JP2006134981A - Cooling device and electronic device equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device improved in mounting workability and cooling performance which is made thin and which has integrally unitized, with a simple structure, a comparatively big cooling device used for cooling or the like by the use of circulation of the fluid refrigerant. <P>SOLUTION: The cooling device has a heat receiving integral pump, a liquid flow path 5, two or more radiators 3 for radiating heat by heat exchange with the liquid refrigerant arranged at a part of the liquid flow path 5, a centrifugal fan 4 for ventilating the radiator 3 with air, and an exhaust port 4b formed in a fan case 4a in each direction in which radiators 3 are arranged. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In the present invention, a heat generating electronic component such as a central processing unit (hereinafter referred to as a CPU) disposed inside an electronic device casing is forced to cool a cooling system using a heat pipe or to circulate a liquid refrigerant by a pump. The present invention relates to a cooling device used for a liquid cooling method to be performed and an electronic apparatus including the same.

  Recently, the speed of data processing in computers has been very rapid, and the clock frequency of the CPU has become much larger than before. As a result, the amount of heat generated by the CPU increases, so that not only the conventional method of dissipating heat by contacting a heat sink or heat radiating fin as a heat sink, but also a method of directly cooling the heat sink with a fan or heat from a heat receiver. In a heat sink module thermally connected to a radiator using a pipe, the radiator is blown and cooled by a fan.In addition, a liquid refrigerant with high thermal conductivity is forcibly circulated using a pump, and the heat receiver and radiator Liquid cooling methods that exchange heat between them are indispensable, and further improvement in cooling capacity and reduction in size and weight are required in the future.

  Therefore, as a heat dissipation structure for heat generated from the mounted heat generating electronic component using the cooling device as described above, for example, as disclosed in (Patent Document 1), the electronic component which is a heat generating member is thermally connected. A large number of fin members are arranged on the heat receiving plate, a heat pipe in which a predetermined amount of hydraulic fluid is sealed is mounted in the fin member, and a cooling fan for cooling the fin member is disposed in the upper position. 2. Description of the Related Art Cooling devices having a duct that forms a desired ventilation path between them are known.

  FIG. 10 is a front view showing a conventional element cooling apparatus described in Patent Document 1, in which 20 is a plurality of, for example, two cooling fans arranged above the fin member 21, and 22 is a cooling fan 20. For example, a partition plate 23 that is arranged inside each fin member 21 so as to share the cooling air passage and is divided into two on both sides, is connected to the end of each cooling fan 20 and the end of each fin member 21. This is a duct that forms a passage for passing the cooling air between the fin members 21 partitioned by the partition plate 22. Next, the operation will be described. The cooling air from the two cooling fans 20 flows into the passage between the two fin members 21 on both sides formed by the partition plate 22 and the duct 23, and the cooling air is sent to the center of each fin member 21 by the partition plate 22. The parts do not interfere with each other, are distributed smoothly and flow smoothly, and are exhausted from both end sides of each fin member 21. In addition, although the case where the duct 23 was arrange | positioned perpendicularly | vertically from the edge part of the cooling fan 20 was shown, you may arrange | position to the inclination shape which connects the edge part of the cooling fan 20, and the both ends upper side of each fin member 21. FIG. .

  In this embodiment, a plurality of cooling fans 20 arranged above the fin members 21, a partition plate 22 arranged inside each fin member 21 so that each cooling fan 20 shares a cooling air passage, By providing a duct 23 that is connected to the end of the cooling fan 20 and the end of each fin member 21 and forms a passage for allowing the cooling air from the cooling fan 20 to flow between the fin members 21, a plurality of cooling is provided. It is possible to prevent the cooling air from the fan 20 from interfering with the central portion of each fin member 21 and the flow of the cooling air from stagnation. As described above, by improving the flow of the cooling air at the fin central portion, the heat dissipation characteristics at the fin central portion are improved, so that high performance and downsizing can be achieved.

Further, as another heat dissipation structure, for example, as disclosed in (Patent Document 2), a casing including an air inlet on one side and a storage chamber having an air outlet on the other side;
2. Description of the Related Art A heat dissipating fan device is known that includes a plurality of fans housed in the housing chamber that perform forward rotation and reverse rotation, respectively.

