JP2006163563A - Cooling device and electronic equipment having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device that is a relatively large device used for cooling, or the like utilizing the circulation of the refrigerant of liquid, is made compact, and improves cooling performance and fitting working efficiency. <P>SOLUTION: The cooling device comprises a heat reception integral pump 2 thermally connected to a heat generation electronic component; a liquid flow path 5 in which the liquid refrigerant for conducting heat is sealed; a radiator 3 that is arranged at one portion of the liquid flow path 5 and heat-exchanges with the liquid refrigerant for radiating heat; and an axial flow fan 4 for blowing air in the direction of the radiator 3. The axial flow fan 4 and the radiator 3 are arranged opposingly so that the air supply/exhaust direction of the axial flow fan 4 is the same as the ventilation direction of the radiator 3, and an exhaust duct 7 is provided in the exhaust direction of the radiator 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention uses a cooling system using a heat pipe or a pump for the purpose of forcibly cooling a heat generating electronic component such as a central processing unit (hereinafter referred to as a CPU) disposed inside a casing of an electronic device. The present invention relates to a cooling device used in a liquid cooling method for forcibly circulating a liquid refrigerant and an electronic device including the same.

  Recently, the speed of data processing in computers has been very rapid, and the clock frequency of the CPU has become much larger than before. As a result, the amount of heat generated by the CPU increases, so that not only the conventional method of dissipating heat by contacting the heat sink or heat dissipating fins with the heat generator, but also the method of directly cooling the heat sink with a fan, or the heat receiving unit In a heat sink module thermally connected to the heat radiating part using a heat pipe, the heat radiating part is blown and cooled by a fan, or a liquid refrigerant having high thermal conductivity is forcibly circulated using a pump, and the heat receiving part and the heat radiating part A liquid cooling method for exchanging heat between the two is indispensable, and further improvement in cooling capacity and reduction in size and weight are required in the future.

  Therefore, as a cooling device that dissipates heat generated from the mounted heat generating electronic component, for example, as disclosed in (Patent Document 1), heat connection is performed using a heat generating electronic component that is a heating element and a heat pipe. As a structure of the heat dissipating part, a plurality of heat dissipating fins are provided in parallel along the air blowing direction in a duct provided on the fan outlet side of the fan so as to pierce the plurality of heat dissipating fins. There is known a cooling unit in which a heat pipe heat dissipating part is attached.

  FIG. 8 schematically shows an enlarged view of a cooling unit 20 that is a heat radiating portion of the cooling device, and includes a fan 21 and a duct 22. In the heat radiating portion of this cooling device, the air sucked by the fan 21 is exhausted from the duct 22 by changing the direction of the air flow in a substantially right angle direction along the shape of the inner wall of the fan case 25 that houses the fan 21. Yes. A plurality of heat radiation fins 23 are arranged in parallel inside the duct 22 along the air blowing direction in the duct 22, and the heat radiation side of the heat pipe 24 is attached so as to pierce the heat radiation fins 23 in the duct 22. . With such a structure, heat carried from a heat receiving block (not shown) is efficiently dissipated, so that the cooling body using the cooling unit 20 is excellent in terms of space efficiency. .

In addition, since air from the duct 22 is exhausted to the outside of the portable personal computer on which the cooling device is mounted, it is easy to install the duct 22 on the casing of the portable personal computer. Such a cooling device is particularly effective in the case of a product having a strong space constraint such as a portable personal computer. In other words, by applying heat pipes, radiation fins and heat sinks can be placed at positions that are not close to heat-generating electronic components, and the degree of freedom of design of the layout and layout of the radiation fins and heat sinks is increased. .
JP 2000-35291 A (page 4, FIG. 2)

  However, such a cooling device is particularly effective for a product such as a portable personal computer in which the interior is space-constrained. By applying a heat pipe, a heat generating electronic component that is a heating element is used. It is possible to place heat-dissipating fins and heat sinks at positions that are not close to each other, and a method to increase the degree of freedom in designing the arrangement of the heat-dissipating fins and heat sinks in the housing of the electronic equipment is proposed. However, even if an axial flow fan is used to secure a high air volume in this way, the inflow direction of the air and the exhaust direction are orthogonal to each other. Since the direction of the collision is changed to a substantially right angle, not only the air flow rate is significantly reduced and the cooling performance is degraded, but also the fan noise increases due to local pressure loss. There was a new problem that.

