JP3452060B1 - Electronic equipment cooling device - Google Patents

Abstract

The present invention can improve the heat exchange efficiency, does not cause an airlock, can be reduced in size, weight, and thickness, and has a simple structure and a low-cost cooling device for electronic equipment. The purpose is to provide. SOLUTION: In the cooling device for electronic equipment according to the present invention, the radiator 1 is provided with a circulation path 6 constituting a closed circulation path, and at least the circulation path 6 and the reserve tank 2 become these flow path walls. Flow path wall radiating plate 1a having integrally formed curved surface
It is characterized by being joined by welding or the like to a flat channel-shaped wall heat-radiating plate 1b, which is another curved surface, to form an internal space by abutment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for electronic equipment which cools heat-generating electronic parts such as a central processing unit (hereinafter, CPU) arranged inside a housing by circulating a refrigerant. .

[0002]

2. Description of the Related Art The recent trend toward higher speeds in computers has been extremely rapid, and the clock frequency of CPUs has become significantly greater than before. As a result, the amount of heat generated by the CPU is increased, and the capacity is insufficient only by air-cooling with a heat sink as in the conventional case, and a cooling device with high efficiency and high output is essential. Therefore, as such a cooling device, a cooling device has been proposed that circulates a cooling medium to cool a substrate on which heat-generating components are mounted (see Patent Documents 1 and 2).

A conventional cooling device for electronic equipment which circulates and cools such a refrigerant will be described below. In addition,
In the present specification, the electronic device mainly refers to a device that loads a program into a CPU or the like to perform arithmetic processing, and in particular, a small portable device such as a notebook personal computer. It includes a device equipped with a heating element. This conventional first cooling device,
For example, the one shown in FIG. 8 is known. FIG. 8 is a configuration diagram of a first cooling device for a conventional electronic device. In FIG. 8, 100 is a housing, 101 is a heat generating component, and 102
Is a substrate on which the heat generating component 101 is mounted, and 103 is the heat generating component 1.
01 is a cooler that cools the heat-generating component 101 by exchanging heat between the refrigerant, 104 is a radiator that removes heat from the refrigerant,
Reference numeral 105 is a pump that circulates the refrigerant, 106 is a pipe connecting these, and 107 is a fan that cools the radiator 104 by air.

The operation of the conventional first cooling device will be described. The refrigerant discharged from the pump 105 is sent to the cooler 103 through the pipe 106. Here, the heating component 101
By taking away the heat of, the temperature rises and is sent to the radiator 104. In the radiator 104, the temperature is lowered by being forcedly cooled by the fan 107, and the temperature returns to the pump 105 again to repeat this. In this way, the refrigerant is circulated to take heat from the heat-generating component 101 to cool it.

Next, as a conventional second cooling device for electronic equipment, the one shown in FIG. 9 has been proposed (see Patent Document 3). This second cooling device cools the heat-generating member by efficiently transporting the heat generated by the heat-generating member to the wall of the metal casing, which is the heat-dissipating portion, when the heat-generating member is mounted in a narrow casing.
FIG. 9 is a configuration diagram of a second cooling device for a conventional electronic device.
In FIG. 9, 108 is a wiring board of an electronic device, 109 is a keyboard, 110 is a semiconductor heating element, 111 is a disk device, 112 is a display device, and 113 is a semiconductor heating element 1.
Heat receiving header for exchanging heat with 10, 114 is a heat dissipation header for heat dissipation, 115 is a flexible tube, 11
Reference numeral 6 is a metal housing of the electronic device.

In this second cooling device, the semiconductor heating element 110, which is a heating member, and the metal casing 116 are thermally connected by a heat transport device having a flexible structure.
This heat transport device includes a flat heat receiving header 113 having a liquid flow path attached to a semiconductor heating element 110, and a heat radiating header 11 having a liquid flow path and brought into contact with the wall of a metal casing 116.
4. Flexible tube 115 that connects both
The liquid sealed inside is driven or circulated between the heat receiving header 113 and the heat radiating header 114 by the liquid driving mechanism built in the heat radiating header 114. As a result, the semiconductor heating element 110 and the metal housing 116 can be easily connected without being influenced by the arrangement of parts, and heat is transported with high efficiency by driving the liquid. In the heat dissipation header 114, the heat dissipation header 114 and the metal housing 11
Since 6 and 6 are thermally connected, the heat is widely diffused to the metal housing 116 due to the high thermal conductivity of the metal housing 116.

[0007]

[Patent Document 1] Japanese Unexamined Patent Publication No. 5-264139

[Patent Document 2] Japanese Unexamined Patent Publication No. 8-32263

[Patent Document 3] Japanese Unexamined Patent Publication No. 7-142886

[0008]

However, in the first cooling device of the related art, the cooler 103 that cools the heat-generating component 101 by exchanging heat between the heat-generating component 101 and the refrigerant, and the radiator 104 that removes heat from the coolant. The pump 105 that circulates the refrigerant, although not shown, needs the tank for replenishment because it must be replenished with the refrigerant, and the combination of these causes the device to be large and complicated, difficult to miniaturize, and high in cost. there were. That is, the conventional first cooling device is originally suitable for cooling a large electronic device, is small, lightweight, and thin, and is a recent high-performance portable notebook computer that is carried and used in various postures. It was not possible to deal with such problems.

The smaller and thinner the electronic device is, the smaller the size of the first cooling device is. Therefore, in the case of a device having a relatively large size, the gasification of the refrigerant and the entrainment of bubbles accompanying it can be ignored. Becomes apparent. When gasification of the refrigerant and mixing of air bubbles occur, air bubbles start to accumulate in the pipe 106 and the pump 105, and when used for a long time, the air bubbles cause the pump 105 to be inoperable due to air bubbles that have grown, resulting in heat exchange efficiency. There was a problem that it gradually decreased. It is difficult for the user to discharge the air once accumulated, and there is also a problem that the life of the electronic device is determined due to the malfunction of the cooling device.

Although the second conventional cooling device can be used in a notebook personal computer or the like, the flat heat receiving header 113 attached to the semiconductor heating element 110 is also brought into contact with the wall of the metal casing 116. Also, the heat dissipation header 114 is inevitably thick in the shape of a box, which hinders the thinning of a notebook computer or the like. Further, it is unavoidable that the bubbles that enter the liquid flow paths grow and cause airlock, and this measure is inevitable.