  FIG. 11 is a perspective view showing a conventional heat dissipating fan device described in Patent Document 2, in which the heat dissipating fan device of the present invention is mounted inside the computer main body, and the two air outlets of the casing 30 are connected to each other. It corresponds to the heat radiating device 31 of the central processing unit, that is, the outside of the two air outlets of the casing 30 and the heat radiating device 31 are in contact with each other, and the heat radiating device 31 is in contact with the central processing unit by the bottom. Heat energy generated when the processing apparatus is operated is transferred to the heat radiating device 31, and the heat radiating device 31 has a plurality of heat radiating fins 32, and a flow path 33 is formed between the heat radiating fins 32. The cover 34 is covered on the upper part of the radiation fins 32. Therefore, when the impellers 36 of the two fans 35 of the heat dissipation fan device are driven by a motor, cool air can be introduced from the two air inlets 37 of the casing 30 and the two air guides of the casing 30 can be introduced. Cool air is sent out from the outlets, and the cool air can cool the central processing unit and the heat dissipation device 31 outside the two air outlets.

  As described above, since the heat dissipating fan device of the present invention has the plurality of fans 35, a relatively large air volume can be obtained and the air flow can be forcibly circulated, so that the heat dissipating ability is excellent and a preferable heat dissipating efficiency is obtained. Therefore, it can be applied to a central processing unit with a high calorific value.

  Further, according to the present invention, the rotation direction of the fans 35 can be controlled to be opposite to each other, and the airflow during operation of the fans 35 can be aligned on the sides adjacent to each other of the air outlets, That is, it is possible to practice that cool air is sent out from the intermediate portion of the heat dissipation fan device, and cool air can be concentrated in the intermediate portion of the maximum temperature of the heat dissipation device 31, so that excellent heat dissipation efficiency can be obtained.

  Furthermore, as another heat dissipation structure, for example, a plurality of fins are provided in parallel along the air blowing direction in a duct provided on the fan outlet side as disclosed in (Patent Document 3). A cooling unit in which a heat radiating part of a heat pipe is attached so as to pierce the fin is known.

  FIG. 12 is a perspective view showing a conventional cooling unit described in Patent Document 3, and includes a fan 51 and a duct 52. In this heat radiating device, the air taken in by the fan 51 is exhausted from the duct 52. A plurality of fins 53 are installed inside the duct 52. The fins 53 are arranged in parallel along the air blowing direction in the duct. Since air is exhausted from the duct 52 to the outside of the portable personal computer, it is convenient to install the duct 52 on the casing of the portable personal computer. The heat pipe 54 is attached so as to pierce the fins 53 in the duct 52. A plurality of fins 53 are provided in parallel in a duct 52 provided on the air outlet side of the fan 51 along the air blowing direction, and the heat radiation side of the heat pipe 54 is attached so as to pierce the fins 53. It has a configuration. With such a structure, the exhaust from the fan 51 directly hits the heat radiation side of the heat pipe 54 in addition to the fins 53. Therefore, the heat dissipation performance is higher. Since the heat carried from the heat receiving block is efficiently dissipated by such a compact structure, the cooling structure using the cooling unit 50 is excellent in terms of space efficiency.

Such a cooling structure is a particularly effective method in the case of a product having a strong space constraint such as a portable personal computer. In other words, by applying a heat pipe, it becomes possible to arrange fins and heat sinks at positions that are not close to the heat-generating component, and the degree of freedom in increasing the size of fins and heat sinks and designing the arrangement is increased.
Japanese Patent Laid-Open No. 11-307703 Utility Model Registration No. 3089954 JP 2000-35291 A

  However, in the conventional cooling device described in (Patent Document 1) or (Patent Document 2), a semiconductor element such as a CPU which is a heat generating electronic component is used with a metal member having high thermal conductivity such as aluminum or copper. The electronic device is designed to improve the cooling efficiency by thermally connecting to the plurality of heat radiation fins via the heat receiving section and further arranging the plurality of heat radiation fins on the exhaust side of the cooling fan attached to the cooling device. First, it is necessary to install it close to the heat-generating electronic components mounted in the housing, and there are significant restrictions in designing the arrangement of the CPU mounting board and other peripheral devices in the electronic device housing, for example, It becomes difficult to arrange the heat generating electronic component at a position far away from the heat generating electronic component or the back surface side of the CPU mounting surface, and the degree of freedom in design is relatively small.

