JP2006235914A - Liquid cooling system, and small electronic device equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid cooling system for a small and portable electronic device such as a laptop with high cooling efficiency/capacity, and to provide the small electronic device using the system. <P>SOLUTION: The liquid cooling system for electronic equipment includes a heat generation element 30 such as a CPU inside a main body case 10. The system comprises: a cooling jacket 40 which is thermally connected to the heat generation element, so as to transmit the generated heat to an internally flowing liquid refrigerant; a radiator part 100 for discharging the heat transmitted to the liquid refrigerant in the cooling jacket to the outer part of the equipment; and a circulation pump 50 for circulating the liquid refrigerant in a loop including the cooling jacket and the radiator part. The radiator part includes: a meander flow passage 110 formed by meandering a flow passage; a heat radiation part 130; and a tank part surrounding the meander flow passage. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a so-called small and portable electronic device such as a laptop computer or a laptop computer, which includes a semiconductor integrated circuit element, which is a heating element, in a liquid refrigerant. The present invention relates to a liquid cooling system capable of efficient cooling and a small electronic device including such a liquid cooling system.

  A small and portable electronic device such as a laptop computer or a laptop personal computer includes a semiconductor integrated circuit element typified by a CPU (Central Processing Unit), which is a heating element, inside the housing. For this reason, cooling is usually required to ensure the normal operation of the heating element. Conventionally, in order to realize such cooling, generally, a so-called heat sink, in which a heat transfer body integrally formed with fins is attached to the heat generating element in a thermally connected manner, and a so-called fan is provided that sends cooling air to the heat generating element. The air cooling system was used.

  However, in recent years, along with the miniaturization and high integration of the semiconductor integrated circuit elements, which are the heat generating elements, and the higher functionality, heat generation in the heat generating elements has increased, and the heat generating parts have become localized. For this reason, instead of the conventional air-cooling type cooling system, for example, a liquid cooling type cooling system having a high cooling efficiency using a refrigerant such as water has attracted attention and has been adopted.

  As a liquid-cooled cooling system that is used in a small and portable electronic device such as a laptop or notebook personal computer described above and has a high cooling efficiency, for example, as known from the following patent documents, etc. In general, a member called a heat receiving (cooling) jacket is directly mounted on the surface of the CPU that is a heating element, and on the other hand, a liquid refrigerant is passed through a flow path formed inside the heat receiving jacket. That is, the heat generated from the CPU is transmitted to the refrigerant flowing in the jacket, thereby cooling the heating element with high efficiency. In such a liquid cooling type cooling system, a heat cycle is usually formed with the cooling jacket as a heat receiving part. Specifically, a circulation pump for circulating the liquid refrigerant in the cycle, the liquid refrigerant A radiator that is a heat radiating part for radiating the heat of the outside to the outside, and further, if necessary, a refrigerant tank for storing liquid refrigerant provided in a part of the cycle, and these, for example, They are connected via a tube made of an elastic body such as a metal tube or rubber.

On the other hand, it is also suitable for use in small and portable electronic devices such as laptops and notebook personal computers, in order to dissipate high heat from the CPU uniformly in the case and to dissipate heat to the outside. A so-called heat pipe in which a heat pipe is attached to the back side of a display unit such as a liquid crystal display in a lid-side casing is already known from, for example, Patent Document 2 below. In addition, a cooling system for an electronic device that cools a CPU having a high calorific value using a so-called thermosiphon phenomenon is already known according to Patent Documents 3 and 4 below.
JP 2002-189535 A JP-A-8-288868 US Pat. No. 6,097,597 US Pat. No. 6,510,052

By the way, in the cooling systems known in the above-mentioned other patent documents 2 to 4, a phenomenon called a heat pipe or a thermosiphon is utilized, and this is attached to the inside of the lid side casing, particularly the back side of the liquid crystal display. However, compared with the cooling method that actively circulates the liquid refrigerant in the cooling system, the cooling capacity is low, and in particular, it is not sufficient for cooling a CPU that generates a large amount of heat with the recent increase in functionality. there were.
CPU