  In order to solve the above problems, a cooling device according to the present invention is a device that cools a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted, and is a heat receiving member that is thermally connected to the heat generating electronic component. A liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving section is enclosed, a radiator that is disposed in a part of the liquid flow path and performs heat exchange with the liquid refrigerant, and in the direction of the radiator The main feature is that it is equipped with an axial fan with the same direction of intake and exhaust as it blows air, and is arranged so that the intake and exhaust directions of the axial fan and the ventilation direction of the radiator are the same. Since it is the same as the ventilation direction of the radiator without changing the exhaust direction, it is possible to smoothly blow air to the radiator, so that it is possible to secure the amount of air necessary for cooling. In addition, since local pressure loss can be reduced, fan noise can be suppressed.

  According to the cooling device of the present invention, the heat receiving part that is thermally connected to the heat generating electronic component, the liquid flow path in which the liquid refrigerant that conducts heat of the heat receiving part is sealed, and the liquid flow path that is disposed in a part of the liquid flow path A radiator that dissipates heat by exchanging heat with the refrigerant, and an axial fan that has the same direction of intake and exhaust as the direction of the radiator, so that the intake and exhaust directions of the axial fan and the direction of the radiator are the same Thus, it is possible to improve the cooling performance, and to provide a cooling device that can be easily incorporated into an electronic device with less restrictions on the mounting position while suppressing fan noise.

  In order to solve the above-mentioned problem, the invention according to claim 1 is an apparatus for cooling a heat-generating electronic component by a liquid cooling method on a substrate on which a heat-generating electronic component such as a CPU is mounted. A heat receiving part, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is enclosed, a radiator that is disposed in a part of the liquid flow path and radiates heat by exchanging heat with the liquid refrigerant, and a radiator The main feature is that it is equipped with an axial fan with the same direction of intake and exhaust as to blow air in the same direction, and is placed so that the intake and exhaust directions of the axial fan and the ventilation direction of the radiator are the same. A fan case in which an axial fan with the same intake direction and exhaust direction as a fan is arranged facing the almost entire area of the plurality of radiating fins and heat pipes constituting the radiator and accommodates the fan The air flow direction is not forcibly changed by the throat, so that an almost uniform and sufficient air volume can be secured on the entire surface of the heat radiating fins forming the radiator, and heat is efficiently radiated from the radiator. The heat dissipation can be improved, and the fan noise can be suppressed without unnecessary local pressure loss.

  In addition, the space between the heat receiving part that is thermally connected to the heat generating electronic component and the radiator that dissipates heat is composed of a liquid flow path in which a liquid refrigerant is sealed, so by setting the liquid flow path long as necessary Since it is not necessary to install radiators and axial fans, which are relatively large components, close to the heat-generating electronic components, the arrangement of the CPU mounting board and other peripheral devices inside the housing of the electronic device is designed. The degree of freedom increases, and it is easy to incorporate into electronic devices.

  Furthermore, it is also possible to install axial fans and radiators, which are the main elements belonging to the heat dissipation part of the cooling device, at any location, for example, away from heat-generating electronic components or on the back side of the CPU mounting surface of the motherboard. Accordingly, the restriction on the arrangement of the inside of the casing of the electronic device is reduced, and the degree of freedom of the layout design inside the casing of the electronic apparatus is improved.

  The invention described in claim 2 is an invention dependent on the invention described in claim 1, and is an apparatus for cooling a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted. A heat receiving part that is thermally connected to the liquid, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is enclosed, and a radiator that is disposed in a part of the liquid flow path and performs heat dissipation by exchanging heat with the liquid refrigerant. In addition to the axial flow fan in which the intake direction and the exhaust direction for blowing air in the direction of the radiator are the same direction, the axial flow is arranged so that the intake / exhaust direction of the axial flow fan and the ventilation direction of the radiator are the same. It is characterized in that an exhaust duct is provided in the exhaust direction of the radiator with the fan arranged opposite to it, and an exhaust duct is provided in the exhaust direction of the radiator with the axial flow fan arranged in opposition, so that heat exchange with the radiator is possible. Ri warmed air can smoothly be discharged from the exhaust port provided in the housing of an electronic device without staying in the inside of the housing of an electronic device, it is possible to further improve the cooling performance of the entire electronic device.