  Furthermore, if an axial fan that blows air in the direction parallel to the fan rotation axis as a cooling fan is arranged in the upper part of or adjacent to the heat dissipating fins, the vertical height of the CPU mounting board will increase and the entire electronic device will be enlarged. Even if a fan air passage is formed with ducts and covers for improving cooling efficiency, the entire air passage inside the electronic device casing is still used to secure the air flow in and out of the electronic device housing. The design flexibility is extremely limited because it is necessary to consider a typical arrangement.

  In addition, regarding the design on the cooling device side, even if the cooling device has the same structure, if the arrangement in the electronic device casing and the configuration of the air flow path for inflow and exhaust of air are different, the air flow rate of the cooling fan differs, Since performance is greatly affected, final cooling performance evaluation such as temperature rise tests in actual mounting conditions is required for each model. In other words, since a customized design with less versatility is required, it has been a problem in reducing the cost of the cooling device and the electronic equipment equipped with the cooling device.

  On the other hand, when a centrifugal fan that blows air in the direction perpendicular to the fan rotation axis is arranged adjacent to the heat radiating fins, the centrifugal fan can be used even if it can cope with the downsizing and downsizing of the entire electronic device. As a result, it is difficult to obtain sufficient cooling performance due to the shortage of air flow, and as described above, the unique layout design in the electronic device casing, the air flow design for air inflow and exhaust, and the dedicated design for the cooling device In addition, final cooling performance evaluation such as a temperature rise test in an actual mounting state is also required for each model.

  In response to the above-described problems, (Patent Document 3) uses a heat pipe as a particularly effective method in the case of a product whose space is limited, such as a portable personal computer. It has been proposed that fins and heat sinks can be placed in positions that are not close to each other, and that the degree of freedom in designing fins and heat sinks is increased. Even if the air flow is to be secured, the air inflow direction and the air discharge direction are orthogonal to each other, so that the air flow collides with the inner wall of the fan case. As a result, there is a new problem that the cooling performance is lowered.

A cooling device according to claim 1 of the present invention is an apparatus for cooling a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted. A heat receiving part to be thermally connected; a liquid flow path enclosing a liquid refrigerant that conducts heat of the heat receiving part; and a plurality of parts that dissipate heat by exchanging heat with the liquid refrigerant disposed in a part of the liquid flow path The main feature is that it has a radiator and a centrifugal fan in which the air intake direction and the exhaust direction for blowing air to the radiator are orthogonal to each other, and an exhaust port is provided in each direction where the radiator is arranged in the fan case of the centrifugal fan. .

  The cooling device according to claim 2 of the present invention is disposed in a heat receiving part thermally connected to the heat generating electronic component, a liquid flow path in which a liquid refrigerant conducting heat of the heat receiving part is enclosed, and a part of the liquid flow path The radiator includes a plurality of radiators that dissipate heat by exchanging heat with a liquid refrigerant, and a centrifugal fan in which the air intake direction and the exhaust direction for blowing air are orthogonal to the radiator, and the radiator is disposed in the fan case of the centrifugal fan In addition to providing an exhaust port in each direction, an exhaust duct that houses a radiator and forms an air passage in a predetermined direction is provided.

  The cooling device according to claim 3 of the present invention is disposed in a heat receiving part thermally connected to the heat generating electronic component, a liquid channel enclosing a liquid refrigerant that conducts heat of the heat receiving part, and a part of the liquid channel. The radiator includes a plurality of radiators that dissipate heat by exchanging heat with a liquid refrigerant, and a centrifugal fan in which the air intake direction and the exhaust direction for blowing air are orthogonal to the radiator, and the radiator is disposed in the fan case of the centrifugal fan In addition to providing an exhaust port in each direction, a plurality of centrifugal fans are arranged, and a partition plate is provided between the centrifugal fans adjacent to each other.

