6 fixed to the surface of the main chassis 3 in a spiral, for example, may leak refrigerant liquid due to heat shrinkage at the joint of the turning portion. A liquid receiver 11 for collecting the refrigerant liquid is provided below the front side of the main chassis so as to prevent the refrigerant from spilling on the stand along the chassis. Since the main chassis is normally kept upright or slightly inclined from the upright state, the leaked liquid flows down the surface of the main chassis and can be collected by the liquid receiver 11. FIG. 2 shows an example in which the liquid receiver 11 is provided on the front side of the main chassis 3, but the liquid receiver is also provided on the back side of the main chassis to collect leaking liquid that has descended along the tube. You may.

Further, the computer main body 1 is entirely covered with a cover 12, and a cover portion corresponding to a lower portion of the space between the liquid crystal panel 5 and the main chassis 3 is composed of a tube for transporting heat and a main chassis. In order to cool the radiator with air, an air inlet 13 for taking in air is provided. Similarly, an exhaust port 14 for discharging air is provided in an upper portion of the cover 12. The air circulation route from the air inlet 13 to the air outlet 14 produces a chimney effect of air, thereby further cooling the air in the heat radiating portion, and improving the cooling efficiency.

Next, as another configuration example of the first embodiment of the present invention described above, a fan for air blowing is provided in a lower portion in the cover, and air is forcibly taken in to perform heat exchange in the heat radiating portion. The air can be exhausted and the cooling efficiency can be further improved.

As described above, according to the first embodiment of the present invention, the housing (cover) of the currently used desktop computer can be used as it is without changing its size. The heat can be dissipated by utilizing the large surface area, and the heat can be dissipated from both the front and back surfaces to achieve a further heat dissipation effect. Further, it can be expected that the heat radiation efficiency is further enhanced by the chimney effect of air in the heat radiation part of the tube.

Next, FIG. 4 shows a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention. According to FIG. 4, the present embodiment has a structure in which a tube that has passed through a pump, a heat receiving head, and a main chassis opening is fixedly arranged on the back surface of a liquid crystal panel to form a heat radiating portion. Since the back surface of the liquid crystal panel is made of a metal material, heat from the refrigerant liquid in the spiral or zigzag structure or the meandering tube can be efficiently transmitted to the back surface of the liquid crystal panel to dissipate the heat.

Since the space between the liquid crystal panel and the main chassis is a space for arranging electrical wiring connected to the connector of the liquid crystal panel, as described in the embodiment shown in FIG. No special space is required for arranging the tubes to form the heat radiating portion. Therefore, also in the embodiment shown in FIG. 4, the heat radiating portion can be installed without changing the external dimensions of the current housing of the desktop computer, which can contribute to the thinning and miniaturization of the computer.

Furthermore, since the rear surface of the liquid crystal panel has a large metal surface area, heat can be efficiently dissipated using this large surface area. In addition, by opening an air intake port at the lower part of the cover that covers between the liquid crystal panel and the main chassis and providing an air exhaust port at the upper part, the upper part is exhausted from the lower intake port. An air circulation path to the outlet is formed, and an improvement in the heat radiation effect can be expected due to the so-called chimney effect.

Also, as a configuration example of the air circulation to the heat radiating unit in the embodiment shown in FIG. 1, a structure in which a fan for air blowing is provided at a lower part and / or an upper part of a cover that covers between a liquid crystal panel and a main chassis is shown. It is shown in FIG. By employing the fan shown in FIG. 10, the conveyance of air can be further promoted. Furthermore, since a large amount of cooling air can be transported by providing a fan, the lower and upper openings for intake and exhaust can be narrowed, and the device can be made thinner. In addition, there is an effect that the inflow of dust can be reduced.

Next, FIG. 5 shows a configuration relating to the liquid leakage prevention of liquid cooling of the desktop computer according to the embodiment of the present invention. This embodiment is a countermeasure method in the case where leakage of the refrigerant liquid occurs in the heat radiating portion with respect to a structure in which heat from the heat receiving head is radiated on the front side of the main chassis as shown in the embodiment shown in FIG. . In a desktop computer with a liquid crystal display composed of a computer main body and a stand, the computer main body is held on a stand in an upright state or slightly inclined from the upright state in use or non-use. The liquid leaking from the heat radiating portion where the liquid leaks easily in the cooling device leaks to the bottom of the main chassis due to the inclined state of the computer main body. Therefore, a feature of the present embodiment is to provide a liquid receiver at the lowermost portion of the main chassis.