  In addition, when used in a casing of an electronic device that places importance on quietness and operability, the direction of the air exhausted in a predetermined direction can be controlled, so the exhaust vents arranged at the rear of the casing or at the bottom of the casing By connecting to the air flow path, it is possible to form an air flow path that has little influence on the operator's work environment.

  The invention described in claim 3 is an invention subordinate to the invention described in claim 2, and is an apparatus for cooling a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted. A heat receiving part that is thermally connected to the liquid, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is enclosed, and a radiator that is disposed in a part of the liquid flow path and performs heat dissipation by exchanging heat with the liquid refrigerant. , Equipped with an axial fan with the same direction of intake and exhaust as the direction of the radiator, and arranged so that the intake and exhaust directions of the axial fan and the ventilation direction of the radiator are the same, the axial fan is opposed In addition to providing an exhaust duct in the exhaust direction of the arranged radiator, the exhaust duct houses the radiator, and the exhaust duct also serves as the outer member of the radiator. Because it placed the fin and pipes, also reduced production becomes easier the number of parts that make up the radiator.

  In addition, when using a metal material with good thermal conductivity as the production member of the exhaust duct, when it also serves as the outer member of the radiator, the exhaust duct itself has heat dissipation due to the heat conduction from the radiation fin, Not only can the direction of the air flow exhausted from the radiator be controlled, but also the heat dissipation performance of the radiator itself can be improved.

  The invention described in claim 4 is an invention dependent on the invention described in claim 1, and is an apparatus for cooling a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted. A heat receiving part that is thermally connected to the liquid, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is enclosed, and a radiator that is disposed in a part of the liquid flow path and performs heat dissipation by exchanging heat with the liquid refrigerant. In addition to the axial flow fan in which the intake direction and the exhaust direction for blowing air in the direction of the radiator are the same direction, the intake and exhaust directions of the axial flow fan and the ventilation direction of the radiator are arranged to face each other, in addition to the heat receiving portion Is a heat receiving integrated pump with a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path. In addition to the effect of the invention of claim 1, the compact and compact with a built-in pump in the heat receiving part. Cold in various forms Can be constructed a device, the overall size of the cooling device becomes easier.

  The invention described in claim 5 is an invention dependent on the invention described in claim 4, and is an apparatus for cooling a heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a CPU is mounted. A heat receiving part that is thermally connected to the liquid, a liquid flow path in which a liquid refrigerant that conducts heat of the heat receiving part is enclosed, and a radiator that is disposed in a part of the liquid flow path and performs heat dissipation by exchanging heat with the liquid refrigerant. , Equipped with an axial flow fan with the same direction of intake and exhaust as to the direction of the radiator, and arranged so that the intake and exhaust directions of the axial flow fan and the ventilation direction of the radiator are the same, the heat receiving part is liquid In addition to being a heat receiving integrated pump with a built-in pump that forcibly circulates the refrigerant in the liquid flow path, a universal pipe was used as part of the liquid flow path provided between the heat receiving integrated pump and the radiator. The heat receiving part Since a universal pipe is used for a part of the liquid flow path provided between the heat receiving integrated pump and the radiator as the heat radiating unit, the heat receiving integrated pump is connected to other components such as a radiator, an axial fan, and an exhaust duct. Since the positional relationship can be handled independently within a certain range, for example, fixing work for heat connection to a heat generating electronic component such as a CPU or replacement work of the heat generating electronic component is improved and maintenance can be performed easily. .

  In addition, it is easy to bend the flexible tube and thermally connect the heat receiving integrated pump to the mounting surface side of the CPU, which is a heating element, and arrange other components such as a radiator, an axial fan, and an exhaust duct on the back side of the motherboard. Therefore, the degree of freedom in layout design including peripheral devices is further increased.

  The invention described in claim 6 is characterized in that the cooling device according to any one of claims 1 to 5 is provided, and a heat receiving portion of the cooling device is thermally connected to a heat generating electronic component. This is an electronic device whose part is thermally connected to a heat generating electronic component, and it becomes possible to improve the cooling performance of the entire electronic device, improve the processing capability of the electronic device, such as the CPU, and ensure more stable operation state .

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention relate to a liquid cooling type cooling apparatus using a liquid refrigerant mounted on a computer device as an electronic apparatus, and will be described with reference to the drawings.