  According to a fourth aspect of the present invention, there is provided a cooling device comprising: a heat receiving part thermally connected to the heat generating electronic component; a liquid channel enclosing a liquid refrigerant that conducts heat of the heat receiving part; and a part of the liquid channel. The radiator includes a plurality of radiators that dissipate heat by exchanging heat with a liquid refrigerant, and a centrifugal fan in which the air intake direction and the exhaust direction for blowing air are orthogonal to the radiator, and the radiator is disposed in the fan case of the centrifugal fan In addition to providing an exhaust port in each direction, the heat receiving section is a heat receiving integrated pump having a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path.

  The cooling device according to claim 5 of the present invention is disposed in a heat receiving part thermally connected to the heat generating electronic component, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is sealed, and a part of the liquid flow path The radiator includes a plurality of radiators that dissipate heat by exchanging heat with a liquid refrigerant, and a centrifugal fan in which the air intake direction and the exhaust direction for blowing air are orthogonal to the radiator, and the radiator is disposed in the fan case of the centrifugal fan In addition to providing an exhaust port in each direction, the heat receiving part is a heat receiving integrated pump having a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path, and the liquid flow path between the heat receiving integrated pump and the radiator. It is characterized by the use of a flexible tube in part.

  The cooling device according to claim 6 of the present invention is characterized in that at least the heat receiving portion, the liquid flow path, the radiator, and the centrifugal fan are disposed on a flat substrate.

  An electronic apparatus according to a seventh aspect of the present invention includes the cooling device according to any one of the first to sixth aspects, wherein a heat receiving portion of the cooling apparatus is thermally connected to a heat generating electronic component in the electronic device casing. It is a feature.

  According to the cooling device of the present invention, the heat receiving part that is thermally connected to the heat generating electronic component, the liquid flow path in which the liquid refrigerant that conducts heat of the heat receiving part is sealed, and the liquid flow path that is disposed in a part of the liquid flow path Each direction in which a plurality of radiators that dissipate heat by exchanging heat with the refrigerant, and a centrifugal fan in which the air intake direction for blowing air to the radiator and the exhaust direction are orthogonal to each other are arranged in the fan case of the centrifugal fan By providing the exhaust port in the cooling device, the entire cooling device can be reduced in size and the cooling performance can be improved.

  In order to solve the above-mentioned problem, the invention according to claim 1 is an apparatus for cooling a heat-generating electronic component by a liquid cooling method on a substrate on which a heat-generating electronic component such as a CPU is mounted. A heat receiving part, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is sealed, and a plurality of radiators that are disposed in a part of the liquid flow path and perform heat dissipation by exchanging heat with the liquid refrigerant. The main feature is that it is equipped with a centrifugal fan in which the air intake direction for blowing air and the exhaust direction are orthogonal to the radiator, and an exhaust port is provided in each direction where the radiator is arranged in the fan case of the centrifugal fan. Since a liquid flow path in which a liquid refrigerant is enclosed is formed between a heat receiving part that is thermally connected to an electronic component and a plurality of radiators that dissipate heat, a comparison is made by setting the liquid flow path relatively long. Size Since it is not necessary to install radiators and centrifugal fans that are components close to the heat generating electronic components, the degree of freedom can be increased in designing the arrangement of the CPU mounting board and other peripheral devices in the electronic device casing, For example, it can be arranged at a position far away from the heat generating electronic component or on the back side of the CPU mounting surface.

  In addition, a centrifugal fan with the intake and exhaust directions orthogonal to each other is used as a cooling fan to exhaust smoothly in the direction of multiple radiators that dissipate heat, so the overall structure of the cooling device radiator and cooling fan can be reduced in size. In addition, the pressure loss due to the air flow colliding with the inner wall of a fan case such as an axial fan is reduced, and the noise at that time can be reduced.

  In addition, a plurality of radiators are provided, and an exhaust port is provided in each direction where the radiator is arranged in the fan case of the centrifugal fan, so that the total area of the exhaust port of the centrifugal fan can be increased. Compared to a conventional cooling device provided with an exhaust port in only one direction, the cooling performance can be greatly improved.