  On the other hand, in the cooling system disclosed in the above-described prior art, particularly Patent Document 1, it is possible to efficiently cool a CPU having a high calorific value by the action of the liquid refrigerant circulating in the cooling system and the heat receiving jacket. . However, a heat dissipating plate disposed in the lid-side casing to dissipate the heat to the outside employs a heat dissipating plate formed by winding a metal pipe on a metal flat plate. From the structure, it was difficult to say that a sufficient heat dissipation effect could be obtained.

  It is also important to circulate a relatively large amount of liquid refrigerant in order to efficiently cool a CPU with a high calorific value. However, in the cooling system of Patent Document 1 that circulates the liquid refrigerant, a part of the liquid refrigerant is leaked from the connection portion formed by the tube made of the elastic body described above due to vaporization. In order to maintain the cooling capacity, it is necessary to provide a refrigerant tank for storing the liquid refrigerant in a part of the cycle. However, when the refrigerant tank is provided in the main body housing for that purpose, problems such as a further narrowing of the space in the housing have been pointed out.

  Therefore, the present invention has been made in view of the above-described problems in the prior art, that is, suitable for use in a small and portable electronic device such as the laptop or notebook personal computer. And a liquid cooling system including a radiator part in which a refrigerant tank is formed in order to exhibit a high cooling capacity, and a small electronic device including the liquid cooling system. And

  And according to the present invention, in order to achieve the above-described object, first, a liquid cooling system for an electronic device including a semiconductor element that generates heat in a housing, which is thermally connected to the semiconductor element, A cooling jacket for transmitting the generated heat to the liquid refrigerant flowing inside, a radiator section for releasing heat transmitted to the liquid refrigerant in the cooling jacket to the outside of the device, and the cooling jacket and the radiator section A circulation pump for circulating the liquid refrigerant in a loop including: and the radiator portion includes a heat radiating portion on the plane for radiating the heat of the liquid refrigerant to the outside of the housing, There is provided a liquid cooling system including a tank part for storing a liquid refrigerant formed surrounding the heat radiating part.

  In the present invention, in the liquid cooling system, the heat radiating portion of the radiator section includes a liquid flow path having an inflow port for the liquid refrigerant and an outflow port for the liquid refrigerant, and the tank portion includes the liquid refrigerant. An opening for allowing the refrigerant to flow through is connected to the liquid flow path of the heat radiating section, and crosses a conduit connected to either the inlet or the outlet of the heat radiating section to store the liquid refrigerant storage section. By forming, it may be constituted by a storage part arranged around the heat radiating part, or the height of the heat radiating part and the height of the tank part may be constituted by substantially the same thickness. Further, in the liquid cooling system described above, the heat radiating portion of the radiator portion may be formed by meandering a flow path through which the liquid refrigerant flows, and further, the radiator portion may include the heat radiating portion. It is preferable that the tank and the tank are integrally formed. In that case, it is preferable that the said radiator part forms the said thermal radiation part and the said tank with a plate-shaped metal plate.

  According to the present invention, in the liquid cooling system described above, it is preferable that a heat radiating member is attached to one surface forming the heat radiating portion of the radiator portion, and in that case, the heat radiating portion of the radiator portion. The heat dissipating member attached to the one surface forming the heat dissipating member may be constituted by a heat dissipating fin, or may be formed by a corrugated plate made of a material excellent in heat conduction. Alternatively, the heat radiating portion is formed on a surface opposite to the surface on which the flow path is formed and the liquid flow path having the liquid refrigerant inlet and the liquid refrigerant outlet formed on one surface. It is preferable that the heat storage member is configured to have a storage portion height of the tank portion that is substantially the same as the combined height of the liquid flow path and the heat dissipation member of the heat dissipation portion. In addition, a conduit for introducing liquid refrigerant from the outside into the tank or leading out the liquid refrigerant in the tank to the outside is provided in the tank forming the radiator portion. It is preferable to provide in the range of about 1/2 or less.