Further, the heat dissipation header 114 which is in contact with the wall of the metal housing 116 is directly attached to the metal housing 116 by sandwiching a thermal compound or a high heat conductive silicone rubber, or by screwing. The thermal efficiency was poor and the cooling power was limited. At this time, it is possible to increase the heat dissipation area in order to increase the cooling power, but simply increasing the area will lengthen the flow path and increase the circulation amount, conversely increasing the possibility of airlock and shortening the life. There was a problem of doing. Then, the increase of the circulation amount leads to the increase of the weight, which goes against the weight reduction. Therefore, for the heat dissipation header 114 of the second cooling device, it is contradictory to increase the heat dissipation area in order to enhance heat conduction. In addition, there is no conventional method to deal with the air lock, and it is possible to think of this second cooling device as an idea, but there is a problem in terms of practicality, and electronic devices that are used in various postures like a laptop computer. The use of this type of chiller in equipment was considered to be practically difficult. Even if this is adopted, there is no choice but to sacrifice the desired small size, light weight, and thinness.
When the CPU capacity has recently been improved and a larger cooling capacity is required, the conventional second cooling device having such a problem can reduce the size, weight and thickness of the notebook computer. It was not possible to deal with it sufficiently and there was doubt about its future potential.

Therefore, according to the present invention, the heat exchange efficiency can be improved, the air lock is not caused, the size is small,
An object of the present invention is to provide a cooling device for an electronic device which is lightweight and thin, has a simple structure, and is low in cost.

[0013]

In order to solve this problem, in a cooling device for electronic equipment of the present invention, the radiator is provided with an internal circulation path forming a part of a closed circulation path, and at least the internal circulation path is provided. The circulation path and the reserve tank are characterized by being formed by butting together a heat dissipation plate integrally formed with curved surfaces serving as the flow path walls, and another heat dissipation plate.

As a result, the heat exchange efficiency can be improved, air lock is not caused, and the size and weight can be reduced.
It can be thin, has a simple structure, and can be manufactured at low cost.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is such that a cooler and a radiator are provided in a closed circuit for circulating a refrigerant.
A cooling device for electronic equipment in which a circulation pump and a reserve tank for storing the refrigerant are respectively provided, the cooler uses the refrigerant to remove heat from the heat-generating components, and the heat is dissipated by the radiator. Is provided with an internal circulation path that constitutes a part of a closed circulation path, and at least the internal circulation path and the reserve tank have a heat dissipation plate integrally formed with curved surfaces serving as flow path walls of these and another heat dissipation plate. By joining, formed by butt , internal circulation path and reserve tank
However, the outflow of bubbles restricts the movement of mixed bubbles in one direction.
Since it is a cooling device for electronic equipment characterized by being connected by a restricted path, it is compact, thin, and low cost because the internal circulation path and the reserve tank are integrally joined and formed by a heat sink with a recess. reduction can be easily realized, a small number of parts manufacturing and assembly is easy, it is possible to realize an inexpensive cooling system, the coolant against the reserve tank
In addition to the function for replenishing, the mixed air bubbles are closed circuit.
To provide a gas-liquid separation function that separates the gas-liquid from the
Can reduce the heat exchange efficiency due to air bubbles and the aerodynamics of the pump.
Can be prevented .

[0016]

[0017] The invention according to claim 2 of the present invention, since a cooling device for an electronic apparatus according to claim 1, characterized in that the reserve tank is provided above the radiator, the internal circulation path The air bubbles are captured in the reserve tank, and it is possible to prevent the heat exchange efficiency from being lowered and the air lock of the pump due to the air bubbles.

The invention according to claim 3 of the present invention is characterized in that one bubble outflow limiting passage is provided.
Since in any of 1-2 is a cooling device for an electronic device according may be retained in securely reserve tank once trapped air bubbles. Further, since pressure is applied to the vicinity of the bubble outflow restricting path during the pump operation, even if the heat radiating plate is turned upside down, the gas in the reserve tank can be prevented from flowing out into the circulation path.

[0019] according to claim 4 of the present invention invention according to any one of claims 1 to 3, characterized in that the bottom of the reserve tank is inclined obliquely downward toward the bubble outflow restriction passage Since it is a cooling device for electronic devices, the refrigerant can be efficiently and reliably supplied to the internal circulation path.

According to a fifth aspect of the present invention, the cross-sectional area of the internal circulation passage of the radiator becomes large in the vicinity of the bubble outflow limiting passage, and the electron according to any one of the first to fourth aspects. Since the device is a cooling device, the flow velocity in the vicinity of the bubble outflow limiting path is reduced, and the bubbles can be reliably guided into the reserve tank.

The invention according to claim 6 of the present invention is characterized in that the upper surface of the internal circulation path of the radiator adjacent to the lower side of the reserve tank is inclined upward toward the bubble outflow restriction path. Since it is the electronic device cooling device according to any one of claims 1 to 5 , it is possible to reliably guide the bubbles to the bubble outflow limiting path regardless of whether the pump is operated or stopped.

[0022] The invention according to claim 7 of the present invention, an electronic apparatus according to any one of claims 1 to 4, characterized in that the internal circulation path for the radiator in the bubble outflow restriction passage near meanders Therefore, even if the radiator is turned upside down when the pump is stopped, the amount of bubbles flowing into the internal circulation path is very small, and it is possible to prevent a decrease in the circulating flow rate and air lock during pump operation.

The invention described in claim 8 of the present invention, according to claim 1-7, characterized in that a first extension reserve tank and the second extension reserve tank respectively downward at both ends of the reserve tank Since it is the electronic device cooling device according to any one of 1, the gas in the reserve tank is trapped in the first extension reserve tank and the second extension reserve tank even when the radiator is turned upside down when the pump is stopped, It is possible to prevent bubbles from flowing out to the circulation path.

The invention described in claim 9 of the present invention, according to claim 8, wherein the capacity of each of the first extension reserve tank and the second extension reserve tank is characterized in that it is a half of the capacity of the reserve tank Since it is the electronic device cooling device described above, it is possible to prevent the bubbles in the reserve tank from flowing out to the internal circulation path even when the radiator is rotated by 90 °.

According to a tenth aspect of the present invention, dimples are formed on the heat dissipation plate which constitutes the reserve tank,
The two heat sinks are connected to each other.
Since it is the electronic device cooling device according to any one of claims 1 to 6, it is possible to prevent the radiator from being deformed due to an increase in the internal pressure of the radiator, and dimples are also provided in the vicinity of the circulation passage and the bubble outflow limiting passage of the reserve tank. Therefore, it is possible to prevent bubbles from flowing out from the reserve tank to the circulation path. Even if the bubbles flow out to the circulation path, the bubbles are subdivided by the dimples, and the air lock of the pump can be prevented.