  The invention described in claim 2 is an invention subordinate to the invention described in claim 1, characterized in that an exhaust duct that accommodates the radiator and forms an air passage in a predetermined direction is provided. In addition to the effects of the described invention, since the exhaust duct prevents the diffusion of air passing through the plurality of radiators, the heat dissipation efficiency of the radiator is improved and the cooling performance can be further improved.

  In addition, since the direction of the air that has passed through the plurality of radiators can be controlled in a predetermined direction by the exhaust duct, for example, it can be arranged so that it can be gathered in the direction of the exhaust port of the electronic device casing and directly blown. It can also contribute to improvement.

  The invention described in claim 3 is an invention dependent on the invention described in claim 1, characterized in that a plurality of centrifugal fans are arranged, and a partition plate is provided between the adjacent centrifugal fans, In addition to the effect of the first aspect of the invention, not only can the air volume be increased by the plurality of centrifugal fans, but also the cooling air does not interfere with each other between the adjacent centrifugal fans, so the flow of the cooling air is stagnant. Therefore, air can be smoothly blown to the exhaust ports provided in the respective directions where the radiators are arranged, so that the cooling performance can be improved.

  The invention according to claim 4 is an invention dependent on the invention according to claim 1, wherein the heat receiving portion is a heat receiving integrated pump having a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path. In addition to the effects of the first aspect of the invention, the cooling device can be configured in a compact and compact form with a built-in pump in the heat receiving portion, which can contribute to downsizing of the entire cooling device.

The invention described in claim 5 is an invention dependent on the invention described in claim 4, characterized in that a universal pipe is used as a part of the liquid flow path between the heat receiving integrated pump and the radiator. In addition to the effects of the invention described in 4, the liquid flow passage is partly configured with a flexible tube, so that the heat receiving integrated pump can be handled independently from other components such as a radiator and a cooling fan. Maintenance such as fixing work for heat connection to heat generating electronic parts and replacement work of heat generating electronic parts can be easily performed.

  In addition, it is easy to place other components such as radiators and cooling fans on the back side of the mounting surface of the CPU where the universal pipe is bent and the heat receiving integrated pump is thermally connected. Also, the mountability of the cooling device to the electronic device is improved.

  The invention according to claim 6 is dependent on the invention according to any one of claims 1 to 5, and at least the heat receiving portion, the liquid flow path, the radiator, and the centrifugal fan are disposed on the flat substrate. Since the main elements constituting the cooling device are disposed and can be handled as an integrated unit, the cooling device itself can be easily assembled and incorporated into an electronic device.

  Furthermore, since the cooling device is unitized, for example, outside air on the side surface of the electronic device casing is directly sucked by a cooling fan, and an air exhaust area that has passed through the radiator can be secured. If placed on the side, etc., stable cooling performance can be secured and the versatility of the cooling device itself can be increased, so that it is possible to simplify the final cooling performance evaluation such as temperature rise tests in actual mounting conditions for each model. In addition, it is possible to reduce the price of the cooling device and the electronic device equipped with the cooling device.

  The invention described in claim 7 includes the cooling device according to any one of claims 1 to 6, wherein a heat receiving portion of the cooling device is thermally connected to a heat generating electronic component, Therefore, it is possible to provide an electronic device having a large degree of freedom in designing the arrangement of the cooling device and the CPU mounting board and other peripheral devices, and having a small size and improved cooling performance.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention relate to a liquid cooling type cooling apparatus using a liquid refrigerant mounted on a computer device as an electronic apparatus, and will be described with reference to the drawings.

