CN100418037C - Cooler for electronic equipment - Google Patents
Cooler for electronic equipment Download PDFInfo
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- CN100418037C CN100418037C CNB200480018168XA CN200480018168A CN100418037C CN 100418037 C CN100418037 C CN 100418037C CN B200480018168X A CNB200480018168X A CN B200480018168XA CN 200480018168 A CN200480018168 A CN 200480018168A CN 100418037 C CN100418037 C CN 100418037C
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- coldplate
- path
- electronic equipment
- cooling device
- cooling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a thin cooler for electronic equipment, having a large heat radiation area and preventing leakage of a refrigerant. A cooler has a first and a second cooling panel (1, 2) respectively having flow paths (11, 21) formed by joining a lower heat radiation plate and an upper heat radiation plate, the plates having groove portions formed in them, and a circulation pump (3) for circulating a refrigerant in the flow paths (11, 21). In the upper heat radiation plate of the second cooling panel (2) are formed an outflow opening from which the refrigerant flows out from the flow path (21) toward the circulation pump (3) and an inflow opening from which the refrigerant flows in from the circulation pump (3) toward the flow path (21). The circulation pump (3) is fixed to the upper heat radiation plate of the cooling panel (2) such that a suction port and a discharge port are aligned with the outflow opening and the inflow opening, respectively.
Description
Technical field
The present invention relates to a kind of cooling device of electronic equipment, particularly relate to and a kind ofly be applicable to that cooling is loaded in the cooling device of electronic equipment of the heat release parts of the CPU of subnotebook PC etc. etc.
Background technology
In the electronic equipment of in recent years PC etc., to follow increase and high speed, and load the heat release parts of the big CPU of consumed power etc. in the calculation process amount, the heat that above-mentioned heat release parts produce constantly increases.Employed various electronic unit in these electronic equipments, temperature dependency from heat-resisting reliability and operating characteristic, because usually its serviceability temperature scope is limited, so in these electronic equipments, the establishment that the heat that takes place in inside is discharged to outside technology expeditiously becomes the task of top priority.
Generally in the electronic equipment of PC etc., install as the metal fin of heat sink and so-called heat pipe etc. at CPU etc., to all heat diffusion of electronic equipment be installed on the fan of cooling usefulness of the electromagnetic type of cabinet, emit heat to the outside by heat conduction from electronic equipment internal.
Subnotebook PC for example, in the electronic equipment that has assembled electronic unit to high-density, the heat-dissipating space of electronic equipment internal is very little, by the existing cooling fan of independent use, or the existing cooling device of cooling fan and heat pipe combination, can cool off the CPU of the consumed power about 30W.But, among the CPU of the consumed power more than this, distribute its inner heat fully and just become difficult.
And, having under the situation of heat release, the big cooling fan of draft capacity must be set, particularly when using the cooling fan of electromagnetic type, because the noise of the sound of the wind of its rotary blade etc., so destroyed quietness greatly.Therefore in addition, in the computer that server is used, along with the increase of popularity rate, the requirement of miniaturization and quietization also becomes strongly, for the distributing of heat, has also produced the problem same with subnotebook PC.
Therefore, in order effectively the heat release that increases to be dispersed into the outside, and the cooling device of the liquid cooling mode that makes circulate coolant is discussed.For example; the cooling device of the liquid cooling mode of putting down in writing in special Open 2003-67087 communique is as follows: possessing the bottom of acceptance from the PC main body section of the head that is heated of the heat of the heat release parts generation of PC main body section, disposed housing with following equipment, comprising: by the connector of head transmission that be heated from the heat of heat release parts; Be connected in connector and be filled with the pipeline of cooling medium; The pump of circulating coolant.
In the existing technology of above-mentioned communique record, because being circulated in the pipeline of the bottom that is disposed at the PC main body section, cooling medium constitutes, so can not guarantee area of dissipation fully, exist cooling effectiveness low, and problem that can't the cooling device slimming.
Summary of the invention
The present invention is point in view of the above-mentioned problems, and its purpose is to provide a kind of cooling device of electronic equipment, and it can make cooling effectiveness can do liter by guaranteeing area of dissipation fully, and can realize slimming.
In order to reach above-mentioned purpose, the invention provides a kind of cooling device of electronic equipment, it is characterized in that having: the 1st coldplate, it is formed with the 1st path of circulating coolant; The 2nd coldplate, it is formed with the 2nd path of circulating coolant, with relative configuration of described the 1st panel; Bindiny mechanism, it connects described the 1st path and described the 2nd path; Ebullator, it makes circulate coolant by described the 1st path and the 2nd path, makes the heat diffusion that is transmitted to described the 1st coldplate and the 2nd coldplate.
In addition, the present invention proposes a kind of electronic equipment, it is characterized in that, is equipped with the cooling device of above-mentioned electronic equipment.
The cooling device of electronic equipment of the present invention, the 1st coldplate and the 2nd coldplate are disposed relative to each other, by cooling medium being circulated, thereby can access cooling device with sufficient area of dissipation and high cooling effectiveness in the path of these coldplates by general ebullator.
The cooling device of electronic equipment of the present invention preferably possesses bindiny mechanism, and its axle supports described the 1st coldplate and the 2nd coldplate, makes its switch freedom.Can access the cooling device of compact form.
And at least one side of described the 1st coldplate and the 2nd coldplate in described path, preferably has the Micro Channel Architecture that contains a plurality of in a narrow margin path littler than the width of described path.At this moment, described at least one side of described the 1st coldplate and the 2nd coldplate preferably has the formed zone of air cooling heat radiator on the surface, and this zone is configured in the downstream of described Micro Channel Architecture.And the path in described zone is excellent in crawling.And, also preferably cooling fan is set corresponding to described air cooling heat radiator.
Described ebullator preferably is fixed in the surface of described the 2nd coldplate.And also preferred setting is communicated in the reservoir of described the 2nd path on the surface of described the 2nd coldplate, perhaps, in the inside of described the 2nd coldplate, the reservoir that is communicated in described the 2nd path is set.In addition, a side or the both sides of also preferred described the 1st path and the 2nd path are bonded with each other and form at the reeded downside heat radiator of a square one-tenth and upside heat radiator at least.And, the area of described the 1st coldplate, preferably the area than described the 2nd coldplate is little.The width of described the 1st path, narrower than the width of described the 2nd path, and the degree of depth of described the 1st path, darker than the degree of depth of described the 2nd path, this also is a preferred formation of the present invention.
Description of drawings
Fig. 1 (a) is the vertical view of the 1st embodiment of the cooling device of electronic equipment of the present invention, is respectively its side view and front elevation (b) and (c).
Fig. 2 is the vertical view of the formation of the path under the expression air cooling heat radiator shown in Figure 1.
Fig. 3 (a) is the vertical view of downside heat radiator that constitutes the 1st coldplate of the 1st coldplate material shown in Figure 1, (b) is the sectional view along (a) X-X ' line.
Fig. 4 is the vertical view of upside heat radiator that constitutes the 1st coldplate of the 1st coldplate material shown in Figure 1, (b) is its side view.
Fig. 5 is the vertical view of the formation of expression introduction part to Micro Channel Architecture shown in Figure 1.
Fig. 6 is the vertical view of the 2nd coldplate shown in Figure 1, is respectively its side view and front elevation (b) and (c).