[0026] The invention according to claim 11 of the present invention, claims 1-3 or 5, characterized in that the bottom of the reserve tank is inclined obliquely upward toward the bubble outflow restriction passage
Since it is the electronic device cooling device according to any one of items 1 to 10, it is possible to reliably guide the bubbles in the reserve tank to the first extension reserve tank and the second extension reserve tank even when the radiator is turned upside down. You can

According to a twelfth aspect of the present invention, the reserve tanks are arranged in an upper direction and a lateral direction of the radiator, and baffles inclined obliquely upward are alternately arranged on both sides in the reserve tank. Since it is the cooling device for an electronic device according to claim 1, it has an effect that the flowing bubbles can be subdivided and gas-liquid separated. Moreover, even if the radiator is turned upside down, bubbles can be captured by the baffle and prevented from flowing out to the pump. In addition, since the flow path meanders, it has an effect of improving heat dissipation efficiency.

[0028] The invention according to claim 13 of the present invention, electrons according to any one of claims 1 to 12, wherein the internal height of the reserve tank is greater than the internal height of the internal circulation path of the radiator Since it is a device cooling device, the capacity of the reserve tank can be made larger. Further, even when the radiator is horizontal, the step formed by the difference in internal height can prevent the gas in the reserve tank from flowing out to the internal circulation path.

The invention according to claim 14 of the present invention is the cooling device for electronic equipment according to any one of claims 1 to 13 , characterized in that at least one joint is provided in the reserve tank. Therefore, it can be used as a charging port when the refrigerant is charged into the closed circuit or as an air vent.

According to a fifteenth aspect of the present invention, in which the joint is provided with a check valve, the cooling device for electronic equipment according to the thirteenth aspect is provided. Eliminates the need to seal hands.

The invention described in claim 16 of the present invention, reservoir
Since the internal circulation path revolves around the reserve tank, the reserve tank is located in the center of the radiator because it is the cooling device for electronic equipment according to any one of claims 1 to 3 . As a result, the weight balance of the radiator is improved, it is possible to prevent the radiator from falling over, the temperature can be dispersed in a wide range, and the heat radiation efficiency can be improved.

According to a seventeenth aspect of the present invention, in the pump, a ring-shaped impeller having a large number of blades formed on the outer circumference and a rotor magnet provided on the inner circumference, and a pump provided on the inner circumference side of the rotor magnet. And a pump casing having a suction port and a discharge port for accommodating an impeller inside and having a ring-shaped cylindrical portion. since a cooling device of an electronic apparatus according to any one of claims 1 to 16, characterized in that the impeller is vortex pumps rotatably supported, and more compact the entire cooling device, to be thin it can.

[0033]

[0034]

[0035]

The embodiment of the present invention will be described below with reference to FIG.
It will be described with reference to FIG.

(Embodiment 1) FIG. 1A is an explanatory view of a radiator of a cooling device for an electronic device according to Embodiment 1 of the present invention, and FIG. 1B is an A- of the radiator of FIG. A sectional view, FIG.
FIG. 3 is a partial crushed perspective view when the cooling device for electronic equipment according to Embodiment 1 of the present invention is incorporated in a notebook computer.

In FIGS. 1 (a), 1 (b) and 2, reference numeral 1 is a material having good thermal conductivity such as aluminum or stainless steel, a radiator usually formed of a metal plate, and 1a is a flow path formed by pressing or the like. A heat dissipation plate constituting the flow path wall (heat dissipation plate of the present invention) 1b in which a concave portion (curved surface of the present invention) serving as a wall is formed, and a flat plate shape that constitutes the radiator 1 by being joined to the heat dissipation plate 1a constituting the flow path wall. It is a flow path wall constituent heat sink (other heat sink of this invention). A recess may be formed in the heat dissipation plate 1b constituting the flow path wall, or may be simply a flat plate. Reference numeral 2 denotes a reserve tank for storing a refrigerant for replenishment and for allowing bubbles to flow in but not allowing them to flow out even if bubbles are mixed in a circulation path 6 which will be described later. Reference numeral 2a denotes a tapered bottom surface of the reserve tank 2. The refrigerant is preferably an antifreeze liquid so that the cooling system does not break down due to freezing in cold regions or winter. Reference numeral 3 denotes a first extension reserve tank which is extended from one end of the reserve tank 2 by changing its direction at right angles, and 4 is a second extension reserve tank which is similarly extended from the other end of the reserve tank 2. Figure 1
As shown in (b), the reserve tank 2, the first extension reserve tank 3, and the second extension reserve tank 4 are U-shaped, and the flat portions of the heat dissipation plates 1a and 1b are joined together. Integral to form one tank. In the first embodiment, the capacity of each of the first extension reserve tank 3 and the second extension reserve tank 4 is set to half the capacity of the reserve tank 2.

Reference numeral 5 is a connection port (a bubble outflow restricting passage of the present invention) which connects a circulation passage 6 and a reserve tank 2 which will be described later, and which allows bubbles to enter the reserve tank 2 side but does not allow movement in the opposite direction. is there. In order to allow air bubbles to enter and to prevent air bubbles from flowing out, when the connection port 5 is viewed from the front, the radius on the circulation path 6 side is large and the radius on the reserve tank 2 side is small. ing. Further, as described later, a step is formed on the reserve tank 2 side in the internal height direction (depth direction when viewed from the front). 6 is a circulation path (internal circulation path of the present invention) formed in a wide meandering manner to increase the heat dissipation area, 7 is between the reserve tank 2 and the circulation path 6, and further the first extension reserve tank 3 and the circulation path. 6 is a first partition wall provided between the two.
Reference numeral 8 is a second partition wall which is also provided between the reserve tank 2 and the circulation path 6 and between the second extension reserve tank 4 and the circulation path 6.

As shown in FIG. 1 (b), the second partition wall 8 is a flat portion of the heat dissipation plate of the flow path wall structure in which a recess serving as the inner wall surface of the flow path is formed by pressing or the like. It is joined to the flat portion of the heat dissipation plate 1b by welding or the like. Similarly, the first partition wall 7 is also a flat portion of the heat dissipation plate 1a forming the flow path wall, and is joined to the flat portion of the heat dissipation plate 1b forming the flow path wall by welding or the like. By joining corresponding flat portions of the other heat dissipation plates 1a and 1b for forming the flow path walls, at least the circulation path 6, the reserve tank 2 above the circulation path 6, the first extension reserve tank 3 in the lateral direction, and the second extension reserve. The tank 4 is configured as an internal space at the same time. As described above, since the two heat dissipation plates 1a and 1b for forming the flow path wall are joined to form the flow path wall, the number of parts is extremely small, the flow path can be formed in one step, the manufacturing is easy, and the accuracy is high. The radiator 1 can be configured to be lightweight and thin.