(Embodiment 1)
1 to 3, FIG. 1 is a perspective view of a cooling device according to Embodiment 1 of the present invention, FIG. 2 is a front view of the cooling device according to the present invention, and FIG. 3 is a side view of the cooling device according to the present invention. In the figure, the heat receiving surface of the heat receiving integrated pump 2 of the cooling device 1 using a liquid refrigerant is pressed against the center of a CPU (not shown) with a predetermined load. The cooling device 1 is a liquid cooling type cooling device using a liquid refrigerant whose main components are a heat receiving integrated pump 2, a radiator 3, a centrifugal fan 4, a liquid flow path 5, and a reserve tank 6. The heat generated from the CPU, which is a heat generating electronic component, is transmitted to the coolant, which is the liquid refrigerant circulating inside the heat receiving surface, via the heat receiving surface located on the bottom surface 2a of the heat receiving integrated pump 2, and the temperature of the coolant rises. To do. The warmed coolant is forcedly transported by the heat receiving integrated pump 2 and passes through a free pipe 7 such as one made of a thin elastic material including rubber or PET (polyethylene terephthalate) or a composite of metal members. , And sent to the two radiators 3 connected in series by the liquid flow path 5. The radiator 3 is composed of a metal pipe 3a through which a coolant flows and a plurality of heat-radiating fins 3b such as aluminum and copper that are in thermal contact with the pipe 3a. The heat is efficiently transmitted to the plurality of radiation fins 3b. In addition, two centrifugal fans 4 in which the intake direction indicated by the arrow in FIG. 1 and the exhaust direction for blowing air to the radiator 3 are orthogonal to each other are provided, and each direction in which the radiator 3 is disposed in the fan case 4a of the centrifugal fan 4 Is provided with an exhaust port 4b indicated by a broken line, and the air sucked from the intake port 4c is smoothly exhausted in the direction of the two radiators 3. Therefore, the entire configuration of the radiator 3 and the centrifugal fan 4 of the cooling device 1 is provided. In addition, the pressure loss due to the air flow colliding with the inner wall of the fan case such as an axial fan can be reduced, and the noise at that time can be reduced. Moreover, the radiation fin 3b which comprises the radiator 3 is arrange | positioned substantially in parallel with the ventilation direction of the centrifugal fan 4, and it considers so that air volume may be increased by making an air path resistance small. In addition, since the partition plate 4d shown by the one-dot chain line in FIG. 2 is provided between two adjacent centrifugal fans 4, the cooling air does not interfere with each other in the intermediate region between the centrifugal fans 4. The stagnation of the flow can be prevented, and air can be smoothly blown in the direction of the respective exhaust ports where the radiator 3 is arranged, thereby improving the cooling performance.

  Moreover, since the exhaust port 4b provided in the fan case 4a of the centrifugal fan 4 is provided in each direction in which the radiator 3 is disposed, the total area of the exhaust port 4b can be increased, and a high air volume is ensured. However, the cooling performance is greatly improved as compared with the conventional cooling device provided with the exhaust port in only one direction.

  On the other hand, the heat receiving integrated pump 2 and the reserve tank 6 disposed on the mounting surface side of the CPU are connected to the radiator 3 disposed on the back side of the CPU mounting surface by the liquid flow path 5. Since the free pipe 7 is used, other components such as the radiator 3 and the centrifugal fan 4 can be easily arranged, the degree of freedom in design of the arrangement is increased, and the cooling device 1 can be mounted on an electronic device. Will also improve.

  Further, the two exhaust ducts 8 respectively accommodate the two radiators 3 and are provided with exhaust ports 8a of the exhaust duct 8 indicated by broken lines in FIG. 1, and the air passages in the direction indicated by the arrows in FIG. Therefore, it is possible to arrange the electronic device casings so as to be gathered in the direction of the exhaust port of the electronic device casing so that the air can be directly blown, thereby improving the exhaust efficiency. As for the material of the exhaust duct 8 and the flat substrate 9, it is preferable to use a metal material having high heat conductivity when cooling performance is more important, and the effect of promoting heat dissipation from the radiator may be increased. Although possible, a molded product made of a resin material may be used for weight reduction and cost reduction.

  Furthermore, the heat receiving integrated pump 2, the liquid flow path 5, the radiator 3, and the centrifugal fan 4, which are at least main elements constituting the cooling device 1, are arranged on one surface of the flat substrate 9, Can be handled as an integrated unit, making it easy to assemble the cooling device itself and to incorporate it into electronic equipment.