According to FIG. 5, the liquid leaked from the heat radiating part descends along the front surface of the main chassis and is collected by the liquid receiver at the bottom of the main chassis. In FIG. 5, the liquid receiver is attached to the lowermost portion of the main chassis, but may be of an integral structure with the main chassis. Further, as another configuration example, a liquid receiver integrated with the cover (the configuration example shown in FIG. 5) may be used to collect the liquid that falls along the main chassis surface.

Further, since a connection portion or a connection portion of the refrigerant liquid tube can be considered as a portion where the liquid leakage is likely to occur, a liquid receiver may be provided on the back side of the main chassis with respect to the liquid leakage from the heat receiving head and the pump (see the above description). Fluid leaking from the tube connection will run down the outer surface of the tube and down along the back of the main chassis). Further, in order to cope with leakage liquid falling from the lowermost part of the motherboard to which the pump or the heat receiving head is attached, a liquid receiver having a structure integral with the cover may be provided at a position corresponding to the lowermost part of the motherboard. Further, a liquid receiver may be provided at a position near the computer head office on the stand.

As described above, according to the embodiments shown in FIGS. 1 and 5, it is possible to collect the leaked refrigerant liquid and prevent damage to the equipment in the stand due to the leakage of the refrigerant liquid.

Next, FIG. 6 shows a configuration relating to liquid cooling and air cooling of the desktop computer according to the embodiment of the present invention. In the embodiment shown in FIG. 6, a heat receiving head is fixed on a CPU arranged on a motherboard and heat generated by the CPU is transmitted to the heat receiving head. The heat receiving head passes through a refrigerant liquid (water or ethylene glycol) in a tube. In addition to transmitting the generated heat to the heat radiating portion on the front side of the main chassis or the rear surface of the liquid crystal panel (similar to the embodiment shown in FIGS. 1 and 4), the heat receiving head is provided with radiating fins.

In other words, the embodiment shown in FIG. 6 attempts to radiate heat that cannot be radiated from the radiation fins provided on the heat receiving head by liquid cooling. In a desktop computer, since there is room in the space between the back surface of the motherboard and the back cover, the installation of the heat radiating fins as in the present embodiment does not change the extra external size. FIG. 6B shows a structure in which a fan is further provided on the heat radiation fins on the heat receiving head. By providing the blower fan, heat radiation from the radiation fins can be efficiently and quickly performed.

As described above, since the embodiment shown in FIG. 6 applies a combination of liquid cooling and air cooling to a heat source such as a CPU, it is possible to increase the maximum heat radiation amount and increase the heat radiation efficiency. it can. In addition, even when an abnormality occurs in the liquid cooling device, such as when the refrigerant liquid such as water freezes, the operation of the computer can be continued by the air cooling effect of the radiation fins fixed to the heat receiving head. It is effective.

Next, FIGS. 7, 8 and 9 are views showing a configuration example regarding the shape and structure of the heat radiating portion in the tube. FIG. 7A is a cross-sectional view showing that a spiral tube is disposed between the liquid crystal panel and the main chassis to dissipate heat, and FIG. 7B is a cross-sectional view of FIG. FIG. 7C is a cross-sectional view showing that a helical tube is disposed between the liquid crystal panel and the main chassis, and a tube made of aluminum or the like is disposed at the center of the tube to radiate heat. It is. According to the configuration example shown in FIG. 7, the tube that has passed through the main chassis opening from the heat receiving head is guided to the back surface of the liquid crystal panel, disposed along the back surface, and then guided to the main chassis side to be guided to the front surface of the main chassis. In this case, a structure is adopted in which the heat dissipating portions are formed along the arrangement (the order of disposition may be reversed). With this structure, since both the liquid crystal panel and the main chassis can be used as heat dissipation surfaces, a further heat dissipation effect can be expected. FIG. 7 (3) is to improve the heat radiation efficiency by arranging (chewing) a metal for heat radiation such as aluminum in the central space of the spiral tube provided on the liquid crystal panel and the main chassis. Is what you do.

FIG. 8 shows a case in which a spiral tube is arranged between a motherboard provided with a heating element and a back cover, and a tubular heat-dissipating metal such as aluminum is arranged in a central space surrounded by the spiral tube. It is a configuration example showing that the operation is performed. In FIG. 8, the cover corresponding to the upper part and the lower part of the cylindrical metal is provided with an opening for air circulation and an inlet and an outlet. And, by making the tubular metal into a hollow body structure, an air path is formed from the inlet to the exhaust through the inside of the hollow body, and the heat transferred from the tube to the tubular metal is efficiently cooled by the chimney effect. Is done.