  Furthermore, according to the present invention, in order to achieve the above-described object, a first housing in which a semiconductor element that generates heat is disposed, a movable body with respect to the first housing, and one of them. A small electronic device having at least a second housing provided with a display unit, wherein the liquid cooling system described above is attached to the second housing. ing. In the small electronic device described above, it is preferable that the liquid cooling system is attached to the back side of the display unit provided in the second casing.

  According to the present invention described above, as will be apparent from the following detailed description, according to the liquid cooling system according to the present invention, in particular, the radiator portion in which the heat radiating portion and the tank portion are integrally configured. It is suitable for use as a cooling system for small and portable electronic devices such as laptop and notebook personal computers due to its function, and furthermore, according to a small electronic device equipped with such a liquid cooling system, high cooling is possible. Exhibits an excellent effect of being able to demonstrate its abilities.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First, attached FIG. 1 shows the overall configuration of an electronic apparatus including a liquid cooling system according to an embodiment of the present invention. That is, this example shows an example in which the liquid cooling system of the present invention is applied to a notebook personal computer which is a small and portable electronic device.

  As shown in FIG. 1, the notebook personal computer has a main body portion (housing) 10 made of, for example, a plastic molded body whose outline is indicated by a broken line in the figure, and the main body portion. For example, it includes a portion (lid housing) 20 attached by a hinge mechanism so as to be rotatable about a rotation axis along one side of the main body portion. As shown by a solid line in the figure, the main body (housing) 10 has recently been remarkably miniaturized and highly integrated, and further highly functional, so that heat generation tends to increase. For example, a semiconductor integrated circuit element represented by a CPU (Central Processing Unit), that is, a heating element 30 is attached.

  Although not shown here, the main body (housing) 10 is provided with various switches and indicator lamps including a power switch, as well as a keyboard and a touch mouse. Along with various connection terminals, various driver devices for driving a so-called external information recording medium such as a floppy disk (registered trademark), a CD, and a DVD are attached. In addition, for example, a hard disk device and other various necessary components are mounted inside the main body portion (housing) 10.

  As is apparent from the figure, a part of the main body portion (housing) 10 includes a so-called heat receiving (cooling) jacket 40 that constitutes a part of the liquid cooling system of the present invention. It is attached to the surface of the heating element 30 in thermal connection (for example, via heat conductive grease). As described above, for example, a flow path is formed to meander inside the heat receiving jacket 40, and a liquid refrigerant is passed through the flow path. As a result, the heat generated from the CPU, which is the heating element 30, is transmitted to the refrigerant flowing in the jacket 40, thereby cooling the heating element 30 with high efficiency.

  In addition, a refrigerant driving pump 50 that constitutes a part of the liquid cooling system of the present invention is attached to the inside of the main body portion (housing) 10. For example, liquid refrigerant such as water or ethylene glycol is circulated in a cycle including the radiator section 100 described in detail (see arrows in the figure). Moreover, the code | symbol 51, 52, 53 in a figure has shown the piping tube for connecting between each part of the said liquid cooling system. In addition, as these piping tubes, metal tubes are generally used, but in particular, a tube made of an elastic body with little refrigerant permeation from the wall surface, such as butyl rubber, is used for the movable part. Has been.

  On the other hand, the surface (right side in the figure) of the portion (lid housing) 20 that is rotatably attached to the main body portion (housing) 10 is not shown, but for example, a display device such as a liquid crystal panel Is attached, and a plate-like radiator portion 100 is attached to the back side thereof. As is clear from FIG. 1, the radiator portion 100 is meanderingly formed at the center thereof, and a flow path 110 through which the liquid refrigerant flows is provided in the center portion. Forming. Further, a tank portion 120 for storing the liquid refrigerant is formed inside the meandering flow path 110 forming the heat radiating portion, that is, in a frame shape. In the tank unit 120, for example, over a product warranty period of 5 years, a sufficient amount of liquid cooling system is necessary to maintain the necessary cooling capacity in consideration of leakage of liquid refrigerant to the outside. Liquid refrigerant (for example, water or water obtained by mixing so-called antifreeze liquid at a predetermined ratio, such as propylene glycol) is held.