(Embodiment 1)
1 to 3, FIG. 1 is a perspective view of a cooling device according to the present invention, FIG. 2 is a front view of the cooling device according to the present invention, and FIG. 3 is a side view of the cooling device according to the present invention. The heat receiving surface of the heat receiving integrated pump 2 of the cooling device 1 using this refrigerant is pressed against the center of a CPU (not shown) with a predetermined load. The cooling device 1 is a liquid cooling type cooling device using a liquid refrigerant whose main components are a heat receiving integrated pump 2, a radiator 3, an axial fan 4, a liquid flow path 5, a reserve tank 6, and an exhaust duct 7. is there.

  The heat generated from the CPU, which is a heat generating electronic component, is transmitted to the coolant, which is the liquid refrigerant circulating inside the heat receiving surface, through the heat receiving surface located on the bottom surface 2a of the heat receiving integrated pump 2, which is the heat receiving portion. Temperature rises. The warmed coolant is forcedly transported by the heat receiving integrated pump 2 and passes through a free pipe 8 such as one made of a thin elastic material including rubber or PET (polyethylene terephthalate) or a composite of metal members. And sent to the radiator 3 connected in series by the liquid flow path 5. The radiator 3 is accommodated in an exhaust duct 7 and is composed of a metal pipe 3a through which a coolant flows and a plurality of heat radiating fins 3b having good thermal conductivity such as aluminum and copper in thermal contact with the pipe 3a. The heat of the coolant that is configured and warmed is efficiently transmitted to the plurality of heat radiation fins 3b.

  Furthermore, an axial fan 4 is provided that exhausts air in the same direction as the intake direction indicated by the arrow in FIG. 1 and blows air in the ventilation direction of the radiator 3, and one of the radiators 3 accommodated in the exhaust duct 7 is provided. The axial fan 4 is held by the fan case 4 a so as to face the surface, and the air introduced from the air inlet of the fan case 4 a is blown substantially parallel to the rotational axis of the axial fan 4. The structure is such that substantially uniform cooling air can be applied to the entire area of the plurality of heat dissipating fins 3b and the metal pipe 3a disposed in the fan case 4a.

  Further, the heat receiving integrated pump 2 arranged on the mounting surface side of the CPU is connected to the radiator 3 as a heat radiating unit using a flexible tube 8 having flexibility, so that the radiator 3, the axial fan 4 and the reserve are easily provided. Since other components such as the tank 6 and the exhaust duct 7 can be arranged at positions away from the heat generating electronic components such as the CPU, and the degree of freedom in designing the arrangement increases, the cooling device 1 can be mounted on the electronic device. It is easy to install. The fixing member 9 attached to the upper surface of the heat receiving integrated pump 2 is a member for thermally connecting the bottom surface 2a of the heat receiving integrated pump 2 to a heat generating electronic component such as a CPU, and fixing screws 9a are attached in advance at four locations. In addition, by being fixed to a predetermined screw hole on the mounting board side, the thermal connection to the upper surface of a heat generating electronic component such as a CPU can be easily performed.

  On the other hand, FIG. 4 is a front view for explaining the exhaust duct containing the radiator of the cooling device according to the present invention. The axial flow fan 4, the fan case 4 a, and the liquid flow path 5 connected to the heat receiving integrated pump 2 side first. Although the connected portion is omitted, the exhaust duct 7 accommodates the radiator 3, and the exhaust duct 7 also serves as an outer member of the radiator 3. Since the heat dissipating fins 3b having good thermal conductivity such as aluminum and copper through which the pipe 3a penetrates and is in thermal contact are arranged at predetermined positions, the radiator 3 is a component constituting the outer member. The number of points is reduced, making production easier. Here, the exhaust duct 7 is a resin molded product. However, when the exhaust duct 7 is made of a metal material having good heat conductivity such as stainless steel or aluminum as a production member, the exhaust duct 7 also serves as an outer member of the radiator 3. The exhaust duct 7 itself has heat dissipation due to heat conduction from the radiation fins 3b, and not only controls the direction of the air flow exhausted from the radiator 3, but also improves the heat dissipation performance of the radiator 3 itself. Is possible.