Fig. 7 (a) is the vertical view of downside heat radiator that constitutes the 2nd coldplate of the 2nd cooling component shown in Figure 6, (b) is the sectional view by the Y-Y ' of (a) expression.
Fig. 8 is the vertical view of upside heat radiator that constitutes the 2nd coldplate of the 2nd cooling component shown in Figure 6.
Fig. 9 is the curve map of the relation of the width of expression path shown in Figure 6 and the degree of depth and cooling performance.
Figure 10 is the curve map of the relation of the width of expression path shown in Figure 6 and thickness of slab and withstand voltage properties.
Figure 11 (a) is the open cube display of the 1st example of ebullator shown in Figure 1, (b) is its sectional side view.
Figure 12 (a) reaches the sectional side view of the assembly method that (b) is expression ebullator shown in Figure 11.
Figure 13 (a) is the open cube display of the 2nd example of ebullator shown in Figure 1, (b) is its sectional side view.
Figure 14 (a)～(d) is a sectional side view of representing the assembly method of ebullator shown in Figure 13 respectively.
It is the sectional side view of representing the assembly method of ebullator shown in Figure 13 respectively that Figure 15 (a) reaches (b).
Figure 16 (a) is the open cube display of the 3rd example of ebullator shown in Figure 1, (b) is sectional side view.
Figure 17 (a)～(c) is a sectional side view of representing the assembly method of ebullator shown in Figure 16 respectively.
Figure 18 is the stereographic map of the formation of expression reservoir shown in Figure 1.
Figure 19 (a) and (b) be respectively sectional view along the Z-Z ' line of Figure 18.
Figure 20 (a)～(d) is the key diagram that is respectively applied for the air trapping function of explanation reservoir shown in Figure 180.
Figure 21 (a) is expression to the stereographic map of the 1st built-in example of the electronic equipment of the 1st embodiment of the cooling device of electronic equipment of the present invention, (b) is the sectional view along the Z-Z ' line of (a).
Figure 22 (a) is expression to the stereographic map of the 2nd built-in example of the electronic equipment of the embodiment of the cooling device of electronic equipment of the present invention, (b) is the sectional view along the Z-Z ' line of (a).
Figure 23 (a) is expression to the stereographic map of the 3rd built-in example of the electronic equipment of the embodiment of the cooling device of electronic equipment of the present invention, (b) is the sectional view along the Z-Z ' line of (a).
Figure 24 is expression according to the vertical view of the experimental example of the cooling effect due to the variation of the following airshed of the 2nd coldplate shown in Figure 1.
Figure 25 is expression according to the curve map of the relation of the cooling effect due to the variation of the following airshed of the 2nd coldplate shown in Figure 1.
Figure 26 is the vertical view of the 2nd coldplate of the 2nd embodiment of the cooling device of electronic equipment of the present invention.
Figure 27 (a)～(c) is illustrated respectively in the 2nd the used vertical vertical view of putting the structure of type reservoir of embodiment.
Embodiment
Below, based on embodiments of the present invention,, further describe the present invention with reference to accompanying drawing.Also have, with reference to the accompanying drawings, to the same same symbol of inscape mark.
If with reference to Fig. 1, then the cooling device of the electronic equipment of the 1st embodiment has: the 1st coldplate 1; The 2nd coldplate 2; Connect the 1st coldplate 1 and the 2nd coldplate 2, with the 1st coldplate 1 with respect to the 2nd coldplate 2, along with Fig. 1 (c) but arrow shown in direction and do the linking part 61,62 of the free switch that axle supports.
Cooling device has following function: by making the cooling medium of water and anti freezing solution etc., the path in being formed at the 1st coldplate 1 and the 2nd coldplate 2 circulates, and the heat release parts 7 of the CPU of heating and other heater etc. are followed in cooling.Symbol 84 shown in Figure 1 is to be illustrated in the battery of being settled when electronic equipment loads cooling device, the 2nd coldplate 2, and the shape in the zone of battery 84 is avoided in formation.
The 1st coldplate 1 shown in Figure 1 and the shape of the 2nd coldplate 2 when being loaded into electronic equipment, suitably determine according to various restrictions.
The 1st coldplate 1 adopts for example thermal conductivity good metal material of copper (Cu) and aluminium (Al) material etc., and as shown in Figure 1, portion is formed with path 11 and microchannel 12 within it.And, at the upper and lower surface of the 1st coldplate 1, be respectively equipped with air cooling heat radiator 13, be provided with the path 11 of the regional 13A of air cooling heat radiator 13, as shown in Figure 2, form serpentine passages 111 in order to improve radiating effect.Also have, the symbol 5 shown in Fig. 1 (a) is cooling fans, by cooling fan 5, forms flowing of air at the air cooling heat radiator 13 of being located at the 1st coldplate 1, thereby improves cooling effect.
The 1st coldplate 1 is the downside heat radiator that will be represented respectively by Fig. 3 and Fig. 4 17 and upside heat radiator 18, and the joining technique by diffusion bond, soldered joint, laser bonding etc. engages and forms.Be formed at the concave part 171 of downside heat radiator 17 of the 1st coldplate and the groove in a narrow margin 172 of microchannel 12, cover, form path 11 and Micro Channel Architecture 12 thus by the upside heat radiator 18 of the 1st coldplate.Also have, to the concave part 171 of the downside heat radiator 17 of the 1st coldplate, and the formation of the groove in a narrow margin 172 of Micro Channel Architecture, consideration can form by the following method: the method that forms these grooves by punching press; The method of moulding with the state that forms these grooves; Method that forms by grinding etc.
The downside heat radiator 17 of the 1st coldplate as shown in Figure 3, is formed with at path 11 as the opening B of the inflow entrance of cooling medium inflow with as the open C that flows out the flow export of cooling mediums from path 11.In opening B, open C, be connected with metal tube 14, metal tube 15 respectively.Metal tube 14, metal tube 15 adopt pliable and tough metal tube, the obstacle when not constituting the 1st coldplate 1 with respect to the 2nd coldplate 2 switches.
The following Micro Channel Architecture 12 formed zones of the downside heat radiator 17 of the 1st coldplate, power attenuation is very big, and small size be contacted with partly the CPU that follows heat radiation and other radiator etc. heat release parts 7 above.The heat that produces at heat release parts 7, the Micro Channel Architecture 12 of the downside heat radiator 17 by the 1st coldplate is taken away by flowing coolant.Micro Channel Architecture 12, width than the path 11 that is formed at the 1st coldplate 1 is little, constitutes the downside heat radiator 17 of the 1st coldplate by the little a plurality of path in a narrow margin below the width 1mm, with the above area in above-mentioned zone, be formed at the zone that contacts with heat release parts 7.Also have, in the 1st embodiment, the width that makes the path 11 that is formed at the 1st coldplate 1 is that 6mm, the degree of depth are 1.5mm, in Micro Channel Architecture 12, forms the path of 38 wide 0.5mm, dark 1.5mm.