By the way, the internal height t1 of the reserve tank 2, the first extension reserve tank 3, and the second extension reserve tank 4 is formed larger than the internal height t2 of the circulation path 6. Therefore, in addition to the above-mentioned small radius on the reserve tank 2 side, the connection port 5 has internal heights t1, t
A step is formed due to the difference of 2. The reason why the difference between the internal heights t1 and t2 is provided is that, firstly, it is necessary to increase the amount of heat radiated from the circulation path 6 to the outside air. That is, by reducing the internal height t2 of the circulation path 6, the surface area per unit flow rate of the circulating refrigerant can be increased, and when the amount of the circulating refrigerant is small, the motor output of the pump 24 described later can be reduced. This is because the pump can be made small, the motor itself is small, and the amount of heat generated is small. The second reason is that by increasing the capacity of the reserve tank 2, it is possible to increase the heat capacity, and it is possible to suppress fluctuations due to heat generation inside the electronic device.

A third reason is to prevent bubbles that have flowed into the reserve tank 2 side from flowing out to the circulation path 6 side. That is, in order for the bubbles grown in the reserve tank 2 to flow out, it is necessary to move inside the connection port 5 while maintaining the surface tension of the interface, and the inside of the connection port 5 having a low internal height and a narrow width is When such a grown bubble passes through, it is blocked by air, and since the resistance of the fine bubbles increases in the outflow direction due to the shape of the connection port 5 and the like, even if the buoyancy acts in the outflow direction, This is because they have overcome this resistance and cannot flow out. Note that it is preferable that the connection port 5 between the reserve tank 2 and the circulation path 6 is provided only at one location because the gas-liquid separation function can be ensured.

By the way, the first partition wall 7 and the second partition wall 8 between the reserve tank 2 and the circulation path 6 are inclined obliquely upward toward the central connection port 5 when the radiator 1 is erected in the vertical direction. A bottom surface 2a is formed. Therefore, the width of the circulation path 6 is wide near the connection port 5. This configuration makes it easier to collect bubbles from the refrigerant on the circulation path 6 side and send them to the reserve tank 2 side, and conversely makes it more difficult for bubbles to flow out from the connection port 5 on the reserve tank 2 side to the circulation path 6. To do. That is, even if the posture of the radiator 1 is reversed, the taper of the bottom surface 2a of the first partition wall 7 and the bottom surface 2a of the second partition wall 8 has an inverse gradient with respect to the buoyancy acting on the bubbles, and the bubbles usually wrap around the connection port 5. Even if it goes around, the outflow can be suppressed by the influence of the above-mentioned surface tension, viscosity and the like. With these configurations, it is possible to reliably seal the air lock of the pump, especially in the closed circuit, which is the greatest difficulty when cooling the electronic device with the refrigerant.

In FIG. 1 (a), 9 is an inlet which is an inlet end of the circulation path 6 in the radiator 1, and 10 is a flow which is an outlet end of the circulation path 6 in the radiator 1. An outlet, 11 is a joint. The inflow port 9 and the outflow port 10 are connected to an external circulation path including a later-described pump 24 that sends the refrigerant. A joint 11 is connected above the reserve tank 2. Joint 11
Is closed during normal operation, but is open only when the refrigerant is charged. Therefore, after charging the refrigerant, it may be plugged with a rubber cap or the like, or a check valve may be built in advance.
In the first embodiment, the radiator 1 is configured by joining the flat portions of the heat dissipation plates 1a and 1b constituting the flow path wall, but a flat metal pipe is crushed and fixed to a flat metal pipe. Although it seems that it can be configured in the same way even if it is configured with, the number of parts is increased, the accuracy is not obtained and the manufacturing is practically difficult.

Next, a description will be given of the case where the cooling device of the first embodiment is used as an electronic device in a notebook computer. In FIG. 2, reference numeral 21 denotes a notebook personal computer main body (first housing of the present invention) having an upper surface and a keyboard which houses an electronic circuit including a CPU and a storage device, and 22 a liquid crystal display of the notebook personal computer. Further, a display unit (second housing of the present invention) 22a which corresponds to the upper lid is a display device such as a liquid crystal display capable of displaying the processing result of the CPU. The display unit 22 is rotatably attached to the notebook computer main body 21. The radiator 1 is provided on the back surface of the display device 22a. The heat dissipation plate 1b constituting the flow path wall may be exposed without a decorative plate, or may be covered with a decorative plate having good thermal conductivity. A cooler 23 is attached to a heat generating element (heat generating component of the present invention) such as a CPU, and at least a contact surface for transferring heat is formed of a metal having good heat conductivity such as aluminum or stainless steel. In the case of the first embodiment, although not shown in FIG. 2, the circulation path 6 for circulating the refrigerant is formed inside the cooler 23. Reference numeral 24 is a pump for forcedly circulating the refrigerant (circulation pump of the present invention), and 25 is a pipe forming a closed circulation path.

Although not shown, the pump 24 of the first embodiment is a vortex pump (also called a Wesco type pump, a regenerative pump or a friction pump), and has a large number of grooved blades formed on the outer circumference and an inner circumference on the inner circumference. A ring-shaped impeller provided with a rotor magnet and a motor stator provided on the inner peripheral side of the rotor magnet are provided and driven by energizing the motor stator. The ring-shaped impeller is housed in a pump casing having a suction port and a discharge port.
In this pump casing, a cylindrical portion is arranged between the motor stator and the rotor magnet, and a ring-shaped impeller is rotatably supported by the cylindrical portion. This pump 2
Since 4 has a small size and a flat and thin shape, the cooling device can be made smaller and thinner. The pump 7 according to the first embodiment has a thickness of 5 to 10 mm in the rotation axis direction, a representative dimension of 40 to 50 mm in the radial direction, and a rotation speed of 1200.
The pump has an rpm, a flow rate of 0.08 to 0.12 L / min, and a head of about 0.35 to 0.45 m. The specifications of the pump of the present invention include the values of the first embodiment,
Thickness 3 to 15 mm, radial representative dimension 10 to 70 mm,
The flow rate is 0.01 to 0.5 L / min, and the head is about 0.1 to 2 m. This is a specific speed of 24 to 28
It is a pump of about (unit: m, m ³ / min, rpm), which is a small and thin pump having a size completely isolated from the conventional pump.

