CN118102661A - Heat abstractor and computing device - Google Patents

Abstract

The embodiment of the application provides a heat dissipation device and a computing device, wherein the heat dissipation device comprises: a base including a base body and a plurality of fins, the base body having oppositely disposed top and bottom surfaces, the bottom surface for contacting a heating element to absorb heat from the heating element; the fins are arranged on the top surface of the base body at intervals, and two adjacent fins and the top surface of the base body between the two adjacent fins form a cooling area; the jet flow assembly is arranged on one side, far away from the substrate, of the base and comprises an inner cavity, a liquid inlet and at least one first nozzle, the liquid inlet and the first nozzle are communicated with the inner cavity of the jet flow assembly, and the first nozzle sprays cooling medium towards the cooling area. The heat dissipation device and the computing equipment provided by the application have the advantages of targeted cooling, improved cooling efficiency and convenience in assembly and disassembly.

Description

Heat abstractor and computing device

Technical Field

The embodiment of the application relates to the technical field of electronic equipment, in particular to a heat dissipation device and computing equipment.

Background

A job platform, such as an internet service provider, an enterprise platform, a research institution, etc., that requires a large amount of computing requirements, carrying the requirements of storage, computing, and networking, is referred to as a data center. As the demand for information and communication technology in modern society increases, computing devices in data centers gradually move from low to high density, which causes a large amount of heat generated when the computing devices are operated to increase gradually, and thus, cooling systems for the computing devices have been developed.

In the related art, a computing device includes a housing, a circuit board disposed in an interior cavity of the housing, and a heating element disposed on the circuit board. The heat radiator is arranged on one side of the heating element far away from the circuit board, and can be in contact with the heating element to transfer heat so as to reduce the heat of the heating element. And the heat of the radiator can be dissipated through immersion liquid cooling, jet liquid cooling and the like.

However, the cooling efficiency of the related art heat sink is limited, and cannot meet the increasing heat dissipation demands of the computing devices.

Disclosure of Invention

The embodiment of the application provides a heat dissipation device and computing equipment, which are used for solving the problems that the cooling efficiency of the heat dissipation device in the related art is limited and the increasing heat dissipation requirement of the computing equipment cannot be met.

In order to achieve the above purpose, the present application provides the following technical solutions:

One aspect of an embodiment of the present application provides a heat dissipating device, including: a base including a base body and a plurality of fins, the base body having oppositely disposed top and bottom surfaces, the bottom surface for contacting a heating element to absorb heat from the heating element; the fins are arranged on the top surface of the base body at intervals, and two adjacent fins and the top surface of the base body between the two adjacent fins form a cooling area;

The jet flow assembly is arranged on one side, far away from the substrate, of the base and comprises an inner cavity, a liquid inlet and at least one first nozzle, the liquid inlet and the first nozzle are communicated with the inner cavity of the jet flow assembly, and the first nozzle sprays cooling medium towards the cooling area.

According to the heat dissipation device provided by the application, the base is arranged, the base comprises the base body, the bottom surface of the base body is in contact with the heating element for heat transfer, the plurality of fins are arranged on the top surface of the base body at intervals, and a cooling area is formed between two adjacent fins and the top surface of the base body between the two adjacent fins; and through setting up the efflux subassembly, the efflux subassembly has inner chamber, inlet and first spout, the inlet with first spout all with the inner chamber intercommunication of efflux subassembly to make cooling medium get into in the inner chamber of efflux subassembly through the inlet, and through first spout orientation cooling medium is spouted in the cooling district, so that the pertinence cooling, in order to improve heat abstractor's cooling efficiency. In addition, compared with the case of installing the spray head on the computing equipment in the related art, the jet flow component provided by the embodiment of the application is installed on the base, and has the advantage of convenience in assembling and disassembling the computing equipment.

In one possible implementation, the first nozzle ejects the cooling medium toward two opposite sidewalls of two adjacent fins; and/or the first nozzle sprays cooling medium towards the top surface of the matrix between two adjacent fins.

Through the scheme, the heat dissipation between the two adjacent fins is accelerated, and/or the heat dissipation of the matrix between the two adjacent fins is accelerated.

In one possible implementation manner, the jet assembly is arranged on one side, far away from the substrate, of the fin, and at least part of the bottom surface of the jet assembly covers the top of the cooling area and is provided with the first nozzle.