Cooling medium flows into the inflow portion of Micro Channel Architecture 12, and as shown in Figure 5, the width of path 11 is expanded lentamente to microchannel 12 sides, becomes identical with the width of Micro Channel Architecture 12 at its end.In Micro Channel Architecture inflow portion, form guide plate 16, it is used to make the cooling medium that flows to from path 11 to diffuse to the width of Micro Channel Architecture 12.Guide plate 16, the 1st guide plate the 161, the 2nd guide plate the 162, the 3rd guide plate 163 of the pair of right and left that is disposed successively by the upstream side from flow of coolant constitutes.The length of each guide plate has following relation: the side length that is positioned at the guide plate of upstream; The length of the 1st guide plate 161 is longer than the length of the 2nd guide plate 162; The length of the 2nd guide plate 162 is longer than the length of the 3rd guide plate 163.And represented with arrow that by Fig. 5 the angle θ with respect to the flow of coolant direction of each guide plate has following relation: a side of angle who is positioned at the guide plate of upstream becomes big; The angle of the 1st guide plate 161 is bigger than the angle of the 2nd guide plate 162; The angle of the 2nd guide plate is bigger than the angle of the 3rd guide plate 163.
The 2nd coldplate 2 adopts for example metal material of the very property led of copper (Cu) and aluminium (Al) material etc., as shown in Figure 6, forms path 21 in inside, and ebullator 3 and reservoir 4 are installed in the above.
The 2nd coldplate 2 is downside heat radiator 23 and upside heat radiator 24 of being represented respectively by Fig. 7 and Fig. 8, and the joining technique by diffusion bond, soldered joint, laser bonding etc. engages and forms.The concave part 231 that is formed at the downside heat radiator 23 of the 2nd coldplate is covered by upside heat radiator 24, forms path 21 thus.Also have, to the formation of the concave part 231 of the downside heat radiator 23 of the 2nd coldplate, consider to form as the method that forms groove 231 by punching press by following method; Method with the state forming that forms groove 231; Form the method for groove 231 etc. by grinding.And groove can form at upside heat radiator 24, perhaps, can form the both sides of upside heat radiator 23 with downside heat radiator 24.
At the middle body of the path 21 of the 2nd coldplate 2, promptly be formed at the middle body of concave part 231 of the downside heat sink 23 of the 2nd coldplate, form a plurality of pillar 22 with predetermined distance.Pillar 22 is used to guarantee in the intensity of the downside heat radiator 23 that engages the 2nd coldplate during with upside heat radiator 24.In the relation of the width of path 21 and the degree of depth and cooling performance, as shown in Figure 9, if duct width is wide more, and the degree of depth is shallow more, can improve cooling performance more, but as shown in figure 10, if duct width is wide more, thickness of slab is thin more, then withstand voltage properties reduces.Therefore, from the viewpoint of cooling performance, require as far as possible the width of enlarged passageway 21 the time with, and the degree of depth is shoaled, but withstand voltage properties can descend.Therefore, in the 1st embodiment, realize the raising of withstand voltage properties by pillar 22.And, in the 1st embodiment, make pillar 22 be formed at the middle body of path 21, but, be not limited to middle body in the position that forms pillar 22, for example, also can be arranged as latticed or zigzag.Also have, in the 1st embodiment, the width that is formed at the path 21 of the 2nd coldplate 2 is 20mm, and the degree of depth is 0.8mm, at the central part of path 21, with the interval of 20mm, forms the pillar of wide 0.5mm, long 2mm.
As shown in Figure 8, the upside heat radiator 24 at the 2nd coldplate is formed with: the opening (difference hole) that is communicated in reservoir 4; Flow out the cooling medium flow export 26 of cooling medium to ebullator 3 from path 21; Flow into the coolant flow inlet 27 of cooling medium to path from ebullator 3; As the opening A that flows out the flow export of cooling medium from path 21; As flowing into the opening D of cooling medium to the inflow entrance of path 21.At opening A, opening D, connect metal tube 14, metal tube 15 respectively.Also have, also can form Micro Channel Architecture at the 2nd coldplate 2.
Next, the flow of coolant to the 1st embodiment is elaborated.
From be arranged at the 2nd coldplate 2 above ebullator 3 cooling medium of discharging, by coolant flow inlet 27, flowing through is formed at path 21 in the 2nd coldplate 2, by opening A, metal tube 14 and opening B, flows into the 1st coldplate 1.Flow into the cooling medium of the 1st coldplate 1, flowing through is formed at path 11 in the 1st coldplate 1, flows into Micro Channel Architecture 12.
Flow into the cooling medium of Micro Channel Architecture 12, absorb the heat that is produced by heat release parts 7, the serpentine passages 111 of flowing through and being formed at the zone that air cooling heat radiator 13 is set by open C, metal tube 15 and opening D, flows into the 2nd coldplate 2.Flow into the cooling medium of the 2nd coldplate 2, flowing through is formed at path 21 in the 2nd coldplate 2, and the below of the opening 25 by being communicated in reservoir 4 arrives cooling medium flow export 26, flows into ebullator 3 once again.
By so making circulate coolant by ebullator 3, at the heat that heat release parts 7 produce, thermal diffusion to the 1 coldplate 1 and the 2nd coldplate 2 is all by the heat transmission, thereby improves radiating effect.
Secondly, based on Figure 11 and Figure 12, explain the 1st configuration example about ebullator 3, it is installed on the upside heat radiator 24 of the 2nd coldplate of upper face side of the 2nd coldplate 2.
Figure 11 is the figure of the 1st configuration example of expression ebullator shown in Figure 1, (a) is open cube display, (b) is sectional side view.Figure 12 is the sectional side view of the assembly method of expression ebullator shown in Figure 11.
If the 1st configuration example of ebullator 3 is with reference to Figure 11, then by constituting as lower member: pump case 311; The zero shape ring 312 of rubber resin system; Piezoelectric vibrating plate 313; Push down the top board 314 of piezoelectric vibrating plate 313.In pump case 311, be formed with respectively relatively with the cooling medium flow export 26 of the upside heat radiator 24 that is formed at the 2nd coldplate and coolant flow inlet 27 to inhalation port 315 with discharge port 316, and form space as pump chamber 319.At inhalation port 315, discharging port 316, be respectively equipped with and prevent, and prevent from the outflow non-return valve 318 of path 21 to the adverse current of pump chamber 319 from the inflow non-return valve 317 of pump chamber 319 to the adverse current of path 21.Flow into non-return valve 317 and flow out non-return valve 318, constitute, be connected in the bottom surface of pump case 311 by spot welding or screw retention by the thin plate leaf-valve of metal.
The assembly method of ebullator 3 shown in Figure 11, if with reference to Figure 12 (a), then at first, the joining technique of the diffusion bond by metal, soldered joint, laser bonding etc. is at the upside heat radiator 24 integrated ground fixed pump housings 311 of the 2nd coldplate.Pump case 311 at this moment, processing engage the space of inhalation port 315, discharge port 316, pump chamber 319 formation, flow into back to end valve 317 and flow out back only valve 318.
Secondly, shown in Figure 12 (b), embed zero shape ring 312, the bedding piezoelectric vibrating plate 313 at an upper portion thereof, form pump chamber 319.Then, compress securely by top board 314 and to be close to zero shape ring 312 guaranteeing watertightness, and make piezoelectric vibrating plate 313 be in around fixing state.At this moment, top board 314 can also can use screw fastening around top board 314 from the top with screw retention.
According to above explanation, in the 1st configuration example of ebullator 3, the joining technique by metal fully links ebullator 3 and the 2nd coldplate 2 and forms one, prevent the pressure loss and leak of liquid thus.And, because ebullator 3 and the 2nd coldplate 2 shaping one, so can realize slimming and cheapness.In addition, by the ebullator 3 that uses this structure, can realize the slimming of cooling device, its height can make largest portion that ebullator 3 disposed below 7mm.