  In addition, on the back side of the above-described radiator unit 100 (that is, the side opposite to the side on which the liquid crystal panel is attached), as shown in FIG. In the formed portion, a flow path through which the liquid refrigerant flows is not formed (that is, its surface is flat), and a heat radiating member 130 made of, for example, a corrugated plate or a heat radiating fin is attached. . The corrugated plate or the heat radiating fin constituting the heat radiating member 130 is formed of a material excellent in heat conduction.

  3 (a) and 3 (b), the above-described radiator section 100 is composed of a pair (two) of metal plate-like members having excellent heat conductivity such as copper and aluminum. Is formed. That is, FIG. 3A is a plan view of the plate-like member 101 on the surface side of the radiator section 100 (that is, the attachment side of the liquid crystal panel) viewed from the inside, and FIG. A plan view of the plate-like member 101 ′ on the back surface side (that is, the opposite side of the liquid crystal panel) as seen from the inside is also shown.

  As is clear from FIG. 3A, first, on the surface of the plate-like member 101 on the front surface side, a recess (groove) that forms the flow path 110 in the center portion (that is, forming a heat radiating portion). ) Portion 111 is meandering, and a recess 121 for forming the frame-shaped tank portion 120 is formed so as to surround the recess 111 of the meandering flow path 110. In the figure, reference numeral 140 denotes an inlet conduit for guiding the liquid refrigerant from the outside into the meandering flow path 110, and reference numeral 150 denotes the liquid refrigerant from the flow path 110 to the tank unit 120. Shows the path to guide. Since the tank part 120 is arranged so as to circulate around the flow path 110, the level of the liquid level generated in the tank part 120 is kept at the same height regardless of the direction of the radiator part 100. . For this reason, the inlet conduit 140 intersects the recess 121 of the tank unit 120. Moreover, the arrows in the figure indicate the direction of the flow of the liquid refrigerant in the meandering flow path 110 and tank section 120 of the radiator section 100.

  On the other hand, as is clear from FIG. 3 (b), a concave portion for forming the flow path 110 is formed in the center portion (that is, forming the heat radiating portion) on the surface of the plate-like member 101 ′ on the back surface side. However, a recess 121 ′ for forming the frame-shaped tank portion 120 is formed corresponding to the recess 121 formed in the plate-like member 101 on the surface side. Further, a concave portion 141 ′ for forming a refrigerant outlet of the tank portion 120 is formed in the lower part of the plate-like member 101 ′ on the back side. Reference numeral 160 in the figure denotes an outlet conduit for discharging the refrigerant attached to a part of the refrigerant outlet. In FIG. 3B as well, the arrows indicate the flow direction of the liquid refrigerant in the tank unit 120 of the radiator unit 100. Note that the pair (two) of metal plate members constituting the radiator unit 100 can be easily manufactured in large quantities by, for example, press working or the like. It can be provided at a relatively low cost. In addition, the refrigerant inlet conduit 140 and outlet conduit 160 are also formed of metal tubes, like the plate-like members 101 and 101 '.

  Further, in FIGS. 4A and 4B attached, a partial enlarged cross section in a state where the plate member 101 on the front surface side and the plate member 101 ′ on the back surface side are overlapped and joined to each other is shown. It is shown (see the dashed line IV-IV in FIG. 1). 4A shows an example in which a heat radiating member 130 is formed by attaching a metal corrugated plate 131 having excellent heat conductivity to the heat radiating portion on the back side of the radiator section 100, while FIG. Instead of this, for example, an example is shown in which the heat dissipating fins 132 are formed as a heat dissipating member 130 (in this example, integrally formed).