Through the scheme, most of the cooling medium sprayed out of the first spray nozzle flows towards the top surface of the base body, so that heat dissipation of the top surface of the base body is facilitated.

In one possible implementation manner, the jet assembly is provided with a second nozzle communicated with the inner cavity of the jet assembly, and the second nozzle is positioned on one side of the fin away from the top surface of the base body and sprays cooling medium towards one side of the fin away from the top surface of the base body.

Through the scheme, the temperature of one side of the fin away from the top surface of the substrate is conveniently reduced.

In one possible implementation manner, at least part of the jet assembly extends into the cooling area and is provided with the first nozzle.

Through above-mentioned scheme to through reducing the distance between first spout and the fin, improve the radiating effect.

In one possible implementation, at least part of the jet assembly extends beyond the outermost side wall of the outermost fin and is provided with a third nozzle that ejects the cooling medium toward the outermost side wall of the outermost fin.

Through above-mentioned scheme to the fin that is located outermost week is cooled down.

In one possible implementation, the jet assembly includes a cover having an interior cavity and an opening in communication with the interior cavity of the cover; the bottom plate with the lid can dismantle the connection and the closing cap the opening of lid, and with the lid surrounds into the space that is used for storing cooling medium, the bottom plate is equipped with first spout.

By adopting the scheme, the assembly of the jet flow assembly is simplified, and the processing of the jet flow assembly is facilitated.

In one possible implementation manner, the fins are sheet-shaped and extend along a first direction, and a plurality of fins are arranged at intervals along a second direction;

The first direction and the second direction are parallel to the bottom surface of the matrix, and the first direction and the second direction are intersected;

The cooling area is communicated with the outside at two ends of the first direction.

Through the scheme, the cooling medium in the cooling area can flow out along the first direction, so that the heat dissipation effect is further improved.

In one possible implementation manner, the plurality of fins are arranged in a plurality of columns along a first direction, and two adjacent fins in each column are arranged at intervals along a second direction;

The first direction and the second direction are parallel to the bottom surface of the matrix, and the first direction and the second direction are intersected;

the cooling area is communicated with the outside in the first direction and the second direction.

Through the scheme, the cooling medium in the cooling area can be diffused to the periphery so as to further improve the heat dissipation effect.

Another aspect of the embodiment of the present application provides a computing device, including a chassis, where the chassis has an inner cavity, an input port, and an output port, the inner cavity of the chassis is provided with a circuit board, a heating element, and a heat dissipating device as described above, the input port is communicated with a liquid inlet of the heat dissipating device through a pipeline, and the output port is communicated with the inner cavity of the chassis and is used for flowing out a cooling medium; the heating element is arranged on the circuit board, and one surface of the heating element, which is far away from the circuit board, is in contact with the bottom surface of the base body of the heat dissipation device for heat transfer.

The computing equipment provided by the application has the advantages of targeted cooling and improved cooling efficiency of the heat dissipation device. In addition, compared with the case of installing the spray head on the computing equipment in the related art, the jet flow component provided by the embodiment of the application is installed on the base, and has the advantage of convenience in assembling and disassembling the computing equipment.

In addition to the technical problems, the technical features constituting the technical solutions, and the beneficial effects caused by the technical features of the technical solutions described above, other technical problems that can be solved by the embodiments of the present application, other technical features included in the technical solutions, and beneficial effects caused by the technical features described above, further detailed descriptions will be made in the detailed description of the embodiments.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

FIG. 1 is a schematic diagram of a related art spray liquid cooling method;

FIG. 2 is a schematic diagram of a computing device provided by an embodiment of the present application;

FIG. 3 is a top view of a base according to an embodiment of the present application;

FIG. 4 is a top view of another base provided by an embodiment of the present application;

fig. 5 is a schematic diagram of a first heat dissipating device according to an embodiment of the present application;

fig. 6 is a schematic diagram of a second heat dissipating device according to an embodiment of the present application;

Fig. 7 is a schematic diagram of a third heat dissipating device according to an embodiment of the present application;

fig. 8 is a schematic diagram of a fourth heat dissipating device according to an embodiment of the present application;

FIG. 9 is a perspective view of a body portion according to an embodiment of the present application;

FIG. 10 is an exploded view of the body portion shown in FIG. 9;

FIG. 11 is a top view of another fluidic component provided in an embodiment of the present application;

fig. 12 is a schematic diagram of a server system according to an embodiment of the present application.