Next, based on Figure 13 to Figure 15, explain the 2nd configuration example of ebullator 3, it is installed on the upside heat radiator 24 of the 2nd coldplate of upper face side of the 2nd coldplate 2.
Figure 13 is the figure of the 2nd configuration example of expression ebullator shown in Figure 1, (a) is open cube display, (b) is sectional side view.Figure 14 and Figure 15 are the sectional side views of the assembly method of expression ebullator shown in Figure 13.
If the 2nd configuration example of ebullator 3 is with reference to Figure 13, then by constituting as lower member: pump case 321; The disk 322 of subsidiary non-return valve; The zero shape ring 312 of rubber resin; Piezoelectric vibrating plate 313; Pin the top board 314 of piezoelectric vibrating plate.Be formed with inhalation port 315 and discharge port 316 in the disk 322 of subsidiary non-return valve, cooling medium flow export 26 and coolant flow inlet 27 with the upside heat radiator 24 that is formed at the 2nd coldplate is relative respectively for it.Respectively at inhalation port 315, discharge port 316, be provided with and prevent from pump chamber 319 to the inflow non-return valve 317 of the adverse current of path 21 with prevent from the outflow non-return valve 318 of path 21 to the adverse current of pump chamber 319.Flow into non-return valve 317 and flow out non-return valve 318, constitute, be connected in by spot welding or screw retention on the disk 322 of subsidiary non-return valve by the thin plate leaf-valve of metal.
The assembly method of ebullator 3 shown in Figure 13, if with reference to Figure 14 (a)～(c), then at first, the joining technique of the diffusion bond by metal, soldered joint, laser bonding etc. makes pump case 321 form one on the upside heat radiator 24 of the 2nd coldplate.This moment, the pump case body 603, can be processed to form the part of pump chamber 319 etc. in advance, also can process afterwards.
Secondly, shown in Figure 14 (d), make the disk 322 that engages inhalation port 315, discharges port 316, flows into non-return valve 317 and flow out the subsidiary non-return valve that non-return valve 318 forms by processing be embedded in the inside of pump case 321.
Secondly, shown in Figure 15 (a), embed zero shape ring 312, at an upper portion thereof, shown in Figure 15 (b), bedding piezoelectric vibrating plate 313 forms pump chamber 319.Then, compress securely by top board 314 and to be close to zero shape ring 312 guaranteeing watertightness, and allow piezoelectric vibrating plate 313 be in around stationary state.At this moment, top board 314 can also can use screw fastening around top board 314 from the top with screw retention.
As described above, in the 2nd configuration example of ebullator 3, on the disk 322 of subsidiary non-return valve, processing engages inhalation port 315, discharges port 316, flows into non-return valve 317 and flows out non-return valve 318, and can constitute the disk 322 of subsidiary non-return valve with exchanging.In view of the above, when utilizing for a long time, at obstruction owing to inhalation port 315 and discharge port 316, with flow into non-return valve 317 and flow out the plastic yield etc. of non-return valve 318 and when causing pump performance to reduce, can pump performance be recovered, can easily safeguard.
Next, based on Figure 16 and Figure 17, explain the 3rd formation of ebullator 3, it is installed on the upside heat radiator 24 of the 2nd coldplate of upper face side of the 2nd coldplate 2.Figure 16 is the figure of the 3rd configuration example of expression ebullator shown in Figure 1, (a) is open cube display, (b) is sectional side view.Figure 17 is the sectional side view of the assembly method of expression ebullator shown in Figure 16.
If the 3rd configuration example of ebullator 3 is with reference to Figure 16, then by constituting as lower member: pump case 331; The disk 322 of subsidiary non-return valve; The zero shape ring 312 of rubber resin system; Piezoelectric vibrating plate 313; Pin the top board 314 of piezoelectric vibrating plate.Bottom surface portions in pump case 331 is formed with pump bottom surface inflow entrance 333 and pump bottom surface flow export 334, and cooling medium flow export 26 with the upside heat radiator 24 that is formed at the 2nd coldplate is relative with coolant flow inlet 27 respectively for it.
Pump bottom surface inflow entrance 333 and pump bottom surface flow export 334 are connected to the inhalation port 315 of the disk 322 that attaches non-return valve and discharge port 316.At inhalation port 315, discharge port 316, be respectively equipped with and prevent from pump chamber 319 to the inflow non-return valve 317 of the adverse current of path 21 with prevent from the outflow non-return valve 318 of path 21 to the adverse current of pump chamber 319.Flow into non-return valve 317 and flow out non-return valve 318, constitute, be connected by spot welding or screw retention on the disk 322 of subsidiary non-return valve by the thin plate leaf-valve of metal.
The assembly method of ebullator 3 shown in Figure 16, if with reference to Figure 17 (a)～(b), then at first, the joining technique of the diffusion bond by metal, soldered joint, laser bonding etc. makes the 2nd coldplate upside heat radiator 24 and the 2nd coldplate downside heat radiator 23 form one.
Secondly, the disk 322 of the subsidiary non-return valve that inhalation port 315, discharge port 316, inflow non-return valve 317 and 318 processing of outflow non-return valve are bonded into embeds the inside of pump case 331.Then be zero shape ring 312, the bedding piezoelectric vibrating plate 313 at an upper portion thereof, and then portion compress securely by top board 314 and is close to zero shape ring 312 guaranteeing watertightness from it, and allows piezoelectric vibrating plate 313 be in stationary state all around, built-in in advance ebullator 3.At this moment, top board 314 can also can use screw fastening around top board 314 from the top with screw retention.
Secondly, shown in Figure 17 (c), make pump bottom surface inflow entrance 333 and pump bottom surface flow export 334 in 2 the zero shape ring groove 335 that the pump bottom surface side separates being made as, embed zero shape ring 332 respectively, fastening by screw retention, and pump 3 and the 2nd coldplate 2 that assembling constitutes in advance.
As described above, in the 3rd configuration example of ebullator 3,, can easily carry out the maintenance of the replacement etc. of ebullator 3 as the countermeasure of the performance degradation of ebullator 3 etc., and, the advantage that also has cost-effectivenes to become cheap.Also have, ebullator 3 engages with the 2nd coldplate 2, though there is not the metal bond as the 1st and the 2nd configuration example of above-mentioned ebullator 3, is to connect with the degree of guaranteeing abundant watertightness.
Next, based on Figure 18 to Figure 20, explain the formation of reservoir 4, it is installed on the upside heat radiator 24 of the 2nd coldplate of upper face side of the 2nd coldplate 2.
Figure 18 is the stereographic map of the formation of expression reservoir shown in Figure 1, and Figure 19 is a Z-Z ' sectional view shown in Figure 180, and Figure 20 is the key diagram that is used to illustrate the air accumulator function of reservoir shown in Figure 180.