Further, in the first embodiment, as shown in FIG. 2, the cooler 23 and the pump 24 are separated into the pipe 2
Although it is connected by 5, it is also possible to use the above-mentioned vortex pump as a constituent part of the pump 24 that also serves as the cooler 23, and to mount this constituent part directly on the CPU or the like which is a heat generating part. In this case, the pump casing needs to be made of a metal having a high thermal conductivity such as aluminum. Since the side surface of the pump is flat, it can be mounted on the CPU or the like. As a result, sufficient heat transfer can be performed.

The radiator 1, the cooler 23, and the pump 24
Are connected in series by a pipe 25, and the above-mentioned inflow port 9,
It is connected to the outflow port 10 and constitutes a closed circuit as a whole together with the circuit 6. This closed circuit is filled with a refrigerant that exchanges heat. In the case of the conventional cooling device, there is a high possibility that air will be locked if the air is not completely discharged, but in the case of the first embodiment, there is no problem even if air remains in the reserve tank 2, and rather this On the contrary, some air is enclosed. This is because the posture of the laptop computer changes in various ways, and when the enclosed air is moved to the first extension reserve tank 3 and the second extension reserve tank 4, the dispersed fine bubbles become one. Due to the above-mentioned reasons relating to the gathered and grown bubbles, they cannot pass through the connection port 5 and prevent outflow. Further, even if the volume of the refrigerant increases due to thermal expansion, the enclosed air serves as a cushion to prevent liquid leakage from the circulation passage and rupture of the circulation passage.

Next, the operation of the cooling device according to the first embodiment will be described. When the power of the notebook computer is turned on and the heating elements such as the CPU need to be cooled, a voltage is applied to the pump 24. The pump 24 starts driving and starts circulating the refrigerant in the circulation path. As a result, the heat generated from the heat generating element such as the CPU is heat-exchanged between the cooler 23 and the heat generating element, and is transferred from the contact surface to the lower surface of the cooler 23. Is transmitted to the refrigerant. The heat-transferred refrigerant is transferred to the radiator 1 via the inflow port 9 by the pump. The refrigerant transferred to the radiator 1 meanders through the circulation path 6 in the radiator 1 to exchange heat with the outside air and radiate heat. The refrigerant cooled by the radiator 1 passes through the outlet 10 and the pipe 25 such as a flexible tube, and is cooled again by the cooler 23.
And is exchanged with the heating element again.

Then, with the passage of time, a part of the refrigerant is gasified, and although it depends on the material, it is replaced with the atmosphere through the pipe 25, and air bubbles are mixed into the refrigerant. In the case of the first embodiment, the bubbles mixed in the refrigerant are circulated together with the refrigerant and transferred to the circulation path 6 in the radiator 1. Due to the buoyancy, the bubbles in the circulation path 6 reach the connection port 5 along the first partition wall 7, float from the connection port 5 into the reserve tank 2, and are separated into gas and liquid. Similarly, when the pump 24 is stopped, the air bubbles accumulated along the second partition wall 8 reach the connection port 5 along the second partition wall 8 by the action of buoyancy, enter the reserve tank 2 through the connection port 5, and enter the gas. Liquid is separated.

According to the cooling device of the first embodiment, the radiator 1 and the reserve tank 2 are integrally arranged as a recess on the heat dissipation plate 1a of the flow path wall and the heat dissipation plate 1b of the flow path wall and are welded together. Since they are joined together, it is possible to realize downsizing, weight saving, and thinning, and it is possible to provide a cooling device at low cost.

Further, since the width of the circulation path 6 near the connection port 5 is wide, the flow velocity near the connection port 5 is reduced, and the bubbles mixed in the refrigerant can be reliably captured in the reserve tank. It is possible to prevent a decrease in the circulation flow rate due to the suction of bubbles by the pump 24 and air lock, or a decrease in the heat exchange efficiency due to a reduction in the circulation flow rate and the inclusion of bubbles in the refrigerant.

Further, since the first partition wall 7 and the second partition wall 8 are inclined obliquely upward toward the connection port 5, even if the pump 24 is not operating, bubbles are generated in the reserve tank by the action of buoyancy. Can lead to. The volumes of the first extension reserve tank 3 and the second extension reserve tank 4 are each formed to be half the volume of the reserve tank 2, and the first partition wall 7 and the second partition wall 8 face the connection port 5. Since the slope is formed obliquely upward, the air in the reserve tank can be surely retained in the reserve tank regardless of the direction in which the radiator 1 is inclined.

(Second Embodiment) FIG. 3 is an explanatory diagram of a radiator of a cooling device for an electronic device according to a second embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 3, reference numeral 2b denotes a baffle which is alternately projecting obliquely upward from both sides in the reserve tank 2. The area between the baffles 2b has a small inlet and outlet,
It is possible to form an air retention region inside, and even if air is mixed in the refrigerant and the posture is reversed, the air is trapped in this retention region and is not moved to the pump side.

The radiator 1 of the second embodiment is similar to the first embodiment shown in FIG. 1 (b) in that the heat dissipation plate 1a for forming a flow path wall is provided with a recess serving as a flow path wall formed by pressing or the like (see FIG. 3 is not shown) and a flat plate-shaped heat dissipation plate 1b (FIG. 3).
(Not shown) are joined together by welding or the like to be integrated. The heat dissipation plates 1a and 1b for forming the flow path walls are formed of a metal plate having good thermal conductivity such as aluminum or stainless steel. A circulation path 6 is provided in the heat dissipation plate 1a having a flow path wall having a recess.
At the same time, a recess serving as the reserve tank 2 is provided in an inverted L-shape as a whole in the upper (vertical direction) of the radiator 1 and the portion bent laterally with respect thereto. Flat portions are alternately formed on both sides of the bent lateral concave portion so as to form the baffles 2b from both sides.

According to the radiator 1 of the second embodiment,
Since the baffles 2b inclined obliquely upward are alternately arranged on both sides in the first reserve tank 2, the refrigerant meanders in the reserve tank 2 and the heat exchange efficiency is improved.
Further, gas and liquid are separated by the baffle 2b, and the pump 24
It is possible to prevent bubbles from flowing into (not shown in FIG. 3). Furthermore, even if the radiator 1 is turned upside down,
Air is trapped by the baffle 2b, so that bubbles can be prevented from flowing into the pump 24.

(Third Embodiment) FIG. 4 is an explanatory diagram of a radiator of a cooling device for electronic equipment according to a third embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 4, reference numeral 2c designates a tapered bottom surface formed in the reserve tank 2 located in the upper direction (vertical direction) of the radiator 1, and is formed in a structure inclined obliquely downward toward the connection port 5. ing. Reference numeral 6a is a guide wall which is formed in the circulation path 6 near the connection port 5 and is inclined obliquely upward toward the connection port 5.