Reference numerals illustrate:

110-a heat sink; 111-a heat transfer section; 112-fin portions; 120-top wall of the chassis; 130-spray head; 140-pipeline;

200-a heat dissipation device;

210-a base; 211-substrate; 212-fins; 213-a cooling zone;

220-a jet assembly;

221-a body portion; 2211-a cover; 2212-a bottom plate; 2213-a seal; 2214-a tube;

222-drainage portion;

223-liquid inlet; 224-first spout; 225-a second spout; 226-a third spout;

300-chassis; 310-outlet; 320-input ports;

400-a circuit board;

500-heating elements;

600-liquid level;

700-inflow tube;

810-a heat exchanger; 820-a liquid supply pump; 830-a computing device; 840-cabinet.

Specific embodiments of the present application have been shown by way of the above drawings and will be described in more detail below. The drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts to those skilled in the art by reference to the specific embodiments.

Detailed Description

Fig. 1 shows a related art spray liquid cooling method. Referring to fig. 1, in the related art, a spray head 130 is mounted to a top wall 120 of a cabinet of a computing device. The cooling liquid is supplied to the nozzle 130 through the pipe 140, and is discharged to the top end of the radiator 110 through the nozzle 130. The heat sink 110 includes a heat transfer portion 111 and fin portions 112 provided at intervals on the top surface of the heat transfer portion 111.

The inventors found that the temperature difference between the adjacent two fin portions 112 is large, and if the cooling medium is injected between the adjacent two fin portions 112 in a concentrated manner, the cooling efficiency of the radiator 110 is greatly improved. The broken line in fig. 1 indicates the cooling medium sprayed from the spray head 130, and referring to fig. 1, a part of the cooling medium sprayed from the spray head 130 is sprayed to the top surfaces of the fin portions 112 of the heat sink 110 and is sputtered off, resulting in a small amount of the cooling medium sprayed between two adjacent fin portions 112, and further resulting in a limitation of the cooling effect of the heat sink 110 of the related art. In addition, a related art spray head 130 is mounted on the top wall 120 of the chassis of the computing device. When the operator removes the top wall 120 of the chassis for maintenance, the operation difficulty and the operation amount are forced to be increased due to the involvement of the pipeline 140.

In view of this, according to the heat dissipating device provided by the embodiment of the application, the jet assembly is arranged on the base, the jet assembly is provided with the inner cavity, the liquid inlet and the first nozzle, the cooling medium enters the inner cavity of the jet assembly through the liquid inlet, and is sprayed out towards the cooling area through the first nozzle, so that the temperature can be reduced in a targeted manner, and the cooling efficiency of the heat dissipating device can be improved. In addition, compared with the related art, the jet flow assembly provided by the embodiment of the application is arranged on the base, and has the advantage of convenience in assembling and disassembling the computing equipment.

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application.

All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. The following embodiments and features of the embodiments may be combined with each other without conflict.

Fig. 2 is a schematic diagram of a computing device according to an embodiment of the present application. Referring to fig. 2, a computing device provided by an embodiment of the present application may include a chassis 300, a circuit board 400, and a heat generating element 500. The chassis 300 may have an inner cavity, the circuit board 400 may be disposed in the inner cavity of the chassis 300, and the heating element 500 may be disposed on a board surface of the circuit board 400. The heating element 500 is an electronic component (such as a chip, a memory, a network card, etc.) that generates heat during operation. The circuit board 400 may provide mechanical support for the various heat generating components 500 to secure, assemble, and may also provide desired electrical characteristics for wiring and electrical connections or insulation between the various heat generating components 500. Alternatively, the computing device may be a server.

The cooling medium with a certain liquid level 600 may be stored in the inner cavity of the case 300 as shown in fig. 2, and the heating element 500 of the computing device may be immersed in the cooling medium, and the heat of the heating element 500 is taken away by means of the circulation flow of the cooling medium. The cooling medium may be made of a non-conductive material, for example, and may be converted into a liquid state and a gas state during the cooling process of the heating element 500.

In addition, relatively short heating elements 500, such as a CPU (central processing unit ), ASIC (Application SPECIFIC INTEGRATED Circuit), etc., may be all submerged in the liquid, and the top of relatively tall heating elements 500, such as a memory, network card, etc., may be above the level 600 of the cooling medium. In order to improve the cooling effect of the shorter heating element 500, such as a chip, the heat dissipating device 200 is usually disposed on a side of the heating element 500 away from the circuit board 400.