The air 45 that compiles at reservoir shrink by the expansion along with the liquid of temperature variation, and performance is realized the effect of the mitigation of the pressure variation in the path 21, helps to improve the permanance of cooling device.On the other hand, the air 45 that is compiled is sneaked in the fluid path 21, if air 45 flows in the ebullator, then the discharge pressure of ebullator 3 reduces, the performance of ebullator 3, and promptly the flow of cooling medium might descend significantly.Therefore, in the bottom surface of reservoir 4,, form with the outlet in difference hole 43 trapezoidal cone shape tapered portion 41 as the summit as Figure 18 and shown in Figure 19.Because even tapered portion 41 when turning upside down cooling device, also can make the air 45 that comes together in the reservoir 4 continue as much as possible to be detained.Also have, do not return fluid path in order to make the air 45 that comes together in the reservoir 4, the outlet in difference hole 43 need always be immersed in the cooling medium 44.In the 1st embodiment, as shown in figure 19, on the A-A ' boundary surface that the outlet in difference hole 43 is located, the volume of the reservoir 4 of the downside of A-A ' boundary surface, bigger and constitute than the volume of the upside reservoir 4 of A-A ' boundary surface, in the reservoir 4 shown in Figure 19 (b), the liquid level that makes cooling medium 44 be filled to cooling medium 44 surpasses A-A ' boundary surface and arrives the top.
The common state that utilizes of the cooling device of the 1st embodiment is that reservoir 4 is the state shown in Figure 20 (a), and air 45 is because than the light specific gravity of cooling medium 44, so be trapped in the top.Also have, be full of cooling medium 44 this moment in reservoir 4, and make the outlet (the conial vertex portion of tapered portion 41) in difference hole 43 usually will be not in liquid.And the volume of reservoir 4 is considered the thermal expansion, withstand voltage etc. of the thermal expansion amount of cooling medium 44 and cooling device housing, is designed to the volume that can fully bear.
Secondly, when cooling device was tilted, reservoir 4 formed state shown in Figure 20, and certain direction is partial to and is stranded in to the air 45 in the reservoir 4.At this moment, the outlet in difference hole 43 can not exposed from liquid, and the air 45 in the reservoir 4 can not enter difference hole 43 yet.
Secondly, cooling device is tilted more, when turning upside down, reservoir 4 forms the state shown in Figure 20 (c).At this state, in the bottom surface of reservoir 4, be formed with tapered portion 41, a side of the volume of the reservoir 4 of A-A ' boundary surface downside shown in Figure 20 is bigger than upside, and cooling medium 44 is filled to more top of A-A ' boundary surface.Therefore, the interruption-forming that goes out in difference hole 43 always is immersed in state in the cooling medium 44, and air 45 is stranded in the reservoir 4 and does not enter in the difference hole 43.
Secondly, when cooling device more tilts, reservoir 4, pass to the state shown in Figure 20 (d) air 45 in the reservoir 4, the taper surface of swarming tapered portion 41 from the state shown in Figure 20 (c), arrive near the outlet in difference hole 43, be stranded in a side of reverse side.Because the area of section in difference hole 43 is very little at this moment,, and be trapped in reverse side so air 45 is crossed difference hole 43.
For the validity of the reservoir 4 of verifying the 1st embodiment practically, the cooling device of making, the part at path 21 is provided with: the difference hole 43 of φ 2mm; The reservoir 4 of diameter 50mm, high 7mm (the difference of height 4mm of tapered portion 41).On this cooling device, connect the high-pressure pump that sell in market, by supposition with pressure amplitude from 0 to 1MPa, the rapid temperature variation of the electronic equipment of frequency 10Hz, and carry out pressure fatigue test.
Its result, when reservoir not being set, confirm in 200kPa (2 atmospheric pressure) lower part wall of moment and the separation of fluid path plate, but when reservoir 4 is set, with 1MPa (100 atmospheric pressure),, also unconfirmed to leak of liquid until circulation 150000 times, with respect to the change of pressure, can confirm the raising of endurance quality of the reservoir 4 of the 1st embodiment.
According to above explanation, the reservoir 4 of the 1st embodiment is characterized in that, for the path 21 that in 2 dimensional planes, prolongs, for it part or all can 2 dimensional planes be configured, can slimming.Also have, such reservoir 4 by not just a plurality of settings of odd number, can be brought into play big effect.And, if constitute removably reservoir 4, then, can do additional cooling medium just in case the situation that the amount of the cooling medium in the cooling device reduces occurs, very effectively.
Next, with reference to Figure 21 to Figure 25, explain built-in example to the electronic equipment of the cooling device of the 1st embodiment.
Figure 21 is the figure of expression to the 1st built-in example of electronic equipment, (a) is stereographic map, (b) is the Z-Z ' sectional view shown in (a).Figure 22 is expression to the figure of the 2nd built-in example of the electronic equipment of the embodiment of the cooling device of electronic equipment of the present invention, (a) is stereographic map, (b) is the Z-Z ' sectional view shown in (a).Figure 23 is expression to the figure of the 3rd built-in example of the electronic equipment of the embodiment of the cooling device of electronic equipment of the present invention, (a) is stereographic map, (b) be shown in (a) Z-Z ' sectional view.Figure 24 is the figure of expression according to the experimental example of the cooling effect of the variation of the following airshed of the 2nd coldplate shown in Figure 1.Figure 25 is the chart of the relation of the variation of following airshed of expression the 2nd coldplate shown in Figure 1 and cooling effect.
The 1st built-in example, if with reference to Figure 21, then in the housing 80 of the notebook computer of the about 3～4cm of general thickness, the mainboard 86 that the heat release parts 7 of the different main electronic unit of the thickness that loading DVD-RAM81, FD-RAM82, HDD83, battery 84, memory card 85 etc. are comparatively big and CPU etc. are assembled.Downside at mainboard 86 loads the 2nd coldplate 2.Also have, constitute in the 1st built-in example: as the Micro Channel Architecture 12 that is formed at the 2nd coldplate 2, the end face that is assemblied in the 2nd coldplate 2 in the top heat release parts 7 of mainboard 86 and Micro Channel Architecture 12 formed zones contacts.
The 2nd built-in example is the high built-in example of cooling effect than the 1st built-in example.If with reference to Figure 22, then the upside of the mainboard 86 that is assembled at the heat release parts 7 of CPU etc. is mounted with the 1st coldplate 1, and is mounted with the 2nd coldplate 2 at the downside of mainboard 86.It constitutes: being assemblied in the top heat release parts 7 of mainboard 86 and the 1st the following of coldplate 1 in Micro Channel Architecture 12 formed zones contacts.In the 2nd built-in example, as above-mentioned explanation, but because the 1st coldplate 1 switch, so by opening the 1st coldplate 1, can be assemblied in the maintenance of replacing etc. of the top heat release parts 7 of mainboard 86 with comparalive ease.
In the 3rd the built-in example, be the high built-in example of cooling effect than the 2nd built-in example.If with reference to Figure 23, then the upside of the mainboard 86 that is assembled at the heat release parts 7 of CPU etc. is mounted with the 1st coldplate 1, and is mounted with the 2nd coldplate 2 at the downside of mainboard 86.It constitutes: being assemblied in the top heat release parts 7 of mainboard 86 and the 1st the following of coldplate 1 in Micro Channel Architecture 12 formed zones contacts, and is formed with air cooling heat radiator 13 at the 1st coldplate 1.And, be provided with:, form the fan 5 that flows of air at the air cooling heat radiator 13 that is formed at the 1st coldplate 1; Below the 2nd coldplate 2, form the fan 51 that flows of air.
In the 3rd built-in example, in order to verify by the airshed of supplying with below of the 2nd coldplate 2 and the relation of cooling effect, as shown in figure 24, below the 2nd coldplate 2, disposed the fan 51～55 that flows that forms air, changed the quantity of fan 51～55 and measure thermal resistance.Also have,, form the fan 5 that flows of air, with the state estimating of common driving at the air cooling heat radiator 13 that is formed at the 1st coldplate 1.Its result, as shown in figure 25, the quantity of the fan 51～55 of driving is many more, and thermal resistance diminishes more, and the cooling effect raising is verified.