FIG. 9 (1) is a view showing that heat is dissipated by disposing a tube between the liquid crystal panel and the main chassis without contact / fixing, and FIG. 9 (2) is a view showing the liquid crystal panel and the main chassis. FIG. 6 is a view showing that the distance between the liquid crystal panel and the liquid crystal panel is substantially equal to the diameter of the tube, and the entire region of the tube contacts the liquid crystal panel and the main chassis to radiate heat.

Next, FIG. 11 shows a refrigerant liquid supply pump, a heat receiving head (water jacket W / J), a tube, a radiating system including a helical or zigzag or meandering tube radiating portion, and a flow of the refrigerant liquid. This shows the relationship with the direction. Since (1) in FIG. 11 shows the liquid flow direction as shown in the figure, the flow path from the pump to the top of the head passing through the heat radiating portion becomes longer, so that the pump capacity becomes larger by that amount. Bubbles generated in the refrigerant liquid in the evacuated tube escape upward along the flow and have a large bubble removing effect (a bubble removing port is provided at the top of the head). Also, since the liquid flow direction in FIG. 11B is as shown, the flow path from the pump to the top is shorter than that in FIG. 11A, so that the pump can be downsized. Further, in FIG. 11 (3), as described above, since a plurality of heating elements are provided outside the CPU as heat sources in the desktop computer, a plurality of heat receiving heads are provided corresponding to the plurality of heating elements. This shows that the tubes are connected in series with the heat receiving head.

Next, FIG. 12 is a schematic view showing a function of a reserve tank for replenishing the refrigerant liquid and a function of removing air bubbles in the tube heat radiating portion. According to FIG. 12, a reserve tank for a liquid reservoir is provided at the uppermost part of the circulation path of the refrigerant liquid, that is, at the upper part of the tube spiral structure (radiator). The solution functions as a replenisher. In addition, by arranging the reserve tank at the uppermost part of the liquid circulation path, bubbles generated in the circulation path escape to the tank.

Further, the shape of the tube heat radiating portion shown in FIG. 12 does not reciprocate the tube in a horizontal manner, but forms an inclined path having an angle α from the turning point and proceeds to the next turning point. I have. In this manner, by forming the liquid circulation path in the heat radiating portion in an inclined shape, bubbles in the refrigerant liquid generated in the heat radiating portion can easily escape to the reserve tank. That is, bubbles generated in the refrigerant liquid due to slight liquid leakage or the like can be quickly eliminated through the reserve tank.

Next, FIG. 13 shows a configuration example regarding liquid cooling of the desktop computer according to the embodiment of the present invention. In this embodiment, the heat radiating portion of the refrigerant liquid tube is formed on a back cover (rear cover) provided on the back side of the main body. The back cover is usually made of metal or plastic, so that the surface area from the heat radiating portion is large. Can dissipate heat to the outside air through the back cover. The plastic of the back cover has the same heat radiation characteristics as metal. Further, FIG. 13 shows a structure in which a liquid receiver for collecting the leakage liquid of the refrigerant liquid is provided below the tube heat radiating portion provided on the back cover.

In the configuration shown in FIG. 13, the back cover is removed at the time of maintenance and inspection of the computer, and various devices inside the main body are inspected. In the present embodiment, the back cover is not removed in consideration of the maintenance and inspection. , Which can be freely opened and closed with a hinge structure. In addition, the heat radiating part is installed on the back cover fixed to the main body, and for maintenance and inspection, the liquid crystal panel is tilted to the front side with the bottom side as a fulcrum, and the liquid crystal panel is opened with the side side as a fulcrum. It may be possible to check the internal devices.

Next, FIG. 14 shows a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention. In this embodiment, when viewed from the front of the computer, a liquid crystal panel, a motherboard, a main chassis, a heat radiating unit, and a back cover are arranged in this order. The back cover is configured to be detachable from the main body, a main chassis is provided facing the back cover, and a heat radiating portion is attached to the main chassis, and the heat radiating portion has an elastic function. In this configuration, heat is transferred to the back cover through the body. That is, since the heat radiating portion is in contact with the back cover without any gap via the elastic heat transfer body, the heat radiating effect is good.

According to the present embodiment, heat can be dissipated through the back cover having a large heat dissipation area, and the mounting error of the back cover can be absorbed by the elastic heat transfer body.