Specifically, the heat dissipating device 200 provided by the embodiment of the present application may include a base 210, and the base 210 may include a substrate 211 and a plurality of fins 212. Wherein, the base 211 may have a top surface and a bottom surface disposed opposite to each other, the bottom surface of the base 211 may be in direct contact with the heat generating element 500 or in contact with the heat generating element through a heat transfer material, and the top surface of the base 211 may be provided with a plurality of fins 212 disposed at intervals. The fins 212 can enhance the disturbance of the cooling medium and prevent the thermal boundary layer from being thickened in a large range, so that the thermal resistance of the thermal boundary layer part is reduced, and the film heat transfer coefficient of the convection side is improved. The fins 212 also increase the heat dissipation area, ensuring the overall heat dissipation. The material of the fins 212 may be generally cast aluminum alloy, and the fins 212 may be machined and cast by precision machining equipment. In addition, in order to reduce the consumption of resistance of the liquid cooling medium, the fins 212 may have a front rounded and rear pointed water drop-shaped structure, so as to reduce the loss of local flow resistance, enhance the fluid disturbance at the positions of the fins 212, and enhance the heat exchange efficiency. Of course, the fins 212 may also have a streamline shape such as an oval shape with a round front and a round rear or a diamond shape with a pointed front and a pointed rear, which can also achieve the purpose of reducing the local flow resistance loss, and the embodiment of the present application is not limited thereto.

In addition, the arrangement of the plurality of fins 212 may have several possibilities:

Fig. 3 is a top view of a base 210 according to an embodiment of the present application, and referring to fig. 3, in one possible implementation, the fins 212 may be sheet-shaped and may extend along the first direction X. The plurality of fins 212 may be disposed at intervals along the second direction Y. The first direction X and the second direction Y are parallel to the bottom surface of the substrate 211, and the first direction X intersects the second direction Y.

Fig. 4 is a top view of another base 210 according to an embodiment of the present application. Referring to fig. 4, in one possible implementation, a plurality of fins 212 are arranged in a plurality of columns along a first direction X, and two adjacent fins 212 in each column are spaced apart along a second direction Y. The first direction X and the second direction Y are parallel to the bottom surface of the substrate 211, and the first direction X intersects the second direction Y. Additionally, adjacent rows of fins 212 may be aligned as shown in FIG. 4, or may be offset.

In addition, in order to improve the heat dissipation effect of the heat sink 110, the heat dissipation device 200 provided in the embodiment of the present application may further include a jet assembly 220. The jet assembly 220 may be attached to the fins 212 or the base 211 by welding or the like. Alternatively, the jet assembly 220 may be removably coupled to the fins 212 or the base 211 by snap fit, clamps, or the like.

Fig. 5 is a schematic diagram of a first heat dissipating device 200 according to an embodiment of the application. Referring to fig. 5, the jet assembly 220 may be disposed on the base 210, and the jet assembly 220 may have an inner cavity, a liquid inlet 223, and a first nozzle 224. Wherein, the liquid inlet 223 and the first nozzle 224 may both be in communication with the inner cavity of the jet assembly 220. The cooling medium may flow into the inner cavity of the jet assembly 220 from the outside of the chassis 300 through the inflow pipe 700 and the liquid inlet 223 shown in fig. 2, and may be ejected through the first nozzle 224.

Illustratively, the cooling medium may be made of a material (e.g., a fluorinated liquid, etc.) having a boiling point between 30 ℃ and 60 ℃. Referring to fig. 5, on the one hand, the cooling medium ejected through the first nozzle 224 may strike the base 210, so that the liquid cooling medium is heated, and changes from a liquid state to a gaseous state and absorbs a large amount of heat, so that the temperature of the base 210 is reduced, and further, the heat of the heating element 500 in contact with the base 210 for heat transfer is reduced. Wherein, referring to fig. 2, in order to facilitate the recycling of the cooling medium, the cabinet 300 may have an output port 310 communicating with the inner cavity of the cabinet 300. The gaseous cooling medium can flow out of the inner cavity of the case 300 through the output port 310, and can be converted from the gaseous state to the liquid state by reducing the temperature and/or compressing the volume, and then flow back into the inner cavity of the jet assembly 220 through the pipeline 140.