  Next, the operation of the liquid cooling system according to the embodiment of the present invention including the radiator unit 100 whose structure has been described in detail above will be described below.

  Referring to FIGS. 1 and 2 above, first, the heat receiving jacket 40 receives heat (absorbs heat) from the CPU, which is the heat generating body 30, and transmits it to the liquid refrigerant flowing inside. On the other hand, the liquid refrigerant is driven by the drive pump 50 and circulates in a loop constituting the liquid cooling system, that is, receives heat generated by the CPU by the heat receiving jacket 40, and then passes through the drive pump 50. The radiator unit 100 is reached. More specifically, the liquid refrigerant from the drive pump 50 first flows through the inlet conduit 140 into one end of the meandering flow path 110 (groove 111) of the radiator unit 100, and then the meandering flow path. While sequentially flowing 110 (see the arrow in the figure), it reaches the other end of the flow path 110 (groove 111). At this time, the liquid refrigerant flowing through the meandering flow path 110 transfers the received heat to the plate-like members 101 and 101 ′ constituting the radiator section 100, and more particularly, on the back side constituting the radiator section. Heat is transmitted from the surface of the plate-like member 101 ′ to the heat radiating member 130 to radiate heat to the outside air. Thereafter, the dissipated liquid refrigerant enters the frame-shaped tank portion 120 (grooves 121 and 121 ′) through the passage 150.

  Then, the liquid refrigerant that has flowed into the tank portion 120 moves in the direction indicated by the arrow in the figure while being diffused into a large amount of liquid refrigerant stored therein. Thereafter, the liquid refrigerant in the tank portion 120 passes through the refrigerant outlet (recess 141 ′) formed in the lower portion thereof, and further returns to the heat receiving jacket 40 through the outlet conduit 160 (that is, It circulates in the loop that makes up the liquid cooling system).

  As described above, in the liquid cooling system according to the embodiment of the present invention, in particular, the radiator section 100 constituting the heat radiating section includes the meandering flow path 110 and one of them (the side opposite to the liquid crystal panel). In addition to the heat radiating member 130 attached to the surface, a tank portion 120 is integrally formed so as to surround the meandering flow path 110. According to such a configuration, when flowing through the meandering flow path 110, the liquid refrigerant radiated and cooled by the heat radiating member 130 further flows into the tank unit 120 that stores a larger amount of liquid refrigerant therein. Because of the diffusion, the uneven temperature of the entire radiator unit 100 is eliminated, that is, the temperature of the entire radiator unit 100 is made uniform. According to this, the heat dissipation effect in the radiator unit 100 is improved, and in particular, the display unit composed of a liquid crystal panel or the like disposed (adjacently) to the lid housing 20 together with the radiator unit 100 is provided with uneven distribution of heat. Can be solved. That is, it is possible to obtain a good display image due to the uniform temperature of the entire radiator unit 100.

  Further, according to the radiator section 100, it is possible to configure the heat radiation section and the tank section, which are conventionally provided separately, as a member having a substantially plate shape, and in particular, As shown in the embodiment, it is suitable for mounting in the lid housing 20 of the notebook personal computer. In addition, since it is possible to delete the tank portion from the components constituting the liquid cooling system, it is easy to incorporate the liquid cooling system into the electronic device.

  Furthermore, according to the structure of the radiator section 100 described above, a pair of (two) metal plate-like members are connected to each other, with the pipes forming the inlet conduit 140 and the outlet conduit 160 being sandwiched therebetween. Therefore, metal plate-like members can be processed by pressing or the like, and the plate-like members can be manufactured easily and in large quantities by joining, for example, by electric welding. It is.

  Next, a liquid cooling system according to another embodiment of the present invention will be described with reference to FIGS.

  First, FIG. 5 shows a liquid cooling system according to another embodiment, in the same manner as in FIG. 2 described above. In particular, the radiator 100 is placed on the back side (that is, the side opposite to the side on which the liquid crystal panel is attached). Here, the same members as those shown in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted.