FIG. 1 is a cross-sectional view illustrating an overall configuration related to liquid cooling of a desktop computer according to an embodiment of the present invention. FIG. 2 is a front view in which a tube and a liquid receiver are fixed to a main chassis in the entire configuration shown in FIG. 1. FIG. 2 is a rear view in which (CPU + heat receiving head) and a pump are arranged on a motherboard in the entire configuration shown in FIG. 1. FIG. 3 is a cross-sectional view of a configuration example related to liquid cooling of the desktop computer according to the embodiment of the present invention, in which a tube is fixed to a liquid crystal panel and heat is released. FIG. 3 is a cross-sectional view illustrating a configuration example regarding prevention of liquid-cooled liquid leakage of the desktop computer according to the embodiment of the present invention. FIG. 3 is a diagram illustrating a configuration example regarding liquid cooling and air cooling of the desktop computer according to the embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a configuration example of an arrangement of tubes in liquid cooling of the desktop computer according to the embodiment. FIG. 9 is a cross-sectional view illustrating another configuration example regarding the arrangement of tubes in liquid cooling of the desktop computer according to the embodiment. FIG. 3 is a cross-sectional view illustrating an example of a configuration related to the arrangement of a tube, a main chassis, and a liquid crystal panel in liquid cooling of the desktop computer according to the embodiment. FIG. 6 is a cross-sectional view illustrating heat exhausted by a fan in a configuration related to liquid cooling of the desktop computer according to the embodiment. FIG. 3 is a schematic diagram showing the arrangement of a pump, a heat receiving head, and a tube and a liquid flow direction in liquid cooling of the desktop computer according to the embodiment. It is a schematic diagram which shows the function of the reserve tank which performs the replenishment of the refrigerant | coolant liquid in the liquid cooling of the desktop type computer which concerns on this embodiment, and the bubble removal function in a tube heat radiation part. FIG. 3 is a cross-sectional view illustrating a configuration example related to liquid cooling of the desktop computer according to the embodiment of the present invention, in which a tube and a liquid receiver are arranged on a back cover. FIG. 2 is a cross-sectional view of a configuration example regarding liquid cooling of the desktop computer according to the embodiment of the present invention, in which a tube is arranged on a main chassis facing a back cover.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Computer main body 2 Stand 3 Main chassis 4 Motherboard 5 Liquid crystal panel 6 Tube 7 Pump 8 Heat receiving head 9 CPU
10 HDD
11 Liquid receiver 12 Cover 13 Inlet port 14 Exhaust port

Claims (8)

A cooling module of a display device-integrated computer having a CPU and a flat display,
The cooling module, a refrigerant liquid circulation means comprising a tubular flow path filled with the refrigerant liquid,
A heat receiving head fixed to at least one heat generating portion including the CPU;
A part of the refrigerant liquid circulating means is vertically arranged in a clearance space on the back surface of the flat display, and the refrigerant liquid circulating through the refrigerant liquid circulating means is used as a heat transfer medium to absorb heat absorbed by the heat receiving head into the flat display. A cooling module, which radiates heat through a part of the refrigerant liquid circulating means disposed in a clearance space on the back surface of the cooling module. 2. The cooling module according to claim 1, wherein the heat receiving heads are respectively provided for heat generating units, and sequentially absorb heat of the refrigerant liquid circulating through the refrigerant liquid circulating means into a heat transfer medium. 3. 2. The cooling module according to claim 1, wherein a part of the refrigerant liquid circulating unit disposed in the gap space on the back surface of the flat display has a meandering shape or a zigzag shape. 3. A cooling jacket for a personal computer having at least one heat generating portion including a CPU and cooling the heat generating portion by a circulating refrigerant liquid,
The cooling jacket is connected in the middle of a circulation path of the refrigerant liquid, and has a heat receiving head that transfers generated heat of the heat generating portion to the refrigerant liquid, and a radiation fin that radiates heat stored in the heat receiving head into the air. A cooling jacket, characterized by: The cooling jacket is provided with the heat receiving head on a side of a heat connection surface with a CPU,
The cooling jacket according to claim 4, further comprising a radiation fin on a side of the heat receiving head that faces a heat connection surface with the CPU. A cooling jacket for a personal computer having at least one heat generating portion including a CPU and cooling the heat generating portion by a circulating refrigerant liquid,
The cooling jacket is connected in the middle of a circulation path of the refrigerant liquid, and transfers a heat generated by the heat generating portion to the refrigerant liquid, a heat radiation fin that radiates the heat reception air into the air, and a heat radiation fin. And a fan for forcibly cooling the cooling jacket. The cooling jacket is provided with the heat receiving head on a side of a heat connection surface with a CPU,
A heat radiation fin is provided on a side of the heat receiving head opposite to a heat connection surface with the CPU,
The cooling jacket according to claim 6, further comprising a cooling fan outside the radiation fin. The cooling module according to claim 1, wherein a heat radiation fine or a cooling fan is provided on a side of the heat receiving head that faces a thermal connection surface with the CPU.

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