With continued reference to fig. 5, on the other hand, the cooling medium sprayed out through the first nozzle 224 may hit the base 210, so that bubbles generated in the boiling heat dissipation process of the cooling medium on the base 210 may be quickly separated, so as to accelerate the bubble generation rate, and further improve the heat dissipation efficiency. In addition, in contrast to the related art in which the spray head 130 is mounted to the cabinet 300 of the computing device shown in fig. 1, referring to fig. 5, the jet assembly 220 provided in the embodiment of the present application is mounted to the base 210 to facilitate assembly and disassembly of the computing device.

As mentioned above, the inventors found that the temperature difference between the areas between the adjacent two fins 212 is large, indicating that the cooling effect is excellent. In order to improve the cooling efficiency of the heat dissipating device 200, the temperature can be reduced specifically. Referring to fig. 5, adjacent two fins 212 and the top surface of the base 211 between the adjacent two fins 212 may form a cool down region 213. The first nozzles 224 may spray the cooling medium toward the cooling area 213, so as to reduce the temperature in a targeted manner, thereby improving the cooling efficiency of the heat dissipating device 200.

In order to facilitate the flow of the gaseous cooling medium, the heat sink 200 may be provided with an opening communicating with the cooling area 213, and the opening may communicate with the outside (the inner cavity of the cabinet 300). For example, referring to fig. 3, when the fins 212 are sheet-shaped and extend along the first direction X, and the plurality of fins 212 are disposed at intervals along the second direction Y, the cooling areas 213 may communicate with the inner cavity of the chassis 300 at both ends of the first direction X. As another example, referring to fig. 4, when the plurality of fins 212 are arranged in a plurality of columns along the first direction X and two adjacent fins 212 in each column are arranged at intervals along the second direction Y, the cooling area 213 may be in communication with the inner cavity of the chassis 300 in both the first direction X and the second direction Y.

In addition, referring to fig. 5, the cooling medium flowing out through the first nozzle 224 may spray the cooling medium toward the top surface of the base 211 between the adjacent two fins 212; or the cooling medium flowing out through the first nozzle 224 may be sprayed toward two opposite sidewalls of the adjacent two fins 212; or a portion of the cooling medium flowing out through the first nozzle 224 may be sprayed toward the top surface of the base 211 between the adjacent two fins 212, and another portion of the cooling medium flowing out through the first nozzle 224 may be sprayed toward the top surface of the base 211 between the adjacent two fins 212.

Further, the present inventors have found that the temperature difference between the end of the fin 212 near the base 211 is larger than that of other locations, and that the first nozzle 224 may spray the cooling medium toward the junction between the fin 212 and the base 211 in order to improve the cooling efficiency.

Alternatively, referring to fig. 5, the jet assembly 220 may include a body portion 221, and the body portion 221 may be disposed on a side of the fins 212 remote from the top surface of the base 211. And at least part of the body 221 may cover the top of the cooling area 213 and be provided with a first nozzle 224. As such, the first nozzle 224 may be opposite the top surface of the base 211 between two adjacent fins 212, that is, the projection of the first nozzle 224 onto the top surface of the base 211 along the normal direction of the top surface of the base 211 may be located within the top surface of the base 211 between two adjacent fins 212. And two adjacent fins 212, the top surface of the base body 211 between two adjacent fins 212 and the bottom surface of the body 221 between two adjacent fins 212 can form a chamber with a longitudinal section in a closed pattern, so as to prevent the cooling medium sprayed out from the first nozzle 224 from splashing out of the upper part of the fins 212, so as to facilitate the centralized cooling of the side wall of the fins 212 in the cooling area 213 and the top surface of the base body 211, and further improve the cooling effect.

The body 221 may cover the top of the cooling area 213 by abutting against the end surface of the substrate 211 as shown in fig. 5; or the body 221 may cover the top of the cooling area 213 by being embedded in the cooling area 213.

Fig. 6 is a schematic diagram of a second heat dissipating device 200 according to an embodiment of the application. Referring to fig. 6, optionally, the main body portion may further be provided with a second nozzle 225, and the second nozzle 225 may be in communication with the inner cavity of the jet assembly 220, and may be located at a side of the fin 212 away from the top surface of the base 211, and spray the cooling medium toward the end surface of the top surface of the base 211, so as to increase the contact area between the cooling medium and the fin 212, so as to improve the heat dissipation effect.