And the example of formation air cooling heat radiator below the 2nd coldplate 2 is measured thermal resistance with the quantity that changes fan 51～55 similarly.Its result, as shown in figure 25, when forming the air cooling heat radiator in the bottom of the 2nd coldplate 2 and when not having the air cooling heat radiator, cooling effect does not almost have difference.
As described above, in the 1st embodiment, constitute: be formed at the concave part 231 of downside heat radiator 23 by covering, and the 2nd coldplate 2 that will form path 21 is loaded into the bottom of electronic equipment by upside heat radiator 24.Thus, by guaranteeing sufficient area of dissipation, and cooling effectiveness is improved, and can make the cooling device slimming.Although also can doing one's utmost to prevent cooling medium, the cooling device slimming leaks.
In addition, the embodiment according to the 1st in the path 21 of the 2nd coldplate 2 of the bottom that is loaded into electronic equipment, forms the pillar that downside heat radiator 23 and engaging of upside heat radiator 24 are strengthened.Thus, can expand the width of the path 21 of the 2nd coldplate 2, and because can reduce the thickness of slab of downside heat radiator 24 and upside heat radiator 24, so can improve cooling effect by guaranteeing area of dissipation fully, and can make the cooling device slimming.
In addition, the embodiment according to the 1st by being made as fixed cycles pump 3 on the 2nd coldplate 2 of the bottom that is loaded into electronic equipment, and can do one's utmost to prevent that cooling medium from leaking.
In addition, embodiment according to the 1st, by upper side at the path 21 of the 2nd coldplate 2 of the bottom that is loaded into electronic equipment, the difference hole of difference is set, and on this top, difference hole reservoir 4 is set, thereby the temperature inside by electronic equipment can be changed or fluid path in pressure change and the bubble that produces comes together in reservoir 4.Therefore, can prevent to descend owing to sneaking into of bubble causes the discharge of ebullator 3.
In addition, embodiment according to the 1st, by upper side at the path 21 of the 2nd coldplate 2 of the bottom that is loaded into electronic equipment, the difference hole of difference is carried out in setting, and reservoir 4 is set on this top, difference hole, thereby can be by the air 45 in the reservoir 4, and make, thereby can prevent to come from the pressure variation in the path and the breakage that stress caused that produces in the part along with the pressure variation in the path of the temperature variation in the electronic equipment obtains relaxing.
In addition, embodiment according to the 1st, constitute: constitute the downside heat radiator 23 and the upside heat radiator 24 of the 2nd coldplate 2 of the path 21 that circulate coolant constitutes by the good metal of thermal conductivity, the upside heat radiator 24 of the 2nd coldplate is joined with ebullator 3 by metal bond.Thus, ebullator 3 forms one with path 11, and because the whole of path 11 are covered by metal material, so have the effect that cooling medium can not evaporate and leak.Also have, ebullator 3 is being connected in the structure (the 3rd configuration example) of the upside heat radiator 24 of the 2nd coldplate by zero shape ring 332, because ebullator 3 is monomers, so how many evaporation of the residual cooling medium that is caused by the connection of zero shape ring 332 and possibilities of leakage are arranged.But this situation can easily be safeguarded.
As mentioned above, in the 1st embodiment of the cooling device of electronic equipment of the present invention, the concave part that is formed at the downside heat radiator of the 2nd coldplate is covered by the upside heat radiator of the 2nd coldplate, and the 2nd coldplate that will be formed at path therefrom is loaded into the bottom of electronic equipment.Constitute in view of the above, by guaranteeing sufficient area of dissipation, and cooling effectiveness is improved, and can make the cooling device slimming.Although also can doing one's utmost to prevent cooling medium, the cooling device slimming leaks.
In addition, in the 1st embodiment of the cooling device of electronic equipment of the present invention, in the path of the 2nd coldplate of the bottom that is loaded into electronic equipment, form the pillar that engages that strengthens downside heat radiator and upside heat radiator.Constitute in view of the above, can expand the width of the path of the 2nd coldplate 2, and can reduce the downside heat radiator of the 2nd coldplate and the thickness of slab of upside heat radiator.Therefore, by guaranteeing sufficient area of dissipation, and cooling effectiveness is improved, and can make the cooling device slimming.
In addition, in the 1st embodiment of the cooling device of electronic equipment of the present invention, by on the 2nd coldplate of the bottom that is loaded into electronic equipment, the fixed cycles pump is set, and can prevents that cooling medium from leaking with doing one's utmost.
In addition, in the 1st embodiment of the cooling device of electronic equipment of the present invention, the upper side at the path of the 2nd coldplate of the bottom that is loaded in electronic equipment is provided with the difference hole of carrying out difference, on this top, difference hole reservoir is set.Thus because can with change owing to the temperature inside of electronic equipment or fluid path in pressure change the bubble that produce and come together in reservoir, so can prevent the reduction that causes owing to sneaking into of bubble from the discharge of self-circulating pump.
In addition, in the 1st embodiment of the cooling device of electronic equipment of the present invention, the upper side at the path of the 2nd coldplate of the bottom that is loaded in electronic equipment is provided with the difference hole of carrying out difference, on this top, difference hole reservoir is set.Thus, can be by the air in the reservoir, and relax along with the pressure variation in the path of the temperature variation in the electronic equipment, can prevent to come from the pressure variation in the path and the breakage that stress caused that takes place in the part.
In addition, in the 1st embodiment of the cooling device of electronic equipment of the present invention, constitute the downside heat radiator and the upside heat radiator of the 2nd coldplate of the path that circulate coolant constitutes by the good metal of thermal conductivity, the upside heat radiator and the ebullator of the 2nd coldplate are joined by metal bond.Thus, make ebullator and path form one, and because the whole of path are covered by metal material, so have the effect that cooling medium does not evaporate and leaks.Also have, in the structure of the upside heat radiator that ebullator is connected in the 2nd coldplate by zero shape ring, because ebullator is a monomer, so have the effect that easily to safeguard, but also might exist because the evaporation of the cooling medium that connection produced of zero shape ring and the problem of leak of liquid.
Next, the 2nd embodiment to the cooling device of electronic equipment of the present invention describes.At first, vertical simple formation of putting type reservoir 411 is described with reference to Figure 26.In the cooling device with figure, coldplate (matrix) 20 has Construction integration, is formed with the groove 231 that constitutes path 21 in inside.Also have, the path 21 in being deployed in two dimensional surface is formed with horizontal type reservoir 4 and the vertical type reservoir 411 of putting midway, this cooling device, for example, with the upside of Figure 26 top as vertical direction, with the downside of Figure 26 below, use with upright state as vertical direction.The vertical type reservoir 411 of putting shrinks for the expansion along with the temperature change of cooling medium, has mitigation that realizes the pressure variation in the path and the effect that compiles the bubble in the path 11.
On the other hand, from directly over when watching the state of the form of Figure 26 to use, when promptly this cooling device used with horizontal on the table, horizontal type reservoir 4 had the vertical therewith identical effect of type reservoir 411 of putting.From above, by possessing this two reservoirs 4,411, when for example the electronic equipment machine body of notebook PC etc. utilizes on the table, when utilizing hanging on wall, can realize along with the expansion of the cooling medium of the temperature change of the cooling medium in the path 21 is shunk and the mitigation of the pressure variation that causes, and, can help the permanance of this cooling device to promote by compiling the bubble in the path 21.