  Next, FIG. 4 is an overall perspective view showing a state before the cooling device according to the first embodiment of the present invention is attached to the electronic device. The cooling device 1 integrated as a unit is the bottom surface or side surface of the electronic device 10. FIG. 6 is a state diagram before being mounted on the storage unit 12 which is located in the rear cover 11 and is located at the position; Since the cooling device 1 is disposed on one surface of the flat substrate 9, it can be inserted in the direction of the arrow along a plurality of guides 13 provided on both sides of the storage unit 12 of the electronic device 10. It has a structure. Further, since the rear cover 11 is provided with an opening 11a in which the air inlet 4c of the centrifugal fan 4 of the cooling device 1 is opened, the structure is such that air outside the electronic device can be easily taken in.

  FIG. 5 is an overall perspective view showing a state after the cooling device according to Embodiment 1 of the present invention is attached to an electronic device, and the state after the cooling device 1 is attached to the storage unit 12 covered with the rear cover 11. FIG. On the other hand, the front cover 14 provided with the opening 11a as in the case of the rear cover 11 has a plurality of guides 13 provided on both sides of the storage unit 12 of the electronic device 10 after the cooling device 1 is stored in a predetermined position. Can be inserted in the direction of the arrow and fixed with screws. Therefore, the cooling device 1 according to the present invention can be easily incorporated into the electronic apparatus having such a structure. Naturally, the CPU replacement operation can be handled as a unit in which the removal and attachment of the cooling device 1 are integrated, so that it is easier than the conventional cooling device.

FIG. 6 is an overall side view showing a state after the cooling device according to the first embodiment of the present invention is attached to an electronic device. The heat receiving integrated pump 2 including the cooling device according to the present invention and serving as a heat receiving portion of the cooling device is shown in FIG. It is a state diagram arranged so as to be thermally connected to the heat generating electronic component, and since the cooling device 1 is arranged on the side surface side of the electronic device 10, the width of the entire electric device is reduced and the centrifugal fan 4 The air intake area can be arranged on the side of the electronic device 10, and the air exhaust area that has passed through the radiator 3 can be secured on the back side opposite to the direction in which the operator of the electronic device is located, so that it is stable without affecting the operator. Cooling performance can be obtained.

  It should be noted that there is no problem at all in other forms of the centrifugal fan intake area and the air exhaust area that has passed through the radiator as long as the workability for mounting the cooling device and the cooling performance itself are appropriate. For example, in order to further increase the air flow rate, an opening similar to the opening 11a formed by the front cover 14 and the rear cover 11 is also provided in the flat base material 9, and the centrifugal fan 4 is used from both the front and back surfaces. A structure that can take in air is also preferable, and in that case, it is desirable to design so that the opening is not located in the vicinity of the heat generating electronic component in consideration of an increase in air temperature inside the electronic device casing.

(Embodiment 2)
FIG. 7 is a front view of the heat radiating portion of the cooling device according to Embodiment 2 of the present invention, and is a diagram schematically showing only the heat radiating portion including at least the radiator 3. The two radiators 3 are connected in parallel to the liquid flow path 5, and the liquid flow paths 5 are connected to the respective radiators 3 in the cooling liquid feed direction between the heat receiving portion (not shown) and the radiator 3. The liquid flow path 5 is branched and the liquid flow path 5 is coupled in the return direction of the coolant, and the coolant is circulated in the direction of the arrow. Since the two radiators 3 are connected in parallel to the liquid flow path 5, the heat conducted from the heat receiving portion to each radiator 3 via the liquid flow path 5 is evenly dissipated. ing.

(Embodiment 3)
FIG. 8 is a front view of the heat dissipating part of the cooling device according to Embodiment 3 of the present invention, and is a diagram schematically showing only the heat dissipating part including at least the radiator 3. The radiator 3 is arranged on the three side surfaces of the fan case 4a of the centrifugal fan 4, the pipe 3a is thermally connected to each radiator 3, and the liquid flow path 5 for the cooling liquid is formed in a substantially loop shape. Thus, the radiator 3 is arranged at the exhaust port of the air blown from the centrifugal fan 4, and the total area for heat exchange with the liquid refrigerant to dissipate heat can be increased, so that the cooling performance can be improved. FIG. 9 is a rear view of the heat radiating portion of the cooling device according to the third embodiment of the present invention. In order to further increase the total air volume, the centrifugal fan 4 can suck air from the back side of the flat substrate 9. The flat base material 9 is provided with an opening 9a so that air can be sucked from both the front and back surfaces, thereby increasing the total air intake area.