In order to control the sputtering area of the cooling medium ejected through the second nozzle 225 on the top surface of the fin 212, the second nozzle 225 may be disposed at the bottom of a groove, as shown in fig. 6, and the groove may be covered outside the top of the fin 212. In this manner, the sputtered region of the cooling medium that is created after impinging the top surface of the fins 212 is controlled in the cavity of the groove, and there may be a portion of the cooling medium flowing through the outer edge of the top surface of the fins 212 toward the side walls of the fins 212 and may flow along the side walls of the fins 212 toward the substrate 211 in order to further reduce the temperature of the fins 212. Of course, to focus on cooling the junction of the fins 212 and the substrate 211, the cross-section of the first ports 224 may be larger than the cross-section of the second ports 225, such that the flow rate per unit time out of the first ports 224 is greater than the flow rate per unit time out of the second ports 225.

Fig. 7 is a schematic diagram of a fourth heat dissipating device 200 according to an embodiment of the application. Referring to fig. 7, alternatively, at least part of the body portion may be located outside the outermost fins 212 and provided with third spouts 226, and the third spouts 226 may spout the cooling medium toward the outermost side walls of the outermost fins 212.

Specifically, the outermost fins 212 are fins 212 near the outer edge of the base 211, and the side wall of the outermost fins 212 away from the cooling space may be referred to as the outermost side wall of the outermost fins 212. By spraying the cooling medium to the outermost side walls of the outermost fins 212, the heat dissipation effect of the entire base 210 can be improved.

Fig. 8 is a schematic diagram of a third heat dissipating device 200 according to an embodiment of the present application. Referring to fig. 8, optionally, the jet assembly 220 may include a drain 222. The drainage portion 222 may extend into the cooling area 213 and may be provided with a first nozzle 224, so as to reduce a distance between the first nozzle 224 and the top surface of the substrate 211, thereby improving a cooling effect of the cooling medium flowing out through the first nozzle 224 on the fins 212 and the substrate 211.

Wherein the first nozzle 224 may spray the cooling medium toward the top surface of the substrate 211; and/or the first nozzles 224 may spray cooling medium toward the sidewalls of the fins 212. Of course, when the first nozzle 224 sprays the cooling medium toward the top surface of the base 211, the first nozzle 224 may have a first preset distance from the top surface of the base 211. When the first nozzle 224 sprays the cooling medium toward the side wall of the fin 212, the first nozzle 224 may have a second preset distance from the side wall of the fin 212. In addition, the length of the drainage portion 222 extending into the cooling area 213 can be adjusted according to the requirement, so as to improve the flexibility of the device. In addition, the drainage portion 222 may be in communication with the main body portion and may be disposed along a direction perpendicular to the top surface of the substrate 211, so as to adjust a length of the drainage portion 222 extending into the cooling area 213.

Several possible implementations of the body portion 221 are described below:

Fig. 9 is a perspective view of a body 221 according to an embodiment of the present application, and fig. 10 is an exploded view of the body 221 shown in fig. 9. Referring to fig. 9 and 10, the body 221 may illustratively include a cover 2211 and a bottom plate 2212. The cover 2211 may have a lumen and an opening, and the opening may be in communication with the lumen of the cover 2211. The bottom plate 2212 may cover the opening of the cover 2211 and may enclose a space capable of storing a certain amount of cooling medium with the cover 2211 for storing a certain amount of cooling medium.

Wherein, the liquid inlet 223 may be provided at the cover 2211 so as to be connected with the inflow pipe 700 shown in fig. 2. The first spout 224 and/or the second spout 225 and/or the third spout 226 may be provided to the bottom plate 2212. In addition, the bottom plate 2212 is detachably connected to the cover 2211, so that when the arrangement of the fins 212 on the substrate 211 is changed, the new arrangement can be adapted by replacing the bottom plate 2212, so as to improve the application range of the jet assembly 220. In addition, in order to achieve sealing between the cover 2211 and the bottom plate 2212, a sealing member 2213 may be provided therebetween. Wherein the seal 2213 may be made of a rubber material.