As shown in FIG. 4, the radiator 1 according to the third embodiment has a flow path in which a concave portion serving as a flow path wall is formed by pressing or the like as in the first embodiment shown in FIG. 1B. The wall-constituting heat dissipation plate 1a (not shown in FIG. 4) and the plate-shaped flow path wall-constituting heat dissipation plate 1b (not shown in FIG. 4) are joined by welding or the like to be integrated. Flow path wall configuration heat sink 1a,
1b is formed of a metal plate having good thermal conductivity such as aluminum or stainless steel. Heat dissipation plate 1 for forming flow path wall having recess
A reserve tank 2 is branched from a circulation path 6 in a, a flat portion is formed so that a concave portion forming the bottom surface 2c is inclined toward a connection port 5, and a guide wall 6a is inclined obliquely upward. Thus, the flat portion is formed.

According to the third embodiment, since the bottom surface of the reserve tank 2 is inclined obliquely downward toward the connection port 5, the refrigerant can be efficiently and reliably supplied to the circulation path 6. . Further, since the upper surface of the circulation path 6 adjacent to the reserve tank 2 is inclined obliquely upward toward the connection port 5, the pump 24 (not shown in FIG. 4).
The bubbles can be guided into the reserve tank 2 by the action of the buoyancy even if is not operating. The bubbles that once entered the reserve tank 2 do not return to the circulation path 6 side for the above reason.

(Fourth Embodiment) FIG. 5 is an explanatory diagram of a radiator of a cooling device for electronic equipment according to a fourth embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 5, 6b is a meandering path provided in the circulation path 6 near the connection port 5. This meandering path 6b allows the circulation path 6
It is possible to prevent a large amount of gas from flowing from the pump to the pump 24 (not shown in FIG. 5).

As shown in FIG. 5, the radiator 1 according to the fourth embodiment is similar to the first embodiment shown in FIG. 1 (b) in that the flow path is formed with a concave portion to be a flow path wall by press working or the like. The wall-structured heat dissipation plate 1a (not shown in FIG. 5) and the plate-shaped flow path wall-structured heat dissipation plate 1b (not shown in FIG. 5) are joined by welding or the like to be integrated. Flow path wall configuration heat sink 1a,
1b is formed of a metal plate having good thermal conductivity such as aluminum or stainless steel. Heat dissipation plate 1 for forming flow path wall having recess
In a, the reserve tank 2 is located in the upper direction (vertical direction) of the radiator 1 and is branched from the circulation path 6, and its bottom surface 2c is inclined obliquely downward toward the connection port 5. In addition, the width of the circulation path of the meandering path 6b is formed to be wider immediately below the connection port 5 than at other portions.

According to the radiator 1 of the fifth embodiment, since the bottom surface 2c of the reserve tank 2 is inclined obliquely downward toward the connection port 5, the refrigerant is efficiently and reliably supplied to the circulation path 6. can do. Further, since the meandering path 6b near the connection port 5 meanders along the bottom surface 2c, even if the radiator 1 is turned upside down when the pump is stopped,
It is possible to prevent a large amount of gas from flowing out to the pump 24 (not shown in FIG. 5) side, and it is possible to prevent a decrease in the circulating flow rate during operation of the pump, an air lock, and the like. The bubbles that once entered the reserve tank 2 do not return to the circulation path 6 side for the above reason.

(Embodiment 5) FIG. 6 (a) is an explanatory view of a radiator of a cooling device for electronic equipment according to Embodiment 5 of the present invention, and FIG. 6 (b) is an A- of the radiator of FIG. 6 (a). FIG. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIGS. 6 (a) and 6 (b), 2d are dimples provided in the reserve tank 2 at regular intervals. This dimple 2d is provided on the radiator 1, especially in the reserve tank 2 having a large area. Further, dimples 2d are also provided in the vicinity of the circulation path 6 and the connection port 5 of the reserve tank 2.

The radiator 1 of the fifth embodiment is similar to the first embodiment shown in FIG. 1 (b) in that the heat dissipation plate 1a for forming a flow path wall is provided with a recess for forming a flow path wall by pressing or the like. The heat dissipation plate 1b having a flat plate-like flow path wall is joined and integrated by welding or the like. Further, as shown in FIG. 6B, a large number of dimples 2d are formed so as to project from the heat dissipation plate 1a forming the flow path wall, and are joined to the heat dissipation plate 1b forming the flow path wall by welding or the like. However, the dimples 2d may be formed on the heat dissipation plate 1b side of the flow path wall, or on both sides of the heat dissipation plate 1a and the heat dissipation plate 1b of the flow path wall. The heat dissipation plates 1a and 1b for forming the flow path walls are formed of a metal plate having good thermal conductivity such as aluminum or stainless steel. A circulation path 6 is formed in a heat dissipation plate 1a for forming a flow path wall having a dimple 2d and a recess serving as a flow path wall so as to intersect with the recess serving as the reserve tank 2. The first extension reserve tank 3 and the second extension reserve tank 4 are extended by changing their directions at right angles so as to form a U shape.

According to the fifth embodiment, the dimple 2d
Since it is provided in the radiator 1, especially in the reserve tank 2 having a large area, it is possible to prevent the radiator 1 from being deformed or damaged due to an increase in the internal pressure of the radiator 1. In addition, the circulation path 6,
Also, the dimples 2 are provided near the connection port 5 of the reserve tank 2.
Since d is provided, the bubbles can be prevented from flowing out from the reserve tank 2 to the circulation path 6, and even if the bubbles flow out to the circulation path 6, the dimple 2
The bubbles are subdivided by d, and the air lock of the pump can be prevented.

(Sixth Embodiment) FIG. 7 is an explanatory diagram of a radiator of a cooling device for an electronic device according to a sixth embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 7, the reserve tank 2 is located at the center of the radiator 1, and the circulation path 6 is shown in the reserve tank 2
Is provided at a position surrounding the outside of the. The circulating refrigerant circulates around the outer periphery of the reserve tank 2 and then flows out of the radiator 1 through the central portion of the radiator 1.