  As is clear from FIG. 5, in the liquid cooling system according to another embodiment, the cooling fan 200 is further attached below the radiator unit 100 (two in this example), and the air outside the apparatus ( Is taken in and released toward the heat radiating member 130 of the radiator section 100 (see arrow B in the drawing), and actively promotes heat radiation from the heat radiating member 130. is there.

  FIG. 6 shows a state in which the liquid cooling system according to another embodiment is incorporated in a notebook personal computer, which is a small and portable electronic device. As is clear from this figure, the radiator section 100 and the cooling fan 200 are attached to the inside of the lid housing 20 of the notebook personal computer. Here, reference numeral 300 denotes an opening that is opened on the back surface of the lid housing 20 in order to bring the radiator unit 100 into contact with the outside air. The opening 300 usually has, for example, a mesh-like member structure. A so-called dust cover 350 is attached.

  According to the liquid cooling system according to another embodiment described above, in addition to the liquid cooling system of the above embodiment, since the cooling fan 200 is further provided, the air outside the apparatus is taken in and the heat radiating member 130 is used. Therefore, it is possible to obtain a more efficient liquid cooling system having a higher cooling capacity.

  As shown in FIG. 7 described above, a notebook personal computer to which the liquid cooling system of the present invention is applied is usually used with its lid housing 20 raised vertically. Therefore, as shown in FIGS. 3 (a) and 3 (b) above, the refrigerant outlet (recess 141 ′) of the tank part 120 formed in the radiator part 100 has a liquid refrigerant at the bottom even if air enters the tank. Since it gathers in, it is formed in the lower part. However, the small and portable electronic device according to the present invention is not necessarily used only when the radiator unit 100 is raised vertically.

  Therefore, FIG. 7 below shows a structure according to a modified example of the present invention, which is suitable even when the radiator unit 100 is used in a substantially horizontal direction. In this case as well, the same members as those described above are denoted by the same reference numerals, and description thereof is omitted.

  That is, as is apparent from the figure, according to the structure of the radiator portion 100 according to this modification, the refrigerant outlet (recessed portion 141 ′) of the tank portion 120 that surrounds the meandering flow path 110 and is formed in a frame shape, In addition, a conduit 122 is attached. And the front-end | tip opening of this conduit | pipe 122 is arrange | positioned so that it may be located in the approximate center part of the height of the tank part 120 of the left side of a figure, and the approximate center part of the cross section of a tank part.

  According to this configuration, when the level of the liquid refrigerant indicated by the symbol W decreases as shown in the drawing, or when the radiator unit 100 is inclined in the horizontal direction, the radiator unit 100 is further turned upside down. Even in this case, it is possible to reliably circulate the liquid refrigerant inside the system. That is, even if a part of the liquid refrigerant inside the tank leaks to the outside, usually more than half of the liquid refrigerant is filled with the liquid refrigerant. Since the positions of the liquid levels W are maintained at the same height, the end opening of the conduit 122 located at the substantially central portion of the height of the tank portion 120 and at the substantially central portion of the cross section of the tank portion is Therefore, it is surely immersed in the liquid refrigerant, so that the liquid refrigerant inside the tank can be reliably led out.

In order to show an example of the arrangement configuration of the cooling system in the small electronic device according to an embodiment of the present invention, it is a perspective view of the device viewed from diagonally forward. In order to show an example of the arrangement configuration of the cooling system in the small electronic device, it is a perspective view seen from the diagonally rear side of the device. It is a top view which shows the structure of a pair of plate-shaped member which comprises the radiator part of the said cooling system. It is a partially expanded sectional view for showing the detail of the structure of the said radiator part, and is sectional drawing cut | disconnected along the dashed-dotted line IV-IV in FIG. It is a perspective view which shows an example of the arrangement configuration of the cooling system which becomes other embodiment of this invention. It is a perspective view which shows the state which mounted the water cooling system which becomes said other embodiment in the laptop computer personal computer which is a small electronic device. It is a perspective view for showing the structure of the modification of the said radiator.