Fig. 11 is a top view of another fluidic component 220 provided in an embodiment of the present application. Referring to fig. 11, another example, the body 221 may be formed of a plurality of pipes 2214 communicating with each other. At least one tube 2214 may be provided with an inlet 223 and at least one tube 2214 may be provided with a first spout 224 and/or a second spout 225 and/or a third spout 226. The tubes 2214 can be detachably connected through connectors such as joints, so that when the arrangement mode of the fins 212 on the substrate 211 is changed, a new arrangement mode can be adapted by changing the communication mode of the tubes 2214 or the length of the tubes 2214, so that the application range of the jet flow assembly 220 is improved.

Fig. 12 is a schematic diagram of a server system according to an embodiment of the present application. Referring to fig. 12, embodiments of the present application also provide a server system that may include a cooling medium distribution apparatus, a first conduit, a second conduit, and a computing device 830 as provided above. The cooling medium distribution device may include a heat exchanger 810 and a liquid supply pump 820. The computing device 830, the heat exchanger 810, and the liquid supply pump 820 may be formed with a circulation loop for flowing a cooling medium.

In particular, computing device 830 may have input port 320 and output port 310. Referring to fig. 12, a heat exchanger 810 may cool down a cooling medium flowing therethrough, and a liquid supply pump 820 may power the circulation of the cooling medium between the heat exchanger 810 and a computing device 830. A second conduit may be in communication between the input port 320 of the computing device 830 and the fluid supply pump 820 (or the heat exchanger 810), and a first conduit may be in communication between the output port 310 of the computing device 830 and the heat exchanger 810 (or the fluid supply pump 820). Gaseous cooling medium flowing from output 310 of computing device 830 may enter heat exchanger 810 via a first conduit under the direction of liquid supply pump 820; the cooling medium, which may change to a liquid state after being liquefied by heat exchanger 810, flows from input port 320 into computing device 830 via a second conduit; the liquid cooling medium entering the computing device 830 may be communicated with the liquid inlet 223 of the jet flow assembly 220 of the heat dissipating device 200 through the inflow pipe 700, and may be sprayed to the heat generating element 500 through the jet flow assembly 220, and the cooling medium which is rapidly changed into a gaseous state after contacting with the higher temperature components or the higher temperature air may flow out from the output port 310 of the computing device 830; in this way, a passage for circulating the cooling medium is formed.

In addition, the server system may further include a cabinet 840, where the cabinet 840 may be configured in a variety of shapes, typically the cabinet 840 is configured as a square, which may be larger than other shaped structures, and may be capable of deploying more devices therein. A plurality of partitions (not shown in fig. 12) may be mounted within the cabinet 840 to divide the space within the cabinet 840 into at least two storage spaces, each of which may be used to house a computing device 830. The plurality of partitions may be arranged at intervals in the vertical direction, so that the plurality of storage spaces may be arranged in the vertical direction.

In addition, the heat exchanger 810 and the liquid supply pump 820 may be assembled inside the cabinet 840 as shown in fig. 12; or the heat exchanger 810 and the liquid supply pump 820 may be mounted outside the cabinet 840. The number of the computing devices 830 may be one or at least two, and each computing device 830 may form a circulation loop with the heat exchanger 810 and the liquid supply pump 820. The computing device 830, heat exchanger 810, and liquid supply pump 820 may be arranged in a one-to-one correspondence; or multiple computing devices 830 within a cabinet 840 may share a heat exchanger 810 and a liquid supply pump 820; or multiple computing devices 830 within multiple cabinets 840 may share one heat exchanger 810 and one liquid supply pump 820. In addition, in order to allow the gaseous cooling medium to be converted into the liquid cooling medium while passing through the heat exchanger 810, the heat exchanger 810 may directly release heat to the environment, which may be referred to as an atmospheric environment or an indoor environment. The heat exchanger 810 can be cooled by air cooling or liquid cooling.

The embodiment of the application also provides a data center, which generally refers to a system for realizing the functions of centralized processing, exchange, management and the like of data in one physical space. The data center provided by the embodiment of the application can comprise a machine room and a plurality of server systems provided above and arranged in the machine room so as to meet the requirement of data processing capacity.

For convenience of description, when the server system works normally, one end of the server system facing the ground and other supporting surfaces is a lower end (or a bottom end), and one end of the server system facing away from the ground and other supporting surfaces is an upper end; the side of the server system facing the operator who installs the server system is taken as the front side, and the side of the server system opposite to the front side is taken as the rear side (or back side); the left side and the right side are respectively arranged on the left side and the right side of the rest. The left-right direction is the longitudinal direction of the server system, the front-back direction is the width direction of the server system, and the up-down direction is the height direction of the server system.