As shown in FIG. 7, in the radiator 1 of the sixth embodiment, as in the case of the first embodiment shown in FIG. 1 (b), the flow path in which the concave portion to be the flow path wall is formed by press working or the like is formed. The wall-structured heat dissipation plate 1a (not shown in FIG. 7) and the plate-shaped flow path wall-structured heat dissipation plate 1b (not shown in FIG. 7) are joined by welding or the like to be integrated. Flow path wall structure heat sink 1
Each of a and 1b is formed of a metal plate having good thermal conductivity such as aluminum or stainless steel. In the heat dissipation plate 1a of the flow path wall,
A recess for forming the reserve tank 2 is formed at the center of the radiator 1 so as to intersect with the circulation path 6, and the bottom surface 2a thereof is inclined obliquely upward toward the connection port 5.

According to the radiator 1 of the sixth embodiment, since the reserve tank 2 is located at the center of the radiator 1, the weight balance of the radiator 1 is improved and, for example, a liquid crystal display of a notebook computer or the like. When the radiator 1 is housed in the upper lid, the weight balance can be prevented from being unstable, the laptop body can be prevented from falling, and the thickness of the radiator 1 near the outer periphery can be reduced. Since it is possible, it is possible to create a design shape that does not feel the thickness. Further, since the refrigerant passes through the outer peripheral side of the reserve tank 2,
Due to the dimensions, even if the circulation path 6 cannot be provided near the outer circumference of the radiator 1, the temperature can be dispersed in a wide range,
The heat dissipation efficiency can be improved.

[0074]

According to the cooling device for electronic equipment of the present invention,
Since at least the internal circulation path and the reserve tank are integrally formed and joined with a heat dissipation plate having a curved surface, the size is small,
It is possible to realize a thin and low-cost cooling device, a small number of parts, easy manufacturing and assembling, and an inexpensive cooling device.

In addition to the function of supplying the refrigerant to the reserve tank, it is possible to provide a gas-liquid separation function of separating mixed air bubbles from the closed circulation path by separating them from each other. It is possible to prevent lowering and air lock of the pump.

Since the reserve tank is provided above the radiator, the bubbles in the internal circulation passage are trapped in the reserve tank, and it is possible to prevent the heat exchange efficiency from being lowered by the bubbles and the air lock of the pump. It is possible to supply a highly reliable cooling device.

Since there is only one air bubble outflow limiting passage from the internal circulation passage of the radiator to the reserve tank, it is possible to surely retain the air bubbles once captured in the reserve tank, and to keep the air bubbles in the pump operation. Since pressure is applied near the outflow restriction path, even if the heat sink is turned upside down, it is possible to prevent the gas in the reserve tank from flowing out into the closed circulation path. It is possible to prevent lowering of efficiency and air lock of the pump,
A highly reliable cooling device can be supplied.

Since the bottom surface of the reserve tank is inclined obliquely downward toward the bubble outflow restricting passage, the refrigerant can be efficiently and reliably supplied to the internal circulation passage.

Since the cross-sectional area of the internal circulation passage of the radiator becomes large in the vicinity of the connection port, the flow velocity in the vicinity of the bubble outflow limiting passage is reduced, and it becomes possible to reliably guide the bubbles into the reserve tank. It is possible to prevent a decrease in exchange efficiency and an air lock of the pump, and it is possible to supply a highly reliable cooling device.

Since the upper surface of the internal circulation path of the radiator adjacent to the lower side of the reserve tank is inclined upward toward the bubble outflow restriction path, regardless of whether the pump is operating or stopped,
It is possible to reliably guide the bubbles to the bubble outflow limiting path,
It is possible to prevent a decrease in heat exchange efficiency due to air bubbles, an air lock of the pump, and the like, and it is possible to supply a highly reliable cooling device.

Since the internal circulation passage of the radiator in the vicinity of the bubble outflow limiting passage meanders, even if the radiator is turned upside down when the pump is stopped, the amount of gas flowing out to the circulation passage is very small, and it is It is possible to prevent a decrease in circulation flow rate, air lock, etc., and to supply a highly reliable cooling device.

Since the first extension reserve tank and the second extension reserve tank are respectively provided downward at both ends of the reserve tank, even if the radiator is turned upside down when the pump is stopped, the gas in the reserve tank is the first. Captured in the extension reserve tank and the second extension reserve tank, it is possible to prevent the outflow of gas to the closed circulation path, and it is possible to prevent the decrease of heat exchange efficiency due to bubbles and the air lock of the pump. A highly efficient cooling device can be supplied.

The capacity of each of the first extension reserve tank and the second extension reserve tank is 1 of the reserve tank capacity.
Since it is / 2, even if the radiator is rotated by 90 °, it is possible to prevent the gas in the reserve tank from flowing out to the internal circulation path, and prevent the heat exchange efficiency from being reduced due to bubbles and the air lock of the pump. Therefore, a highly reliable cooling device can be supplied.

Since the strength is improved by providing the dimples in the reserve tank having a large area, it is possible to prevent the heat sink from being deformed or damaged due to an increase in the inner pressure of the heat sink even when there is an abnormality, and to construct the flow path wall structure. Since the heat sink can be made thin, weight reduction and cost reduction can be realized. Further, since the circulation path and the dimples are provided in the vicinity of the connection port of the reserve tank, it is possible to prevent the outflow of bubbles from the reserve tank to the circulation path and subdivide the bubbles,
The air lock of the pump can be prevented.

Since the bottom surface of the reserve tank is inclined obliquely upward toward the bubble outflow restricting path, even if the radiator is turned upside down, the bubbles in the reserve tank can be retained in the first extension reserve tank and the second extension reserve tank. Can be reliably led to.

Bubbles flowing through the baffle can be subdivided and gas-liquid separated. Moreover, even if the radiator is turned upside down, bubbles can be captured by the baffle and prevented from flowing out to the pump. Moreover, since the flow path meanders, heat dissipation efficiency is improved.

Since the internal height of the reserve tank is larger than the internal height of the internal circulation path of the radiator, the capacity of the reserve tank can be made larger. Further, even when the radiator is in the horizontal state, it is possible to prevent the gas in the reserve tank from flowing out to the internal circulation path due to the step formed by the difference in the internal height.

Since the reserve tank is provided with at least one joint, it can be used as a filling port when the closed circulation path is filled with the refrigerant or as an air vent port. Since the joint is provided with the check valve, the work of sealing the joint after charging the closed circuit with the refrigerant becomes unnecessary. Since it is a swirl pump, the entire cooling device can be made smaller and thinner.

Since the reserve tank is located at the center of the radiator, the weight balance of the radiator is improved, it is possible to prevent falls, etc., and it is possible to disperse the temperature in a wide range and improve the heat radiation efficiency. Can be made.