Next with reference to Figure 27, specifically describe vertical formation of putting type reservoir 411.Figure 27 (a)～(c) is a vertical enlarged drawing of putting type reservoir 411 shown in Figure 1, represents the situation that the electronic equipment fuselage of notebook PC for example etc. utilizes with the vertical state of putting.In other words, be the figure of expression user when the front is watched.
Be contained in by ebullator 3 among path 11 coolant circulating 415 by temperature change etc. and the bubble 413 that produces, if near putting with near the reservoir 411 to vertical, because bubble 413 itself is than the light specific gravities of liquid, institute is so that be directed to the vertical usefulness reservoir 411 of putting along the wall of 412 ones of tapers.Then, be stranded in reservoir above after, finally become the structure that comes together in air layer 414.
And, as importing to the vertical bubble of putting in the type reservoir 411 413 in order to make, the structure in the return path 11 no longer, as making the vertical structure of putting the entering part of type reservoir 411 with trapezoidal taper 412, make to indulge and put the inside of type reservoir 411 to laterally widening, or to the depth expansion, the internal volume with horizontal type reservoir 4 equates at least, or bigger than it.
By above formation, if utilize the light specific gravity this point of described bubble 413 self than liquid, then bubble 413 can not put the liquid of type reservoir 411 return paths 11 from vertical.This fact, the experiment by inventors is confirmed.And, according to embodiment, put type reservoir 411 and form the volume equal by indulging with horizontal type reservoir 4, perhaps form than its big volume, and the amount of the air layer 414 in the reservoir during to vertical putting is optimized, and is achieved thereby can confirm the slow of pressure variation that shrinks in the path that causes along with the expansion of coolant temperature change.
Secondly, vertical shape of putting type reservoir 411 is described.Reservoir 411 shown in Figure 27 (a)～(c) has the effect of the collecting function and the pressure alleviating function of bubble 413 respectively.But, when the " loaded " position of the heat release parts of CPU etc., ebullator 3, horizontal type container 4 etc. changes, in the optimal design of path 11, can be subjected to various restrictions.According to embodiment, layout corresponding to the large-scale electronic unit of heat release parts, HDD and the DVD etc. of CPU on for example mainboard in the electronic equipment machine etc., and select the vertical shape of putting type reservoir 411 shown in Figure 27 (a)～(c), thereby to the cooling performance of this cooling device promote and slimming etc. be embodied as effective.
The vertical type reservoir 411 of putting shown in 27 (a) is horizontal width variety types, and it is big to form transverse width, vertical short and small shape, and for example can make becomes the shortlyest with path 11 at the interval of the path 11 of adjacency up and down, and also can guarantee function as reservoir.And the vertical type reservoir 411 of putting shown in 27 (b) is lengthwise types, and is different with (a), make with about the interval of path 11 of adjacency the shortest, use the space between the path 11 up and down, by guarantee big volume as far as possible, can further relax the change of pressure.
Vertical the putting in the type reservoir 411 shown in 27 (c), a vertical part of putting type reservoir 411 links to each other with path 11.Thus, when the flow of flowing coolant increases in path 11, compare, can positively collect more bubble 413 with Figure 27 (a) and reservoir (b).At this moment, need not be full of reservoir, can guarantee common air in certain amount layer 414 and positively compile bubble 413 by liquid.
No matter put in which kind of the structure of type reservoir, all can carry out the collection of gassing 413 in the path effectively the 2nd embodiment vertical.Therefore, has so vertical type reservoir 411 of putting of air trapping function, liquid circulating passage for this cooling device, can form deployed configuration with the two dimensional surface shape, because the upside heat radiator and the downside heat radiator inside of the 1st coldplate that constitutes at metal material by the good aluminium of thermal conductivity, copper etc., can jointly bury underground with path, so whole thickness of coldplate can form the following thickness of 2mm.Also have, so vertically put type reservoir 411 and horizontal type reservoir 4, be not limited to singlely,, obviously can bring into play immeasurable effect by carrying out the setting of a plurality of same model or different model.
Also have, the present invention is not limited to the respective embodiments described above, and in the scope of technical conceive of the present invention, each embodiment obviously can obtain by suitable change.For example, the quantity of said structure member, position, shape etc. are not limited to above-mentioned embodiment, can form suitable quantity, position, shape etc. in the embodiment of this invention.
Claims (13)
1. the cooling device of an electronic equipment is characterized in that, has:
The 1st coldplate (1), it is formed with cooling medium and carries out round-robin the 1st path (11);
The 2nd coldplate (2), it is formed with cooling medium and carries out round-robin the 2nd path (21), and is relative with described the 1st coldplate (1) and be provided with;
The mechanism (15) that continues, its continue described the 1st path (11) and described the 2nd path (21);
Ebullator (3), it circulates cooling medium, thereby makes the heat diffusion that is transmitted to described the 1st coldplate (1) and the 2nd coldplate (2) by described the 1st path (11) and the 2nd path (21),
Wherein, at least one comprises Micro Channel Architecture (12) in described the 1st coldplate (1) and the 2nd coldplate (2) in described path (11,21), and described Micro Channel Architecture (12) comprises the narrow path of a plurality of width less than described path (11,21), and at least one comprises the zone (13A) that is formed with air cooling heat radiator (13) from the teeth outwards in described the 1st coldplate (1) and the 2nd coldplate (2), and the described path on described zone (13A) is to crawl.
2. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that having bindiny mechanism (61,62), its axle supports described the 1st coldplate (1) and the 2nd coldplate (2), makes described the 1st coldplate (1) and the 2nd coldplate (2) switch freedom; The described mechanism that continues (15) has pliability.
3. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that at least one comprises the reservoir with described the 1st passage or described the 2nd channel connection in described the 1st coldplate (1) and the 2nd coldplate (2).
4. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that described zone (13A) is disposed at the downstream of described Micro Channel Architecture (12).
5. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that, be provided with cooling fan (5) corresponding to described air cooling heat radiator (13).
6. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that described ebullator (3) is fixed in the surface of described the 2nd coldplate (2).
7. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that,, be provided with the reservoir (4) that is communicated in described the 2nd path (21) on the surface of described the 2nd coldplate (2).
8. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that,, be formed with the reservoir (411) that is communicated in described the 2nd path (21) in the inside of described the 2nd coldplate (2).
9. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that, at least one side of described the 1st path (11) and the 2nd path (21) is to be bonded with each other and to form be formed with the downside heat radiator (23) of groove (231) and upside heat radiator (24) at least one.
10. according to the cooling device of the electronic equipment of claim 1 record, it is characterized in that, the area of described the 1st coldplate (1) is littler than the area of described the 2nd coldplate (2).
11. the cooling device according to the electronic equipment of claim 1 record is characterized in that, the width of described the 1st path (11) is narrower than the width of described the 2nd path (21).
12. the cooling device according to the electronic equipment of claim 1 record is characterized in that, the degree of depth of described the 1st path (11) is darker than the degree of depth of described the 2nd path (21).