The plurality of server systems may be disposed side by side and in close proximity along their length, i.e., side-to-side, so that the arrangement of the server systems is compact and orderly. A certain space can be reserved between two adjacent rows of server systems, namely, a preset interval is reserved between the two adjacent server systems along the front-back direction or the width direction of the server systems, so that operators can operate the server systems from the front side of the server systems or observe the conditions of the server systems. In addition, a plurality of server systems may be formed in a matrix form to facilitate transmission of wireless signals. In addition, the two server systems can be in communication connection by adopting the directional antennas, the directional antennas in the same direction can form an antenna array, and when the directional antennas are used for transmitting wireless signals, the strength of the signals can be enhanced, and the anti-interference capability is improved.

The terms "upper" and "lower" are used to describe the relative positional relationship of the respective structures in the drawings, and are merely for convenience of description, not to limit the scope of the application, and the change or adjustment of the relative relationship is considered to be within the scope of the application without substantial change of technical content.

It should be noted that: in the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In addition, in the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (10)

1. A heat sink, comprising:

a base including a base body and a plurality of fins, the base body having oppositely disposed top and bottom surfaces, the bottom surface for contacting a heating element to absorb heat from the heating element; the fins are arranged on the top surface of the base body at intervals, and two adjacent fins and the top surface of the base body between the two adjacent fins form a cooling area;

The jet flow assembly is arranged on one side, far away from the substrate, of the base and comprises an inner cavity, a liquid inlet and at least one first nozzle, the liquid inlet and the first nozzle are communicated with the inner cavity of the jet flow assembly, and the first nozzle sprays cooling medium towards the cooling area.

2. The heat sink of claim 1, wherein the first nozzle ejects cooling medium toward two opposing sidewalls of two adjacent fins; and/or the first nozzle sprays cooling medium towards the top surface of the matrix between two adjacent fins.

3. The heat sink of claim 2, wherein the jet assembly is disposed on a side of the fin remote from the base, and at least a portion of a bottom surface of the jet assembly covers a top of the cool down region.

4. A heat sink according to claim 3, wherein the jet assembly is provided with a second nozzle communicating with the inner cavity of the jet assembly, the second nozzle being located on a side of the fin remote from the top surface of the base and ejecting the cooling medium towards a side of the fin remote from the top surface of the base.

5. A heat sink according to claim 3, wherein at least part of the jet assembly extends into the cooling zone.

6. The heat sink according to any one of claims 1-5, wherein at least part of the jet assembly extends beyond the outermost side wall of the outermost fins and is provided with a third jet which jets a cooling medium towards the outermost side wall of the outermost fins.

7. The heat sink of any one of claims 1-5, wherein the jet assembly comprises a cover and a base plate, the cover having an interior cavity and an opening in communication with the interior cavity of the cover; the bottom plate with the lid can dismantle the connection and the closing cap the opening of lid, and with the lid surrounds into the space that is used for storing cooling medium, the bottom plate is equipped with first spout.

8. The heat sink according to any one of claims 1 to 5, wherein the fins are sheet-like and extend in a first direction, and a plurality of the fins are arranged at intervals in a second direction;

The first direction and the second direction are parallel to the bottom surface of the matrix, and the first direction and the second direction are intersected;

The cooling area is communicated with the outside at two ends of the first direction.

9. The heat sink of any one of claims 1-5, wherein the plurality of fins are arranged in a plurality of rows along a first direction, and adjacent two of the fins in each row are spaced apart along a second direction;

The first direction and the second direction are parallel to the bottom surface of the matrix, and the first direction and the second direction are intersected;

the cooling area is communicated with the outside in the first direction and the second direction.

10. A computing device, comprising a chassis, wherein the chassis has an inner cavity, an input port and an output port, a circuit board, a heating element and the heat dissipating device according to any one of claims 1-9 are arranged in the inner cavity of the chassis, the input port is communicated with a liquid inlet of the heat dissipating device through a pipeline, and the output port is communicated with the inner cavity of the chassis and is used for flowing out cooling medium; the heating element is arranged on the circuit board, and one surface of the heating element, which is far away from the circuit board, is in contact with the bottom surface of the base body of the heat dissipation device for heat transfer.