An electronic device can be stored even in a notebook computer whose installation space is severely restricted, and has a function of cooling a larger amount of heat generation. Since the radiator is arranged on the back of the display device, the back side of the display device can be fully used in electronic devices such as laptop computers where the installation space is severely restricted, and effective cooling is achieved without increasing the thickness. be able to. By using the antifreeze as the refrigerant, the refrigerant does not freeze and the cooling system does not break down even in cold regions.

[Brief description of drawings]

FIG. 1A is an explanatory diagram of a radiator of a cooling device for an electronic device according to a first embodiment of the present invention, and FIG. 1B is a sectional view taken along the line AA of the radiator of FIG.

FIG. 2 is a partially crushed perspective view when the cooling device for the electronic device according to the first embodiment of the present invention is incorporated in a notebook computer.

FIG. 3 is an explanatory diagram of a radiator of an electronic device cooling device according to a second embodiment of the present invention.

FIG. 4 is an explanatory diagram of a radiator of a cooling device for an electronic device according to a third embodiment of the present invention.

FIG. 5 is an explanatory diagram of a radiator of a cooling device for an electronic device according to a fourth embodiment of the present invention.

6A is an explanatory view of a radiator of a cooling device for an electronic device according to a fifth embodiment of the present invention, and FIG. 6B is a sectional view taken along line AA of the radiator of FIG. 6A.

FIG. 7 is an explanatory diagram of a radiator of an electronic device cooling device according to a sixth embodiment of the present invention.

FIG. 8 is a configuration diagram of a first cooling device for a conventional electronic device.

FIG. 9 is a configuration diagram of a second cooling device for a conventional electronic device.

[Explanation of symbols]

1 radiator 1a, 1b Flow path wall configuration heat sink 2 reserve tanks 2a, 2c bottom 2b baffle 2d dimple 3 First extension reserve tank 4 Second extension reserve tank 5 connection ports 6 circuit 6a guide wall 6b meandering path 7 First partition 8 second partition 9 Inlet 10 Outlet 11 joints 21 Notebook PC 22 Display 22a display device 23 Cooler 24 pumps 25 piping 100 housing 101 heat generating parts 102 substrate 103 cooler 104 radiator 105 pump 106 plumbing 107 fans 108 wiring board 109 keyboard 110 Semiconductor heating element 111 Disk device 112 display device 113 Heat receiving header 114 heat dissipation header 115 Flexible tube 116 metal housing

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI G06F 1/00 360A (72) Inventor Masashi Hirose 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Aizo Jōmitsu 1006 Kadoma, Kadoma City, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (56) Reference JP 2001-24372 (JP, A) JP 2000-222072 (JP, A) JP 10-213370 (JP, A) JP 10-185465 (JP, A) JP 7-307423 (JP, A) JP 2000-111225 (JP, A) JP 5-209522 (JP, A) JP HEI 5-139493 (JP, A) JP 2002-182797 (JP, A) JP 2002-335091 (JP, A) Actual development Sho 63-177096 (JP, U) (58) Fields investigated (Int.Cl . ⁷ , DB name) H05K 7/20 H01L 23/34-23/473 G06F 1/20

Claims (17)

(57) [Claims] 1. A cooler, a radiator, a circulation pump, and a reserve tank for storing the refrigerant are respectively provided in a closed circuit for circulating the refrigerant, and the cooler uses the refrigerant to generate heat from a heat generating component. A cooling device for an electronic device in which the radiator radiates the deprived heat, wherein the radiator is provided with an internal circulation path forming a part of the closed circulation path, and at least the internal circulation path and the The reserve tank is formed by abutting the heat dissipation plate integrally formed with the curved surfaces to be these flow path walls with another heat dissipation plate, and the internal circulation path and the reserve tank are
Bubble outflow restriction that restricts the movement of mixed bubbles in one direction
A cooling device for electronic equipment, which is connected by a road . 2. A cooling device for an electronic apparatus according to claim 1, wherein the reserve tank above the radiator are provided. 3. A cooling device of an electronic apparatus according to any one of claims 1-2, characterized in that the bubble outflow restriction passage is provided one place. 4. A cooling device for an electronic apparatus according to any one of claims 1 to 3, characterized in that the bottom of the reserve tank is inclined obliquely downward toward the bubble outflow restriction passage. 5. The cooling device of an electronic apparatus according to any one of claims 1-4, characterized in that the cross-sectional area of the internal circulation path of the radiator in the bubble outflow restriction path proximal increases. 6. The upper surface of the internal circulation passage of the radiator adjacent to the lower portion of the reserve tank is inclined obliquely upward toward the bubble outflow limiting passage.
A cooling device for an electronic device according to any one of claims 5 to 10 . 7. A cooling device for an electronic apparatus according to any one of claims 1 to 4, the internal circulation path for the radiator in the bubble outflow restriction path proximal characterized in that the meanders. 8. Electronic device according to any one of claims 1 to 7, characterized in that each provided with first extension reserve tank and the second extension reserve tank downward at both ends of the reserve tank Cooling system. 9. The cooling device for an electronic device according to claim 8, wherein the capacity of each of the first extension reserve tank and the second extension reserve tank is 1/2 of the capacity of the reserve tank. 10. A dimple is formed on the heat radiating plate constituting the reserve tank, the cooling device of an electronic device according to claim 1-6, wherein the connecting the two radiating plates. 11. The electronic device according to claim 1 or 5-10, characterized in that the bottom of the reserve tank is inclined obliquely upward toward the bubble outflow restriction passage Cooling system. 12. The reserve tank is arranged in an upper direction and a lateral direction of the radiator, and baffles inclined obliquely upward are alternately arranged on both sides in the reserve tank. The electronic device cooling device according to 1. 13. The cooling device of an electronic apparatus according to any one of claims 1 to 12, wherein the internal height of the reserve tank is greater than the internal height of the internal circulation path of the radiator. 14. The method of claim, characterized in that joint to the reserve tank is provided at least one or more places 1-13
A cooling device for an electronic device according to any one of 1. 15. The cooling device for an electronic device according to claim 13, wherein the joint includes a check valve. 16. The cooling device of an electronic apparatus according to claim 1, wherein the peripheral internal circulation path of the reserve tank is equal to or orbiting. 17. The pump has a ring-shaped impeller having a large number of blades formed on the outer circumference and a rotor magnet provided on the inner circumference, a motor stator provided on the inner circumference side of the rotor magnet, and the motor. A cylindrical portion disposed between the stator and the rotor magnet is formed, and a pump casing that houses the impeller inside and has a suction port and a discharge port is provided, and the cylindrical portion functions as the ring-shaped impeller. cooling apparatus for electronic device according to any one of claims 1 to 16, characterized in that a rotatably vortex pump journaled.