  Next, FIGS. 5 to 7 are an internal perspective view, an internal front view, and an internal side view of the electronic apparatus, respectively, illustrating a state after the cooling device according to the present invention is attached. Here, as shown in FIG. 7, the heat receiving integrated pump 2 that is the heat receiving unit is thermally connected to the CPU 16 that is the heat generating electronic component, and the liquid refrigerant is accommodated in the heat receiving integrated pump 2 and the exhaust duct 7. The radiator 3 is circulated through the free pipe 8 and the liquid flow path 5. On the other hand, the axial fan 4, the radiator 3, and the exhaust duct 7 constituting the heat radiating unit are fixed adjacent to the power source 11 located in the upper part of the interior 10 of the electronic device, so The HDD 13, the PCI card 14, the memory board 15, etc., which are the main components of the electronic device, are arranged at predetermined positions in the direction of the component mounting surface side, and the heat receiving integrated pump 2 is restricted in position by the universal pipe 8. Therefore, the components in the entire interior of the housing 10 of the electronic device are compactly arranged without affecting the arrangement of these main parts.

  That is, since only the heat receiving integrated pump 2 is disposed on the upper surface of the CPU 16 that is a heat generating electronic component mounted on the motherboard 12, the HDD 13 is directly above the heat receiving integrated pump 2. The space inside the casing 10 of the electronic device is utilized to the maximum extent.

  On the other hand, as shown in FIGS. 5 and 6, an air path is formed so that the exhaust port 7a of the exhaust duct 7 can be installed on the back side of the casing 10 of the electronic device. It has a structure that reduces the influence of noise and exhaust air directly on the operator's work environment.

  In the embodiment described above, the cooling device is a liquid cooling method using a liquid refrigerant as the cooling device, and the heat receiving integrated pump that is the main component, the radiator that is the other component, the shaft The number, arrangement position, arrangement method, and mutual connection method of the flow fan, the liquid flow path, the reserve tank, and the exhaust duct are not limited to the present embodiment. There is no particular problem even if some of these components are arranged on the other surface of the mounting surface.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a cooling device that cools a heat-generating electronic component while circulating a liquid refrigerant and an electronic apparatus including the same.

The perspective view of the cooling device in Embodiment 1 of this invention Front view of cooling device according to Embodiment 1 of the present invention Side view of cooling device according to Embodiment 1 of the present invention. The front view explaining the exhaust duct of the cooling device in Embodiment 1 of this invention The internal perspective view of the electronic device which shows the state after attachment of the cooling device in Embodiment 1 of this invention The internal front view of the electronic device which shows the state after attachment of the cooling device in Embodiment 1 of this invention The internal side view of the electronic device which shows the state after attachment of the cooling device in Embodiment 1 of this invention Explanatory drawing which shows the cooling device of conventional patent document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat receiving integrated pump 2a Bottom surface of heat receiving integrated pump 3 Radiator 3a Pipe 3b Radiation fin 4 Axial fan 4a Fan case 5 Liquid flow path 6 Reserve tank 7 Exhaust duct 7a Exhaust port 8 Free pipe 9 Fixing member 9a Fixing screw 10 Electronic device casing 11 Power supply 12 Motherboard 13 HDD
14 PCI card 15 Memory board 16 CPU
17 ODD
20 Cooling Unit 21 Fan 22 Duct 23 Heat Dissipation Fin 24 Heat Pipe 25 Fan Case

Claims (6)

A device for cooling the heat generating electronic component by a liquid cooling method on a substrate on which a heat generating electronic component such as a central processing unit is mounted, and a heat receiving portion thermally connected to the heat generating electronic component, and conducting heat of the heat receiving portion A liquid flow path in which a liquid refrigerant is enclosed; a radiator that is disposed in a part of the liquid flow path and performs heat exchange with the liquid refrigerant; and an intake direction and an exhaust direction in which air is blown toward the radiator A cooling device comprising axial fans in the same direction and arranged to face each other so that the intake / exhaust direction of the axial fans is the same as the ventilation direction of the radiator. The cooling device according to claim 1, wherein an exhaust duct is provided in an exhaust direction of the radiator in which the axial fan is disposed so as to face the axial flow fan. The cooling device according to claim 2, wherein the exhaust duct accommodates the radiator. 2. The cooling device according to claim 1, wherein the heat receiving unit is a heat receiving integrated pump having a built-in pump for forcibly circulating a liquid refrigerant in the liquid flow path. 5. The cooling device according to claim 4, wherein a universal pipe is used as a part of the liquid flow path provided between the heat receiving integrated pump and the radiator. An electronic apparatus comprising the cooling device according to claim 1, wherein a heat receiving portion of the cooling device is thermally connected to a heat generating electronic component.

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