  In the description of each of the above embodiments, the cooling device is a liquid cooling system that uses a liquid refrigerant as the cooling device, and the heat receiving integrated pump 2 that is a main element of the cooling device is a flat substrate 9. The other radiator 3, the centrifugal fan 4, and the liquid flow path 5 that are disposed on one surface are disposed on the opposite surface of the flat substrate 9. The number of fans and radiators used, their positions, their placement method, and their connection method are not limited to this embodiment, and even if all the components are placed on one side, No problem.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a cooling device that cools a heat-generating electronic component while circulating a liquid refrigerant and an electronic apparatus including the same.

The perspective view of the cooling device in Embodiment 1 of this invention Front view of cooling device according to Embodiment 1 of the present invention Side view of cooling device according to Embodiment 1 of the present invention. Whole perspective view which shows the state before attachment to the electronic device of the cooling device in Embodiment 1 of this invention Whole perspective view which shows the state after the attachment to the electronic device of the cooling device in Embodiment 1 of this invention Whole side view which shows the state after attachment to the electronic device of the cooling device in Embodiment 1 of this invention Front view of heat dissipation part of cooling device in embodiment 2 of the present invention Front view of heat dissipating part of cooling device in embodiment 3 of the present invention The rear view of the heat sink of the cooling device in Embodiment 3 of the present invention The front view which shows the element cooling device of the conventional patent document 1 The perspective view which shows the conventional heat dissipation fan apparatus of patent document 2 The perspective view which shows the cooling unit of the conventional patent document 3

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat receiving integrated pump 2a Bottom surface of heat receiving integrated pump 3 Radiator 3a Pipe 3b Radiation fin 4 Centrifugal fan 4a Fan case 4b Exhaust port 4c Intake port 4d Partition plate 5 Liquid flow path 6 Reserve tank 7 Free pipe 8 Exhaust duct 8a Exhaust Duct exhaust port 9 Flat substrate 9a Opening portion 10 Electronic device 11 Rear cover 11a Opening portion 12 Storage portion 13 Guide 14 Front cover 20 Cooling fan 21 Fin member 21a One end side 22 Partition plate 23 Duct 24 Pipe member 25 Heat receiving plate DESCRIPTION OF SYMBOLS 30 Casing 31 Heat radiation apparatus 32 Radiation fin 33 Flow path 34 Cover 35 Fan 36 Impeller 37 Air inlet 38 Lower casing 39 Upper casing 40 Radiation fin 41 Connection screw 50 Cooling unit 51 Fan 52 Duct 53 Fin 54 Heat pipe

Claims (7)

A device for cooling the heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a central processing unit is mounted, and a heat receiving portion thermally connected to the heat generating electronic component, and conducting heat of the heat receiving portion A liquid flow path in which a liquid refrigerant is sealed, a plurality of radiators arranged in a part of the liquid flow path to dissipate heat by exchanging heat with the liquid refrigerant, and an intake direction for blowing air to the radiator A cooling device comprising: a centrifugal fan having exhaust directions orthogonal to each other, wherein an exhaust port is provided in each direction in which the radiator is disposed in a fan case of the centrifugal fan. The cooling device according to claim 1, further comprising an exhaust duct that accommodates the radiator and forms an air passage in a predetermined direction. The cooling device according to claim 1, wherein a plurality of the centrifugal fans are arranged, and a partition plate is provided between the centrifugal fans adjacent to each other. 2. The cooling device according to claim 1, wherein the heat receiving unit is a heat receiving integrated pump having a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path. The cooling apparatus according to claim 4, wherein a universal pipe is used as a part of a liquid flow path between the heat receiving integrated pump and the radiator. The cooling device according to any one of claims 1 to 5, wherein at least the heat receiving portion, the liquid flow path, the radiator, and the centrifugal fan are disposed on a flat substrate. An electronic apparatus comprising the cooling device according to any one of claims 1 to 6, wherein a heat receiving portion of the cooling device is thermally connected to a heat generating electronic component.

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