13. an electronic equipment is characterized in that, is mounted with the cooling device of electronic equipment of each record of claim 1 to 11.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003184369 | 2003-06-27 | ||
| JP184369/2003 | 2003-06-27 |
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| CN1813230A CN1813230A (en) | 2006-08-02 |
| CN100418037C true CN100418037C (en) | 2008-09-10 |
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| CNB200480018168XA Expired - Fee Related CN100418037C (en) | 2003-06-27 | 2004-06-25 | Cooler for electronic equipment |
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| US (1) | US20070006996A1 (en) |
| JP (1) | JPWO2005001674A1 (en) |
| CN (1) | CN100418037C (en) |
| TW (1) | TWI239229B (en) |
| WO (1) | WO2005001674A1 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1925898A4 (en) * | 2005-09-13 | 2011-11-02 | Mitsubishi Electric Corp | Heat sink |
| JP2007103633A (en) * | 2005-10-04 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Cooling device and electronic apparatus including the same |
| US7331378B2 (en) * | 2006-01-17 | 2008-02-19 | Delphi Technologies, Inc. | Microchannel heat sink |
| JP4892493B2 (en) * | 2006-01-24 | 2012-03-07 | 日本電気株式会社 | Liquid-cooled heat dissipation device |
| US8720531B2 (en) | 2006-01-30 | 2014-05-13 | Nec Corporation | Electronic device cooling apparatus |
| JP5412815B2 (en) * | 2008-12-04 | 2014-02-12 | 富士通株式会社 | Cooling jacket, cooling unit, cooling system and electronic equipment |
| JP4676008B2 (en) * | 2009-03-30 | 2011-04-27 | 株式会社東芝 | Electronics |
| CN102338361A (en) * | 2010-07-27 | 2012-02-01 | 夏志清 | Radiating fin of light emitting diode (LED) lighting lamp |
| US8902591B2 (en) * | 2011-05-11 | 2014-12-02 | Microjet Technology Co., Ltd. | Heat dissipation device |
| US8927129B2 (en) * | 2011-09-19 | 2015-01-06 | GM Global Technology Operations LLC | Interconnection-less liquid fin design for battery cooling module |
| JP6127416B2 (en) * | 2012-09-07 | 2017-05-17 | 富士通株式会社 | Electronics |
| JP5991125B2 (en) * | 2012-09-28 | 2016-09-14 | 富士通株式会社 | Electronics |
| US9196935B2 (en) * | 2013-03-12 | 2015-11-24 | Gm Global Technology Operations, Llc | Micro-channel cooling fin design based on an equivalent temperature gradient |
| JP5854487B1 (en) * | 2014-10-28 | 2016-02-09 | Ｎｅｃプラットフォームズ株式会社 | External device heat dissipation structure, electronic device, and external device |
| CN112135498B (en) * | 2020-10-12 | 2022-09-16 | 上海海事大学 | Variable-aperture porous fin double-layer tapered micro-channel radiator |
| CN114501917A (en) * | 2020-10-25 | 2022-05-13 | 北京航空航天大学 | Micro-channel radiator with air cooling auxiliary heat dissipation function |
| CN112394778B (en) * | 2020-11-17 | 2024-02-23 | 杭州频卓电子工程有限公司 | Computer case |
| CN115087300A (en) * | 2021-03-12 | 2022-09-20 | 华为技术有限公司 | Gas collection device |
| CN116126113A (en) * | 2023-03-02 | 2023-05-16 | 安徽文研科技有限公司 | Cooling device and cooling method for big data Internet server |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2453646Y (en) * | 2000-11-15 | 2001-10-10 | 唐徵 | Guiding tube type air cooling radiator |
| JP2002182791A (en) * | 2000-12-19 | 2002-06-26 | Sharp Corp | Information equipment |
| JP2002196843A (en) * | 2001-12-03 | 2002-07-12 | Hitachi Ltd | Electronic equipment device |
| JP2002314279A (en) * | 2001-04-19 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Cooling equipment |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3133485A1 (en) * | 1980-09-15 | 1982-05-06 | Peter 2563 Ipsach Herren | LIQUID-COOLED ELECTRICAL ASSEMBLY |
| JPS61222242A (en) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | Cooling device |
| US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
| US5653111A (en) * | 1993-07-07 | 1997-08-05 | Hydrocool Pty. Ltd. | Thermoelectric refrigeration with liquid heat exchange |
| US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
| JPH11163565A (en) * | 1997-11-27 | 1999-06-18 | Ando Electric Co Ltd | Cooling structure for printed board |
| JP3601282B2 (en) * | 1998-01-20 | 2004-12-15 | 株式会社日立製作所 | Notebook computer |
| JPH11325764A (en) * | 1998-05-08 | 1999-11-26 | Fujikura Ltd | Cooling device for electron element |
| US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US6619044B2 (en) * | 1999-10-07 | 2003-09-16 | Hydrocool Pyt, Limited | Heat exchanger for an electronic heat pump |
| KR100319198B1 (en) * | 1999-11-17 | 2001-12-29 | 윤종용 | Equipment for assembling heatsink to semiconductor module and method for assembling thereof |
| US20010023762A1 (en) * | 2000-01-11 | 2001-09-27 | Sagal E. Mikhail | Heat pipe spreader construction |
| EP1148547B8 (en) * | 2000-04-19 | 2016-01-06 | Denso Corporation | Coolant cooled type semiconductor device |
| JP2002009477A (en) * | 2000-06-19 | 2002-01-11 | Aisin Aw Co Ltd | Power module refrigerator for controlling electric motors |
| JP3594900B2 (en) * | 2000-12-19 | 2004-12-02 | 株式会社日立製作所 | Display integrated computer |
| JP3698087B2 (en) * | 2001-10-16 | 2005-09-21 | 株式会社日立製作所 | Electronic equipment |
| AU2003214698A1 (en) * | 2002-04-06 | 2003-10-27 | Zalman Tech Co., Ltd | Chipset cooling device of video graphic adapter card |
| JP3452060B1 (en) * | 2002-05-15 | 2003-09-29 | 松下電器産業株式会社 | Electronic equipment cooling device |
| US6934154B2 (en) * | 2003-03-31 | 2005-08-23 | Intel Corporation | Micro-channel heat exchangers and spreaders |
| US7483261B2 (en) * | 2003-06-27 | 2009-01-27 | Nec Corporation | Cooling device for an electronic equipment |
-
2004
- 2004-06-25 CN CNB200480018168XA patent/CN100418037C/en not_active Expired - Fee Related
- 2004-06-25 JP JP2005511044A patent/JPWO2005001674A1/en active Pending
- 2004-06-25 WO PCT/JP2004/008980 patent/WO2005001674A1/en active Application Filing
- 2004-06-25 US US10/562,362 patent/US20070006996A1/en not_active Abandoned
- 2004-06-28 TW TW093118823A patent/TWI239229B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2453646Y (en) * | 2000-11-15 | 2001-10-10 | 唐徵 | Guiding tube type air cooling radiator |
| JP2002182791A (en) * | 2000-12-19 | 2002-06-26 | Sharp Corp | Information equipment |
| JP2002314279A (en) * | 2001-04-19 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Cooling equipment |
| JP2002196843A (en) * | 2001-12-03 | 2002-07-12 | Hitachi Ltd | Electronic equipment device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1813230A (en) | 2006-08-02 |
| US20070006996A1 (en) | 2007-01-11 |
| WO2005001674A1 (en) | 2005-01-06 |
| TW200507736A (en) | 2005-02-16 |
| TWI239229B (en) | 2005-09-01 |
| JPWO2005001674A1 (en) | 2007-09-20 |
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