Explanation of symbols

10 Main body (housing)
20 (lid housing)
30 Heating element (CPU)
40 heat receiving jacket 50 drive pump 71, 72 circulation pump 81, 82 ... tube (piping)
DESCRIPTION OF SYMBOLS 100 Radiator part 101,101 'Plate-shaped member 110 Serpentine flow path 120 Tank part 122 Conduit 130 Radiating member 140 Inlet conduit 150 Passage 160 Outlet conduit 200 Cooling fan 300 Opening 350 Dust cover

Claims (13)

A liquid cooling system for an electronic device including a semiconductor element that generates heat in a housing, wherein the cooling jacket is thermally connected to the semiconductor element and transmits the generated heat to a liquid refrigerant that flows through the inside. A radiator section for releasing heat transmitted to the liquid refrigerant to the outside of the device in the cooling jacket; and a circulation pump for circulating the liquid refrigerant in a loop including the cooling jacket and the radiator section. And
The radiator section includes a heat radiating section on the plane for radiating the heat of the liquid refrigerant to the outside of the casing, and a tank section for storing the liquid refrigerant formed surrounding the heat radiating section. A liquid cooling system characterized by that.   2. The liquid cooling system according to claim 1, wherein the radiator portion includes a liquid passage having an inlet of the liquid refrigerant and an outlet of the liquid refrigerant, and the tank portion includes the liquid refrigerant. The liquid refrigerant storage passage is formed by crossing a conduit connected to either the inlet or the outlet of the heat radiating portion, connected to the liquid flow path of the heat radiating portion at an opening for allowing flow through. By doing so, the liquid cooling system characterized by comprising the storage part which circulated and arrange | positioned the said thermal radiation part.   2. The liquid cooling system according to claim 1, wherein a height of the heat radiating portion and a height of the tank portion are substantially the same.   2. The liquid cooling system according to claim 1, wherein the heat radiating portion of the radiator portion is formed by meandering a flow path through which liquid refrigerant flows.   3. The liquid cooling system according to claim 2, wherein the radiator unit integrally forms the heat radiating unit and the tank.   6. The liquid cooling system according to claim 5, wherein in the radiator, the radiator and the tank are formed of a plate-shaped metal plate.   The liquid cooling system according to claim 1, wherein a heat radiating member is attached to one surface of the radiator portion that forms the heat radiating portion.   8. The liquid cooling system according to claim 7, wherein the heat dissipating member attached to one surface forming the heat dissipating part of the radiator part is constituted by a heat dissipating fin.   The liquid cooling system according to claim 7, wherein the heat dissipating member attached to one surface forming the heat dissipating part of the radiator part is formed of a corrugated plate made of a material excellent in heat conduction. Liquid cooling system.   The liquid cooling system according to claim 8 or 9, wherein the heat radiating section includes a liquid flow path having an inlet of the liquid refrigerant and an outlet of the liquid refrigerant formed on one surface, and the flow path. The heat radiating member is formed on the surface opposite to the surface on which the heat radiating member is formed, and the reservoir height of the tank portion is substantially the same as the combined height of the liquid flow path and the heat radiating member of the heat radiating portion. A liquid cooling system characterized by comprising.   2. The liquid cooling system according to claim 1, wherein liquid refrigerant from the outside is introduced into the tank or the liquid refrigerant in the tank is led out to the outside of the tank forming the radiator section. The liquid cooling system is characterized in that a conduit for carrying out is provided in a range of approximately ½ or less of the height of the tank.   A first housing in which a semiconductor element that generates heat is disposed, and a second housing that is movable with respect to the first housing and includes at least a display portion in a part thereof. A small electronic apparatus comprising the liquid cooling system according to any one of claims 1 to 9 attached to the second casing.   13. The small electronic device according to claim 12, wherein the liquid cooling system is attached to a back side of the display unit provided in the second casing.

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